JP2022130757A - Package for mounting electronic element, and electronic device - Google Patents

Abstract

To provide a package for mounting an electronic element that can prevent power loss of a signal, and an electronic device.SOLUTION: A package for mounting an electronic element comprises: a wiring board that has a first surface and has a wiring pattern on the first surface; a substrate that has a second surface and has a through hole having an opening located in the second surface; a first insulating member that is located inside the through hole and has a first end located on the opening side; a signal line that penetrates the first insulating member and has a second end located on the opening side; and a conductive joint material that joins the wiring pattern and the second end of the signal line to each other. The wiring board is arranged with a gap from the first end of the first insulating member, and the conductive joint material has a first area located in at least part of the gap.SELECTED DRAWING: Figure 3

Description

The present disclosure relates to an electronic device mounting package and an electronic device.

2. Description of the Related Art Conventionally, there is a package for mounting an electronic element, which has a wiring pattern joined to an electronic element and a signal line joined to the wiring pattern. Among such packages, there is a package in which a coaxial line structure including signal lines and a wiring pattern such as a microstrip line structure are joined with a conductive joining material (for example, Patent Document 1). The above-described coaxial line structure can be such that a through hole is provided in a metal substrate, and a signal line is arranged so as to pass through an insulating member positioned inside the through hole.

JP-A-2000-353846

However, in the above configuration, the coaxial line structure is converted to a microstrip line structure or the like at the junction between the signal line and the wiring pattern, and the signal propagation mode becomes discontinuous. Therefore, the characteristic impedance is likely to increase due to the weakening of the electric field or the like at the joint. As a result, there is a problem that signal power loss is likely to occur due to the characteristic impedance mismatch at the joint.

An object of the present disclosure is to provide an electronic device mounting package and an electronic device capable of suppressing signal power loss.

One aspect of the present disclosure is
a wiring substrate having a first surface and having a wiring pattern on the first surface;
a base body having a second surface in which a through hole having an opening is located in the second surface;
a first insulating member located inside the through hole and having a first end located on the opening side;
a signal line passing through the first insulating member and having a second end located on the opening side;
a conductive bonding material that bonds the wiring pattern and the second end of the signal line;
with
The wiring board is arranged with a gap between it and the first end of the first insulating member,
The conductive bonding material has a first region located in at least part of the gap,
It is a package for mounting an electronic element.

In addition, another aspect of the present disclosure is
the electronic device mounting package;
an electronic element bonded to the wiring pattern;
An electronic device comprising:

According to the contents of the present disclosure, there is an effect that power loss of signals can be suppressed in a package for mounting an electronic device.

1 is an overall perspective view of an electronic device; FIG. It is the figure which expanded and showed the bonding position vicinity by a conductive bonding material. It is a figure which shows the cross section of the electronic element mounting package in the position which passes along a signal line. It is a figure explaining the problem regarding the mismatch of the characteristic impedance in a comparative example. It is a figure explaining the characteristic impedance matching in an Example. FIG. 4 is a diagram showing the result of a simulation in which the loss in the electronic device mounting package is calculated with respect to the frequency of the signal; FIG. 5 is a diagram for explaining the effect of suppressing characteristic impedance mismatch caused by a recess in an insulating member in an example. FIG. 11 shows another embodiment in which the insulating member has recesses; It is a figure explaining the heat dissipation effect in an Example. It is a figure explaining the suppression effect of the influence of the load with respect to a wiring board in an Example. FIG. 10 is a cross-sectional view showing Modified Example 1 of the package for mounting an electronic element; FIG. 11 is a cross-sectional view showing Modified Example 2 of the package for mounting an electronic element.

Embodiments will be described below with reference to the drawings. However, for convenience of explanation, each drawing referred to below shows only the main members necessary for explaining the embodiment in a simplified manner. Therefore, the electronic device and the electronic device mounting package of the present disclosure can include arbitrary constituent members that are not shown in the referenced figures. Also, the dimensions of the members in each drawing do not faithfully represent the actual dimensions and dimensional ratios of the constituent members.

(Structure of Electronic Device and Package for Mounting Electronic Element)
First, configurations of an electronic device 1 and an electronic element mounting package 100 will be described with reference to FIGS. 1 to 3. FIG.
FIG. 1 is an overall perspective view of an electronic device 1 of this embodiment.
FIG. 2 is an enlarged view of the vicinity of the joint position by the conductive joint material 16 in the electronic device mounting package 100 included in the electronic device 1. As shown in FIG.
FIG. 3 is a diagram showing a cross section of the electronic device mounting package 100 at a position passing through the signal line 12. As shown in FIG.

The electronic device 1 includes an electronic element mounting package 100 and an electronic element 200 .
The electronic device mounting package 100 includes a base 11, a signal line 12, a wiring board 14, an insulating member 15 (first insulating member), a conductive bonding material 16, and the like.

The substrate 11 is a conductive metal and functions as a ground plane. In addition to this, the substrate 11 may have high thermal conductivity (heat dissipation). The base 11 has a base portion 111 and a projection portion 112 . The base 111 here has, for example, a disk-like shape with a diameter of 3 to 10 mm and a thickness of 0.5 to 2 mm, but is not limited to this. A surface of the base portion 111 from which the projection portion 112 protrudes is hereinafter referred to as a second surface 11a. Base 111 and projection 112 may be integral.

A through hole 111a having an opening 111b on the second surface 11a is positioned in the base 111 . The through hole 111a may have a circular cross section parallel to the second surface 11a of the inner wall surface, but is not limited to this, and the inner wall surface may have a cross section other than circular. An insulating member 15 is positioned in the through hole 111a. The insulating member 15 has a first end 15a (see FIG. 3) located on the opening 111b side. In FIG. 1, the inside of the through hole 111a is occupied by the insulating member 15. As shown in FIG. The material of the insulating member 15 and the size of the through hole 111a may be determined according to the desired characteristic impedance. As the insulating member 15, for example, glass having a predetermined dielectric constant can be used.

The signal line 12 is a rod-shaped conductor. The signal line 12 passes through the insulating member 15 in the through hole 111a of the base 111 and has a second end 12a located on the opening 111b side. Moreover, the signal line 12 is exposed from the opening 111b of the through hole 111a in the second surface 11a. In other words, the signal line 12 is exposed from the first end 15a in the opening 111b. The diameter of the signal line 12 is, for example, approximately 0.1 to 1.0 mm. At least one of the signal lines 12 is a ground terminal of the base 11 and directly connected to the base 111 . Other signal lines 12 protrude from the side of the base portion 111 opposite to the second surface 11a, are electrically connected to external wiring and the like, and are used as lead electrodes. 1 and 2 show a state in which two signal lines 12 are joined to a wiring pattern 141 via a conductive joint material 16 on the second surface 11a side. The signal line 12 may have a circular cross section parallel to the second surface 11a, but is not limited to this, and may have a non-circular cross section.

The tip (second end portion 12a) of the signal line 12 is exposed from the first end portion 15a on the second surface 11a of the base portion 111 at approximately the center of the circular opening 111b of the through hole 111a. Further, as shown in FIG. 3, the tip of the signal line 12 is exposed without protruding from the first end 15a. Therefore, the tip (second end 12a) of the signal line 12 is in the same plane as the second surface 11a of the base 111 and the first end 15a. In other words, in the cross section of FIG. 3 passing through the signal line 12 (for example, the center of the signal line 12) and perpendicular to the second surface 11a, the second surface 11a, the second end 12a, and the first end 15a are aligned. on the line. Inside the insulating member 15 , the signal line 12 is separated from the outer base portion 111 by the insulating member 15 . A coaxial line L1 is formed by the base portion 111 (through hole 111a), the insulating member 15 and the signal line 12 having such a configuration. In the base portion 111, signals are transmitted through this coaxial line L1.

The protrusion 112 of the base 11 has a plane extending vertically from the second surface 11a of the base 111, and the wiring substrate 14 is positioned on the plane. The wiring board 14 has a first surface 14a. The first surface 14 a is the surface opposite to the connection surface with the protrusion 112 . The wiring board 14 has a wiring pattern 141 on the first surface 14a, and a ground layer 142 (see FIG. 3) on the surface opposite to the first surface 14a (the surface on the projection 112 side). The ground layer 142 and the protrusion 112 are joined by a grounding conductive member 17 (see FIG. 3). Here, the wiring board 14 is used, for example, as a high-frequency line board. The wiring substrate 14 is an insulating substrate, for example, made of resin. The thickness and material (relative dielectric constant) of the wiring board 14 may be appropriately determined according to the desired characteristic impedance.

The wiring board 14 is arranged at a position where a gap G is formed between the wiring board 14 and the second surface 11 a of the base portion 111 . Therefore, the wiring board 14 is arranged with a gap G between it and the insulating member 15 . Specifically, one side surface 143 (see FIG. 3) of the plurality of side surfaces adjacent to the first surface 14a of the wiring board 14 is between the second surface 11a and the insulating member 15 exposed from the opening 111b. It faces the second surface 11a and the exposed portion of the insulating member 15 in a positional relationship in which the gap G is formed.

The wiring pattern 141 formed on the wiring board 14 is electrically connected to the electronic element 200 to supply power and signals to the electronic element 200 . The wiring pattern 141 is joined to the signal line 12 at its ends (here, two places) via the conductive joining material 16 . The shape, length and position of the wiring pattern 141 are appropriately determined according to the size and terminal position of the electronic element 200 to be connected. The ground layer 142 is formed on the entire surface of the wiring board 14 on the side of the protrusion 112, and is connected to the conductive member 17 for grounding so as to have a ground potential. The wiring pattern 141 and the ground layer 142 are conductive metal films with low resistance, here gold (Au) thin films.

As shown in FIG. 2, the wiring portion of the wiring pattern 141 that is connected to the signal line 12 extends on the wiring substrate 14 substantially perpendicularly to the second surface 11a to the vicinity of the exposed surface of the insulating member 15. . The wiring pattern 141 is separated from the ground layer 142 by the wiring board 14 . A microstrip line L2 is formed on the wiring board 14 by the wiring pattern 141 and the ground layer 142 having such a configuration, and signals are transmitted through the microstrip line L2.

The conductive bonding material 16 is positioned between the signal line 12 and the second surface 11a and the wiring pattern 141 and the first surface 14a. Thereby, the conductive bonding material 16 electrically bonds the signal line 12 exposed on the second surface 11a and the wiring pattern 141 on the first surface 14a. Further, as shown in FIG. 3, part of the conductive bonding material 16 has a first region 161 located in at least part of the gap G described above. Between the first region 161 of the conductive bonding material 16 filled in the gap G and the edge portion 111c (the portion forming the edge of the opening 111b) of the substrate 11 (base portion 111), conductive bonding is provided. A space is secured between the material 16 and the base 111 so as not to cause a short circuit.

As the conductive bonding material 16, for example, silver sintering paste or copper sintering paste (conductive paste having fluidity) can be used. The sintering paste is obtained by applying a fluid member in which particles of a conductive metal such as silver or copper are dispersed in a base material such as a resin or solvent to desired joints, followed by heating to a temperature of, for example, 200° C. to 250° C. It is a conductive member obtained by By heating the fluid member, the conductive metal particles are sintered and adhered to each other, resulting in a state of stable electrical conductivity with each other. The base material contained in the fluid member may be removed by heating, or may partially remain after heating. In the conductive bonding material 16 in which the base material (resin component or the like) remains, since the remaining base material is also bonded to the insulating surface, not only the signal line 12 and the wiring pattern 141 but also the insulating member 15 and the insulating surface of the wiring board 14 are bonded. Also join. The particle size of the conductor metal contained in the sintering paste can be, for example, less than 1 μm. In addition to such particles (nanoparticles) having a particle size on the order of nanometers, conductive metal particles (microparticles) such as silver or copper having a particle size exceeding 1 μm may be mixed.

Although the material of the grounding conductive member 17 is not particularly limited, silver sintering paste or copper sintering paste can be used like the conductive bonding material 16 . As shown in FIG. 3, the grounding conductive member 17 is formed in a range of the grounding layer 142 excluding a predetermined range on the side of the base 111 . This prevents the grounding conductive member 17 from entering the gap G and short-circuiting the conductive bonding material 16 and the wiring pattern 141 .

An electronic element 200 indicated by a dashed line in FIG. 1 is located on the first surface 14a and is electrically connected (bonded) to the wiring pattern 141 directly and/or by wire bonding or the like. Electronic device 200 may be a semiconductor device. Electronic device 200 is, for example, a laser diode. Alternatively, as the electronic element 200, various elements such as a photodiode, an LED (Light Emitting Diode), a Peltier element, and various sensor elements may be used. Heat generated by the operation of the electronic device 200 is discharged through the substrate 11 .

The protrusion 112, the wiring board 14 (the wiring pattern 141, the ground layer 142), and the electronic element 200 may be covered with a cover member (lid) (not shown) to be isolated from the outside. When the electronic device 200 emits light to the outside, the cover member may have a window made of a material that transmits the wavelength of the emitted light.

(Characteristic impedance matching between coaxial line L1 and microstrip line L2)
Next, the effect of matching the characteristic impedance between the coaxial line L1 and the microstrip line L2 by the configuration of this embodiment will be described in comparison with a comparative example.

First, with reference to FIG. 4, the problem of characteristic impedance mismatch in the comparative example will be described. In the comparative example of FIG. 4, the wiring board 14 is in contact with the second surface 11a of the base 111 and the insulating member 15 (that is, the gap G is not formed). different from Also, in FIG. 4, the characteristic impedance at each position of the coaxial line L1 and the microstrip line L2 is shown in the lower graph.

The coaxial line L1 and the microstrip line L2 are matched in characteristic impedance so that the characteristic impedance becomes a predetermined reference value. prone to change, especially rising. One of the factors is the vicinity of the boundary with the microstrip line L2 in the coaxial line L1 (the region schematically shown by the dashed ellipse in FIG. 4; hereinafter referred to as the “boundary region R”) ), the electric field coupling between the signal line 12 and the base 111 is weakened, and the electric field E generated between the signal line 12 and the base 111 is weakened. That is, the weakening of the electric field E in the boundary region R reduces the capacitance C in the boundary region R, resulting in an increase in the characteristic impedance.

More specifically, the capacitance C per unit length of the coaxial line L1 is given by:
C=εSE/V (1)
In the boundary region R with the microstrip line L2, the electric field E in the equation (1) is reduced, so that the capacitance C is reduced.

On the other hand, the characteristic impedance Z ₀ of the coaxial line L1 is Z ₀ =(L/C) ^1/2 (2) where L is the inductance per unit length.
Therefore, in the boundary region R with the microstrip line L2, the characteristic impedance _Z0 of the equation (2) increases as the capacitance C of the equation (1) decreases as described above. As a result, as indicated by an arrow A in the lower graph of FIG. 4, the characteristic impedance locally increases from the reference value in the vicinity of the boundary between the coaxial line L1 and the microstrip line L2. This causes a characteristic impedance mismatch between the coaxial line L1 and the microstrip line L2.

On the other hand, in the configuration of this embodiment, as shown in the example of FIG. The end face 16a (the face indicated by the thick line in FIG. 5) of the adhesive material 16 that is in contact with the insulating member 15 also functions as an electrode that forms the capacitance C in the boundary region R. As shown in FIG. That is, in the embodiment of FIG. 5, the area of the electrodes forming the capacitance C is larger than that of the comparative example of FIG. Therefore, the capacitance C increases as the electrode area S in the equation (1) increases. Therefore, an increase in capacitance C in equation (2) results in a decrease in characteristic impedance _Z0 . As a result, as shown in the graph at the bottom of FIG. 5, in the vicinity of the boundary between the coaxial line L1 and the microstrip line L2, the characteristic impedance increases (arrow A) and the gap G becomes electrically conductive. A decrease in the characteristic impedance (arrow B) due to filling the material 16 to increase the capacitance C is offset, and a change in the characteristic impedance is suppressed. As a result, the characteristic impedance mismatch between the coaxial line L1 and the microstrip line L2 is suppressed. As a result, it is possible to effectively suppress the power loss of especially high-frequency signals and obtain good transmission characteristics.

Further, in the embodiment, since the effect of suppressing the mismatch of the characteristic impedance is obtained as described above, the formation range of the grounding conductive member 17 is narrowed to stabilize the ground potential in the vicinity of the boundary of the microstrip line L2. Even if is slightly lowered, it is possible to sufficiently match the characteristic impedance. That is, if the grounding conductive member 17 is formed only in the range of the ground layer 142 excluding the space 17a on the side of the base 111, the stability of the ground potential in the vicinity of the space 17a deteriorates and the wiring pattern 141 is not connected. The electric field between the layers 142 is weakened. As a result, although this leads to a decrease in capacitance and an increase in characteristic impedance, the effect of reducing the characteristic impedance due to filling the gap G with the conductive bonding material 16 can sufficiently compensate for this. Therefore, the degree of freedom of the formation range of the grounding conductive member 17 can be increased without causing the problem of mismatching of the characteristic impedance, so that short-circuiting of the grounding conductive member 17 can be prevented more reliably.

FIG. 6 is a diagram showing the results of a simulation in which the losses in the electronic device mounting package 100 of the example of FIG. 5 and the electronic device mounting package of the comparative example of FIG. 4 are calculated with respect to the signal frequency. In FIG. 6, a solid line indicates the simulation result of the example, and a dashed line indicates the simulation result of the comparative example.

As shown in FIG. 6A, in the high-frequency bands near 40 GHz and 50 GHz indicated by the arrows, the reflection loss of the example (the closer to 0, the greater the reflection with respect to the incident light) is the reflection loss of the comparative example. The result was that it could be kept lower. Further, as shown in FIG. 6B, in the high-frequency bands near 40 GHz and 50 GHz indicated by the arrows, the insertion loss of the example (loss increases as the absolute value increases) is higher than that of the comparative example. The result was that it could be kept lower.

Moreover, by adopting the configuration of the embodiment, additional effects can be obtained. These effects will be described below.

FIG. 7 is a diagram for explaining the effect of suppressing the characteristic impedance mismatch caused by the depression of the insulating member 15 in the embodiment.
3 to 5, the first end portion 15a is flat, but the first end portion 15a may have unevenness. FIG. 7A shows a comparative example in which the first end portion 15a is recessed toward the side opposite to the wiring board 14 side. Also, FIG. 7B shows an embodiment in which the first end portion 15a is recessed toward the side opposite to the wiring board 14 side. That is, in both the comparative example shown in FIG. 7A and the embodiment shown in FIG. 7B, the first end portion 15a has a recess D inside the through hole 111a.

In the comparative example of FIG. 7A in which the first end portion 15a has the depression D, a space due to the depression D is generated near the opening 111b in the internal region of the through hole 111a. Since this space (air) has a lower dielectric constant than the insulating member 15 (for example, glass), it leads to a decrease in capacitance C in equation (1) and an increase in characteristic impedance Z ₀ in equation (2). Therefore, in the comparative example of FIG. 7A, the characteristic impedance mismatch becomes even more pronounced.

On the other hand, in the embodiment shown in FIG. 7B, the conductive bonding material 16 is positioned in at least a part of the recess D in addition to the gap G. As shown in FIG. Specifically, a first region 161 of the conductive bonding material 16 is positioned in the gap G, and a second region 162 of the conductive bonding material 16 is positioned in the recess D. This is because the conductive bonding material 16 also flows into the depression D when the gap G is filled with the conductive bonding material 16 . According to this configuration, it is possible to suppress mismatching of the characteristic impedance due to the space generated in the depression D as shown in FIG. 7(a).
In addition, since the conductive bonding material 16 is filled along the unevenness (curved surface) of the surface of the recess D, the area of the end surface 16a of the conductive bonding material 16 that contacts the insulating member 15 can be increased. Therefore, the capacitance C in equation (1) can be increased, and the characteristic impedance _Z0 in equation (2) can be reduced more effectively.

As shown in FIG. 8, even when the first end portion 15a is convex toward the wiring board 14 side, the same effect as in FIG. 7B can be obtained. That is, in such a configuration, since the peripheral edge portion of the convex first end portion 15a is recessed toward the side opposite to the wiring substrate 14 side, the first end portion 15a is recessed D inside the through hole 111a. becomes a state with In the embodiment of FIG. 8, at least part of the recess D is filled with the conductive bonding material 16, so that mismatching of the characteristic impedance caused by the space in the recess D can be suppressed.

FIG. 9 is a diagram for explaining the heat dissipation effect in the example.
In the comparative example shown in FIG. 9A, the heat generated by the operation of the electronic element 200 is transmitted through the wiring pattern 141, but at the position of the cross section of FIG. Since the distance between the pattern 141 and the base portion 111 is large, heat is less likely to be transferred from the wiring pattern 141 to the base portion 111 . In the comparative example, this reduces the efficiency of heat dissipation through the base 111 .

On the other hand, in the embodiment shown in FIG. 9B, since the gap G is filled with the conductive bonding material 16, the heat transmitted to the wiring pattern 141 is transferred to the conductive bonding material 16 ( For example, sintered silver in a silver sintering paste is easily transmitted to the base portion 111 . Therefore, the heat radiation efficiency via the base 111 can be improved more than the comparative example.

FIG. 10 is a diagram for explaining the effect of suppressing the influence of the load on the wiring board 14 in the embodiment. FIG. 10(a) is a view showing a cross-section perpendicular to the second surface 11a of the electronic device mounting package of the comparative example at a position not passing through the signal line 12. FIG. FIG. 10(b) is a view showing a cross section perpendicular to the second surface 11a of the electronic device mounting package 100 of the embodiment at a position where the signal line 12 does not pass.
As shown in FIG. 10A, in the comparative example, since the wiring board 14 is in direct contact with the base 111, the wiring board 14 receives a leftward drag F from the base 111 when the base 111 is deformed leftward in the drawing. receive (load). Due to this drag force F, various problems may occur due to deformation of the wiring board 14, displacement of the wiring board 14, and the like. Deformation of the base 111 may occur due to external force being applied to the base 111 during the manufacturing process of the electronic device 1 or after completion, or due to expansion of the base 111 due to temperature changes. The external force applied to the base portion 111 during the manufacturing process includes, for example, the force received from the jig when the base portion 111 is held by the jig in order to weld the cover member to the electronic device mounting package 100 . be done.

On the other hand, in the embodiment shown in FIG. 10(b), since the gap G is formed between the wiring board 14 and the base 111, even if the base 111 is deformed, it does not come into contact with the wiring board 14 and the wiring does not come into contact with the wiring board. The substrate 14 does not receive the drag force F. Alternatively, even if the base 111 contacts the wiring board 14 due to deformation of the base 111, the resistance F received by the wiring board 14 can be made smaller than in the comparative example. Therefore, it is possible to suppress the occurrence of various problems caused by deformation, positional displacement, and the like of the wiring board 14 .

(Modification 1)
Next, Modification 1 of the above embodiment will be described.
FIG. 11 is a cross-sectional view showing Modification 1 of the electronic device mounting package 100 of the above-described embodiment. In the electronic device mounting package 100 of Modification 1, the portion (first region 161) of the conductive bonding material 16 filled in the gap G and the edge portion 111c (opening 111b) of the substrate 11 (base portion 111) edge forming portion) and an insulating member 18 (second insulating member). Although the material of the insulating member 18 is not particularly limited, for example, it may be glass like the insulating member 15, or various resins may be used. Due to the presence of the insulating member 18, it is possible to reliably prevent the conductive bonding material 16 filled in the gap G from coming into contact with the base portion 111 to cause a short circuit.

(Modification 2)
Next, Modification 2 of the above embodiment will be described.
FIG. 12 is a cross-sectional view showing Modification 2 of the electronic device mounting package 100 of the above-described embodiment. In the electronic device mounting package 100 of Modification 2, the side surface 143 of the wiring substrate 14 has a first portion 143a and a second portion 143b. The side surface 143 is a side surface located adjacent to the first surface 14a and facing the second surface 11a. The first portion 143a is positioned to face the first end portion 15a with a gap G interposed therebetween. The second portion 143b protrudes toward the first end portion 15a of the insulating member 15 more than the first portion 143a. The second portion 143b is connected to the projection 112 side (lower side in FIG. 12) of the first portion 143a, and forms the gap G and the edge portion 111c (the edge of the opening 111b) of the base 11 (base portion 111). portion), and is in contact with the insulating member 15 .
In other words, a portion (second portion 143 b ) of side surface 143 protrudes toward insulating member 15 to have a step, and the protrusion (second portion 143 b ) formed by the step is in contact with insulating member 15 . , and the remaining portion (first portion 143 a ) forms a gap G with the insulating member 15 .

According to such a configuration, the first region 161 of the conductive bonding material 16 flowing into the gap G flows downward between the first portion 143a and the insulating member 15 and is blocked by the second portion 143b. be stopped. Therefore, it is possible to reliably suppress the occurrence of a short circuit due to contact between the first region 161 of the conductive bonding material 16 in the gap G and the base portion 111 .

Modification 2 may be combined with Modification 1. That is, the insulating member 18 may be further positioned below the second portion 143 b of the wiring board 14 . According to this, it is possible to more reliably suppress the occurrence of a short circuit due to contact between the first region 161 of the conductive bonding material 16 filling the gap G and the base portion 111 .
Also, the second portion 143 b of the side surface 143 does not necessarily have to be in contact with the insulating member 15 . This is because even if the second portion 143b and the insulating member 15 are slightly separated from each other, the second portion 143b has the effect of blocking the conductive bonding material 16 to some extent.

As described above, the electronic device mounting package 100 of the present embodiment has the first surface 14a, the wiring board 14 having the wiring pattern 141 on the first surface 14a, the second surface 11a, and the second surface 11a. A base body 11 having a through hole 111a having an opening 111b on two sides 11a, and an insulating member 15 having a first end 15a positioned inside the through hole 111a and on the side of the opening 111b. , the signal line 12 passing through the insulating member 15 and having the second end 12a located on the side of the opening 111b, the wiring pattern 141, and the second end 12a of the signal line 12 are joined to each other. The wiring board 14 is arranged with the first end 15a of the insulating member 15 with a gap G therebetween, and the conductive joint material 16 fills at least part of the gap G. It has a first region 161 located thereon.
Since the first region 161 of the conductive bonding material 16 is positioned in the gap G between the wiring board 14 and the insulating member 15, the end surface 16a of the conductive bonding material 16 that is in contact with the insulating member 15 is , functions as an electrode that forms a capacitance C in the vicinity of the boundary with the microstrip line L2 in the coaxial line L1. As a result, the capacitance C in the vicinity of the boundary can be increased and the characteristic impedance can be reduced. Therefore, it is possible to suppress the change in the characteristic impedance by canceling out the increase in the characteristic impedance due to the decrease in the electric field in the vicinity of the boundary and the decrease in the characteristic impedance due to the increase in the electrode area S of the capacitor C. As a result, it is possible to suppress mismatching of the characteristic impedance in the transmission mode converter between the coaxial line L1 and the microstrip line L2. As a result, the power loss of especially high-frequency signals can be effectively suppressed, and excellent signal transmission characteristics can be obtained.

In a cross section passing through the signal line 12 and perpendicular to the second surface 11a, the second surface 11a, the second end portion 12a that is the end surface of the signal line 12 on the side of the opening 111b, and the end surface of the insulating member 15 on the side of the opening 111b A certain first end 15a is on a straight line. By not protruding the signal line 12 from the opening 111b, it is possible to avoid problems such as noise caused when the signal line 12 protrudes from the opening 111b and is positioned in parallel with the wiring pattern 141. FIG. In addition, it is possible to suppress the characteristic impedance from deviating from a desired value due to the formation of a capacitance between the protruding signal line 12 and the wiring pattern 141, thereby preventing mismatching of the characteristic impedance. Also, by aligning the first end portion 15a with the second surface 11a and the second end portion 12a, the capacitance C in the vicinity of the boundary between the coaxial line L1 and the microstrip line L2 can be most effectively increased. Therefore, it is possible to suppress an increase in the characteristic impedance in the vicinity of the boundary and more appropriately match the characteristic impedance.

In addition, when the first end portion 15a of the insulating member 15 has the recess D inside the through hole 111a, the conductive bonding material 16 fills the second region 162 located in at least part of the recess D. have more. According to this, it is possible to suppress mismatching of the characteristic impedance due to the decrease in the capacitance C due to the space generated inside the through-hole 111a by the recess D. In addition, since the second region 162 of the conductive bonding material 16 is filled along the unevenness of the recess D, the area of the end surface 16a of the conductive bonding material 16 that contacts the insulating member 15 can be increased. Therefore, the capacitance C can be increased, the characteristic impedance can be reduced more effectively, and the characteristic impedance can be matched.

Further, the electronic device mounting package 100 according to Modification 1 includes a first region 161 that is a portion of the conductive bonding material 16 that fills the gap G, and a portion of the base 11 that forms the edge of the opening 111b. and an insulating member 18 located between the edge 111c. According to this, the first region 161 of the conductive bonding material 16 filling the gap G and the base 11 can be prevented from being short-circuited due to contact with each other.

In addition, the wiring board 14 according to Modification 2 has a side surface 143 adjacent to the first surface 14a and facing the second surface 11a of the base 11. and a second portion 143b protruding toward the first end 15a of the insulating member 15 from the first portion 143a. The gap G is separated by the second portion 143b from the edge portion 111c of the base 11 that forms the edge of the opening 111b. According to this, the first region 161 of the conductive bonding material 16 inside the gap G is blocked by the second portion 143b. Therefore, it is possible to prevent the first region 161 of the conductive bonding material 16 in the gap G from contacting the base 11 and causing a short circuit.

Also, the second portion 143 b is in contact with the insulating member 15 . According to this, it is possible to more reliably suppress the occurrence of a short circuit due to contact between the first region 161 of the conductive bonding material 16 in the gap G and the base 11 .

The conductive bonding material 16 is a fluid conductive paste such as silver sintering paste or copper sintering paste. Since the conductive paste having fluidity has fluidity when filling the gap G, the conductive bonding material 16 can be densely filled so as not to form a gap in the gap G. . Therefore, the electrode area S of the capacitance C can be increased more effectively, and the characteristic impedance can be matched more appropriately.

Further, the electronic device 1 of the present embodiment includes the electronic element mounting package 100 described above and the electronic element 200 joined to the wiring pattern 141 . According to such an electronic device 1, since the characteristic impedance matching is performed more appropriately, the power loss of the signal can be reduced, and the electronic element 200 can be effectively operated without wasting power consumption. .

Note that the above-described embodiment is an example, and various modifications are possible.
For example, in the drawings of the above embodiments, the side surface 143 of the wiring board 14 and the first end portion 15a facing each other to form the gap G are parallel to each other. is not. For example, the side surface 143 of the wiring board 14 may be tapered so that the distance between the side surface 143 and the first end portion 15a decreases toward the lower side of the gap G. According to this, the conductive bonding material 16 can be filled up to a desired position within the gap G more easily.

Further, the positional relationship between the first surface 14a and the second surface 11a may not be orthogonal, and the shape of each surface may be appropriately determined according to the electronic device 200 and the like. Also, the wiring portion of the wiring pattern that joins with the signal line 12 does not have to extend in the direction orthogonal to the second surface 11a.

Further, if the wiring pattern 141 on the first surface 14a of the wiring board 14 and the metal protrusions 112 can constitute the microstrip line L2, the ground layer 142 may be omitted.

Further, in the above embodiment, silver sintering paste or copper sintering paste is used as the conductive bonding material 16, but other conductive bonding materials such as epoxy can be used as the conductive bonding material to be bonded to the wiring board 14. It may be one in which conductive metal particles are dispersed in a resin or the like.

In addition, in FIG. 3 of the above embodiment, an example in which the second end portion 12a is in the same plane as the second surface 11a and the first end portion 15a has been described. may protrude from the second surface 11a toward the wiring substrate 14, or may be located at a position recessed toward the base portion 111 from the second surface 11a. Even in these cases, the signal line 12 and the wiring pattern 141 can be connected by bringing the second end portion 12 a into contact with the conductive bonding material 16 .

In addition, specific details such as configurations, structures, positional relationships, and shapes shown in the above embodiments can be changed as appropriate without departing from the scope of the present disclosure. Moreover, the configurations, structures, positional relationships, and shapes shown in the above embodiments can be appropriately combined without departing from the gist of the present disclosure.

1 Electronic Device 11 Substrate 11a Second Surface 111 Base 111a Through Hole 111b Opening 111c Edge 112 Projection 12 Signal Line 12a Second End 14 Wiring Board 14a First Surface 141 Wiring Pattern 142 Ground Layer 143 Side 143a First Part 143b Second portion 15 insulating member (first insulating member)
15a First end 16 Conductive bonding material 16a End surface 161 First region 162 Second region 17 Grounding conductive member 18 Insulating member (second insulating member)
100 Electronic device mounting package 200 Electronic device D Recess G Gap L1 Coaxial line L2 Microstrip line

Claims (8)

a wiring substrate having a first surface and having a wiring pattern on the first surface;
a base body having a second surface in which a through hole having an opening is located in the second surface;
a first insulating member located inside the through hole and having a first end located on the opening side;
a signal line passing through the first insulating member and having a second end located on the opening side;
a conductive bonding material that bonds the wiring pattern and the second end of the signal line;
with
The wiring board is arranged with a gap between it and the first end of the first insulating member,
The conductive bonding material has a first region located in at least part of the gap,
Package for mounting electronic elements. In a cross-section passing through the signal line and perpendicular to the second plane, the second plane, the second end of the signal line, and the first end of the first insulating member are aligned. A package for mounting an electronic device according to Item 1. The first end of the first insulating member has a recess inside the through hole,
3. The electronic device mounting package according to claim 1, wherein said conductive bonding material further has a second region located in at least part of said recess. 4. The method according to any one of claims 1 to 3, further comprising a second insulating member positioned between said first region of said conductive bonding material and a portion of said substrate forming an edge of said opening. A package for mounting the electronic device described. The wiring board has a side surface adjacent to the first surface and located opposite to the second surface of the base,
The aspect is
a first portion facing the first end of the first insulating member across the gap;
a second portion projecting further toward the first end of the first insulating member than the first portion;
4. The package for mounting an electronic element according to claim 1, wherein said gap is separated by said second portion from a portion of said base which forms an edge of said opening. 6. The electronic device mounting package according to claim 5, wherein said second portion is in contact with said first insulating member. 7. The package for mounting an electronic element according to claim 1, wherein said conductive bonding material is a fluid conductive paste. An electronic device mounting package according to any one of claims 1 to 7;
an electronic element bonded to the wiring pattern;
An electronic device comprising:

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