JP2022146388A - circuit device - Google Patents

Abstract

To provide a technology which enables improvement of reliability of a circuit board included in a circuit device while achieving downsizing of the circuit device.SOLUTION: A first heat radiation member is thermally connected to a first bus bar. A second heat radiation member is thermally connected to a second bus bar. The first bus bar and the second bus bar respectively have a first facing portion and a second facing portion facing each other. The first facing portion has: a first surface mounted with a first electronic component; and a second surface at the opposite side of the first surface. The second facing portion has: a third surface facing the second surface; and a fourth surface located at the opposite side of the third surface and mounted with a second electronic component. A circuit board has a wiring board which is located at the back side relative to the first facing portion and at the front side relative to the second facing portion when the second facing portion side is viewed from the first facing portion side.SELECTED DRAWING: Figure 11

Description

The present disclosure relates to circuit devices.

Patent Literature 1 discloses a heat dissipation board on which electronic components are mounted. Further, Patent Document 2 discloses a circuit device including a heat sink, a semiconductor switching element mounted on the heat sink, and a circuit board electrically connected to the semiconductor switching element.

JP-A-9-321395 JP 2008-166383 A

A circuit device is desired to be miniaturized. Further, in the device disclosed in Patent Document 2, since the circuit board is arranged above the semiconductor switching elements, the circuit board is easily affected by the heat generated by the semiconductor switching elements, which may reduce the reliability of the circuit board. have a nature.

Therefore, it is an object of the present invention to provide a technique capable of improving the reliability of a circuit board included in the circuit device while reducing the size of the circuit device.

A circuit device according to the present disclosure includes: a first electronic component; a first bus bar on which the first electronic component is mounted; a second electronic component; a second bus bar on which the second electronic component is mounted; A first heat dissipation member thermally connected to one bus bar, a second heat dissipation member thermally connected to the second bus bar, and electrically connected to each of the first electronic component and the second electronic component. the first bus bar and the second bus bar each having a first facing portion and a second facing portion facing each other, the first facing portion having the first electronic component mounted thereon; and a second surface opposite to the first surface, and the second facing portion is a third surface facing the second surface of the first facing portion. and a fourth surface opposite to the third surface and on which the second electronic component is mounted, the circuit board extending from the first facing portion side to the second When viewed from the opposing portion side, it has a wiring substrate located further to the rear than the first opposing portion and closer to the front than the second opposing portion.

According to the present disclosure, it is possible to improve the reliability of the circuit board included in the circuit device while reducing the size of the circuit device.

FIG. 1 is a schematic diagram showing an example of a circuit device. FIG. 2 is a schematic diagram showing an example of a circuit device. FIG. 3 is a schematic diagram showing an example of a circuit device. FIG. 4 is a schematic diagram showing an example of a circuit configuration. FIG. 5 is a schematic diagram showing an example of a circuit configuration. FIG. 6 is a schematic diagram showing an example of a circuit configuration. FIG. 7 is a schematic diagram showing an example of a circuit structure. FIG. 8 is a schematic diagram showing an example of a circuit configuration. FIG. 9 is a schematic diagram showing an example of a circuit structure. FIG. 10 is a schematic diagram showing an example of a circuit configuration. FIG. 11 is a schematic diagram showing an example of a circuit structure. FIG. 12 is a schematic diagram showing an example of a circuit structure. FIG. 13 is a schematic diagram showing an example of busbars and conductive terminals. FIG. 14 is a schematic diagram showing a partially enlarged example of a circuit structure. 15A and 15B are schematic diagrams for explaining an example of a method for manufacturing a circuit structure. FIG. 16 is a schematic diagram for explaining an example of the manufacturing method of the circuit structure. 17A and 17B are schematic diagrams for explaining an example of a method for manufacturing a circuit structure. 18A and 18B are schematic diagrams for explaining an example of a method for manufacturing a circuit structure. 19A and 19B are schematic diagrams for explaining an example of a method for manufacturing a circuit structure. FIG. 20 is a schematic diagram for explaining an example of the manufacturing method of the circuit structure. FIG. 21 is a schematic diagram for explaining an example of the manufacturing method of the circuit structure. FIG. 22 is a schematic diagram showing an example of how the insulating portion is fixed to the conductive terminal. FIG. 23 is a schematic diagram showing an example of a circuit device. FIG. 24 is a schematic diagram showing a partially enlarged example of a circuit device. FIG. 25 is a schematic diagram showing an example of a circuit device. FIG. 26 is a schematic diagram showing an example of a case and a circuit structure. FIG. 27 is a schematic diagram showing an example of a heat radiating member and an insulating member. FIG. 28 is a schematic diagram showing an example of a heat radiating member and an insulating member. FIG. 29 is a schematic diagram for explaining an example of heat transfer paths.

[Description of Embodiments of the Present Disclosure]
First, the embodiments of the present disclosure are listed and described.

The circuit device of the present disclosure is as follows.

(1) A first electronic component, a first bus bar on which the first electronic component is mounted, a second electronic component, a second bus bar on which the second electronic component is mounted, and heat is applied to the first bus bar. a first heat dissipating member thermally connected, a second heat dissipating member thermally connected to the second bus bar, and a circuit board electrically connected to each of the first electronic component and the second electronic component. wherein the first bus bar and the second bus bar each have a first facing portion and a second facing portion facing each other, and the first facing portion is a first bus bar on which the first electronic component is mounted and a second surface opposite to the first surface, wherein the second facing portion has a third surface facing the second surface of the first facing portion; a fourth surface located opposite to the third surface and on which the second electronic component is mounted, the circuit board extending from the first facing portion side to the second facing portion side; When viewed, it has a wiring board located on the back side of the first facing portion and located on the front side of the second facing portion. According to the present disclosure, since the first electronic component and the second electronic component are respectively mounted on the first facing portion and the second facing portion facing each other, The planar size of the circuit device when viewed can be reduced. That is, it is possible to reduce the size of the circuit device. Further, according to the present disclosure, heat generated by the first electronic component is transferred to the first heat radiation member through the first facing portion of the first bus bar, and is released to the outside from the first heat radiation member. Further, the heat generated by the second electronic component is transferred to the second heat radiating member through the second facing portion of the second bus bar, and is radiated to the outside from the second heat radiating member. Here, when the second opposing portion side is viewed from the first opposing portion side, the wiring board is positioned on the back side of the first opposing portion and on the front side of the second opposing portion. The first electronic component is mounted on the first surface of the first facing portion opposite to the second surface on the side of the second facing portion, and the second electronic component is mounted on the second surface of the second facing portion. It is mounted on the fourth surface opposite to the third surface on the one facing portion side. Therefore, the wiring board is positioned on the opposite side of the first electronic component with respect to the first facing portion and on the opposite side of the second electronic component with respect to the second facing portion. Therefore, the wiring board is less susceptible to the heat generated by the first electronic component and the heat generated by the second electronic component. Therefore, the reliability of the circuit board is improved.

(2) further comprising a case that houses the first electronic component, the second electronic component, the first facing portion, the second facing portion, and the circuit board; Each may have a portion located on the outer surface of the case. In this case, since each of the first heat radiating member and the second heat radiating member has a portion positioned on the outer surface of the case, adjusting the size of the portion does not affect the arrangement of components in the case. It is possible to adjust the heat dissipation characteristics of the first heat dissipation member and the second heat dissipation member.

(3) It may further include a first thermally conductive material located on the first surface of the first facing portion, and the first heat radiating member may contact the first thermally conductive material. In this case, since the first heat radiating member is in contact with the first heat transfer material located on the first surface opposite to the second surface on the circuit board side in the first opposing portion, A heat transfer path from the first electronic component to the first heat radiation member can be shortened while avoiding interference between the first heat radiation member and the circuit board. Therefore, the heat dissipation characteristics of the circuit device are improved.

(4) further comprising: a third electronic component mounted on the first surface of the first facing portion; and a second thermally conductive material positioned on the first surface of the first facing portion; The first thermally conductive material is positioned around the first electronic component, the second thermally conductive material is positioned around the third electronic component, and the first heat dissipation member comprises the first thermally conductive material and the Each of the second thermally conductive materials may be contacted. In this case, since the first heat dissipation member is in contact with each of the first thermally conductive material around the first electronic component and the second thermally conductive material around the second electronic component, A heat transfer path to the first heat dissipation member and a heat transfer path from the second electronic component to the first heat dissipation member can be shortened. Therefore, the heat dissipation of the circuit device is improved.

(5) The first heat dissipating member has a contact surface that contacts the first thermally conductive material, and an annular protrusion that surrounds the periphery of the contact surface and protrudes from the contact surface toward the first surface. The first insulating member may further include a first insulating member having a portion, and the first thermally conductive material may have a filling portion that fills a recess formed by the contact surface and the annular protrusion. In this case, the first thermally conductive material has a filling portion that fills the recess formed by the contact surface of the first heat dissipating member and the annular projecting portion of the first insulating member. It can be brought into proper contact with the thermally conductive material. This improves the heat dissipation of the circuit device.

(6) The first electronic component has a first connection terminal and a second connection terminal that are adjacent to each other, and the first connection terminal and the second connection terminal are a first part to be joined and a second part to be joined. may be further provided with an insulating portion that is joined with a conductive bonding material to each of the first and second connection terminals and positioned between the first connection terminal and the second connection terminal. In this case, since the insulating portion is positioned between the first connection terminal and the second connection terminal, the conductive bonding material makes it difficult for the first connection terminal and the second connection terminal to short-circuit. Furthermore, since the positions of the first connection terminal and the second connection terminal are regulated by the insulating portion positioned between the first connection terminal and the second connection terminal, the first connection terminal and the second connection terminal are placed in the first connection terminal. The positions of the first connection terminal and the second connection terminal are less likely to be displaced when they are joined to the part to be joined and the second part to be joined.

(7) The first part to be joined is included in a conductive terminal electrically connected to the circuit board, is joined to each of the conductive terminal and the circuit board, and electrically connects the conductive terminal and the circuit board to each other. A curved conductive piece may be further provided for connecting the wires. In this case, the bent conductive piece is joined to each of the conductive terminal and the circuit board to electrically connect the conductive terminal and the circuit board to each other. The bending of the conductive piece can relax the thermal stress applied to the joint portion of the circuit board.

[Details of the embodiment of the present disclosure]
A specific example of the circuit device of the present disclosure will be described below with reference to the drawings. It should be noted that the present invention is not limited to these exemplifications, but is indicated by the scope of the claims, and is intended to include all modifications within the meaning and scope of equivalents to the scope of the claims.

<Overview of circuit device>
FIG. 1 is a schematic plan view showing an example of a circuit device 1. FIG. FIG. 2 is a schematic perspective view showing an example of a state in which the circuit device 1 shown in FIG. 1 is obliquely viewed from the back side of the page of FIG. FIG. 3 is a schematic side view showing an example of the circuit device 1 shown in FIG. 1 as viewed from the right side of the paper surface of FIG. The circuit device 1 is provided, for example, in a power supply path between a battery and various electrical components in an automobile. The circuit device 1 used for such applications is also called an electrical connection box. Note that the application of the circuit device 1 is not limited to this.

As shown in FIGS. 1 to 3, the circuit device 1 includes, for example, a circuit construction body 10 including a plurality of electronic components, a circuit board, etc., a case 70 that partially accommodates the circuit construction body 10, a circuit construction body and a plurality of heat radiating members 80 for radiating heat generated by the circuit device 1 to the outside of the circuit device 1 . In this example, the circuit device 1 includes, for example, two heat dissipation members 80a and 80b. The heat radiation members 80a and 80b are fixed to the case 70, for example.

In the following, the circuit device 1 will be described in detail using the XYZ orthogonal coordinate system shown in FIGS. In the following description, the +Z side is the upper side and the −Z side is the lower side.

<Outline description of the circuit structure>
4 to 12 are schematic diagrams showing an example of the circuit structure 10. FIG. FIG. 4 is a schematic perspective view showing an example of a state in which the circuit construction body 10 is viewed from above. FIG. 5 is a schematic perspective view showing an example of a state in which the circuit structure 10 is viewed from below. FIG. 6 is a schematic top view showing an example of the circuit structure 10. As shown in FIG. FIG. 7 is a schematic bottom view showing an example of the circuit structure 10. As shown in FIG. FIG. 8 is a schematic diagram showing an example of the appearance of the circuit structure 10 shown in FIG. 6 as viewed from the lower side of FIG. 6 (in other words, the -Y side). FIG. 9 is a schematic diagram showing an example of the appearance of the circuit structure 10 shown in FIG. 6 as viewed from the right side of FIG. 6 (in other words, from the -X side). FIG. 10 is a schematic diagram showing an example of a cross-sectional structure taken along line AA in FIG. FIG. 11 is a schematic diagram showing an example of a cross-sectional structure taken along line BB in FIG. FIG. 12 is a schematic diagram showing an example of a cross-sectional structure taken along line CC in FIG.

As shown in FIGS. 4 to 12, the circuit structure 10 includes, for example, the input side busbar 2, the output side busbar 3, the relay busbar 4, the input side busbar 2, the output side busbar 3 and the relay busbar 4. and an insulating member 5 for insulation. Further, the circuit structure 10 includes, for example, a circuit board 6, a plurality of electronic components 11, a plurality of electronic components 12, a plurality of conductive terminals 13, and a plurality of conductive pieces 14.

Each of the input side bus bar 2 (simply referred to as bus bar 2), the output side bus bar 3 (simply referred to as bus bar 3), and the relay bus bar 4 (simply referred to as bus bar 4) is, for example, a plate-like metal member. The thickness of the busbars 2, 3, 4 is, for example, 2 mm. The busbar 2 includes, for example, a body portion 20 and an input terminal portion 23 . The input terminal portion 23 has a through hole 23a penetrating in its thickness direction. The busbar 3 includes, for example, a body portion 30 and an output terminal portion 33 . The output terminal portion 33 has a through hole 33a penetrating in its thickness direction. The busbar 4 is positioned near the body portion 20 of the busbar 2 and the body portion 30 of the busbar 3 .

Each electronic component 11 is, for example, a switching element. The electronic component 11 is, for example, a MOESFET (metal-oxide-semiconductor field-effect transistor). A MOSFET is a type of semiconductor switching element. The electronic component 11 includes, for example, a drain terminal 113 , a plurality of source terminals 112 and a gate terminal 111 . Each of the drain terminal 113, the source terminal 112, and the gate terminal 111 can also be said to be a connection terminal. The plurality of electronic components 11 includes, for example, a plurality of electronic components 11a arranged on the upper side (in other words, the +Z side) and a plurality of electronic components 11b arranged in the lower side (in other words, the -Z side). In this example, the circuit structure 10 includes, for example, four electronic components 11a and four electronic components 11b.

Hereinafter, the electronic components 11, 11a and 11b may be called MOSFETs 11, 11a and 11b, respectively. The electronic component 11 may be a switching element other than a MOSFET. Also, the electronic component 11 may be an electronic component other than the switching element. Also, the number of electronic components 11 included in the circuit structure 10 is not limited to the above example.

Each electronic component 12 is, for example, a diode. The electronic component 12 is, for example, a Zener diode. The electronic component 12 has, for example, a cathode terminal 121 and two anode terminals 122 . Each of the cathode terminal 121 and the anode terminal 122 can also be said to be a connection terminal. The plurality of electronic components 12 includes, for example, one electronic component 12a arranged on the upper side and one electronic component 12b arranged on the lower side.

Hereinafter, the electronic components 12, 12, 12b may be called Zener diodes 12, 12a, 12b, respectively. Electronic component 12 may be a diode other than a Zener diode. Also, the electronic component 12 may be an electronic component other than a diode. Also, the number of electronic components 12 included in the circuit structure 10 is not limited to the above example.

Drain terminals 113 of the plurality of upper MOSFETs 11a are electrically connected to the body portion 20 of the input side bus bar 2, for example. Thereby, the drain terminals 113 of the plurality of MOSFETs 11a are electrically connected to each other. Each source terminal 112 of the plurality of MOSFETs 11a is electrically connected to the relay bus bar 4, for example. Thereby, the source terminals 112 of the plurality of MOSFETs 11a are electrically connected to each other.

The upper Zener diode 12a is an electronic component for preventing overvoltage from being applied between the drain terminal 113 and the source terminal 112 of the MOSFET 11a. The cathode terminal 121 of the Zener diode 12a is electrically connected to the body portion 20 of the input side bus bar 2, for example. Thereby, the cathode terminal 121 of the Zener diode 12a is electrically connected to the drain terminals 113 of the plurality of MOSFETs 11a. Each anode terminal 122 of the Zener diode 12a is electrically connected to the relay bus bar 4, for example. Thereby, the anode terminal 122 of the Zener diode 12a is electrically connected to the source terminals 112 of the plurality of MOSFETs 11a.

The drain terminals 113 of the plurality of lower MOSFETs 11b are electrically connected to the body portion 30 of the output side bus bar 3, for example. Thereby, the drain terminals 113 of the plurality of MOSFETs 11b are electrically connected to each other. Each source terminal 112 of the plurality of MOSFETs 11b is electrically connected to the relay bus bar 4, for example. Thereby, the source terminals 112 of the plurality of MOSFETs 11b are electrically connected to each other. Also, the source terminals 112 of the plurality of lower MOSFETs 11b are electrically connected to the source terminals 112 of the plurality of upper MOSFETs 11b. A source terminal 112 of the upper MOSFET 11 a and a source terminal 112 of the lower MOSFET 11 b are electrically connected to each other by the relay bus bar 4 .

The lower Zener diode 12b is an electronic component for preventing overvoltage from being applied between the drain terminal 113 and the source terminal 112 of the MOSFET 11b. The cathode terminal 121 of the Zener diode 12b is electrically connected to the body portion 30 of the output side bus bar 3, for example. Thereby, the cathode terminal 121 of the Zener diode 12b is electrically connected to the drain terminals 113 of the plurality of MOSFETs 11b. Each anode terminal 122 of the Zener diode 12b is electrically connected to the relay bus bar 4, for example. Thereby, the anode terminal 122 of the Zener diode 12b is electrically connected to the source terminals 112 of the plurality of MOSFETs 11b.

A wiring member extending from a battery, for example, is connected to the input terminal portion 23 of the input-side bus bar 2 using a through hole 23a. The input terminal portion 23 is supplied with the output voltage of the battery through the wiring member. The output voltage of the battery applied to the input terminal section 23 is applied to the drain terminal 113 of each MOSFET 11a through the body section 20. FIG.

For example, a wiring member extending from an electrical component is connected to the output terminal portion 33 of the output-side bus bar 3 using the through hole 33a. The voltage output from the drain terminal 113 of each lower MOSFET 11b is applied to the output terminal section 33 . The voltage applied to the output terminal portion 33 is applied as a power supply, for example, to an electrical component through a wiring member.

The circuit board 6 can control the switching operations of the MOSFETs 11, for example. The circuit board 6 is electrically connected to the gate terminal 111 of each MOSFET 11, for example. The circuit board 6 can apply voltage to the gate terminal 111 of the MOSFET 11, for example. The circuit board 6 can control the switching operation of the MOSFET 11 by controlling the voltage applied to the gate terminal 111 of the MOSFET 11, for example. The circuit board 6 can also be called a control board.

The conductive terminal 13 and conductive piece 14 are members for electrically connecting the gate terminal 111 of the MOSFET 11 to the circuit board 6 . Each of the conductive terminal 13 and the conductive piece 14 is, for example, a metal member. The plurality of conductive terminals 13 included in the circuit structure 10 includes, for example, a plurality of conductive terminals 13a arranged on the upper side and a plurality of conductive terminals 13b arranged on the lower side. The plurality of conductive pieces 14 included in the circuit structure 10 includes, for example, a plurality of conductive pieces 14a arranged on the upper side and a plurality of conductive pieces 14b arranged on the lower side.

The plurality of conductive terminals 13a on the upper side are electrically connected to the gate terminals 111 of the plurality of MOSFETs 11a on the upper side. A plurality of upper conductive pieces 14 a are electrically connected to the circuit board 6 . Also, the plurality of conductive pieces 14a are electrically connected to the plurality of conductive terminals 13a, respectively. The conductive terminal 13a is electrically connected to the circuit board 6 by a conductive piece 14a. The gate terminal 111 of the MOSFET 11a is electrically connected to the circuit board 6 by electrically connecting the conductive terminal 13a electrically connected to the gate terminal 111 of the MOSFET 11a to the circuit board 6 by the conductive piece 14a. .

The plurality of conductive terminals 13b on the lower side are electrically connected to the gate terminals 111 of the plurality of MOSFETs 11b on the lower side. A plurality of conductive pieces 14 b on the lower side are electrically connected to the circuit board 6 . Also, the plurality of conductive pieces 14b are electrically connected to the plurality of conductive terminals 13b, respectively. The conductive terminal 13b is electrically connected to the circuit board 6 by a conductive piece 14b. The gate terminal 111 of the MOSFET 11b is electrically connected to the circuit board 6 by electrically connecting the conductive terminal 13b electrically connected to the gate terminal 111 of the MOSFET 11b to the circuit board 6 by the conductive piece 14b. .

The insulating member 5 holds the busbars 2 , 3 , 4 and the plurality of conductive terminals 13 while electrically insulating the busbar 2 , the busbar 3 , the busbar 4 , and the conductive terminals 13 from each other, for example. The insulating member 5 is formed integrally with the busbars 2, 3, 4 and the plurality of conductive terminals 13, for example. The insulating member 5 is integrally formed with the busbars 2, 3, 4 and the plurality of conductive terminals 13 by insert molding, for example.

<Detailed description of the circuit structure>
<Configuration example of electronic components>
A plurality of upper MOSFETs 11a and Zener diodes 12a are arranged along the X direction. Among the plurality of MOSFETs 11a and Zener diodes 12a arranged in a line, the Zener diode 12a is located on the most -X side. A plurality of lower MOSFETs 11b and Zener diodes 12b are arranged along the X direction. Among the plurality of MOSFETs 11b and Zener diodes 12b arranged in a line, the Zener diode 12b is located on the most -X side.

MOSFET 11 is, for example, a surface mount component. A gate terminal 111, a source terminal 112 and a drain terminal 113 of the MOSFET 11 are made of metal, for example. The gate terminal 111, the source terminal 112 and the drain terminal 113 may be constructed of oxygen-free copper, for example. As this oxygen-free copper, for example, C1020 oxygen-free copper defined by Japanese Industrial Standards (JIS) may be employed. Also, the gate terminal 111, the source terminal 112, and the drain terminal 113 may be made of a copper alloy, or may be made of another kind of metal material.

The MOSFET 11 has, for example, a package in which a semiconductor element or the like is accommodated. The drain terminal 113 has, for example, a flat plate shape and is provided on the back surface of the package. The drain terminal 113 extends slightly outward from the side of the package. The gate terminal 111 and the source terminal 112 are lead terminals, for example, and have a shape in which an elongated plate-like portion is bent at two points. Each of the gate terminal 111 and the source terminal 112 has a shape in which an elongated plate-like portion is bent stepwise. Gate terminal 111 and source terminal 112 extend outward from the sides of the package, for example. The gate terminal 111 and the plurality of source terminals 112 are arranged in a row on the side opposite to the side where the drain terminal 113 extends, for example. Among the gate terminals 111 and the plurality of source terminals 112 arranged in a line, the gate terminal 111 is positioned on the outermost side.

Zener diode 12 is, for example, a surface mount component. The cathode terminal 121 and the anode terminal 122 of the Zener diode 12 are made of metal, for example. The cathode terminal 121 and the anode terminal 122 may be made of oxygen-free copper, for example. As this oxygen-free copper, for example, C1020 oxygen-free copper defined by JIS may be adopted. Also, the cathode terminal 121 and the anode terminal 122 may be made of a copper alloy, or may be made of another kind of metal material.

The Zener diode 12 has, for example, a package containing a semiconductor element or the like. The cathode terminal 121 has a flat plate shape, for example. A cathode terminal 121 is provided on the back surface of the package. Cathode terminal 121 extends slightly outward from the side of the package. The anode terminal 122 is, for example, a lead terminal, and has a shape in which an elongated plate-like portion is bent at two points. Anode terminal 122 has a shape in which an elongated plate-like portion is bent in a stepped shape. Anode terminal 122 extends outwardly from the side of the package. The two anode terminals 122 are arranged next to each other on the side opposite to the side where the cathode terminal 121 extends, for example.

<Configuration example of bus bar>
The busbars 2, 3, 4 are made of copper or a copper alloy, for example. The busbars 2, 3, 4 may be made of oxygen-free copper, for example. As this oxygen-free copper, for example, C1020 oxygen-free copper defined by JIS may be adopted. The busbars 2, 3, 4 may be made of metals other than copper and copper alloys.

FIG. 13 is a schematic diagram showing an example of the busbars 2, 3, 4 and the conductive terminals 13. As shown in FIG. As shown in FIGS. 4, 6, 13, etc., the busbar 2 is formed of, for example, a plate-like member having an approximately L shape. The body portion 20 of the busbar 2 is, for example, an L-shaped plate-like portion. The body portion 20 is composed of, for example, a first portion 21 on which a plurality of MOSFETs 11 a and Zener diodes 12 a are mounted, and a second portion 22 connecting the first portion 21 and the input terminal portion 23 . The first portion 21 is, for example, a plate-like portion extending along the X direction. The second portion 22 is, for example, a plate-like portion extending from the −X side end of the first portion 21 along the +Y direction. The first portion 21 and the second portion 22 are positioned on the same plane. The input terminal portion 23 extends along the +Y direction after slightly extending downward from the +Y side end of the second portion 22 . A boundary portion between the second portion 22 and the input terminal portion 23 is curved stepwise.

As shown in FIGS. 5, 7, 13, etc., the bus bar 3 is composed of, for example, a plate-like member having an approximately L shape. The body portion 30 of the busbar 3 is, for example, an L-shaped plate-like portion. The body portion 30 is composed of, for example, a first portion 31 on which a plurality of MOSFETs 11b and Zener diodes 12b are mounted, and a second portion 32 connecting the first portion 31 and the output terminal portion 33 together. The first portion 31 is, for example, a plate-like portion extending along the X direction. The second portion 32 is, for example, a plate-like portion extending from the +X side end of the first portion 31 along the +Y direction. The first portion 31 and the second portion 32 are located on the same plane with each other. The output terminal portion 33 extends along the +Y direction after slightly extending upward from the +Y side end of the second portion 32 . A boundary portion between the second portion 32 and the output terminal portion 33 is curved in a stepped shape.

Busbar 2 is positioned above busbar 3 so as to partially face busbar 3 in the Z direction. The first portion 21 of the busbar 2 and the first portion 31 of the busbar 3 face each other in the Z direction. The second portion 22 of the busbar 2 is located on the -X side of the second portion 32 of the busbar 3 . When the circuit structure 10 is viewed from above or below, the second portion 22 extending along the Y direction and the second portion 32 extending along the Y direction are parallel to each other. . Henceforth, the 1st part 21 and the 1st part 31 which mutually oppose may be called the facing part 21 and the facing part 31, respectively.

The upper plate-shaped opposing portion 21 has a main surface 211 (also referred to as an outer surface 211) facing the outside of the circuit construct 10 and a main surface 212 (also referred to as an inner surface 212) facing the inside of the circuit construct 10. have. The outer surface 211 is positioned on the +Z side, and the inner surface 212 is positioned on the -Z side. Outer surface 211 is located opposite inner surface 212 .

A plurality of MOSFETs 11a and Zener diodes 12a are mounted on the outer surface 211 . The drain terminal 113 of each MOSFET 11a and the cathode terminal 121 of the Zener diode 12a are joined to the outer surface 211 with a conductive joint material such as solder. Thereby, the drain terminals 113 of the plurality of MOSFETs 11a and the cathode terminals 121 of the Zener diodes 12a are electrically connected to each other through the bus bar 2 .

The lower plate-shaped facing portion 31 has a main surface 311 (also referred to as an outer surface 311) facing the outside of the circuit construct 10 and a main surface 312 (also referred to as an inner surface 312) facing the inside of the circuit construct 10. have The outer surface 311 is located on the -Z side, and the inner surface 312 is located on the +Z side. Outer surface 311 is located opposite inner surface 312 .

A plurality of MOSFETs 11b and Zener diodes 12b are mounted on the outer surface 311 . The drain terminal 113 of each MOSFET 11b and the cathode terminal 121 of the Zener diode 12b are joined to the outer surface 311 with a conductive joint material such as solder. Thereby, the drain terminals 113 of the plurality of MOSFETs 11b and the cathode terminals 121 of the Zener diodes 12b are electrically connected to each other through the bus bar 3 .

The busbar 4 has, for example, a generally U-shaped plate-shaped member. The bus bar 4 includes, for example, a plurality of flat plate-like first portions 40a, a plurality of flat plate-like second portions 40b, and a plate-like connecting portion that connects the plurality of first portions 40a and the plurality of second portions 40b. 41.

The plurality of first portions 40a are arranged along the X direction, for example, apart from each other. The plurality of second portions 40b are arranged along the X direction, for example, apart from each other. The plurality of first portions 40a face the plurality of second portions 40b in the Z direction. The plurality of first portions 40a are positioned on the upper side, and the plurality of second portions 40b are positioned on the lower side.

Each first portion 40a is located on the same plane as the opposing portion 21, for example. Each first portion 40a is, for example, arranged side by side with the opposing portion 21 at intervals in the Y direction. Each second portion 40b is located on the same plane as the facing portion 31, for example. Each second portion 40b is, for example, arranged side by side with the opposing portion 31 at intervals in the Y direction.

The multiple first portions 40a include, for example, four first portions 40a respectively corresponding to the four MOSFETs 11a and one first portion 40a corresponding to the Zener diode 12a. A plurality of source terminals 112 of each MOSFET 11a are joined to the first portion 40a corresponding to the MOSFET 11a. The source terminal 112 of the MOSFET 11a is joined to the main surface (also referred to as the outer surface) on the +Z side of the first portion 40a with a conductive joint material such as solder. Each anode terminal 122 of the Zener diode 12a is joined to the first portion 40a corresponding to the Zener diode 12a. The anode terminal 122 of the Zener diode 12a is bonded to the outer surface of the first portion 40a with a conductive bonding material such as solder. The source terminals 112 of the MOSFETs 11a and the anode terminals 122 of the Zener diodes 12a are electrically connected to each other through the bus bar 4. As shown in FIG. Henceforth, the 1st part 40a may be called the part to be welded 40a or the upper part to be welded 40a.

The multiple second portions 40b include, for example, four second portions 40b respectively corresponding to the four MOSFETs 11b and one second portion 40b corresponding to the Zener diode 12b. A plurality of source terminals 112 of each MOSFET 11b are joined to the second portion 40b corresponding to the MOSFET 11b. The source terminal 112 of the MOSFET 11b is joined to the main surface (also referred to as the outer surface) on the −Z side of the second portion 40b with a conductive joint material such as solder. Each anode terminal 122 of the Zener diode 12b is joined to the second portion 40b corresponding to the Zener diode 12b. The anode terminal 122 of the Zener diode 12b is bonded to the outer surface of the second portion 40b with a conductive bonding material such as solder. The source terminals 112 of the multiple MOSFETs 11b and the anode terminals 122 of the Zener diodes 12b are electrically connected to each other through the bus bar 4 . Hereinafter, the second portion 40b may be referred to as the part to be welded 40b or the lower part to be welded 40b.

The connection portion 41 of the busbar 4 extends, for example, along the X direction. The connection portion 41 connects, for example, the -Y side ends of the plurality of parts to be welded 40a and the -Y side ends of the plurality of parts to be welded 40b.

In addition, in order to facilitate soldering of the terminals and the like to the bus bars 2, 3, and 4, to reduce the contact resistance between the wiring member and the input terminal portion 23, and to reduce the contact resistance between the wiring member and the output terminal portion 33, For reduction, the busbars 2, 3, 4 may have metal plating, such as nickel plating, on their surfaces.

<Configuration example of circuit board>
The circuit board 6 is electrically connected to the multiple MOSFETs 11 . The circuit board 6 includes, for example, a wiring board 60 and a plurality of components mounted on the wiring board 60 . The wiring board 60 extends, for example, along the XY plane, and has an upper major surface 60a (also called an upper side surface 60a) and a lower major surface 60b (also called a lower side surface 60b). The upper side surface 60a is located on the opposite side of the lower side surface 60b and faces the lower side surface 60b in the Z direction.

The wiring board 60 has, for example, an insulating substrate and at least one conductive layer provided on the insulating substrate. The insulating substrate may be, for example, a ceramic substrate or a substrate containing resin. In the latter case, the insulating substrate may be a glass epoxy substrate or another substrate containing resin. The conductive layer may be composed of copper, for example, or may be composed of other metals.

The wiring board 60 is located on the back side of the facing portion 21 and on the front side of the facing portion 31 when the facing portion 31 side is viewed from the facing portion 21 side. It can be said that the wiring board 60 is located on the back side of the facing portion 21 and located on the front side of the facing portion 31 when viewed from above (in other words, +Z side). Further, it can be said that the wiring board 60 is located on the back side of the facing portion 31 and located on the front side of the facing portion 21 when viewed from below (in other words, the −Z side).

The wiring board 60 has, for example, a portion positioned between the body portion 20 of the busbar 2 and the body portion 30 of the busbar 3 in the vertical direction. Specifically, the wiring board 60 has a portion positioned between the facing portions 21 and 31 in the vertical direction and a portion positioned between the second portions 22 and 32 in the vertical direction. include. The upper side surface 60a of the wiring board 60 has an exposed area 60aa exposed from the busbar 2 when viewed from above. A lower side surface 60b of the wiring board 60 has an exposed area 60bb exposed from the busbar 3 when viewed from below.

The multiple components mounted on the wiring board 60 include, for example, multiple electronic components. The plurality of electronic components includes, for example, the microcomputer 62 . Moreover, the plurality of components mounted on the wiring board 60 includes, for example, a connector 65 . The microcomputer 62 and the connector 65 are mounted, for example, on the exposed area 60bb of the lower surface 60b of the wiring board 60. As shown in FIG. The microcomputer 62 has, for example, a CPU (Central Processing Unit) and memory. The microcomputer 62 can control the switching operations of the MOSFETs 11, for example.

The connector 65 is, for example, a connector for electrically connecting a device outside the circuit device 1 (also referred to as an external device) and the circuit board 6 . A wiring member extending from an external device is connected to the connector 65 . The connector 65 has two metal parts 651 for fixing the connector 65 to the wiring board 60 and a plurality of connection terminals 652 . The two metal parts 651 and the plurality of connection terminals 652 are bonded to the wiring board 60 . Microcomputer 62 is electrically connected to an external device through connector 65 . The microcomputer 62 controls the switching operation of each MOSFET 11 according to instructions from an external device.

The wiring board 60 has, for example, a conductive layer positioned on the upper side surface 60a (also referred to as an upper conductive layer) and a conductive layer positioned on the lower side surface 60b (also referred to as a lower conductive layer). The upper conductive layer includes, for example, a plurality of lands 61a electrically connected to the gate terminals 111 of the MOSFETs 11a. The lower conductive layer includes a plurality of lands 61b electrically connected to the gate terminals 111 of the MOSFETs 11b, respectively. The plurality of lands 61a are located in exposed regions 60aa of the upper side surface 60a of the wiring board 60, for example. The plurality of lands 61b are located, for example, in the exposed area 60bb of the lower side surface 60b of the wiring board 60. As shown in FIG. The plurality of lands 61a and the plurality of lands 61b are electrically connected to a drive circuit that applies voltage to the gate terminal 111 of each MOSFET 11. FIG. A drive circuit is provided on the wiring board 60, and the microcomputer 62 controls the switching operation of each MOSFET 11 through the drive circuit.

In addition, the lower conductive layer includes two lands 66b to which the two metal portions 651 of the connector 65 are respectively joined, and a plurality of lands 67b to which the plurality of connection terminals 652 of the connector 65 are respectively joined. ing. The two lands 66b and the plurality of lands 67b are located, for example, in the exposed area 60bb of the lower surface 60b of the wiring board 60. As shown in FIG. A metal portion 651 of the connector 65 is joined to the land 66b with a conductive joining material such as solder. The connection terminal 652 of the connector 65 is joined to the land 67b with a conductive joining material such as solder.

At least one of the microcomputer 62 and the connector 65 may be provided on the upper surface 60 a of the wiring board 60 . Also, the wiring board 60 may be a single-layer board or a multi-layer board. The wiring board 60 may have a conductive layer in its inner layer.

<Configuration example of conductive terminal>
The plurality of conductive terminals 13 includes a plurality of conductive terminals 13a to which the gate terminals 111 of the MOSFETs 11a are respectively connected, and a plurality of conductive terminals 13b to which the gate terminals 111 of the MOSFETs 11b are respectively connected. Each conductive terminal 13 may be made of, for example, a copper alloy, or may be made of another metal material.

The conductive terminal 13 has, for example, a shape obtained by bending one end of an elongated plate-like member into a substantially U shape. The thickness of the conductive terminal 13 is, for example, 0.6 mm. The conductive terminal 13 has, at one end thereof, a junction target portion 130 to be joined with the gate terminal 111 of the MOSFET 11 . In addition, the conductive terminal 13 has, at the other end thereof, a joining target portion 131 to which the conductive piece 14 is joined. The conductive terminal 13 includes a connecting portion 132 that connects the joining target portion 130 and the joining target portion 131 .

The part to be welded 130 is, for example, a plate-like part extending along the Y direction. The bonding target portion 130 of the upper conductive terminal 13a is located on the -Z side of the gate terminal 111 of the MOSFET 11a. The bonding target portion 130 of the lower conductive terminal 13b is located on the +Z side of the gate terminal 111 of the MOSFET 11b. The flat plate-like joining target part 130 has a pair of main surfaces facing each other. One main surface of the part to be welded 130 of the conductive terminal 13 a is located on the same plane as the main surface on the +Z side of the upper part to be welded 40 a of the busbar 4 , for example. The gate terminal 111 of the MOSFET 11a is bonded to one main surface of the bonding target portion 130 of the conductive terminal 13a with a conductive bonding material such as solder. One main surface of the joining target portion 130 of the conductive terminal 13b is located on the same plane as the −Z side main surface of the lower joining target portion 40b of the bus bar 4, for example. The gate terminal 111 of the MOSFET 11b is bonded to one main surface of the bonding target portion 130 of the conductive terminal 13b with a conductive bonding material such as solder.

The part to be joined 131 is, for example, a plate-like part. The flat plate-like joining target portion 131 has a pair of main surfaces facing each other. The joining target portion 131 of the upper conductive terminal 13a is located on the upper side surface 60a of the wiring board 60 while being slightly separated from the upper side surface 60a. One main surface of the joining target portion 131 of the conductive terminal 13 a faces the upper side surface 60 a of the wiring board 60 . The joining target portion 131 of the conductive terminal 13a is located near the land 61a of the wiring board 60 and on the -Y side of the land 61a.

The joining target portion 131 of the lower conductive terminal 13b is located on the lower side surface 60b of the wiring board 60 while being slightly separated from the lower side surface 60b. One main surface of the joining target portion 131 of the conductive terminal 13 b faces the lower side surface 60 b of the wiring board 60 . The joining target portion 131 of the conductive terminal 13b is positioned near the land 61b of the wiring board 60 and on the -Y side of the land 61b.

The connecting portion 132 has, for example, a shape obtained by bending one end of an elongated plate-like portion into an L shape. The connection portion 132 of the conductive terminal 13a extends along the +Y direction after slightly extending from the −Y side end of the joint target portion 130 of the conductive terminal 13a to the −Z side, and then extends along the +Y direction. is connected to the -Y side end of The connection portion 132 of the conductive terminal 13b extends along the +Y direction after slightly extending from the −Y side end of the joint target portion 130 of the conductive terminal 13b to the +Z side, and extends along the +Y direction. It is connected to the -Y side end.

It should be noted that the conductive terminal 13 may have a metal plating such as nickel plating on its surface in order to facilitate soldering of members to the conductive terminal 13 .

<Configuration example of conductive piece>
The plurality of conductive pieces 14 include a plurality of conductive pieces 14a to which the plurality of conductive terminals 13a are respectively joined, and a plurality of conductive pieces 14b to which the plurality of conductive terminals 13b are respectively joined. Each conductive piece 14 may be made of, for example, a copper alloy or other metal material.

As shown in FIGS. 10 to 12 and the like, the conductive piece 14 has, for example, a shape in which a plate-like member is bent at two points. The conductive piece 14, for example, generally has a shape in which a plate-like member is bent stepwise. The conductive piece 14 can also be called a bent conductive piece 14 . The thickness of the conductive piece 14 is smaller than the thickness of the conductive terminal 13, for example. The conductive piece 14a is a member for electrically connecting the conductive terminal 13a and the land 61a. The conductive piece 14b is a member for electrically connecting the conductive terminal 13b and the land 61b. Conductive piece 14 is also called a jumper chip.

The conductive piece 14 a is arranged from the bonding target portion 131 of the conductive terminal 13 a to the land 61 a of the wiring board 60 . The conductive piece 14a has a terminal upper portion located on the joining target portion 131 of the conductive terminal 13a. The terminal upper portion of the conductive piece 14a is joined to the joining target portion 131 of the conductive terminal 13a with a conductive joining material such as solder. Conductive piece 14 a has a land portion located on land 61 a of wiring board 60 . The land upper portion of the conductive piece 14a is joined to the land 61a with a conductive jointing material such as solder. The conductive piece 14a has an inclined portion connecting the terminal upper portion and the land upper portion. The conductive piece 14a is bent at the boundary between the terminal upper portion and the inclined portion, and is bent at the boundary between the inclined portion and the land upper portion.

The conductive piece 14 b is arranged from the joining target portion 131 of the conductive terminal 13 b to the land 61 b of the wiring board 60 . The conductive piece 14b has a terminal upper portion located on the joining target portion 131 of the conductive terminal 13b. The terminal upper portion of the conductive piece 14b is joined to the joining target portion 131 of the conductive terminal 13b with a conductive joining material such as solder. Conductive piece 14 b has a land portion located on land 61 b of wiring board 60 . The land upper portion of the conductive piece 14b is joined to the land 61b with a conductive jointing material such as solder. The conductive piece 14b has an inclined portion connecting the terminal upper portion and the land upper portion. The conductive piece 14b is bent at the boundary between the terminal upper portion and the inclined portion, and is bent at the boundary between the inclined portion and the land upper portion.

Thus, in this example, the bent conductive piece 14 is joined to each of the conductive terminal 13 and the circuit board 6 to electrically connect the conductive terminal 13 and the circuit board 6 to each other. Thus, the bending of the conductive piece 14 can relax the thermal stress applied to the joint portion of the conductive terminal 13 and the joint portion of the circuit board 6 due to the thermal deformation of the conductive terminal 13 and the circuit board 6 .

<Configuration example of insulating member>
The insulating member 5 is made of, for example, an insulating resin. The insulating member 5 may be made of PPS (Poly Phenylene Sulfide) resin, for example. The insulating member 5 is formed integrally with the busbars 2, 3, 4 and the plurality of conductive terminals 13, for example.

The insulating member 5 includes a substantially frame-shaped insulating portion 51, an insulating portion 52a having a portion positioned between the busbars 2 and 4, and an insulating portion 52b having a portion positioned between the busbars 4 and 4. and

A substantially frame-shaped insulating portion 51 surrounds the body portion 20 of the busbar 2 , the body portion 30 of the busbar 3 , and the circuit board 6 . The insulating portion 51 includes a first portion 51a and a second portion 51b extending along the Y direction and facing each other in the X direction, and a third portion 51a and a second portion 51b extending along the X direction and facing each other in the Y direction. It is composed of a portion 51c and a fourth portion 51d.

The first portion 51a has a flat plate shape, extends along the −X side end surface of the second portion 22 of the main body 20, and is attached to the end surface. The second portion 51b has a flat plate shape, extends along the +X side end face of the second portion 32 of the body portion 30, and is attached to the end face. The third portion 51c is generally flat, extends along the inner surface of the connecting portion 41 of the busbar 4, and is attached to the inner surface. The fourth portion 51d has a flat plate shape and extends along the +Y side end surface of the wiring board 60 .

As shown in FIG. 5, the second portion 51b is provided with a slit 55 extending along the Y direction. As will be described later, when the circuit structure 10 is manufactured, the wiring substrate 60 is put inside the substantially frame-shaped insulating portion 51 through the slit 55 .

The insulating portions 52a and 52b are generally flat, for example. The insulating portions 52a and 52b extend from the first portion 51a to the second portion 51b of the insulating portion 51 so that the insulating portions 52a and 52b face each other in the Z direction. The −Y side ends of the insulating portions 52 a and 52 b are connected to the third portion 51 c of the insulating portion 51 . The +Y side end faces of the insulating portions 52 a and 52 b are located on the same plane as the +Y side end face of the facing portion 21 of the busbar 2 and the +Y side end face of the facing portion 31 of the busbar 3 , for example. The insulating portion 52a is located on the +Z side of the wiring substrate 60, and the insulating portion 52b is located on the −Z side of the wiring substrate 60. FIG.

The upper insulating portion 52a extends along the -Z side main surface of the facing portion 21 of the busbar 2 and the -Z side main surfaces of the plurality of upper parts to be joined 40a of the busbar 4, and is attached to these main surfaces. has a first portion. The insulating portion 52a has a second portion positioned between the -Y side end surface of the facing portion 21 of the busbar 2 and the +Y side end surface of each upper joint target portion 40a of the busbar 4 . In this example, as shown in FIG. 10 and the like, the package of the MOSFET 11a is positioned not only on the facing portion 21 but also on the second portion of the insulating portion 52a.

The lower insulating portion 52b spreads along the +Z side main surface of the facing portion 31 of the busbar 3 and the +Z side main surface of the plurality of lower joint target portions 40b of the busbar 4, and is attached to these main surfaces. has a first portion. The insulating portion 52b has a second portion positioned between the -Y side end surface of the facing portion 31 of the busbar 3 and the +Y side end surface of each lower joint target portion 40b of the busbar 4 . In this example, as shown in FIG. 10 and the like, the package of the MOSFET 11b is positioned not only on the facing portion 31 but also on the second portion of the insulating portion 52b.

As shown in FIGS. 4, 6, 8, etc., in this example, among the four conductive terminals 13a, the three conductive terminals 13a other than the conductive terminal 13a located on the most +X side are adjacent to each other. It has a portion located between the two upper parts to be welded 40a. The insulating member 5 is provided to electrically insulate between the two upper parts to be joined 40a and the conductive terminal 13a having a portion positioned between the two upper parts to be joined 40a adjacent to each other. An insulating portion is provided between the joining target portions 40a. This insulating portion is included in the third portion 51c of the insulating portion 51 and the insulating portion 52a. Among the four conductive terminals 13a, the conductive terminal 13a located on the most +X side has a portion facing the +X side end surface of the upper joining target portion 40a. In order to achieve electrical insulation between the conductive terminal 13a located on the most +X side and the upper part to be joined 40a, the insulating member 5 is provided on the +X side end face of the conductive terminal 13a located on the most +X side and the upper part to be joined 40a. It has an insulating portion located between This insulating portion is included in the third portion 51c of the insulating portion 51 and the insulating portion 52a.

As shown in FIGS. 5, 7, 8, etc., in this example, each of the four conductive terminals 13b has a portion positioned between two adjacent lower bonding target portions 40b. In order to achieve electrical insulation between the conductive terminal 13b having a portion positioned between the two adjacent lower parts to be joined 40b and the two lower parts to be joined 40b, the insulating member 5 is provided between the two lower parts to be joined 40b. An insulating portion is provided between the two lower joining target portions 40b. This insulating portion is included in the third portion 51c of the insulating portion 51 and the insulating portion 52b.

The insulating member 5 includes a plurality of insulating portions 50 in addition to the insulating portions 51, 52a, and 52b. The plurality of insulating portions 50 are composed of a plurality of insulating portions 50a respectively corresponding to the plurality of MOSFETs 11a and a plurality of insulating portions 50b respectively corresponding to the plurality of MOSFETs 11b.

FIG. 14 is a schematic diagram showing an enlarged example of the periphery of the MOSFET 11a. The insulating portion 50a is located between the corresponding gate terminal 111 of the MOSFET 11a and the source terminal 112 next to the gate terminal 111. As shown in FIG. The insulating portion 50 a has a portion located in a gap between the gate terminal 111 and the source terminal 112 adjacent to the gate terminal 111 . The insulating portion 50a is, for example, a thin plate-like portion. The insulating portion 50a extends to the +Z side from a portion of the insulating member 5 located between the conductive terminal 13a and the +X side end surface of the upper joining target portion 40a. In the insulating portion 50a, the projection distance of the conductive terminal 13a from the +Z side surface of the bonding target portion 130 and the upper bonding target portion 40a is larger than the thickness of the gate terminal 111 and the source terminal 112 of the MOSFET 11a. The protrusion distance is, for example, about 1 mm. The insulating portion 50a has, for example, a portion located between a tip portion 111a of the gate terminal 111 joined to the conductive terminal 13a and a tip portion 112a of the source terminal 112 joined to the upper joining target portion 40a.

The insulating portion 50b is located between the corresponding gate terminal 111 of the MOSFET 11b and the source terminal 112 next to the gate terminal 111. As shown in FIG. The insulating portion 50b has a portion located in the gap between the gate terminal 111 and the source terminal 112 adjacent to the gate terminal 111 . The insulating portion 50b is, for example, a thin plate-like portion. The insulating portion 50b extends to the -Z side from a portion of the insulating member 5 located between the conductive terminal 13b and the -X side end surface of the lower joining target portion 40b. The projection distance of the insulating portion 50b from the -Z side surfaces of the bonding target portion 130 of the conductive terminal 13b and the lower bonding target portion 40b is larger than the thickness of the gate terminal 111 and the source terminal 112 of the MOSFET 11b. The protrusion distance is, for example, about 1 mm. The insulating portion 50b has, for example, a portion positioned between a tip portion 111a of the gate terminal 111 joined to the conductive terminal 13b and a tip portion 112a of the source terminal 112 joined to the lower joining target portion 40b.

Here, unlike this example, consider a case where the circuit structure 10 does not include the insulating portion 50 . In this case, a conductive bonding material, such as solder, flows between the gate terminal 111 and the adjacent source terminal 112 to bond them to the bonding target portion. 112 may be short-circuited by the conductive bonding material. Further, when the gate terminal 111, the source terminal 112 and the drain terminal 113 of the MOSFET 11 are soldered by, for example, a reflow method, the solder flows between the gate terminal 111 and the source terminal 112 to change the position of the MOSFET 11 and the gate. The positions of the terminal 111 and the source terminal 112 may shift.

In this example, since the insulating portion 50 is positioned between the gate terminal 111 and the adjacent source terminal 112, there is a possibility that the gate terminal 111 and the source terminal 112 will be short-circuited by a conductive bonding material such as solder. Reduce. Furthermore, since the positions of the gate terminal 111 and the source terminal 112 are regulated by the insulating portion 50 positioned between the gate terminal 111 and the source terminal 112, when the gate terminal 111 and the source terminal 112 are bonded to the bonding target portion, As a result, the positions of the gate terminal 111 and the source terminal 112 are less likely to shift.

<An example of a method for manufacturing a circuit structure>
When the circuit assembly 10 having the above configuration is manufactured, first, the busbar material is subjected to, for example, cold forging, cutting, or the like, so that the busbars 2, 3, and 4 are manufactured. Further, for example, the metal plate is press-worked to produce a plurality of conductive terminals 13 . Metal plating such as nickel plating may be formed on the surfaces of the fabricated busbars 2, 3, 4 and conductive terminals 13 by, for example, an electroplating method or a chemical deposition method.

Next, as shown in FIG. 15, the busbars 2, 3, 4 and the plurality of conductive terminals 13 are placed in the insert molding die. In FIG. 15, the illustration of the insert molding die is omitted. Then, a thermoplastic resin having excellent heat resistance such as PPS resin is injected from an injection molding machine into an insert molding die to integrally mold the busbars 2, 3, 4 and the plurality of conductive terminals 13 with the resin. As a result, as shown in FIG. 16, an integrally molded product is obtained in which the busbars 2, 3, 4, the plurality of conductive terminals 13, and the insulating member 5 are integrally molded. FIG. 17 is a schematic diagram showing an enlarged example of the periphery of the insulating portion 50a provided in the insulating member 5. As shown in FIG.

Next, as shown in FIG. 18, the wiring substrate 60 is inserted into the insulating portion 51 through the slit 55 (see FIG. 5) provided in the second portion 51b of the substantially frame-shaped insulating portion 51 of the insulating member 5. It is put in and attached to the insulating member 5 . As a result, as shown in FIG. 19, the wiring board 60 is attached to the integrally molded product in which the busbars 2, 3, 4, the plurality of conductive terminals 13, and the insulating member 5 are integrally molded. A guide groove is formed on the inner surface of the insulating portion 51 so that the wiring board 60 is arranged at a predetermined position. The outer peripheral edge of the wiring board 60 is held by the guide groove.

Next, as shown in FIG. 20, a predetermined region of the facing portion 21 of the busbar 2, a predetermined region of each upper bonding target portion 40a of the busbar 4, a predetermined region of each conductive terminal 13a, and an upper surface 60a of the wiring board 60 are connected. A solder paste 1000 is applied to a predetermined area (each land 61a, etc.). For application of the solder paste 1000, for example, a metered discharge device (also referred to as a dispenser) is used. In FIG. 20, the solder paste 1000 is hatched. A plurality of MOSFETs 11a, Zener diodes 12a, and a plurality of conductive pieces 14a are mounted on the area to which the solder paste 1000 is applied, for example, using a surface mounter (also called a chip mounter). Soldered by method. At this time, due to the function of the insulating portion 50a, short-circuiting between the gate terminal 111 of the MOSFET 11a and the adjacent source terminal 112 is prevented. Further, the position of the MOSFET 11a is less likely to shift.

Next, as shown in FIG. 21, a predetermined area of the facing portion 31 of the busbar 3, a predetermined area of each lower bonding target portion 40b of the busbar 4, a predetermined area of each conductive terminal 13b, and a lower surface 60b of the wiring board 60 are connected to each other. solder paste 1000 is applied to predetermined areas of (a plurality of lands 61b, a plurality of lands 66b, a plurality of lands 67b, etc.). In FIG. 21, the solder paste 1000 is hatched. Then, a plurality of MOSFETs 11b, a Zener diode 12b, a plurality of conductive pieces 14b, a connector 65, and a microcomputer 62 are soldered to the area to which the solder paste 1000 is applied by reflow. At this time, due to the function of the insulating portion 50b, short-circuiting between the gate terminal 111 of the MOSFET 11b and the adjacent source terminal 112 is prevented. Also, the position of the MOSFET 11b is less likely to shift. 20, illustration of the microcomputer 62 is omitted.

As described above, the circuit structure 10 shown in FIGS. 4 to 12 is manufactured. Note that, as shown in FIG. 22, after the insulating portions 50 prepared before manufacturing the insulating member 5 are fixed to the respective conductive terminals 13, the insulating member 5 is formed by insert molding into the bus bars 2, 3, 4, . It may be integrally molded with the plurality of conductive terminals 13 and the plurality of insulating portions 50 . In the example of FIG. 22, the insulating portion 50 has a shape obtained by bending a plate-like member. The insulating section 50 includes, for example, a plate-shaped first portion 510 arranged between the gate terminal 111 and the source terminal 112 and a plate-shaped second portion 520 fixed to the conductive terminal 13 . The second portion 520 is fixed to the inner surface of the joining target portion 130 of the conductive terminal 13 . The insulating portion 50 may be made of resin, or may be made of ceramic, for example. The insulating portion 50 may be made of the same material as the insulating member 5, or may be made of a different material.

<Configuration example of case and heat dissipation member>
FIG. 23 is a diagram showing an example of a cross-sectional structure taken along line DD shown in FIG. 1 described above. FIG. 24 is a schematic diagram showing an enlarged portion surrounded by a dashed line in FIG. FIG. 25 is a schematic perspective view showing an example of how the heat radiating members 80a and 80b are removed from the case 70. As shown in FIG. FIG. 26 is a schematic perspective view showing an example of how the circuit structure 10 is removed from the case 70. FIG.

As shown in FIGS. 1 to 3, 23 to 26, etc., the case 70 is, for example, a rectangular parallelepiped. The case 70 includes, for example, an upper wall portion 710 , a lower wall portion 720 , and a frame-shaped side wall portion 730 connecting the upper wall portion 710 and the lower wall portion 720 . The input terminal portion 23 and the output terminal portion 33 of the circuit structure 10 extend outside the case 70 from the +Y side portion of the side wall portion 730 . A portion of the connector 65 also extends outside the case 70 from the +Y side portion of the side wall portion 730 . The heat radiating member 80 a is fixed to the upper wall portion 710 and the heat radiating member 80 b is fixed to the lower wall portion 720 . The case 70 is made of resin, for example. The case 70 may be made of PPS resin or PBT (Poly Butylene Terephthalate) resin.

The upper wall portion 710 is provided with a plurality of through holes 711 penetrating in its thickness direction. The plurality of through holes 711 are arranged in a row along the X direction, for example. The lower wall portion 720 is provided with a plurality of through holes 721 penetrating in its thickness direction. The plurality of through holes 721 are arranged in a row along the X direction, for example.

Each heat radiating member 80 has, for example, a plate-like fixing portion 800 fixed to the outer surface of the case 70 and a plurality of insertion portions 810 protruding from the fixing portion 800 . The fixing part 800 is located on the outer surface of the case 70 . The plurality of insertion portions 810 are provided on the main surface of the fixed portion 800 on the case 70 side (in other words, the inner main surface). Each insertion portion 810 has a cylindrical shape, for example.

The fixed portion 800 of the heat radiating member 80 a is fixed to the outer surface of the upper wall portion 710 of the case 70 , and the fixed portion 800 of the heat radiating member 80 b is fixed to the outer surface of the lower wall portion 720 of the case 70 . The plurality of insertion portions 810 of the heat radiating member 80a are inserted into the plurality of through holes 711 of the upper wall portion 710, respectively. The plurality of insertion portions 810 of the heat radiating member 80b are inserted into the plurality of through holes 721 of the lower wall portion 720, respectively. The heat dissipation member 80 may be made of, for example, an aluminum-based alloy, may be made of another metal material, or may be made of a material other than a metal material.

A plurality of insulating members 90 are attached to the heat radiating member 80 . A mounting portion 820 to which the insulating member 90 is mounted is provided on the distal end surface of each insertion portion 810 of the heat radiating member 80 .

27 is a schematic perspective view showing an example of how the insulating member 90 is attached to the attachment portion 820. FIG. FIG. 28 is a schematic diagram showing an example of a cross-sectional structure of the heat radiating member 80 and the insulating member 90 attached to the mounting portion 820 of the heat radiating member 80. As shown in FIG.

The mounting portion 820 has, for example, a disc shape. It can also be said that the mounting portion 820 has a low columnar shape. The mounting portion 820 protrudes from the distal end surface of the insertion portion 810 (in other words, the circular surface at the distal end), and can be said to be a protrusion. The diameter of the disk-shaped mounting portion 820 is smaller than the diameter of the cylindrical insertion portion 810 . The central axis of the attachment portion 820 and the central axis of the insertion portion 810 are aligned. In the heat radiating member 80, the periphery of the mounting portion 820 is one step lower. The surface of the mounting portion 820 has a circular principal surface 821 and an annular peripheral end surface 822 connected to the periphery of the principal surface 821 .

The insulating member 90 has, for example, an annular shape. The insulating member 90 may be made of, for example, PPS resin, may be made of another type of resin, or may be made of an insulating material other than resin. The annular insulating member 90 is fitted to the mounting portion 820 so as to surround the peripheral end surface 822 of the mounting portion 820 and come into contact with the peripheral end surface 822 . Since the inner diameter of the annular insulating member 90 is slightly smaller than the diameter of the disk-shaped mounting portion 820, the insulating member 90 fitted in the mounting portion 820 is less likely to come off from the mounting portion 820. . The outer diameter of the insulating member 90 is, for example, the same as the diameter of the cylindrical insertion portion 810 . Accordingly, when the insulating member 90 is fitted into the mounting portion 820 , the insulating member 90 does not protrude beyond the insertion portion 810 . The height of the annular insulating member 90 is slightly larger than the height of the disk-shaped mounting portion 820 . The insulating member 90 has an annular protruding portion 900 that surrounds the periphery of the main surface 821 of the mounting portion 820 and protrudes beyond the main surface 821 . A concave portion 93 is formed by the main surface 821 of the mounting portion 820 and the annular projecting portion 900 of the insulating member 90 mounted on the mounting portion 820 . The peripheral wall portion of the recessed portion 93 is composed of the annular projecting portion 900 , and the bottom surface of the recessed portion 93 is composed of the main surface 821 .

In this example, the circuit device 1 includes a plurality of heat conductive materials 95 corresponding to the plurality of MOSFETs 11 respectively. The multiple thermal conductive materials 95 include multiple thermal conductive materials 95a respectively corresponding to the multiple upper MOSFETs 11a and multiple thermal conductive materials 95b respectively corresponding to the multiple lower MOSFETs 11b. The thermally conductive material 95 is composed of heat dissipation grease, for example. As the heat dissipation grease, for example, thermally conductive silicone grease having a thermal conductivity of 2 W/m·K or more and a viscosity of 50 to 500 Pa·s is used. The thermally conductive material 95 may be composed of a thermally conductive sheet, or may be composed of other types of thermal interface materials (TIMs).

The plurality of thermally conductive members 95a are arranged in a row along the X direction, for example, on the outer surface 211 of the facing portion 21 of the busbar 2 . The plurality of thermally conductive members 95b are arranged in a row along the X direction, for example, on the outer surface 311 of the facing portion 31 of the busbar 3 (see FIG. 26). The thermally conductive material 95 is arranged, for example, around the corresponding MOSFET 11 . The thermally conductive material 95a is arranged, for example, near the drain terminal 113 of the corresponding MOSFET 11a and on the +Y side of the drain terminal 113 . The thermally conductive material 95b is arranged, for example, near the drain terminal 113 of the corresponding MOSFET 11b and on the +Y side of the drain terminal 113. As shown in FIG.

A plurality of through-holes 711 of an upper wall portion 710 of the case 70 are located directly above the plurality of heat conductive members 95a. When the plurality of insertion portions 810 of the heat dissipation member 80a are respectively inserted into the plurality of through holes 711, the main surfaces 821 of the plurality of mounting portions 820 of the heat dissipation member 80a come into contact with the plurality of heat conducting members 95a. Also, the insulating member 90 attached to the attachment portion 820 of the heat radiating member 80a contacts the outer surface 211 of the facing portion 21 of the busbar 2, for example. The interior of the recess 93, which is configured by the main surface 821 of the mounting portion 820 (in other words, the contact surface 821 that contacts the heat conductive material 95a) and the annular projecting portion 900 of the insulating member 90 attached to the mounting portion 82, It is filled with a thermally conductive material 95a. The thermally conductive material 95 a has a filling portion that fills the recess 93 . Note that the heat conducting material 95 a may have a portion that is not positioned inside the recess 93 but is positioned outside the annular projecting portion 900 .

A plurality of through-holes 721 of a lower wall portion 720 of the case 70 are located directly above the plurality of heat conductive members 95b. When the insertion portions 810 of the heat dissipation member 80b are inserted into the through holes 721, the main surfaces 821 of the attachment portions 820 of the heat dissipation member 80b come into contact with the thermal conductors 95b. Also, the insulating member 90 attached to the attachment portion 820 of the heat radiating member 80b contacts the outer surface 311 of the facing portion 31 of the bus bar 3, for example. The interior of the recess 93, which is configured by the main surface 821 of the mounting portion 820 (in other words, the contact surface 821 that contacts the heat conductive material 95a) and the annular projecting portion 900 of the insulating member 90 attached to the mounting portion 82, It is filled with a heat conductive material 95b. The thermally conductive material 95 b has a filling portion that fills the recess 93 . Note that the heat conducting material 95 b may have a portion that is not positioned inside the recess 93 but is positioned outside the annular projecting portion 900 .

FIG. 29 is a schematic diagram showing an example of a heat transfer path of heat generated by the MOSFET 11. As shown in FIG. An arrow 990a in FIG. 29 indicates a heat transfer path of heat generated by the MOSFET 11a. An arrow 990b in FIG. 29 indicates a heat transfer path of heat generated by the MOSFET 11b.

As indicated by an arrow 990a, the heat generated by the MOSFET 11a passes through the facing portion 21 of the busbar 2, the heat conductive material 95a, the mounting portion 820 of the heat radiating member 80a, the insertion portion 810 of the heat radiating member 80a, and the fixed portion 800 of the heat radiating member 80a. It is transmitted in order and released to the outside of the circuit device 1 .

On the other hand, the heat generated by the MOSFET 11b is, as indicated by an arrow 990b, transferred to the facing portion 31 of the busbar 3, the heat conductive material 95b, the mounting portion 820 of the heat radiating member 80b, the insertion portion 810 of the heat radiating member 80b, and the fixing of the heat radiating member 80b. It is transmitted through the portion 800 in order and emitted to the outside of the circuit device 1 .

After the circuit structure 10 is manufactured as described above, a plurality of heat conductive materials 95 a are applied to the outer surface 211 of the facing portion 21 of the busbar 2 , and a plurality of heat conductive materials 95 a are applied to the outer surface 311 of the facing portion 31 of the busbar 3 . A conductive material 95b is applied. After that, after the circuit structure 10 is housed in the case 70 , the heat dissipation member 80 a to which the plurality of insulating members 90 are attached and the heat dissipation member 80 b to which the plurality of insulating members 90 are attached are attached to the case 70 . At this time, the insides of the plurality of recesses 93 formed by the heat radiating member 80 and the plurality of insulating members 90 attached thereto are filled with the heat conducting material 95 . Thus, the circuit device 1 shown in FIGS. 1 to 3 is completed. For waterproofing, after attaching the heat radiating members 80a and 80b to the case 70, the case 70 may be filled with a potting agent made of resin or the like, and then the potting agent may be cured.

Thus, in this example, the MOSFET 11a is mounted on the facing portion 21 of the busbar 2, and the MOSFET 11b is mounted on the facing portion 31 of the busbar 3. FIG. That is, the MOSFET 11a and the MOSFET 11b are mounted on the opposing portion 21 and the opposing portion 31, respectively. This makes it possible to reduce the planar size of the circuit device 1 when viewed from the facing portion 21 side (in other words, the +Z side) or from the facing portion 31 side (in other words, the -Z side). That is, the size of the circuit device 1 can be reduced.

Further, in this example, the heat generated by the MOSFET 11a is transferred to the heat dissipation member 80a through the facing portion 21 of the busbar 2, and is released to the outside from the heat dissipation member 80a. Further, the heat generated by the MOSFET 11b is transferred to the heat dissipation member 80b through the facing portion 31 of the bus bar 3, and released to the outside from the heat dissipation member 80b. Here, when viewed from the facing portion 21 side (in other words, +Z side) to the facing portion 31 side (in other words, −Z side), the wiring substrate 60 is located on the back side of the facing portion 21 and located in front of the The MOSFET 11a is mounted on the outer side surface 211 of the opposing portion 21 opposite to the inner side surface 212 on the side of the opposing portion 31, and the MOSFET 11b is mounted on the side of the opposing portion 31 opposite to the inner side surface 312 on the side of the opposing portion 21. is mounted on the outer surface 311 of the Therefore, wiring substrate 60 is located on the opposite side of opposing portion 21 from MOSFET 11a and on the opposite side of opposing portion 31 from MOSFET 11b. Therefore, the wiring substrate 60 is less susceptible to the heat generated by the MOSFET 11a and the heat generated by the MOSFET 11b (see arrows 990a and 990b in FIG. 29). Therefore, the reliability of the circuit board 6 is improved.

Further, in this example, each of the heat radiating member 80a and the heat radiating member 80b has a portion (fixing portion 800 in the above example) located on the outer surface of the case 70, so that the size of the portion can be adjusted. Therefore, the heat dissipation characteristics of the heat dissipation member 80a and the heat dissipation member 80b can be adjusted without affecting the arrangement of components in the case 70, or the like.

In this example, the heat radiating member 80a is in contact with the heat conducting member 95a located on the outer surface 211 of the facing portion 21 of the busbar 2 opposite to the inner surface 212 on the wiring board 60 side. As a result, the heat transfer path from the MOSFET 11a to the heat dissipation member 80a can be shortened while avoiding interference between the heat dissipation member 80a and the wiring board 60. FIG. Therefore, the heat dissipation characteristics of the circuit device 1 are improved.

Similarly, in this example, the heat-dissipating member 80b is in contact with the heat-conducting member 95b positioned on the outer surface 311 of the facing portion 31 of the busbar 3 opposite to the inner surface 312 on the wiring substrate 60 side. As a result, the heat transfer path from the MOSFET 11b to the heat dissipation member 80b can be shortened while avoiding interference between the heat dissipation member 80b and the wiring board 60. FIG. Therefore, the heat dissipation characteristics of the circuit device 1 are improved.

In addition, in this example, the heat dissipation member 80a is in contact with each of the plurality of thermally conductive members 95a positioned around the plurality of MOSFETs 11a. The route can be shortened. Therefore, the heat dissipation of the circuit device 1 is improved.

Similarly, in this example, since the heat dissipation member 80b is in contact with each of the plurality of thermally conductive members 95b positioned around the plurality of MOSFETs 11b, the conduction from the MOSFET 11b to the heat dissipation member 80b for each MOSFET 11b The heat path can be shortened. Therefore, the heat dissipation of the circuit device 1 is improved.

In this example, the thermally conductive material 95a is a filling portion that fills the concave portion 93 formed by the contact surface 821 of the heat radiating member 80a that contacts the thermally conductive material 95a and the annular projecting portion 900 of the insulating member 90. have Thereby, the heat radiating member 80a can be appropriately brought into contact with the heat conductive material 95a. Therefore, the heat dissipation of the circuit device 1 is improved.

Similarly, in this example, the heat conducting material 95b has a filling portion that fills the recess 93 formed by the contact surface 821 of the heat radiating member 80b and the annular protrusion 900 of the insulating member 90 . Thereby, the heat radiating member 80b can be appropriately brought into contact with the heat conductive material 95b. Therefore, the heat dissipation of the circuit device 1 is improved.

<Another example of the circuit device>
The structure of the circuit device 1 is not limited to the above example. For example, the shape of the busbars 2, 3, 4 is not limited to the above examples. Moreover, the shape of the wiring board 60 is not limited to the above example. In the above example, the wiring board 60 has a portion sandwiched between the facing portion 21 of the busbar 2 and the facing portion 31 of the busbar 3 in the Z direction, but it may not have this portion. In addition, the wiring board 60 does not have to be located on the far side of the facing portion 21 or on the near side of the facing portion 31 when the facing portion 31 side is viewed from the facing portion 21 side. good too. The MOSFET 11 a may be mounted on the second portion 22 of the busbar 2 and the MOSFET 11b may be mounted on the second portion 32 of the busbar 3 . Moreover, the shape of the heat radiating member 80 is not limited to the above example. For example, when the MOSFET 11 a generates a large amount of heat, the fixing portion 800 of the heat dissipation member 80 a may be provided over the entire outer surface of the upper wall portion 710 of the case 70 . Further, when the amount of heat generated by the MOSFET 11b is large, the fixing portion 800 of the heat radiating member 80b may be provided over the entire outer surface of the lower wall portion 720 of the case 70 . Also, the number of the plurality of thermally conductive members 95 is not limited to the above example. For example, the busbar 2 may be provided with one thermally conductive material 95a, and the busbar 3 may be provided with one thermally conductive material 95b. Also, the circuit device 1 may not include the insulating member 90 . Also, the circuit device 1 may not include the insulating section 50 .

Although the circuit device 1 has been described in detail as above, the above description is illustrative in all aspects, and this disclosure is not limited thereto. Moreover, the various modifications described above can be applied in combination as long as they do not contradict each other. And it is understood that numerous variations not illustrated can be envisioned without departing from the scope of this disclosure.

REFERENCE SIGNS LIST 1 circuit device 2 input-side busbar 3 output-side busbar 4 relay busbar 5 insulating member 6 circuit board 10 circuit structure 11, 11a, 11b, 12, 12a, 12b electronic component 13, 13a, 13b conductive terminal 14, 14a, 14b conductive Pieces 20, 30 Main body 21, 31 First portion (facing portion)
22, 32 second portion 23 input terminal portion 23a, 33a, 711, 721 through hole 33 output terminal portion 40a first portion (part to be joined)
40b second portion (part to be joined)
41 connecting portion 50, 50a, 50b, 51, 52a, 52b insulating portion 51a first portion 51b second portion 51c third portion 51d fourth portion 55 slit 60 wiring board 60a, 60b, 211, 212, 311, 312 main surface 60aa, 60bb exposed area 61a, 61b, 66b, 67b land 62 microcomputer 65 connector 70 case 80, 80a, 80b heat dissipation member 90 insulating member 93 recess 95, 95a, 95b thermal conductive material 111 gate terminal 111a tip portion 112 source terminal 112a Tip portion 113 Drain terminal 121 Cathode terminal 122 Anode terminal 130 Part to be joined 131 Part to be joined 132 Connection part 510 First part 520 Second part 651 Metal part 652 Connection terminal 710 Upper wall part 720 Lower wall part 730 Side wall part 800 Fixing part 810 insertion portion 820 mounting portion 821 main surface (contact surface)
822 Peripheral end face 900 Annular protrusion 990a, 990b Arrow 1000 Solder paste

Claims (7)

a first electronic component;
a first bus bar on which the first electronic component is mounted;
the second electronic component;
a second bus bar on which the second electronic component is mounted;
a first heat dissipation member thermally connected to the first bus bar;
a second heat dissipation member thermally connected to the second bus bar;
A circuit board electrically connected to each of the first electronic component and the second electronic component,
The first bus bar and the second bus bar each have a first facing portion and a second facing portion facing each other,
The first facing portion has a first surface on which the first electronic component is mounted and a second surface opposite to the first surface,
The second facing portion is located on the opposite side of a third surface of the first facing portion that faces the second surface, and is located on the side opposite to the third surface. 4 faces,
When viewed from the first facing portion side to the second facing portion side, the circuit board has a wiring that is positioned deeper than the first facing portion and positioned closer to the front side than the second facing portion. A circuit device having a substrate. The circuit device according to claim 1,
further comprising a case that houses the first electronic component, the second electronic component, the first facing portion, the second facing portion, and the circuit board;
The circuit device, wherein each of the first heat radiation member and the second heat radiation member has a portion located on the outer surface of the case. The circuit device according to claim 1 or claim 2,
further comprising a first thermally conductive material positioned on the first surface of the first facing portion;
The circuit device, wherein the first heat dissipation member is in contact with the first thermally conductive material. 4. The circuit device according to claim 3,
a third electronic component mounted on the first surface of the first facing portion;
a second thermally conductive material located on the first surface of the first facing portion;
The first thermally conductive material is positioned around the first electronic component,
The second thermally conductive material is positioned around the third electronic component,
The circuit device, wherein the first heat radiation member is in contact with each of the first thermally conductive material and the second thermally conductive material. 5. The circuit device according to claim 3 or 4,
The first heat dissipation member has a contact surface that contacts the first thermally conductive material,
further comprising a first insulating member having an annular projecting portion that surrounds the periphery of the contact surface and projects from the contact surface toward the first surface;
The circuit device, wherein the first thermally conductive material has a filling portion that fills a recess formed by the contact surface and the annular protrusion. The circuit device according to any one of claims 1 to 5,
the first electronic component has a first connection terminal and a second connection terminal adjacent to each other;
The first connection terminal and the second connection terminal are respectively joined to the first joint target part and the second joint target part with a conductive joint material,
A circuit device, further comprising an insulating portion positioned between the first connection terminal and the second connection terminal. The circuit device according to claim 6,
the first part to be joined is included in a conductive terminal electrically connected to the circuit board;
The circuit device further comprising bent conductive strips bonded to each of the conductive terminals and the circuit board to electrically connect the conductive terminals and the circuit board to each other.

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