JP2022149046A - Processing device and positioning method - Google Patents

Processing device and positioning method Download PDF

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Publication number
JP2022149046A
JP2022149046A JP2021050980A JP2021050980A JP2022149046A JP 2022149046 A JP2022149046 A JP 2022149046A JP 2021050980 A JP2021050980 A JP 2021050980A JP 2021050980 A JP2021050980 A JP 2021050980A JP 2022149046 A JP2022149046 A JP 2022149046A
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Prior art keywords
substrate
positioning
pick
processing apparatus
positioning table
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Japanese (ja)
Inventor
正 帯金
Tadashi Obikane
史 加賀美
Chikashi Kagami
香織 荒井
Kaori Arai
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2021050980A priority Critical patent/JP2022149046A/en
Priority to KR1020237035160A priority patent/KR20230156413A/en
Priority to PCT/JP2022/010937 priority patent/WO2022202405A1/en
Priority to CN202280020861.9A priority patent/CN116964724A/en
Priority to TW111109575A priority patent/TW202301538A/en
Publication of JP2022149046A publication Critical patent/JP2022149046A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

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  • Engineering & Computer Science (AREA)
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  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

To provide a technology capable of positioning a rectangular substrate.SOLUTION: A processing device according to the present disclosure includes a transport mechanism that transports a rectangular substrate, a positioning table for placing the substrate and positioning the substrate, and a turntable that rotates the positioned substrate, and the transport mechanism includes a block portion that presses an end portion of the substrate placed on the positioning table to position the substrate.SELECTED DRAWING: Figure 4

Description

本開示は、処理装置及び位置決め方法に関する。 The present disclosure relates to a processing apparatus and positioning method.

基板を支持部材の上に移動可能に支持し、該基板を押圧部材と位置決め部材とで挟み込むことにより、該基板を位置決めする技術が知られている（例えば、特許文献１参照）。 BACKGROUND ART A technique of positioning a substrate by movably supporting the substrate on a support member and sandwiching the substrate between a pressing member and a positioning member is known (see, for example, Patent Document 1).

特開２００５－１１６８７８号公報JP-A-2005-116878

本開示は、矩形基板を位置決めできる技術を提供する。 The present disclosure provides techniques that can position rectangular substrates.

本開示の一態様による処理装置は、矩形状の基板を搬送する搬送機構と、前記基板を載置して前記基板の位置決めを行うための位置決め台と、位置決めされた前記基板を回転させる回転台と、を有し、前記搬送機構は、前記位置決め台に載置された前記基板の端部を押圧して前記基板の位置決めを行うブロック部を含む。 A processing apparatus according to one aspect of the present disclosure includes a transport mechanism for transporting a rectangular substrate, a positioning table for placing the substrate and positioning the substrate, and a rotating table for rotating the positioned substrate. and the transport mechanism includes a block portion that presses an end portion of the substrate placed on the positioning table to position the substrate.

本開示によれば、矩形基板を位置決めできる。 According to the present disclosure, rectangular substrates can be positioned.

実施形態の検査装置の一例を示す正面図The front view which shows an example of the inspection apparatus of embodiment. 実施形態の検査装置の一例を示す上面図1 is a top view showing an example of an inspection apparatus according to an embodiment; FIG. ローダ部の一例を示す図Diagram showing an example of the loader part ピックの一例を示す図A diagram showing an example of a pick 位置決め台の一例を示す図Diagram showing an example of a positioning table 回転台の一例を示す図Diagram showing an example of a turntable 実施形態の検査方法の一例を示すフローチャートFlowchart showing an example of an inspection method according to an embodiment 基板を位置決めする動作の一例を示す図A diagram showing an example of the operation for positioning the board 基板を回転させる動作の一例を示す図A diagram showing an example of the operation of rotating the substrate 位置決め台及び回転台の別の一例を示す図The figure which shows another example of a positioning base and a rotary base 基板を位置決めする動作の別の一例を示す図（１）A diagram (1) showing another example of the operation for positioning the substrate 基板を位置決めする動作の別の一例を示す図（２）A diagram (2) showing another example of the operation for positioning the substrate 基板を位置決めする動作の別の一例を示す図（３）A diagram (3) showing another example of the operation for positioning the substrate

以下、添付の図面を参照しながら、本開示の限定的でない例示の実施形態について説明する。添付の全図面中、同一又は対応する部材又は部品については、同一又は対応する参照符号を付し、重複する説明を省略する。 Non-limiting exemplary embodiments of the present disclosure will now be described with reference to the accompanying drawings. In all the attached drawings, the same or corresponding members or parts are denoted by the same or corresponding reference numerals, and overlapping descriptions are omitted.

〔検査装置〕
図１～図３を参照し、実施形態の検査装置の一例について説明する。図１は、実施形態の検査装置の一例を示す正面図である。図２は、実施形態の検査装置の一例を示す上面図である。図３は、ローダ部の一例を示す図である。 [Inspection device]
An example of an inspection apparatus according to an embodiment will be described with reference to FIGS. 1 to 3. FIG. 1 is a front view showing an example of an inspection apparatus according to an embodiment; FIG. FIG. 2 is a top view showing an example of the inspection device of the embodiment. FIG. 3 is a diagram illustrating an example of a loader section;

検査装置１は、ローダ部１０、検査部２０、装置コントローラ３０等を有する。検査装置１は、装置コントローラ３０の制御の下、ローダ部１０から検査部２０へ検査対象の基板Ｗを搬送し、基板Ｗに形成された被検査デバイス（ＤＵＴ：Device Under Test）に電気信号を与えて種々の電気特性を検査する。基板Ｗは、例えば矩形状の基板であってよい。矩形状の基板としては、例えばＰＬＰ（Panel Level Package）が挙げられる。 The inspection apparatus 1 has a loader section 10, an inspection section 20, an apparatus controller 30, and the like. The inspection apparatus 1 conveys the substrate W to be inspected from the loader unit 10 to the inspection unit 20 under the control of the apparatus controller 30, and transmits an electric signal to the device under test (DUT: Device Under Test) formed on the substrate W. to test various electrical properties. The substrate W may be, for example, a rectangular substrate. Examples of rectangular substrates include PLPs (Panel Level Packages).

ローダ部１０は、ロードポート１１、位置決め台１２、回転台１３、背面台１４、基板搬送機構１５、位置検出センサ１６等を有する。 The loader section 10 has a load port 11, a positioning table 12, a rotary table 13, a rear table 14, a substrate transfer mechanism 15, a position detection sensor 16, and the like.

ロードポート１１は、検査装置１の正面（－Ｙ方向）側に設けられている。ロードポート１１は、基板Ｗを収容したカセットＣを載置する。 The load port 11 is provided on the front side (−Y direction) of the inspection apparatus 1 . The load port 11 mounts a cassette C containing substrates W thereon.

位置決め台１２は、検査装置１の背面（＋Ｙ方向）側に設けられている。位置決め台１２は、基板Ｗを載置して該基板Ｗの位置決めを行うための台である。位置決め台１２の詳細については後述する。 The positioning table 12 is provided on the back side (+Y direction) of the inspection apparatus 1 . The positioning table 12 is a table for placing the substrate W thereon and positioning the substrate W thereon. Details of the positioning table 12 will be described later.

回転台１３は、検査装置１の背面側であって、位置決め台１２の下方（－Ｚ方向）に設けられている。ただし、回転台１３は、位置決め台１２の上方（＋Ｚ方向）に設けられていてもよい。回転台１３は、基板Ｗを吸着保持して該基板Ｗを回転させるための台である。回転台１３の詳細については後述する。 The turntable 13 is provided on the back side of the inspection apparatus 1 and below the positioning table 12 (-Z direction). However, the turntable 13 may be provided above the positioning table 12 (+Z direction). The turntable 13 is a stand for holding the substrate W by suction and rotating the substrate W. As shown in FIG. Details of the turntable 13 will be described later.

背面台１４は、検査装置１の背面側であって、位置決め台１２の上方に設けられている。ただし、背面台１４は、位置決め台１２の下方に設けられていてもよい。背面台１４は、基板Ｗを載置するトレイ（図示せず）を設置するための台である。該トレイは、検査装置１の背面側から取出し可能である。 The back table 14 is provided on the back side of the inspection apparatus 1 and above the positioning table 12 . However, the rear table 14 may be provided below the positioning table 12 . The rear table 14 is a table for setting a tray (not shown) on which the substrate W is placed. The tray can be removed from the back side of the inspection device 1 .

基板搬送機構１５は、ロードポート１１に載置されたカセットＣ、位置決め台１２、回転台１３、背面台１４のトレイ及び後述する載置台２１の間で基板Ｗを搬送する。基板搬送機構１５は、ピック１５１，１５２、回転駆動機構１５３、上下駆動機構１５４等を含む。 The substrate transport mechanism 15 transports the substrates W among the cassette C placed on the load port 11, the positioning table 12, the rotating table 13, the tray of the rear table 14, and a mounting table 21, which will be described later. The substrate transfer mechanism 15 includes picks 151 and 152, a rotation drive mechanism 153, a vertical drive mechanism 154, and the like.

ピック１５１，１５２は、上下二段に設けられている。各ピック１５１，１５２は、基板Ｗを保持する。ピック１５１，１５２は、フォーク、エンドエフェクタとも称される。ピック１５１，１５２の詳細については後述する。 The picks 151 and 152 are provided in two stages, upper and lower. Each pick 151, 152 holds a substrate W; The picks 151 and 152 are also called forks and end effectors. Details of the picks 151 and 152 will be described later.

回転駆動機構１５３は、ピック１５１，１５２の下部に設けられており、ピック１５１，１５２を回転駆動させる。回転駆動機構１５３は、例えばステッピングモータを含む。 The rotation drive mechanism 153 is provided below the picks 151 and 152 and rotates the picks 151 and 152 . The rotation drive mechanism 153 includes, for example, a stepping motor.

上下駆動機構１５４は、回転駆動機構１５３の下部に設けられており、ピック１５１，１５２及び回転駆動機構１５３を上下駆動させる。上下駆動機構１５４は、例えばステッピングモータを含む。なお、基板搬送機構１５は、図３に示される形態に限定されず、例えば多関節アーム及び上下駆動機構を有する形態であってもよい。 The vertical drive mechanism 154 is provided below the rotary drive mechanism 153 and vertically drives the picks 151 and 152 and the rotary drive mechanism 153 . The vertical drive mechanism 154 includes, for example, a stepping motor. Note that the substrate transfer mechanism 15 is not limited to the form shown in FIG. 3, and may have, for example, a form having a multi-joint arm and a vertical drive mechanism.

位置検出センサ１６は、ピック１５１，１５２で基板ＷをカセットＣに収容する搬送経路に設けられており、ピック１５１，１５２に保持された基板Ｗの位置を検出する。位置検出センサ１６は、投光部１６１及び受光部１６２を含む。投光部１６１は、ロードポート１１に載置されるカセットＣの入口近傍の上部に、左右方向（Ｘ方向）に所定の間隔をあけて２つ設けられている。受光部１６２は、該カセットＣの入口近傍の下部に、左右方向に所定の間隔をあけて２つ設けられている。所定の間隔は、基板Ｗの一辺の長さよりも広く、カセットＣの内寸よりも狭い間隔である。例えば、基板Ｗの一辺の長さが３００ｍｍであり、カセットＣの内寸が３０５ｍｍである場合、所定の間隔は３０１～３０４ｍｍであってよく、３０３ｍｍであることが好ましい。投光部１６１は、受光部１６２に向けて光Ｌを照射する。受光部１６２は、投光部１６１から照射された光Ｌの受光の有無を検出する。なお、投光部１６１と受光部１６２の位置関係は、逆であってもよい。すなわち、投光部１６１がカセットＣの入口近傍の下部に設けられ、受光部１６２がカセットＣの入口近傍の上部に設けられていてもよい。 The position detection sensor 16 is provided on the transport path along which the substrates W are accommodated in the cassette C by the picks 151 and 152 and detects the positions of the substrates W held by the picks 151 and 152 . The position detection sensor 16 includes a light projecting section 161 and a light receiving section 162 . Two light projecting units 161 are provided above the vicinity of the entrance of the cassette C placed on the load port 11 with a predetermined interval in the horizontal direction (X direction). Two light-receiving portions 162 are provided at a lower portion near the entrance of the cassette C with a predetermined interval in the left-right direction. The predetermined interval is wider than the length of one side of the substrate W and narrower than the inner dimension of the cassette C. As shown in FIG. For example, when the length of one side of the substrate W is 300 mm and the inner dimension of the cassette C is 305 mm, the predetermined interval may be 301-304 mm, preferably 303 mm. The light projecting unit 161 irradiates the light L toward the light receiving unit 162 . The light receiving unit 162 detects whether or not the light L emitted from the light projecting unit 161 is received. Note that the positional relationship between the light projecting section 161 and the light receiving section 162 may be reversed. That is, the light projecting section 161 may be provided at the lower portion near the inlet of the cassette C, and the light receiving section 162 may be provided at the upper portion near the inlet of the cassette C.

位置検出センサ１６では、基板Ｗを保持したピック１５１，１５２がカセットＣに進入する際に基板Ｗがピック１５１，１５２の所定の範囲内に位置する場合、受光部１６２が投光部１６１から照射された光Ｌを受光する。一方、基板Ｗがピック１５１，１５２の所定の範囲外に位置する場合、投光部１６１から照射された光Ｌが基板Ｗで遮られるため、受光部１６２は投光部１６１から照射された光Ｌを受光しない。そこで、受光部１６２が投光部１６１から照射された光Ｌを受光しない場合にピック１５１，１５２がカセットＣに基板Ｗを収容しないようにすることで、基板ＷがカセットＣと接触することを回避できる。なお、位置検出センサ１６は、図示の例に限定されず、別の形態であってもよい。 In the position detection sensor 16 , when the picks 151 and 152 holding the substrate W enter the cassette C and the substrate W is positioned within a predetermined range of the picks 151 and 152 , the light receiving unit 162 emits light from the light projecting unit 161 . Receives the light L. On the other hand, when the substrate W is positioned outside the predetermined range of the picks 151 and 152, the light L emitted from the light projecting portion 161 is blocked by the substrate W, so that the light receiving portion 162 receives the light emitted from the light projecting portion 161. does not receive L. Therefore, by preventing the picks 151 and 152 from receiving the substrate W in the cassette C when the light receiving unit 162 does not receive the light L emitted from the light projecting unit 161, the substrate W is prevented from contacting the cassette C. can be avoided. Note that the position detection sensor 16 is not limited to the illustrated example, and may be of another form.

検査部２０は、ローダ部１０に隣接して配置されている。検査部２０は、載置台２１、昇降機構２２、ＸＹステージ２３、プローブカード２４、アライメント機構２５等を有する。 The inspection unit 20 is arranged adjacent to the loader unit 10 . The inspection unit 20 has a mounting table 21, an elevating mechanism 22, an XY stage 23, a probe card 24, an alignment mechanism 25, and the like.

載置台２１は、基板Ｗを載置して保持する。載置台２１は、例えば真空チャックを含む。 The mounting table 21 mounts and holds the substrate W thereon. The mounting table 21 includes, for example, a vacuum chuck.

昇降機構２２は、載置台２１の下部に設けられており、載置台２１をＸＹステージ２３に対して昇降させる。昇降機構２２は、例えばステッピングモータを含む。 The elevating mechanism 22 is provided below the mounting table 21 and raises and lowers the mounting table 21 with respect to the XY stage 23 . The lifting mechanism 22 includes, for example, a stepping motor.

ＸＹステージ２３は、昇降機構２２の下部に設けられており、載置台２１及び昇降機構２２を２軸方向（図中のＸ方向及びＹ方向）に移動させる。ＸＹステージ２３は、検査部２０の底部に固定されている。ＸＹステージ２３は、例えばステッピングモータを含む。 The XY stage 23 is provided below the elevating mechanism 22 and moves the mounting table 21 and the elevating mechanism 22 in two axial directions (X direction and Y direction in the figure). The XY stage 23 is fixed to the bottom of the inspection section 20 . The XY stage 23 includes, for example, a stepping motor.

プローブカード２４は、載置台２１の上方に配置されている。プローブカード２４の載置台２１側には、複数のプローブ２４ａが形成されている。プローブカード２４は、ヘッドプレート２４ｂに着脱自在に取り付けられている。プローブカード２４には、テストヘッドＴを介してテスタ（図示せず）が接続されている。 The probe card 24 is arranged above the mounting table 21 . A plurality of probes 24 a are formed on the mounting table 21 side of the probe card 24 . The probe card 24 is detachably attached to the head plate 24b. A tester (not shown) is connected to the probe card 24 via a test head T. FIG.

アライメント機構２５は、カメラ２５ａ、ガイドレール２５ｂ、アライメントブリッジ２５ｃ等を含む。カメラ２５ａは、アライメントブリッジ２５ｃの中央に下向きに取り付けられており、載置台２１、基板Ｗ等を撮像する。カメラ２５ａは、例えばＣＣＤカメラやＣＭＯＳカメラである。ガイドレール２５ｂは、アライメントブリッジ２５ｃを水平方向（図中のＹ方向）に移動可能に支持する。アライメントブリッジ２５ｃは、左右一対のガイドレール２５ｂによって支持されており、ガイドレール２５ｂに沿って水平方向（図中のＹ方向）に移動する。これにより、カメラ２５ａは、アライメントブリッジ２５ｃを介して、待機位置とプローブカード２４の中心の真下（以下「プローブセンタ」という。）との間を移動する。プローブセンタに位置するカメラ２５ａは、アライメントの際、載置台２１がＸＹ方向に移動する間に載置台２１上の基板Ｗの電極パッドを上方から撮像し、画像処理して表示装置４０に撮像画像を表示する。 The alignment mechanism 25 includes a camera 25a, guide rails 25b, alignment bridges 25c, and the like. The camera 25a is attached downward at the center of the alignment bridge 25c, and images the mounting table 21, the substrate W, and the like. The camera 25a is, for example, a CCD camera or a CMOS camera. The guide rail 25b supports the alignment bridge 25c so as to be movable in the horizontal direction (the Y direction in the figure). The alignment bridge 25c is supported by a pair of left and right guide rails 25b, and moves horizontally (Y direction in the figure) along the guide rails 25b. As a result, the camera 25a moves between the standby position and directly below the center of the probe card 24 (hereinafter referred to as "probe center") via the alignment bridge 25c. During alignment, the camera 25a located at the probe center takes an image of the electrode pads of the substrate W on the mounting table 21 from above while the mounting table 21 is moving in the XY directions. display.

装置コントローラ３０は、載置台２１の下方に設けられており、検査装置１の全体の動作を制御する。装置コントローラ３０に設けられたＣＰＵは、ＲＯＭ、ＲＡＭ等のメモリに格納された品種パラメータに従って、所望の検査を実行する。なお、品種パラメータは、ハードディスクやＲＯＭ、ＲＡＭ以外の半導体メモリに記憶されてもよい。また、品種パラメータは、コンピュータにより読み取り可能な、ＣＤ－ＲＯＭ、ＤＶＤ等の記録媒体に記録された状態で所定位置に挿入され、読み出されるようにしてもよい。 The device controller 30 is provided below the mounting table 21 and controls the overall operation of the inspection device 1 . A CPU provided in the device controller 30 executes a desired inspection according to the product type parameters stored in a memory such as ROM or RAM. Note that the product type parameter may be stored in a semiconductor memory other than a hard disk, ROM, or RAM. Also, the product type parameter may be recorded in a computer-readable recording medium such as a CD-ROM, DVD, or the like, inserted into a predetermined position, and read out.

〔ピック〕
図４を参照し、ローダ部１０が有する基板搬送機構１５のピック１５１の一例について説明する。図４は、ピック１５１の一例を示す図であり、ピック１５１が基板Ｗを保持した状態を示す。図４（ａ）はピック１５１を上方から見た図であり、図４（ｂ）はピック１５１を側方から見た図である。なお、ピック１５２についてもピック１５１と同じ構成であってよい。 〔pick〕
An example of the pick 151 of the substrate transfer mechanism 15 of the loader section 10 will be described with reference to FIG. FIG. 4 is a diagram showing an example of the pick 151, showing a state in which the pick 151 holds the substrate W. As shown in FIG. 4A is a view of the pick 151 viewed from above, and FIG. 4B is a view of the pick 151 viewed from the side. Note that the pick 152 may also have the same configuration as the pick 151 .

ピック１５１は、基台１５１ａ、パッド１５１ｂ、ブロック部１５１ｃ等を含む。 The pick 151 includes a base 151a, a pad 151b, a block portion 151c, and the like.

基台１５１ａは、板状部材により形成されている。基台１５１ａは、平面視で略Ｕ字状を有する。 The base 151a is formed of a plate-like member. The base 151a has a substantially U shape in plan view.

パッド１５１ｂは、基台１５１ａの上面に複数（例えば８つ）設けられている。複数のパッド１５１ｂは、独立して吸引可能な少なくとも２つの吸着パッドを含む。各吸着パッドは、基板Ｗを真空吸着して保持する。また、複数のパッド１５１ｂは、基板Ｗを真空吸着することなく保持する保持パッドを含んでいてもよい。 A plurality of (for example, eight) pads 151b are provided on the upper surface of the base 151a. The plurality of pads 151b includes at least two suction pads capable of suction independently. Each suction pad holds the substrate W by vacuum suction. Moreover, the plurality of pads 151b may include a holding pad that holds the substrate W without being vacuum-sucked.

ブロック部１５１ｃは、ピック１５１の基端の上に設けられている。ブロック部１５１ｃは、押圧面１５１ｄを有する。押圧面１５１ｄは、ピック１５１の進退方向と直交する。押圧面１５１ｄは、ピック１５１の上面から該ピック１５１に保持された基板Ｗの上面より高い位置まで延びる。ブロック部１５１ｃは、位置決め台１２に載置された基板Ｗの端部を押圧面１５１ｄで押圧してピック１５１に対する基板Ｗの位置決めを行う。 The block portion 151 c is provided on the base end of the pick 151 . The block portion 151c has a pressing surface 151d. The pressing surface 151 d is perpendicular to the movement direction of the pick 151 . The pressing surface 151 d extends from the upper surface of the pick 151 to a position higher than the upper surface of the substrate W held by the pick 151 . The block part 151 c presses the edge of the substrate W placed on the positioning table 12 with the pressing surface 151 d to position the substrate W with respect to the pick 151 .

〔位置決め台〕
図５を参照し、ローダ部１０が有する位置決め台１２の一例について説明する。図５は、位置決め台１２の一例を示す図であり、位置決め台１２の上方にピック１５１が進入した状態を示す。図５（ａ）は位置決め台１２を上方から見た図であり、図５（ｂ）は位置決め台１２を側方から見た図である。 [Positioning table]
An example of the positioning table 12 included in the loader section 10 will be described with reference to FIG. FIG. 5 is a diagram showing an example of the positioning table 12, and shows a state in which the pick 151 has entered above the positioning table 12. As shown in FIG. FIG. 5(a) is a view of the positioning table 12 viewed from above, and FIG. 5(b) is a view of the positioning table 12 viewed from the side.

位置決め台１２は、ベース１２１、保持ピン１２２等を含む。 The positioning table 12 includes a base 121, holding pins 122, and the like.

ベース１２１は、ローダ部１０に固定されている。ベース１２１は、板状部材により形成されている。ベース１２１は、平面視で矩形状を有する。 The base 121 is fixed to the loader section 10 . The base 121 is made of a plate-like member. The base 121 has a rectangular shape in plan view.

保持ピン１２２は、ベース１２１上に複数（例えば６つ）設けられている。各保持ピン１２２は、ピック１５１の進入経路を除く位置に設けられている。各保持ピン１２２は、ベース１２１から上方に突出して上端で基板Ｗの下面を摺動自在に保持する。各保持ピン１２２は、例えば摩擦抵抗が小さい材料により形成されている。保持ピン１２２の数は、６つ以上であることが好ましい。これにより、反った基板Ｗを正確に保持できる。 A plurality of (for example, six) holding pins 122 are provided on the base 121 . Each holding pin 122 is provided at a position other than the entrance path of the pick 151 . Each holding pin 122 protrudes upward from the base 121 and slidably holds the lower surface of the substrate W at its upper end. Each holding pin 122 is made of, for example, a material with low frictional resistance. The number of holding pins 122 is preferably six or more. Thereby, the warped substrate W can be held accurately.

〔回転台〕
図６を参照し、ローダ部１０が有する回転台１３の一例について説明する。図６は、回転台１３の一例を示す図であり、回転台１３の上方にピック１５１が進入した状態を示す。図６（ａ）は回転台１３を上方から見た図であり、図６（ｂ）は回転台１３を側方から見た図である。 [Rotating table]
An example of the turntable 13 included in the loader section 10 will be described with reference to FIG. FIG. 6 is a diagram showing an example of the turntable 13, showing a state in which the pick 151 has entered above the turntable 13. As shown in FIG. 6(a) is a top view of the turntable 13, and FIG. 6(b) is a side view of the turntable 13. FIG.

回転台１３は、ステージ１３１、減速機１３２、モータ１３３等を含む。 The turntable 13 includes a stage 131, a speed reducer 132, a motor 133, and the like.

ステージ１３１は、上面に複数（例えば３つ）設けられた吸着パッド１３１ａで基板Ｗを真空吸着して保持する。ステージ１３１は、減速機１３２を介してモータ１３３に接続されており、モータ１３３の動力により該基板Ｗを回転させる。 The stage 131 holds the substrate W by vacuum suction with a plurality of (for example, three) suction pads 131a provided on the upper surface. The stage 131 is connected to a motor 133 via a speed reducer 132 and rotates the substrate W by the power of the motor 133 .

減速機１３２は、モータ１３３側の動力の回転速度を、歯車等で減じてステージ１３１に出力する。 The speed reducer 132 reduces the rotation speed of the power on the motor 133 side using a gear or the like and outputs the result to the stage 131 .

モータ１３３は、減速機１３２を介してステージ１３１に動力を出力することにより、ステージ１３１を回転させる。 The motor 133 rotates the stage 131 by outputting power to the stage 131 via the speed reducer 132 .

〔検査装置の動作〕
図７～図９を参照し、前述した検査装置１において基板Ｗを検査する場合の検査装置１の動作の一例について説明する。図７は、実施形態の検査装置の動作の一例を示すフローチャートである。 [Operation of inspection device]
An example of the operation of the inspection apparatus 1 when inspecting the substrate W in the inspection apparatus 1 described above will be described with reference to FIGS. 7 to 9. FIG. FIG. 7 is a flow chart showing an example of the operation of the inspection device of the embodiment.

ステップＳ１では、ローダ部１０において検査前の基板Ｗの位置決めを行う。図８は、基板Ｗを位置決めする動作の一例を示す図であり、位置決め台１２を側方から見た図である。図９は、基板Ｗを回転させる動作の一例を示す図であり、回転台１３を側方から見た図である。 In step S<b>1 , the substrate W before inspection is positioned in the loader section 10 . FIG. 8 is a diagram showing an example of the operation for positioning the substrate W, and is a diagram of the positioning table 12 viewed from the side. FIG. 9 is a view showing an example of the operation of rotating the substrate W, and is a view of the turntable 13 as seen from the side.

本実施形態において、図８（ａ）に示されるように、装置コントローラ３０は、基板搬送機構１５を制御して、ピック１５１を位置決め台１２の上方に進入させることにより、カセットＣに収容された基板Ｗを位置決め台１２の上方に搬送する。 In this embodiment, as shown in FIG. 8(a), the device controller 30 controls the substrate transport mechanism 15 to move the pick 151 above the positioning table 12 so that the pick 151 is stored in the cassette C, as shown in FIG. The substrate W is transported above the positioning table 12 .

次いで、図８（ｂ）に示されるように、装置コントローラ３０は、基板搬送機構１５を制御して、ピック１５１を補正位置まで下降させることにより、保持ピン１２２上に基板Ｗを載置する。補正位置は、パッド１５１ｂが基板Ｗの下面から離間する位置であり、かつ、ブロック部１５１ｃの上面が基板Ｗの上面よりも高くなる位置である。 Next, as shown in FIG. 8B, the device controller 30 controls the substrate transport mechanism 15 to lower the pick 151 to the correction position, thereby placing the substrate W on the holding pins 122 . The corrected position is a position where the pad 151b is separated from the bottom surface of the substrate W and a position where the top surface of the block portion 151c is higher than the top surface of the substrate W. FIG.

次いで、図８（ｃ）に示されるように、装置コントローラ３０は、基板搬送機構１５を制御して、補正位置に位置するピック１５１を進入方向に第１の距離だけ移動させることにより、ブロック部１５１ｃの押圧面１５１ｄを基板Ｗの端部に押し当て押圧する。これにより、基板Ｗが保持ピン１２２上を摺動し、基板Ｗのブロック部１５１ｃ側の辺が押圧面１５１ｄと平行になる。第１の距離は、例えば３０ｍｍであってよい。 Next, as shown in FIG. 8(c), the apparatus controller 30 controls the substrate transport mechanism 15 to move the pick 151 positioned at the correction position by the first distance in the approach direction, thereby causing the block section to move. The pressing surface 151d of 151c is pressed against the edge of the substrate W to press it. As a result, the substrate W slides on the holding pins 122, and the side of the substrate W on the side of the block portion 151c becomes parallel to the pressing surface 151d. The first distance may be 30 mm, for example.

次いで、図８（ｄ）に示されるように、装置コントローラ３０は、基板搬送機構１５を制御して、ピック１５１を後退方向に第２の距離だけ移動させることにより、ブロック部１５１ｃの押圧面１５１ｄを基板Ｗの端部から離間させる。これにより、ピック１５１に対する基板Ｗの第１方向の位置決めが終了する。第１方向は、ピック１５１の進退方向である。第２の距離は、例えば２０ｍｍであってよい。 Next, as shown in FIG. 8(d), the device controller 30 controls the substrate transport mechanism 15 to move the pick 151 backward by the second distance, so that the pressing surface 151d of the block portion 151c is pressed. are separated from the edge of the substrate W. This completes the positioning of the substrate W with respect to the pick 151 in the first direction. The first direction is the advancing/retreating direction of the pick 151 . The second distance may be 20 mm, for example.

次いで、図８（ｅ）に示されるように、装置コントローラ３０は、基板搬送機構１５を制御して、ピック１５１をＵＰ位置まで上昇させることにより、保持ピン１２２上に載置された基板Ｗをパッド１５１ｂで保持する。ＵＰ位置は、基板Ｗの下面が保持ピン１２２から離間する位置である。 Next, as shown in FIG. 8(e), the apparatus controller 30 controls the substrate transport mechanism 15 to raise the pick 151 to the UP position, thereby removing the substrate W placed on the holding pins 122. It is held by the pad 151b. The UP position is a position where the lower surface of the substrate W is separated from the holding pins 122 .

次いで、図９（ａ）に示されるように、装置コントローラ３０は、基板搬送機構１５を制御して、ピック１５１を回転台１３の上方に進入させることにより、第１方向の位置決めが行われた基板Ｗを回転台１３の上方に搬送する。 Next, as shown in FIG. 9A, the apparatus controller 30 controls the substrate transport mechanism 15 to move the pick 151 above the turntable 13, thereby positioning in the first direction. The substrate W is transported above the turntable 13 .

次いで、図９（ｂ）に示されるように、装置コントローラ３０は、基板搬送機構１５を制御して、ピック１５１をＤＯＷＮ位置まで下降させることにより、ステージ１３１上に基板Ｗを載置する。ＤＯＷＮ位置は、パッド１５１ｂが基板Ｗの下面から離間する位置である。 Next, as shown in FIG. 9B, the device controller 30 controls the substrate transport mechanism 15 to lower the pick 151 to the DOWN position, thereby placing the substrate W on the stage 131 . The DOWN position is a position where the pad 151b is separated from the bottom surface of the substrate W. FIG.

次いで、図９（ｃ）に示されるように、装置コントローラ３０は、回転台１３を制御して、吸着パッド１３１ａで基板Ｗを吸着保持した状態で、ステージ１３１を９０°回転させることにより、該基板Ｗを９０°回転させる。また、装置コントローラ３０は、該基板Ｗを９０°回転させた後、回転台１３を制御して、吸着パッド１３１ａによる吸着を停止させる。 Next, as shown in FIG. 9(c), the apparatus controller 30 controls the turntable 13 to rotate the stage 131 by 90° while the substrate W is held by suction with the suction pads 131a. The substrate W is rotated by 90°. After rotating the substrate W by 90°, the device controller 30 controls the turntable 13 to stop the suction by the suction pad 131a.

次いで、図９（ｄ）に示されるように、装置コントローラ３０は、基板搬送機構１５を制御して、ピック１５１をＵＰ位置まで上昇させることにより、ステージ１３１上に載置された基板Ｗをパッド１５１ｂで保持する。ＵＰ位置は、基板Ｗの下面がステージ１３１から離間する位置である。 Next, as shown in FIG. 9(d), the device controller 30 controls the substrate transport mechanism 15 to raise the pick 151 to the UP position, thereby bringing the substrate W placed on the stage 131 to the pad position. 151b. The UP position is a position where the lower surface of the substrate W is separated from the stage 131 .

次いで、装置コントローラ３０は、基板搬送機構１５を制御して、９０°回転した基板Ｗを再び位置決め台１２に搬送する。そして、図８（ａ）～図８（ｅ）に示されるように、装置コントローラ３０は、ピック１５１に対する基板Ｗの第１方向の位置決めと同じ方法で、ピック１５１に対する基板Ｗの第１方向と直交する第２方向の位置決めを行う。 Next, the apparatus controller 30 controls the substrate transport mechanism 15 to transport the substrate W rotated by 90° to the positioning table 12 again. Then, as shown in FIGS. 8(a) to 8(e), the apparatus controller 30 positions the substrate W in the first direction with respect to the pick 151 in the same manner as positioning the substrate W in the first direction with respect to the pick 151. Positioning is performed in a second orthogonal direction.

以上により、ローダ部１０において、ピック１５１に対する検査前の基板Ｗの第１方向及び第２方向の位置決めが終了する。 As described above, in the loader section 10, the positioning of the substrate W before inspection with respect to the pick 151 in the first direction and the second direction is completed.

ステップＳ２では、ステップＳ１にて位置決めされた検査前の基板Ｗを検査部２０に搬送する。本実施形態において、装置コントローラ３０は、基板搬送機構１５を制御して、第１方向及び第２方向の位置決めが行われた基板Ｗを回転台１３に搬送する。次いで、装置コントローラ３０は、回転台１３を制御して、基板Ｗが予め指定された向きとなるように基板Ｗを回転させる。換言すると、回転台１３により、検査部２０に搬送する基板Ｗを任意の指定角度に回す（回転させる）ことができる。次いで、装置コントローラ３０は、基板搬送機構１５を制御して、回転台１３から検査部２０に基板Ｗを搬送し、載置台２１上に載置する。なお、基板Ｗが予め指定された向きとなっている場合には、装置コントローラ３０は、基板搬送機構１５を制御して、該基板Ｗを回転台１３に搬送することなく、検査部２０に搬送し、載置台２１上に載置してもよい。 In step S<b>2 , the pre-inspection substrate W positioned in step S<b>1 is transported to the inspection section 20 . In this embodiment, the device controller 30 controls the substrate transport mechanism 15 to transport the substrate W positioned in the first direction and the second direction to the turntable 13 . Next, the device controller 30 controls the turntable 13 to rotate the substrate W so that the substrate W is oriented in a predetermined direction. In other words, the turntable 13 can turn (rotate) the substrate W to be conveyed to the inspection section 20 at an arbitrary designated angle. Next, the apparatus controller 30 controls the substrate transport mechanism 15 to transport the substrate W from the turntable 13 to the inspection section 20 and place it on the mounting table 21 . When the substrate W is oriented in a predetermined direction, the device controller 30 controls the substrate transport mechanism 15 to transport the substrate W to the inspection section 20 without transporting the substrate W to the turntable 13. , and may be placed on the placing table 21 .

ステップＳ３では、検査部２０において基板Ｗを検査する。本実施形態において、装置コントローラ３０は、アライメント機構２５を制御して、載置台２１上の基板Ｗに形成された被検査デバイスの電極パッドと、プローブカード２４の複数のプローブ２４ａとの位置を合わせる。次いで、装置コントローラ３０は、昇降機構２２を制御して、載置台２１を上昇させて、プローブカード２４の複数のプローブ２４ａを対応する電極パッドに接触させる。次いで、装置コントローラ３０は、テスタからの検査用信号をテストヘッドＴ及びプローブカード２４の複数のプローブ２４ａを介して基板Ｗに形成された被検査デバイスに印加することにより、被検査デバイスの電気特性を検査する。被検査デバイスの電気特性の検査が終了した後、装置コントローラ３０は、昇降機構２２を制御して、載置台２１を下降させて、プローブ２４ａを電極パッドから離間させる。 In step S<b>3 , the substrate W is inspected in the inspection section 20 . In this embodiment, the apparatus controller 30 controls the alignment mechanism 25 to align the electrode pads of the device under test formed on the substrate W on the mounting table 21 with the plurality of probes 24a of the probe card 24. . Next, the device controller 30 controls the lifting mechanism 22 to lift the mounting table 21 and bring the plurality of probes 24a of the probe card 24 into contact with the corresponding electrode pads. Next, the device controller 30 applies a test signal from the tester to the device under test formed on the substrate W via the test head T and the plurality of probes 24a of the probe card 24, thereby determining the electrical characteristics of the device under test. to inspect. After the inspection of the electrical characteristics of the device under test is completed, the apparatus controller 30 controls the lifting mechanism 22 to lower the mounting table 21 and separate the probes 24a from the electrode pads.

ステップＳ４では、ローダ部１０において検査後の基板Ｗの位置決めを行う。検査後の基板Ｗの位置決めは、ステップＳ１における検査前の基板Ｗの位置決めと同じ方法で実施できる。 In step S<b>4 , the substrate W after inspection is positioned in the loader section 10 . The positioning of the substrate W after inspection can be performed in the same manner as the positioning of the substrate W before inspection in step S1.

ステップＳ５では、検査後の基板ＷをカセットＣに収容する。本実施形態において、装置コントローラ３０は、基板搬送機構１５を制御して、ローダ部１０において位置決めされた検査後の基板ＷをカセットＣに搬送して収容する。このとき、装置コントローラ３０は、位置検出センサ１６の検出値に基づいて、検査後の基板Ｗがピック１５１の所定の範囲内に位置するか否かを判断する。そして、装置コントローラ３０は、検査後の基板Ｗがピック１５１の所定の範囲内に位置すると判断した場合、検査後の基板ＷをカセットＣに搬送して収容する。一方、装置コントローラ３０は、検査後の基板Ｗがピック１５１の所定の範囲外に位置すると判断した場合、検査後の基板ＷをカセットＣに収容しないようにする。例えば、装置コントローラ３０は、基板搬送機構１５を制御して、ピック１５１の動作を停止させる。また例えば、装置コントローラ３０は、基板搬送機構１５を制御して、検査後の基板Ｗを背面台１４に搬送し、背面台１４に設置されたトレイの上に載置する。また例えば、装置コントローラ３０は、表示装置４０に、検査後の基板ＷをカセットＣに収容できないことを表示させるようにしてもよい。また例えば、装置コントローラ３０は、ローダ部１０の各部を制御して、該ローダ部１０において検査後の基板Ｗの位置決めを再び行うようにしてもよい。このように、ステップＳ５では、装置コントローラ３０は、検査後の基板Ｗがピック１５１の所定の範囲外に位置すると判断した場合、検査後の基板ＷをカセットＣに収容しないようにする。これにより、ピック１５１が保持した基板ＷがカセットＣと接触することを回避できる。 In step S5, the substrate W after inspection is accommodated in the cassette C. As shown in FIG. In this embodiment, the device controller 30 controls the substrate transport mechanism 15 to transport the inspected substrates W positioned in the loader section 10 to the cassette C for storage therein. At this time, the device controller 30 determines whether or not the substrate W after inspection is positioned within a predetermined range of the pick 151 based on the detection value of the position detection sensor 16 . Then, when the device controller 30 determines that the substrate W after inspection is positioned within the predetermined range of the pick 151, the substrate W after inspection is transported to the cassette C and accommodated therein. On the other hand, when the apparatus controller 30 determines that the inspected substrate W is outside the predetermined range of the pick 151, the apparatus controller 30 does not store the inspected substrate W in the cassette C. FIG. For example, the device controller 30 controls the substrate transport mechanism 15 to stop the movement of the pick 151 . Further, for example, the apparatus controller 30 controls the substrate transport mechanism 15 to transport the inspected substrate W to the back table 14 and place it on a tray installed on the back table 14 . Further, for example, the device controller 30 may cause the display device 40 to display that the substrate W after inspection cannot be accommodated in the cassette C. FIG. Further, for example, the apparatus controller 30 may control each part of the loader section 10 so that the loader section 10 again positions the substrate W after the inspection. Thus, in step S5, the device controller 30 does not store the substrate W after inspection in the cassette C when it is determined that the substrate W after inspection is positioned outside the predetermined range of the pick 151 . Thereby, the substrate W held by the pick 151 can be prevented from coming into contact with the cassette C. FIG.

なお、前述した実施形態の検査装置１の動作では、検査前の基板Ｗに対する位置決め（ステップＳ１）及び検査後の基板Ｗに対する位置決め（ステップＳ４）を行う場合を説明したが、これに限定されない。例えば、検査前の基板Ｗに対する位置決め（ステップＳ１）及び検査後の基板Ｗに対する位置決め（ステップＳ４）のいずれかを省略してもよい。また例えば、ステップＳ５において装置コントローラ３０が検査後の基板Ｗがピック１５１の所定の範囲外に位置すると判断した場合に限り、検査後の基板Ｗに対する位置決め（ステップＳ４）を行うようにしてもよい。 In addition, in the operation of the inspection apparatus 1 of the above-described embodiment, the case of positioning the substrate W before inspection (step S1) and positioning the substrate W after inspection (step S4) has been described, but the operation is not limited to this. For example, either the positioning of the substrate W before inspection (step S1) or the positioning of the substrate W after inspection (step S4) may be omitted. Further, for example, only when the device controller 30 determines in step S5 that the substrate W after inspection is positioned outside the predetermined range of the pick 151, the substrate W after inspection may be positioned (step S4). .

以上に説明したように、実施形態によれば、位置決め台１２の保持ピン１２２に摺動自在に保持された基板Ｗの端部をピック１５１のブロック部１５１ｃで押圧してピック１５１に対する基板Ｗの位置決めを行う。これにより、基板Ｗを側方から挟むことなく該基板Ｗの位置決めを行うことができる。そのため、樹脂基板、ガラス基板等のように傷つきやすい基板Ｗを位置決めする場合でも、該基板Ｗに傷が生じることを抑制できる。また、基板Ｗのサイズに依存することなく、該基板Ｗの位置決めを行うことができる。そのため、基板Ｗに反りがある場合であっても、該基板Ｗの位置決めを行うことができる。また、ピック１５１の移動によって基板Ｗの位置決めを行うため、基板Ｗの中心位置の微調整が容易である。 As described above, according to the embodiment, the end portion of the substrate W slidably held by the holding pins 122 of the positioning table 12 is pressed by the block portion 151c of the pick 151 to move the substrate W against the pick 151. positioning. Thereby, the substrate W can be positioned without sandwiching the substrate W from the side. Therefore, even when positioning a substrate W that is easily damaged, such as a resin substrate or a glass substrate, it is possible to prevent the substrate W from being damaged. Moreover, the substrate W can be positioned without depending on the size of the substrate W. FIG. Therefore, even if the substrate W is warped, the substrate W can be positioned. Further, since the substrate W is positioned by moving the pick 151, fine adjustment of the center position of the substrate W is easy.

〔変形例〕
図１０を参照し、ローダ部１０が有する位置決め台及び回転台の変形例について説明する。図１０は、位置決め台及び回転台の別の一例を示す図であり、位置決め台及び回転台の上方にピック１５１が進入した状態を示す。図１０（ａ）は位置決め台及び回転台を上方から見た図であり、図１０（ｂ）は位置決め台及び回転台を側方から見た図である。 [Modification]
With reference to FIG. 10, a modification of the positioning table and turntable included in the loader section 10 will be described. FIG. 10 is a diagram showing another example of the positioning table and the turntable, showing a state in which the pick 151 has entered above the positioning table and the turntable. FIG. 10(a) is a top view of the positioning table and the turntable, and FIG. 10(b) is a side view of the positioning table and the turntable.

変形例に係る位置決め台１７及び回転台１８は、両者が一体として設けられている点で、前述の位置決め台１２及び回転台１３と異なる。 The positioning table 17 and the rotating table 18 according to the modified example are different from the positioning table 12 and the rotating table 13 described above in that they are integrally provided.

位置決め台１７は、ベース１７１、保持ピン１７２、支持板１７３、アクチュエータ１７４等を含む。 The positioning table 17 includes a base 171, holding pins 172, a support plate 173, an actuator 174 and the like.

ベース１７１は、アクチュエータ１７４を介して支持板１７３に固定されている。ベース１７１は、板状部材により形成されている。ベース１７１は、平面視で矩形状を有する。 Base 171 is fixed to support plate 173 via actuator 174 . The base 171 is made of a plate-like member. The base 171 has a rectangular shape in plan view.

保持ピン１７２は、前述の保持ピン１２２と同じ構成であってよい。 The retaining pin 172 may have the same configuration as the retaining pin 122 described above.

支持板１７３は、アクチュエータ１７４を介してベース１７１を昇降自在に支持する。支持板１７３は、ローダ部１０に固定されている。 The support plate 173 supports the base 171 via an actuator 174 so that it can move up and down. The support plate 173 is fixed to the loader section 10 .

アクチュエータ１７４は、支持板１７３上に複数（例えば２つ）設けられている。アクチュエータ１７４は、支持板１７３に対してベース１７１を昇降させる。アクチュエータ１７４としては、例えばＤＣモータ、ステッピングモータ、リニアモータ等のモータ、エアシリンダ等のエア駆動機構、ピエゾアクチュエータを利用できる。 A plurality of (for example, two) actuators 174 are provided on the support plate 173 . The actuator 174 raises and lowers the base 171 with respect to the support plate 173 . As the actuator 174, for example, a motor such as a DC motor, stepping motor, or linear motor, an air drive mechanism such as an air cylinder, or a piezo actuator can be used.

回転台１８は、前述の回転台１３と同じ構成であってよい。すなわち、回転台１８は、ステージ１８１、減速機１８２、モータ１８３等を含む。回転台１８は、ステージ１８１の上面に複数（例えば３つ）設けられた吸着パッド１８１ａで基板Ｗを真空吸着して保持した状態で、モータ１８３の動力を、減速機１８２を介してステージ１８１に出力することにより、基板Ｗを回転させる。 The turntable 18 may have the same configuration as the turntable 13 described above. That is, the turntable 18 includes a stage 181, a speed reducer 182, a motor 183, and the like. The rotary table 18 holds the substrate W by vacuum suction with a plurality of (for example, three) suction pads 181 a provided on the upper surface of the stage 181 , and transfers the power of the motor 183 to the stage 181 via the speed reducer 182 . The substrate W is rotated by outputting.

図１１～図１３を参照し、変形例に係る位置決め台１７及び回転台１８を有する検査装置１のローダ部１０において、検査前の基板Ｗの位置決めを行う方法の一例について説明する。なお、検査後の基板Ｗの位置決めについても、検査前の基板Ｗの位置決めと同じ方法で実施できる。図１１～図１３は、基板Ｗを位置決めする動作の一例を示す図であり、位置決め台１７及び回転台１８を側方から見た図である。 An example of a method for positioning a substrate W before inspection in the loader section 10 of the inspection apparatus 1 having the positioning table 17 and the turntable 18 according to the modification will be described with reference to FIGS. 11 to 13. FIG. The positioning of the substrate W after inspection can be performed in the same manner as the positioning of the substrate W before inspection. 11 to 13 are diagrams showing an example of the operation for positioning the substrate W, and are diagrams of the positioning table 17 and the rotary table 18 as seen from the side.

本実施形態において、図１１（ａ）に示されるように、装置コントローラ３０は、基板搬送機構１５を制御して、ピック１５１を位置決め台１７の上方に進入させることにより、カセットＣに収容された基板Ｗを位置決め台１７の上方に搬送する。 In this embodiment, as shown in FIG. 11(a), the apparatus controller 30 controls the substrate transport mechanism 15 to move the pick 151 above the positioning table 17 so that the pick 151 is stored in the cassette C, as shown in FIG. The substrate W is transported above the positioning table 17 .

次いで、図１１（ｂ）に示されるように、装置コントローラ３０は、アクチュエータ１７４を制御して、ベース１７１をＵＰ位置まで上昇させる。ＵＰ位置は、保持ピン１７２の上端がステージ１８１の上面よりも高くなる位置である。 Next, as shown in FIG. 11(b), the device controller 30 controls the actuator 174 to raise the base 171 to the UP position. The UP position is a position where the upper end of the holding pin 172 is higher than the upper surface of the stage 181 .

次いで、図１１（ｃ）に示されるように、装置コントローラ３０は、基板搬送機構１５を制御して、ピック１５１を補正位置まで下降させることにより、保持ピン１７２上に基板Ｗを載置する。補正位置は、パッド１５１ｂが基板Ｗの下面から離間する位置であり、かつ、ブロック部１５１ｃの上面が基板Ｗの上面よりも高くなる位置である。 Next, as shown in FIG. 11C, the device controller 30 controls the substrate transport mechanism 15 to lower the pick 151 to the correction position, thereby placing the substrate W on the holding pins 172. As shown in FIG. The corrected position is a position where the pad 151b is separated from the bottom surface of the substrate W and a position where the top surface of the block portion 151c is higher than the top surface of the substrate W. FIG.

次いで、図１１（ｄ）に示されるように、装置コントローラ３０は、基板搬送機構１５を制御して、補正位置に位置するピック１５１を進入方向に第１の距離だけ移動させることにより、ブロック部１５１ｃの押圧面１５１ｄを基板Ｗの端部に押し当て押圧する。これにより、基板Ｗが保持ピン１７２上を摺動し、基板Ｗのブロック部１５１ｃ側の辺が押圧面１５１ｄと平行になる。第１の距離は、例えば３０ｍｍであってよい。 Next, as shown in FIG. 11(d), the device controller 30 controls the substrate transport mechanism 15 to move the pick 151 located at the correction position by the first distance in the approach direction, thereby causing the block section to move. The pressing surface 151d of 151c is pressed against the edge of the substrate W to press it. As a result, the substrate W slides on the holding pins 172, and the side of the substrate W on the side of the block portion 151c becomes parallel to the pressing surface 151d. The first distance may be 30 mm, for example.

次いで、図１２（ａ）に示されるように、装置コントローラ３０は、基板搬送機構１５を制御して、ピック１５１を後退方向に第２の距離だけ移動させることにより、ブロック部１５１ｃの押圧面１５１ｄを基板Ｗの端部から離間させる。これにより、ピック１５１に対する基板Ｗの第１方向の位置決めが終了する。第１方向は、ピック１５１の進退方向である。第２の距離は、例えば２０ｍｍであってよい。 Next, as shown in FIG. 12(a), the device controller 30 controls the substrate transport mechanism 15 to move the pick 151 backward by a second distance, thereby increasing the pressing surface 151d of the block portion 151c. are separated from the edge of the substrate W. This completes the positioning of the substrate W with respect to the pick 151 in the first direction. The first direction is the advancing/retreating direction of the pick 151 . The second distance may be 20 mm, for example.

次いで、図１２（ｂ）に示されるように、装置コントローラ３０は、基板搬送機構１５を制御して、ピック１５１をＵＰ位置まで上昇させることにより、保持ピン１７２上に載置された基板Ｗをパッド１５１ｂで保持する。ＵＰ位置は、基板Ｗの下面が保持ピン１７２から離間する位置である。 Next, as shown in FIG. 12B, the apparatus controller 30 controls the substrate transport mechanism 15 to raise the pick 151 to the UP position, thereby removing the substrate W placed on the holding pins 172. It is held by the pad 151b. The UP position is a position where the lower surface of the substrate W is separated from the holding pins 172 .

次いで、図１２（ｃ）に示されるように、装置コントローラ３０は、アクチュエータ１７４を制御して、ベース１７１をＤＯＷＮ位置まで下降させる。ＤＯＷＮ位置は、保持ピン１７２の上端がステージ１８１の上面よりも低くなる位置である。 Next, as shown in FIG. 12(c), the device controller 30 controls the actuator 174 to lower the base 171 to the DOWN position. The DOWN position is a position where the upper end of the holding pin 172 is lower than the upper surface of the stage 181 .

次いで、図１２（ｄ）に示されるように、装置コントローラ３０は、基板搬送機構１５を制御して、ピック１５１の進退方向において、ピック１５１（基板Ｗ）の中心が回転台１８の中心と一致するようにピック１５１を移動させる。 Next, as shown in FIG. 12(d), the device controller 30 controls the substrate transport mechanism 15 so that the center of the pick 151 (substrate W) coincides with the center of the turntable 18 in the advancing/retreating direction of the pick 151. The pick 151 is moved so as to

次いで、図１３（ａ）に示されるように、装置コントローラ３０は、基板搬送機構１５を制御して、ピック１５１をＤＯＷＮ位置まで下降させることにより、ステージ１８１上に基板Ｗを載置する。ＤＯＷＮ位置は、パッド１５１ｂが基板Ｗの下面から離間する位置である。 Next, as shown in FIG. 13A , the device controller 30 controls the substrate transport mechanism 15 to lower the pick 151 to the DOWN position, thereby placing the substrate W on the stage 181 . The DOWN position is a position where the pad 151b is separated from the bottom surface of the substrate W. FIG.

次いで、図１３（ｂ）に示されるように、装置コントローラ３０は、回転台１８を制御して、吸着パッド１８１ａで基板Ｗを吸着保持した状態で、ステージ１８１を９０°回転させることにより、該基板Ｗを９０°回転させる。また、装置コントローラ３０は、該基板Ｗを９０°回転させた後、回転台１８を制御して、吸着パッド１８１ａによる吸着を停止させる。 Next, as shown in FIG. 13(b), the apparatus controller 30 controls the turntable 18 to rotate the stage 181 by 90° while the substrate W is held by suction with the suction pads 181a. The substrate W is rotated by 90°. After rotating the substrate W by 90°, the apparatus controller 30 controls the turntable 18 to stop the suction by the suction pad 181a.

次いで、図１３（ｃ）に示されるように、装置コントローラ３０は、基板搬送機構１５を制御して、ピック１５１をＵＰ位置まで上昇させることにより、ステージ１８１上に載置された基板Ｗをパッド１５１ｂで保持する。ＵＰ位置は、基板Ｗの下面がステージ１８１から離間する位置である。 Next, as shown in FIG. 13(c), the device controller 30 controls the substrate transport mechanism 15 to raise the pick 151 to the UP position, thereby placing the substrate W placed on the stage 181 on the pad. 151b. The UP position is a position where the lower surface of the substrate W is separated from the stage 181 .

次いで、装置コントローラ３０は、基板搬送機構１５を制御して、ピック１５１の進退方向において、９０°回転した基板Ｗの中心が位置決め台１７の中心と一致するほうにピック１５１を移動させる。そして、図１１（ａ）～図１１（ｄ）及び図１２（ａ）～図１２（ｃ）に示されるように、装置コントローラ３０は、ピック１５１に対する基板Ｗの第１方向の位置決めと同じ方法で、ピック１５１に対する基板Ｗの第１方向と直交する第２方向の位置決めを行う。 Next, the device controller 30 controls the substrate transport mechanism 15 to move the pick 151 so that the center of the substrate W rotated by 90° coincides with the center of the positioning table 17 in the advancing/retreating direction of the pick 151 . Then, as shown in FIGS. 11(a) to 11(d) and FIGS. 12(a) to 12(c), the device controller 30 positions the substrate W in the first direction with respect to the pick 151 in the same manner. , the substrate W is positioned with respect to the pick 151 in a second direction orthogonal to the first direction.

以上により、ローダ部１０において、ピック１５１に対する検査前の基板Ｗの第１方向及び第２方向の位置決めが終了する。 As described above, in the loader section 10, the positioning of the substrate W before inspection with respect to the pick 151 in the first direction and the second direction is completed.

なお、上記の変形例では、位置決め台１７の保持ピン１７２が回転台１８のステージ１８１に対して昇降自在である場合を説明したが、本開示はこれに限定されない。例えば、回転台１８のステージ１８１が位置決め台１７の保持ピン１７２に対して昇降自在であってもよい。また、位置決め台１７の保持ピン１７２と回転台１８のステージ１８１の両方が昇降自在であってもよい。 In the modified example above, a case has been described in which the holding pins 172 of the positioning table 17 can move up and down with respect to the stage 181 of the turntable 18, but the present disclosure is not limited to this. For example, the stage 181 of the rotating table 18 may be vertically movable with respect to the holding pins 172 of the positioning table 17 . Also, both the holding pins 172 of the positioning table 17 and the stage 181 of the rotating table 18 may be vertically movable.

なお、上記の実施形態において、装置コントローラ３０は制御部の一例である。 It should be noted that in the above embodiments, the device controller 30 is an example of a control section.

今回開示された実施形態はすべての点で例示であって制限的なものではないと考えられるべきである。上記の実施形態は、添付の請求の範囲及びその趣旨を逸脱することなく、様々な形態で省略、置換、変更されてもよい。 It should be considered that the embodiments disclosed this time are illustrative in all respects and not restrictive. The above-described embodiments may be omitted, substituted or modified in various ways without departing from the scope and spirit of the appended claims.

上記の実施形態では、検査装置１を例に挙げて説明したが、本開示はこれに限定されない。検査装置１に代えて、基板Ｗに膜を形成する成膜装置、基板Ｗに形成された膜をエッチングするエッチング装置等の別の処理装置においても適用できる。 Although the inspection apparatus 1 has been described as an example in the above embodiment, the present disclosure is not limited to this. Instead of the inspection apparatus 1, the present invention can also be applied to other processing apparatuses such as a film forming apparatus for forming a film on the substrate W, an etching apparatus for etching a film formed on the substrate W, and the like.

１ 検査装置
１２，１７ 位置決め台
１３，１８ 回転台
１５ 基板搬送機構
１５１，１５２ ピック
１５１ｃ ブロック部
Ｗ 基板 Reference Signs List 1 inspection device 12, 17 positioning table 13, 18 rotating table 15 substrate transport mechanism 151, 152 pick 151c block W substrate

Claims (14)

矩形状の基板を搬送する搬送機構と、
前記基板を載置して前記基板の位置決めを行うための位置決め台と、
位置決めされた前記基板を回転させる回転台と、
を有し、
前記搬送機構は、前記位置決め台に載置された前記基板の端部を押圧して前記基板の位置決めを行うブロック部を含む、
処理装置。 a transport mechanism for transporting a rectangular substrate;
a positioning table for placing the substrate and positioning the substrate;
a turntable for rotating the positioned substrate;
has
The transport mechanism includes a block portion that presses an end portion of the substrate placed on the positioning table to position the substrate,
processing equipment. 前記基板を前記位置決め台に載置し、前記基板の端部を前記ブロック部で押圧することにより、前記基板の第１方向の位置決めを行うステップと、
前記第１方向の位置決めが行われた前記基板を前記回転台に載置して９０°回転させるステップと、
９０°回転した前記基板を前記位置決め台に載置し、前記基板の端部を前記ブロック部で押圧することにより、前記基板の前記第１方向と直交する第２方向の位置決めを行うステップと、
を実行するように構成される制御部を有する、
請求項１に記載の処理装置。 positioning the substrate in the first direction by placing the substrate on the positioning table and pressing the end portion of the substrate with the block portion;
placing the substrate positioned in the first direction on the turntable and rotating it by 90°;
a step of positioning the substrate in a second direction perpendicular to the first direction by placing the substrate rotated by 90° on the positioning table and pressing the end portion of the substrate with the block portion;
having a controller configured to perform
2. The processing apparatus of claim 1. 前記ブロック部は、前記搬送機構のピックの基端に設けられている、
請求項１又は２に記載の処理装置。 The block part is provided at the base end of the pick of the transport mechanism,
3. The processing apparatus according to claim 1 or 2. 前記ブロック部は、前記ピックの進退方向と直交し、前記基板の端部を押圧する押圧面を有する、
請求項３に記載の処理装置。 The block portion has a pressing surface that is perpendicular to the moving direction of the pick and presses the end portion of the substrate,
4. A processing apparatus according to claim 3. 前記ピックは、前記基板を保持する複数のパッドを含む、
請求項３又は４に記載の処理装置。 the pick includes a plurality of pads that hold the substrate;
5. The processing apparatus according to claim 3 or 4. 前記複数のパッドは、独立して吸引可能な少なくとも２つの吸着パッドを含む、
請求項５に記載の処理装置。 The plurality of pads includes at least two suction pads capable of suction independently.
6. A processing apparatus according to claim 5. 前記基板を収容するカセットと、
前記ピックで前記基板を前記カセットに収容する搬送経路に設けられ、前記ピックに保持された前記基板の位置を検出する位置検出センサと、
を有する、
請求項３乃至６のいずれか一項に記載の処理装置。 a cassette containing the substrate;
a position detection sensor provided in a transport path for storing the substrate in the cassette by the pick and detecting the position of the substrate held by the pick;
having
7. A processing apparatus according to any one of claims 3-6. 前記位置決め台は、
板状に形成されたベースと、
前記ベースから上方に突出して上端で前記基板を摺動自在に保持する複数の保持ピンと、を含む、
請求項１乃至７のいずれか一項に記載の処理装置。 The positioning table is
a plate-shaped base;
a plurality of holding pins projecting upward from the base and slidably holding the substrate at upper ends thereof;
8. A processing apparatus according to any one of claims 1-7. 前記位置決め台は、前記ベースを昇降させる昇降機構を含む、
請求項８に記載の処理装置。 The positioning table includes an elevating mechanism that elevates the base,
9. A processing apparatus according to claim 8. 前記位置決め台は、前記回転台の上方又は下方に設けられている、
請求項１乃至９のいずれか一項に記載の処理装置。 The positioning table is provided above or below the rotating table,
10. A processing apparatus according to any one of claims 1-9. 前記位置決め台は、前記回転台と一体として設けられている、
請求項１乃至９のいずれか一項に記載の処理装置。 The positioning table is provided integrally with the rotating table,
10. A processing apparatus according to any one of claims 1-9. 前記基板は、当該処理装置において処理が施される前の基板及び当該処理装置において処理が施された後の基板の少なくともいずれか一方である、
請求項１乃至１１のいずれか一項に記載の処理装置。 The substrate is at least one of a substrate before being processed by the processing apparatus and a substrate after being processed by the processing apparatus.
12. A processing apparatus according to any one of claims 1-11. 前記処理は、前記基板を検査する処理である、
請求項１２に記載の処理装置。 The process is a process of inspecting the substrate,
13. A processing apparatus according to claim 12. 位置決め台に載置された矩形状の基板の端部を、前記基板を搬送する搬送機構に設けられたブロック部で押圧することにより、前記基板の第１方向の位置決めを行うステップと、
前記第１方向の位置決めが行われた前記基板を回転台に載置して９０°回転させるステップと、
９０°回転した前記基板を前記位置決め台に載置し、前記基板の端部を前記ブロック部で押圧することにより、前記基板の前記第１方向と直交する第２方向の位置決めを行うステップと、
を有する、位置決め方法。 a step of positioning the substrate in the first direction by pressing an end portion of the rectangular substrate placed on the positioning table with a block portion provided in a transport mechanism for transporting the substrate;
placing the substrate positioned in the first direction on a turntable and rotating it by 90°;
a step of positioning the substrate in a second direction perpendicular to the first direction by placing the substrate rotated by 90° on the positioning table and pressing the end portion of the substrate with the block portion;
A positioning method comprising:
JP2021050980A 2021-03-25 2021-03-25 Processing device and positioning method Pending JP2022149046A (en)

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