JP2022145478A5 - - Google Patents

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Publication number
JP2022145478A5
JP2022145478A5 JP2021204585A JP2021204585A JP2022145478A5 JP 2022145478 A5 JP2022145478 A5 JP 2022145478A5 JP 2021204585 A JP2021204585 A JP 2021204585A JP 2021204585 A JP2021204585 A JP 2021204585A JP 2022145478 A5 JP2022145478 A5 JP 2022145478A5
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JP
Japan
Prior art keywords
resin
examples
plasma irradiation
irradiation time
heat
Prior art date
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JP2021204585A
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English (en)
Japanese (ja)
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JP2022145478A (ja
JP7750471B2 (ja
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Priority to US17/696,361 priority Critical patent/US12257641B2/en
Priority to CN202210263158.2A priority patent/CN115116817A/zh
Publication of JP2022145478A publication Critical patent/JP2022145478A/ja
Publication of JP2022145478A5 publication Critical patent/JP2022145478A5/ja
Application granted granted Critical
Publication of JP7750471B2 publication Critical patent/JP7750471B2/ja
Active legal-status Critical Current
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JP2021204585A 2021-03-18 2021-12-16 ワーク加工装置 Active JP7750471B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US17/696,361 US12257641B2 (en) 2021-03-18 2022-03-16 Work processing apparatus
CN202210263158.2A CN115116817A (zh) 2021-03-18 2022-03-17 工件加工装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021044350 2021-03-18
JP2021044350 2021-03-18

Publications (3)

Publication Number Publication Date
JP2022145478A JP2022145478A (ja) 2022-10-04
JP2022145478A5 true JP2022145478A5 (enExample) 2024-11-12
JP7750471B2 JP7750471B2 (ja) 2025-10-07

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ID=83460385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021204585A Active JP7750471B2 (ja) 2021-03-18 2021-12-16 ワーク加工装置

Country Status (1)

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JP (1) JP7750471B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025062269A (ja) * 2023-10-02 2025-04-14 株式会社ジェイテックコーポレーション プラズマ援用研磨方法及びその装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05226258A (ja) * 1992-02-13 1993-09-03 Applied Materials Japan Kk プラズマ発生装置
US5238532A (en) * 1992-02-27 1993-08-24 Hughes Aircraft Company Method and apparatus for removal of subsurface damage in semiconductor materials by plasma etching
US5372674A (en) * 1993-05-14 1994-12-13 Hughes Aircraft Company Electrode for use in a plasma assisted chemical etching process
JP2000058521A (ja) * 1998-08-08 2000-02-25 Tokyo Electron Ltd プラズマ研磨装置
JP2002103207A (ja) * 2000-09-27 2002-04-09 Hitachi Ltd 乾式化学機械研磨方法
JP5614677B2 (ja) * 2010-02-25 2014-10-29 国立大学法人大阪大学 難加工材料の精密加工方法及びその装置

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