JP2022170408A - テープ - Google Patents
テープ Download PDFInfo
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- JP2022170408A JP2022170408A JP2021076510A JP2021076510A JP2022170408A JP 2022170408 A JP2022170408 A JP 2022170408A JP 2021076510 A JP2021076510 A JP 2021076510A JP 2021076510 A JP2021076510 A JP 2021076510A JP 2022170408 A JP2022170408 A JP 2022170408A
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- tape
- adhesive
- adhesive layer
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- resin
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- 239000010410 layer Substances 0.000 claims abstract description 39
- 239000012790 adhesive layer Substances 0.000 claims description 50
- 239000000853 adhesive Substances 0.000 claims description 45
- 230000001070 adhesive effect Effects 0.000 claims description 43
- 239000004065 semiconductor Substances 0.000 claims description 30
- 238000010438 heat treatment Methods 0.000 claims description 15
- 229920002577 polybenzoxazole Polymers 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 12
- 239000004820 Pressure-sensitive adhesive Substances 0.000 abstract description 4
- 229920005989 resin Polymers 0.000 description 31
- 239000011347 resin Substances 0.000 description 31
- 239000000463 material Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 12
- 229920001721 polyimide Polymers 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 10
- 239000004697 Polyetherimide Substances 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229920001601 polyetherimide Polymers 0.000 description 6
- 239000004696 Poly ether ether ketone Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229920002530 polyetherether ketone Polymers 0.000 description 4
- -1 polypropylene Polymers 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229920002312 polyamide-imide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004823 Reactive adhesive Substances 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 125000005462 imide group Chemical group 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2461/00—Presence of condensation polymers of aldehydes or ketones
- C09J2461/006—Presence of condensation polymers of aldehydes or ketones in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Laminated Bodies (AREA)
Abstract
Description
前記テープは、230℃×80秒の加熱後、又は前記粘接着層の硬化により粘接着力を低下させた後において、ポリベンゾオキサゾール(PBO)に対する粘接着力が0.5N/25mm以下であってもよい。
前記テープは、半導体チップの保護テープであってもよい。
耐熱性を有する微粘着の粘着剤を用いて厚さ20μmの粘接着層を形成し、三井化学株式会社製の溶剤可溶型ポリイミドワニス(商品名MP17A)を用いて基材層を形成することにより、実施例1~2のテープを作製した。実施例1のテープでは、基材層の厚さを12.5μmとした。実施例2のテープでは、基材層の厚さを25μmとした。
実施例1~2と同じ材料を用いて厚さ20μmの粘接着層を形成し、倉敷紡績株式会社製のポリエーテルエーテルケトンフィルム(商品名EXPEEK(登録商標)、厚さ25μm)を用いて基材層を形成することにより、比較例1のテープを作製した。
実施例1~2と同じ材料を用いて厚さ20μmの粘接着層を形成し、東レ・デュポン株式会社のポリイミドフィルム(商品名カプトン(登録商標)50H、厚さ12.5μm)を用いて基材層を形成することにより、比較例2のテープを作製した。
500~600μmの間隔で、50~60μmの高さのチップが置かれたインターポーザー上にテープを真空テープマウンターにて貼合した。テープは、インターポーザー上に配置された複数のチップの周囲を被覆するように、インターポーザーの表面及び各チップの外周面に貼合される。各チップに追従するようにテープが変形した場合を(〇)、各チップに追従するようにテープが変形しなかった場合を(×)と評価した。
引張特性として、ヤング率、破断強度、破断伸度の3種類を測定した。測定装置には、株式会社島津製作所製のAGS-X 500Nを使用した。試料のサイズは、幅15mm×長さ120mmとした。環境温度を室温(23℃)とし、試料の長さ方向の両端を10mm掴み、引張速度50mm/minで、繰り返し3回測定し、平均値を採用した。
ヤング率(GPa)は、チャートの初期傾きから求めた。
破断強度は、試料が破断した時の強度(MPa)を測定した。
破断伸度は、試験前の試料の長さをLo、破断時の試料の長さをLとして、試料が破断した時の引張伸び(%)を、100×(L-Lo)/Loとして算出した。
耐熱性は、上記の引張特性と同じ形式の試料をオーブンに入れて、230℃×80秒の加熱を経た後の試料について、引張特性として、ヤング率、破断強度、破断伸度の3種類を測定した。
粘接着力は、株式会社島津製作所製のEZ Graphを使用し、試料のサイズを幅25mm×長さ100mmとし、温度23℃(室温)、被着体はPBO処理シリコンウェハ、貼合方法は2kgローラー使用、貼合領域は幅25mm×長さ90mm、引張速度300mm/min、剥離角度180°とする条件で、繰り返し3回測定し、平均値を採用した。粘接着力として、「初期粘接着力」及び「加熱後粘接着力」の2種類を測定した。「初期粘接着力」は、加熱前に測定した粘接着力である。「加熱後粘接着力」は、230℃×80秒の加熱後に測定した粘接着力である。被着体のPBO処理シリコンウェハは、表面にPBO膜を有するシリコンウェハであり、この被着体を用いることにより、PBOに対する粘接着力が測定される。
比較例1~2のテープは、破断伸度は100%未満で、弾性率は2GPaを超えており、チップに対する追従性に劣っていた。比較例1~2のテープも、加熱前の引張特性と、230℃×80秒の加熱後の引張特性とに大差がない点では、耐熱性を有している。テープに耐熱性があるにもかかわらず、チップに対する追従性が劣っていたのは、破断伸度が低く、また、弾性率(ヤング率)が高いことで、テープの変形性が低いためと考えられる。
Claims (5)
- 基材層の片面に粘接着層を有するテープであって、破断伸度100%以上、弾性率2GPa以下であり、かつ、230℃×80秒の加熱後において、破断伸度100%以上、弾性率2GPa以下を保持する、テープ。
- 前記粘接着層が硬化により粘接着力を低下させることができる、請求項1に記載のテープ。
- 230℃×80秒の加熱後、又は前記粘接着層の硬化により粘接着力を低下させた後において、ポリベンゾオキサゾール(PBO)に対する粘接着力が0.5N/25mm以下である、請求項1又は2に記載のテープ。
- 前記粘接着層の、前記基材層とは反対側の粘接着面に、剥離フィルムを有する、請求項1~3のいずれか1項に記載のテープ。
- 半導体チップの保護テープである、請求項1~4のいずれか1項に記載のテープ。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021076510A JP7005805B1 (ja) | 2021-04-28 | 2021-04-28 | テープ |
JP2022000138A JP2022170661A (ja) | 2021-04-28 | 2022-01-04 | テープ |
PCT/JP2022/018955 WO2022230907A1 (ja) | 2021-04-28 | 2022-04-26 | テープ |
CN202280031095.6A CN117203297A (zh) | 2021-04-28 | 2022-04-26 | 带 |
KR1020237036493A KR20240001144A (ko) | 2021-04-28 | 2022-04-26 | 테이프 |
US18/557,385 US20240199921A1 (en) | 2021-04-28 | 2022-04-26 | Tape |
EP22795820.4A EP4332187A1 (en) | 2021-04-28 | 2022-04-26 | Tape |
TW111115976A TW202249093A (zh) | 2021-04-28 | 2022-04-27 | 帶體 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021076510A JP7005805B1 (ja) | 2021-04-28 | 2021-04-28 | テープ |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022000138A Division JP2022170661A (ja) | 2021-04-28 | 2022-01-04 | テープ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP7005805B1 JP7005805B1 (ja) | 2022-02-10 |
JP2022170408A true JP2022170408A (ja) | 2022-11-10 |
Family
ID=80856395
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021076510A Active JP7005805B1 (ja) | 2021-04-28 | 2021-04-28 | テープ |
JP2022000138A Pending JP2022170661A (ja) | 2021-04-28 | 2022-01-04 | テープ |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022000138A Pending JP2022170661A (ja) | 2021-04-28 | 2022-01-04 | テープ |
Country Status (7)
Country | Link |
---|---|
US (1) | US20240199921A1 (ja) |
EP (1) | EP4332187A1 (ja) |
JP (2) | JP7005805B1 (ja) |
KR (1) | KR20240001144A (ja) |
CN (1) | CN117203297A (ja) |
TW (1) | TW202249093A (ja) |
WO (1) | WO2022230907A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016018811A (ja) * | 2014-07-04 | 2016-02-01 | 積水化学工業株式会社 | ダイシング−ダイボンディングテープ |
JP2016117854A (ja) * | 2014-12-22 | 2016-06-30 | リンテック株式会社 | 粘着シート |
JP2018157056A (ja) * | 2017-03-17 | 2018-10-04 | 藤森工業株式会社 | カバーレイフィルム |
JP2019102502A (ja) * | 2017-11-28 | 2019-06-24 | 藤森工業株式会社 | カバーレイフィルムおよびそれを用いた電子機器 |
JP2021050319A (ja) * | 2019-09-19 | 2021-04-01 | 日東電工株式会社 | 粘着テープ |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4247956B2 (ja) | 2001-07-04 | 2009-04-02 | 古河電気工業株式会社 | 帯電防止ダイシングテープ |
JP2006339236A (ja) * | 2005-05-31 | 2006-12-14 | Toyobo Co Ltd | 半導体ウエハ保護用粘着テープ |
JP5503357B2 (ja) | 2009-03-23 | 2014-05-28 | 古河電気工業株式会社 | ダイシングテープ、ダイシングテープの硬化阻害防止方法及び一括封止された半導体基板のダイシング方法 |
JP5534690B2 (ja) | 2009-03-23 | 2014-07-02 | 古河電気工業株式会社 | ダイシングテープ |
JP5068793B2 (ja) * | 2009-09-24 | 2012-11-07 | リンテック株式会社 | 粘着シート |
JP2014001363A (ja) * | 2012-05-21 | 2014-01-09 | Toray Ind Inc | 金属接着用二軸延伸ポリアリーレンスルフィドフィルム |
KR20170084672A (ko) * | 2016-01-12 | 2017-07-20 | 후지모리 고교 가부시키가이샤 | 커버레이 필름 |
CN108713241B (zh) | 2016-03-10 | 2023-04-11 | 琳得科株式会社 | 切割芯片接合片、半导体芯片的制造方法及半导体装置的制造方法 |
JP7411381B2 (ja) * | 2019-10-28 | 2024-01-11 | 藤森工業株式会社 | ダイシングテープ、及び半導体部品の製造方法 |
JP2021076510A (ja) | 2019-11-12 | 2021-05-20 | 日本製鉄株式会社 | 試験装置及び試験方法 |
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JP2016018811A (ja) * | 2014-07-04 | 2016-02-01 | 積水化学工業株式会社 | ダイシング−ダイボンディングテープ |
JP2016117854A (ja) * | 2014-12-22 | 2016-06-30 | リンテック株式会社 | 粘着シート |
JP2018157056A (ja) * | 2017-03-17 | 2018-10-04 | 藤森工業株式会社 | カバーレイフィルム |
JP2019102502A (ja) * | 2017-11-28 | 2019-06-24 | 藤森工業株式会社 | カバーレイフィルムおよびそれを用いた電子機器 |
JP2021050319A (ja) * | 2019-09-19 | 2021-04-01 | 日東電工株式会社 | 粘着テープ |
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US20240199921A1 (en) | 2024-06-20 |
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CN117203297A (zh) | 2023-12-08 |
KR20240001144A (ko) | 2024-01-03 |
JP7005805B1 (ja) | 2022-02-10 |
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TW202249093A (zh) | 2022-12-16 |
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