JP2022142723A5 - - Google Patents

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Publication number
JP2022142723A5
JP2022142723A5 JP2021196119A JP2021196119A JP2022142723A5 JP 2022142723 A5 JP2022142723 A5 JP 2022142723A5 JP 2021196119 A JP2021196119 A JP 2021196119A JP 2021196119 A JP2021196119 A JP 2021196119A JP 2022142723 A5 JP2022142723 A5 JP 2022142723A5
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JP
Japan
Prior art keywords
density
detection unit
mixed fluid
drying
substrate
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Application number
JP2021196119A
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English (en)
Japanese (ja)
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JP2022142723A (ja
JP7816866B2 (ja
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Priority to KR1020220027988A priority Critical patent/KR20220129467A/ko
Priority to TW111108303A priority patent/TW202242983A/zh
Priority to US17/689,199 priority patent/US11901197B2/en
Priority to CN202210220366.4A priority patent/CN115083953A/zh
Publication of JP2022142723A publication Critical patent/JP2022142723A/ja
Priority to US18/392,552 priority patent/US12237178B2/en
Publication of JP2022142723A5 publication Critical patent/JP2022142723A5/ja
Application granted granted Critical
Publication of JP7816866B2 publication Critical patent/JP7816866B2/ja
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JP2021196119A 2021-03-16 2021-12-02 基板処理装置、及び基板処理方法 Active JP7816866B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020220027988A KR20220129467A (ko) 2021-03-16 2022-03-04 기판 처리 장치 및 기판 처리 방법
TW111108303A TW202242983A (zh) 2021-03-16 2022-03-08 基板處理裝置及基板處理方法
US17/689,199 US11901197B2 (en) 2021-03-16 2022-03-08 Substrate processing apparatus and substrate processing method
CN202210220366.4A CN115083953A (zh) 2021-03-16 2022-03-08 基板处理装置和基板处理方法
US18/392,552 US12237178B2 (en) 2021-03-16 2023-12-21 Substrate processing apparatus and substrate processing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021042031 2021-03-16
JP2021042031 2021-03-16

Publications (3)

Publication Number Publication Date
JP2022142723A JP2022142723A (ja) 2022-09-30
JP2022142723A5 true JP2022142723A5 (https=) 2024-09-20
JP7816866B2 JP7816866B2 (ja) 2026-02-18

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ID=83426515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021196119A Active JP7816866B2 (ja) 2021-03-16 2021-12-02 基板処理装置、及び基板処理方法

Country Status (1)

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JP (1) JP7816866B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025229866A1 (ja) * 2024-04-30 2025-11-06 東京エレクトロン株式会社 基板処理装置および基板処理方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120041014A (ko) * 2010-10-20 2012-04-30 세메스 주식회사 기판처리방법
JP5703952B2 (ja) 2011-05-13 2015-04-22 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
KR102010264B1 (ko) * 2016-10-10 2019-08-13 세메스 주식회사 기판 처리 장치, 그리고 이의 공정 유체 모니터링 장치 및 모니터링 방법

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