JP7750471B2 - ワーク加工装置 - Google Patents

ワーク加工装置

Info

Publication number
JP7750471B2
JP7750471B2 JP2021204585A JP2021204585A JP7750471B2 JP 7750471 B2 JP7750471 B2 JP 7750471B2 JP 2021204585 A JP2021204585 A JP 2021204585A JP 2021204585 A JP2021204585 A JP 2021204585A JP 7750471 B2 JP7750471 B2 JP 7750471B2
Authority
JP
Japan
Prior art keywords
workpiece
electrode
plasma
processing
slit portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021204585A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022145478A (ja
JP2022145478A5 (enExample
Inventor
英雄 會田
秀俊 武田
俊郎 土肥
忠一 宮下
惇 鍛冶倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Nagaoka University of Technology NUC
Original Assignee
Fujikoshi Machinery Corp
Nagaoka University of Technology NUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Machinery Corp, Nagaoka University of Technology NUC filed Critical Fujikoshi Machinery Corp
Priority to US17/696,361 priority Critical patent/US12257641B2/en
Priority to CN202210263158.2A priority patent/CN115116817A/zh
Publication of JP2022145478A publication Critical patent/JP2022145478A/ja
Publication of JP2022145478A5 publication Critical patent/JP2022145478A5/ja
Application granted granted Critical
Publication of JP7750471B2 publication Critical patent/JP7750471B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Drying Of Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP2021204585A 2021-03-18 2021-12-16 ワーク加工装置 Active JP7750471B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US17/696,361 US12257641B2 (en) 2021-03-18 2022-03-16 Work processing apparatus
CN202210263158.2A CN115116817A (zh) 2021-03-18 2022-03-17 工件加工装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021044350 2021-03-18
JP2021044350 2021-03-18

Publications (3)

Publication Number Publication Date
JP2022145478A JP2022145478A (ja) 2022-10-04
JP2022145478A5 JP2022145478A5 (enExample) 2024-11-12
JP7750471B2 true JP7750471B2 (ja) 2025-10-07

Family

ID=83460385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021204585A Active JP7750471B2 (ja) 2021-03-18 2021-12-16 ワーク加工装置

Country Status (1)

Country Link
JP (1) JP7750471B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025062269A (ja) * 2023-10-02 2025-04-14 株式会社ジェイテックコーポレーション プラズマ援用研磨方法及びその装置
WO2025249508A1 (ja) * 2024-05-30 2025-12-04 株式会社ジェイテックコーポレーション プラズマ援用研磨装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058521A (ja) 1998-08-08 2000-02-25 Tokyo Electron Ltd プラズマ研磨装置
JP2002103207A (ja) 2000-09-27 2002-04-09 Hitachi Ltd 乾式化学機械研磨方法
JP2011176243A (ja) 2010-02-25 2011-09-08 Osaka Univ 難加工材料の精密加工方法及びその装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05226258A (ja) * 1992-02-13 1993-09-03 Applied Materials Japan Kk プラズマ発生装置
US5238532A (en) * 1992-02-27 1993-08-24 Hughes Aircraft Company Method and apparatus for removal of subsurface damage in semiconductor materials by plasma etching
US5372674A (en) * 1993-05-14 1994-12-13 Hughes Aircraft Company Electrode for use in a plasma assisted chemical etching process

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058521A (ja) 1998-08-08 2000-02-25 Tokyo Electron Ltd プラズマ研磨装置
JP2002103207A (ja) 2000-09-27 2002-04-09 Hitachi Ltd 乾式化学機械研磨方法
JP2011176243A (ja) 2010-02-25 2011-09-08 Osaka Univ 難加工材料の精密加工方法及びその装置

Also Published As

Publication number Publication date
JP2022145478A (ja) 2022-10-04

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