JP2022168770A5 - - Google Patents

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Publication number
JP2022168770A5
JP2022168770A5 JP2021074477A JP2021074477A JP2022168770A5 JP 2022168770 A5 JP2022168770 A5 JP 2022168770A5 JP 2021074477 A JP2021074477 A JP 2021074477A JP 2021074477 A JP2021074477 A JP 2021074477A JP 2022168770 A5 JP2022168770 A5 JP 2022168770A5
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JP
Japan
Prior art keywords
board
copper foil
pad
pattern portion
terminal piece
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JP2021074477A
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English (en)
Japanese (ja)
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JP2022168770A (ja
JP7582618B2 (ja
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Publication of JP2022168770A5 publication Critical patent/JP2022168770A5/ja
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JP2021074477A 2021-04-26 2021-04-26 遊技機 Active JP7582618B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021074477A JP7582618B2 (ja) 2021-04-26 2021-04-26 遊技機

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Application Number Priority Date Filing Date Title
JP2021074477A JP7582618B2 (ja) 2021-04-26 2021-04-26 遊技機

Publications (3)

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JP2022168770A JP2022168770A (ja) 2022-11-08
JP2022168770A5 true JP2022168770A5 (cg-RX-API-DMAC7.html) 2023-10-03
JP7582618B2 JP7582618B2 (ja) 2024-11-13

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JP2021074477A Active JP7582618B2 (ja) 2021-04-26 2021-04-26 遊技機

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JP (1) JP7582618B2 (cg-RX-API-DMAC7.html)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0497589A (ja) * 1990-08-16 1992-03-30 Nec Corp プリント配線基板
JPH0846338A (ja) * 1994-07-29 1996-02-16 Tec Corp 配線板
JPH09139567A (ja) * 1995-11-15 1997-05-27 Fujitsu Ltd プリント基板における表面実装部品搭載パッドと層間接続用スルーホールの接続構造
JP2006222268A (ja) 2005-02-10 2006-08-24 Pioneer Electronic Corp 電子回路用基板
JP2018157166A (ja) 2017-03-21 2018-10-04 サミー株式会社 回路基板アセンブリ及び製造方法
JP2018166977A (ja) 2017-03-30 2018-11-01 京楽産業．株式会社 遊技機
JP6721560B2 (ja) 2017-11-21 2020-07-15 株式会社三共 遊技機
JP2019145638A (ja) 2018-02-20 2019-08-29 株式会社東芝 プリント基板の管理装置、管理方法、およびプリント基板
JP7341432B2 (ja) 2020-11-05 2023-09-11 株式会社大一商会 遊技機

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