JP2022116383A - Electronic device mounting package and electronic device - Google Patents

Abstract

To provide an electronic device mounting package and an electronic device capable of suppressing degradation of signal transmission characteristics.SOLUTION: An electronic device mounting package includes a base body including a base portion having a first surface and a projection portion projecting from the first surface and having a second surface, a wiring board located on the second surface, and a cover that covers the projection portion and the wiring board, and from among the surfaces of the projection portion, the outer surface excluding the second surface has a shape without a ridgeline or a shape in which two surfaces forming an arbitrary ridgeline form an obtuse angle.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to an electronic device mounting package and an electronic device.

2. Description of the Related Art Conventionally, an electronic device having a substrate including a base having a shape such as a disc and a protruding portion protruding from the base, and a wiring substrate to which the electronic device is to be bonded is mounted on the surface of the protruding portion. There are packages for mounting (for example, Patent Documents 1 and 2). In this package, the electronic element can be driven by inputting a high-frequency signal to the electronic element from the signal line penetrating through the base through the wiring board. In addition, this package is used with a cover (cap) attached to the base to cover the electronic element, the wiring board and the projecting portion in order to protect the electronic element.

JP-A-2004-335584 JP 2018-186130 A

However, when the electronic element is driven by supplying a high-frequency signal with the lid attached, electric field coupling occurs between the lid and the base, causing resonance in a specific high-frequency band, resulting in a signal loss at the resonance frequency. There is a problem that the transmission characteristics are degraded.

An object of the present disclosure is to provide an electronic device mounting package and an electronic device that can suppress degradation in signal transmission characteristics.

One aspect of the present disclosure is
a base including a base having a first surface and a projection projecting from the first surface and having a second surface;
a wiring substrate located on the second surface;
a lid that covers the projecting portion and the wiring board;
with
Of the surfaces of the protrusion, the outer surface excluding the second surface has a shape without a ridgeline, or a shape in which two surfaces forming an arbitrary ridgeline form an obtuse angle.
It is a package for mounting an electronic element.

In addition, another aspect of the present disclosure is
the electronic device mounting package;
an electronic element bonded to the wiring substrate;
An electronic device comprising:

According to the contents of the present disclosure, there is an effect that deterioration of signal transmission characteristics can be suppressed in a package for mounting an electronic device.

1 is an overall perspective view of an electronic device and a package for mounting an electronic element; FIG. It is a figure which shows the cross section perpendicular|vertical to a base of an electronic device and a package for mounting an electronic element. It is a figure which shows the structure of the electronic device and electronic element mounting package which concern on a comparative example. FIG. 10 is a diagram showing simulation results of calculation of insertion loss with respect to signal frequency in the electronic device mounting packages of Examples and Comparative Examples. FIG. 10 is a diagram showing simulation results of calculation of reflection loss with respect to signal frequency in the electronic device mounting packages of the example and the comparative example. (a) is a perspective view showing the shape of a substrate according to an example of Modification 1, and (b) is a perspective view showing the shape of a substrate according to a comparative example corresponding to Modification 1. FIG. FIG. 10 is a diagram showing simulation results of insertion loss and reflection loss in electronic device mounting packages of Examples and Comparative Examples according to Modification 1; (a) is a perspective view showing the shape of a base according to an example of Modification 2, and (b) is a perspective view showing the shape of a base according to a comparative example corresponding to Modification 2; FIG. 10 is a diagram showing simulation results of insertion loss and reflection loss in electronic device mounting packages of Examples and Comparative Examples according to Modification 2; FIG. 11 is an overall perspective view of an electronic device and an electronic element mounting package according to Modification 3; FIG. 10 is a diagram showing a cross section perpendicular to the base of an electronic device and an electronic element mounting package according to Modification 3; 14 is a cross-sectional view showing another example of the electronic device and the electronic element mounting package according to Modification 3. FIG.

Embodiments will be described below with reference to the drawings.

(Structure of Electronic Device and Package for Mounting Electronic Element)
First, configurations of an electronic device 1 and an electronic device mounting package 100 will be described with reference to FIGS. 1 and 2. FIG.
FIG. 1 is an overall perspective view of an electronic device 1 and an electronic element mounting package 100 of this embodiment.
FIG. 2 is a diagram showing a cross section perpendicular to the base 111 of the electronic device 1 and the electronic device mounting package 100 .

The electronic device 1 includes an electronic element mounting package 100 and an electronic element 200 .
The electronic device mounting package 100 includes a base 11, a signal line 12, a wiring board 14, an insulating member 15, a conductive bonding material 16, a lid 20, and the like.

The substrate 11 is a conductive metal and functions as a ground plane. In addition to this, the substrate 11 may have high thermal conductivity (heat dissipation). The base 11 has a base portion 111 and a protruding portion 112 . The base 111 here has, for example, a disk-like shape with a diameter of 3 to 10 mm and a thickness of 0.5 to 2 mm, but is not limited to this. The base 111 has a through hole 111b. An insulating member 15 occupies the inside of the through hole 111b. The material of the insulating member 15 and the size of the through hole 111b may be determined according to the desired characteristic impedance. The base portion 111 and the protruding portion 112 may be integrally formed, or may be formed separately and joined together. A surface of the base portion 111 from which the projecting portion 112 protrudes is hereinafter referred to as a first surface 111a.

The projecting portion 112 has a second surface 112a (see FIG. 2) that is in contact with the first surface 111a and perpendicular to the first surface 111a. The wiring substrate 14 is positioned on the second surface 112a. That is, the projecting portion 112 functions as a stage on which the wiring board 14 is placed. The projecting portion 112 is sized to fit inside the lid 20 . The specific size of the protrusion 112 is determined according to the size of the base 11 and the lid 20. For example, the length of the second surface 112a in the direction perpendicular to the first surface 111a is about 1 to 3 mm. The length of the second surface 112a in the direction parallel to the first surface 111a can be about 1.5 to 5 mm. Also, the thickness of the protrusion 112 in the direction perpendicular to the second surface 112a can be about 1 to 3 mm.

Of the surfaces of the projecting portion 112, the outer surface S excluding the second surface 112a consists of an end surface S1 and a side surface S2. Of these, the end surface S1 is the surface of the projecting portion 112 on the side opposite to the base portion 111 side. The side surface S2 connects the first surface 111a and the end surface S1 and extends from the first surface 111a in a direction perpendicular to the first surface 111a.

The side surface S2 has a shape corresponding to a portion of a cylindrical surface. Alternatively, the side surface S2 may have a shape corresponding to a part of the elliptical cylindrical surface.

The end surface S1 has a first sub-end surface S1a that is a plane parallel to the first surface 111a, and a curved surface S1c that connects the first sub-end surface S1a and the side surface S2. That is, the portion of the end surface S1 that is connected to at least the side surface S2 is the curved surface S1c.

More specifically, the curved surface S1c has a cross section perpendicular to the side surface S2 and the first surface 111a that forms an arc with a radius of curvature R. The radius of curvature R is T/3 or more and 2T/3 or less, where T is the thickness of the protrusion 112 in the direction perpendicular to the second surface 112a (the maximum thickness if the thickness is not uniform). can be In this embodiment, the thickness T is 1 mm and the radius of curvature R is 500 μm.

Further, the curvature radius R of the curved surface S1c is determined so as to satisfy the relationship D+R>2T/3, where D is the distance between the projecting portion 112 and the lid 20 in the direction perpendicular to the second surface 112a. It is In this embodiment, the distance D is 300 μm, and the distance D, the radius of curvature R, and the thickness T satisfy the above relationship.

As shown in FIG. 2, the first sub-end surface S1a and the curved surface S1c are smoothly connected at an angle that does not form a ridgeline. Similarly, the curved surface S1c and the side surface S2 are smoothly connected at an angle that does not form a ridgeline. Here, a ridgeline is a line formed at a connecting portion of two surfaces having different normal directions. In the present embodiment, the normal directions of adjacent portions of the connecting portion between the first sub-end surface S1a and the curved surface S1c and the connecting portion between the curved surface S1c and the side surface S2 are the same. That is, the first sub-end surface S1a and the curved surface S1c, and the curved surface S1c and the side surface S2 are connected at an angle such that the normal directions of adjacent portions across the connecting portion are the same. Therefore, the first sub-end surface S1a, the curved surface S1c, and the side surface S2 have shapes without ridgelines. In FIG. 1, the boundary between the first sub-end surface S1a and the curved surface S1c and the boundary between the curved surface S1c and the side surface S2 are indicated by dashed-dotted lines. , does not mean that a ridge is formed.

The outer surface S of the protruding portion 112 including the end surface S1 and the side surface S2 has a shape without ridgelines. The effect of forming the outer surface S in such a shape will be described later.

The wiring board 14 has a wiring pattern 141 on the surface opposite to the protrusion 112 (hereinafter also referred to as "upper surface"), and has a wiring pattern on the surface on the protrusion 112 side (hereinafter also referred to as "lower surface"). 142. Here, the wiring board 14 is used, for example, as a high-frequency line board. The wiring substrate 14 is an insulating substrate, for example, made of resin. The thickness and material (relative dielectric constant) of the wiring board 14 may be appropriately determined according to the desired characteristic impedance. The side surface of the wiring board 14 is joined to the first surface 111 a of the base 111 .

The signal line 12 is a rod-shaped conductor. The signal line 12 penetrates the insulating member 15 in the through hole 111b of the base 111 and is exposed from the opening of the through hole 111b in the first surface 111a. The diameter of the signal line 12 is, for example, approximately 0.1 to 1.0 mm. Glass having a predetermined dielectric constant, for example, can be used as the insulating member 15 . At least one of the signal lines 12 is a ground terminal of the base 11 and directly connected to the base 111 . Other signal lines 12 protrude from the side of the base portion 111 opposite to the first surface 111a, are electrically connected to external wiring, and are used as lead electrodes. Specifically, inside the insulating member 15 , the signal line 12 is separated from the outer base portion 111 by the insulating member 15 . A coaxial line L1 is formed by the base portion 111 (through hole 111b), the insulating member 15 and the signal line 12 having such a configuration. In the base portion 111, signals are transmitted through this coaxial line L1. FIG. 1 shows a state in which two signal lines 12 are joined to a wiring pattern 141 via a conductive joint material 16 on the first surface 111a side of the base portion 111 .

A wiring pattern 141 formed on the upper surface of the wiring board 14 is electrically connected to the electronic element 200 to supply power and signals to the electronic element 200 . The wiring pattern 141 is joined to the signal line 12 at its ends (here, two places) via the conductive joining material 16 . The shape, length and position of the wiring pattern 141 are appropriately determined according to the size and terminal position of the electronic element 200 to be connected. Moreover, the wiring pattern 142 is formed on the entire lower surface of the wiring board 14, and is connected to the protruding portion 112 to be grounded. The wiring patterns 141 and 142 are conductive metal films with low resistance, here gold (Au) thin films.

As shown in FIG. 1, the wiring portion of the wiring pattern 141 that is connected to the signal line 12 extends on the wiring substrate 14 substantially perpendicularly to the first surface 111a to the vicinity of the exposed surface of the insulating member 15. . The wiring pattern 141 is separated from the wiring pattern 142 by the wiring board 14 . The wiring patterns 141 and 142 having such a configuration form a microstrip line L2 on the wiring board 14, and signals are transmitted through this microstrip line L2.

The conductive bonding material 16 is positioned between the signal line 12 and the first surface 111 a and the wiring pattern 141 and the upper surface of the wiring board 14 . Thereby, the conductive bonding material 16 electrically bonds the signal line 12 exposed on the first surface 111 a and the wiring pattern 141 on the upper surface of the wiring board 14 . As the conductive bonding material 16, silver sintering paste or copper sintering paste can be used. The sintering paste contains a mixture of a conductor metal such as silver or copper and a protective molecule such as a resin. When heated, the resin reacts to bond and fix the conductor metal. Moreover, at this time, the resin component also bonds to the insulating surface. Therefore, the conductive bonding material 16 bonds not only to the signal line 12 and the wiring pattern 141 but also to the insulating member 15 and the insulating surfaces of the wiring board 14 .

An electronic element 200 indicated by a dashed line in FIG. 1 is located on the upper surface of the wiring board 14 and is electrically connected (bonded) to the wiring pattern 141 directly and/or by wire bonding or the like. The electronic device 200 of this embodiment is a laser diode that emits light according to an input signal. However, the electronic element 200 is not limited to this, and may be a photodiode, an LED (Light Emitting Diode), a Peltier element, various sensor elements, or the like. Also, the electronic device 200 may be a semiconductor device. Heat generated by the operation of the electronic device 200 is discharged through the substrate 11 .

The lid 20 is a cover member that covers the protrusion 112 , the wiring board 14 and the electronic element 200 to isolate them from the outside and protect the protrusion 112 , the wiring board 14 and the electronic element 200 . The lid 20 has a cylindrical shape with an upper surface closed except for a portion (opening 20a), and a portion corresponding to the lower surface of the cylindrical shape is welded and joined to the first surface 111a of the base 111. ing. The lid 20 is made of a conductive metal like the base 111 and is grounded together with the base 111 . The lid 20 has an opening 20a through which light incident from the electronic element 200 passes, on the surface covering the cylindrical upper surface. Further, the opening 20a is covered with glass 30 (dielectric) from the inside of the lid 20. As shown in FIG. That is, the glass 30 is positioned between the lid 20 and the projecting portion 112 . The glass 30 has a function of protecting the internal configuration of the lid 20 , that is, the protrusion 112 , the wiring board 14 and the electronic element 200 . Alternatively, as the glass 30, one having a function of condensing the light emitted from the electronic element 200 (condensing lens) may be used.

(Effect of Outer Shape of Protruding Portion)
Next, the effect of the outer surface shape of the protruding portion in the configuration of this embodiment will be described in comparison with a comparative example.

First, referring to FIG. 3, the configuration of a conventional electronic device mounting package 100a as a comparative example will be described. FIG. 3A is a perspective view of an electronic device 1a and an electronic device mounting package 100a according to a comparative example, and FIG. 4 is a diagram showing a cross section perpendicular to the base 111. FIG.

As shown in FIGS. 3A and 3B, in the electronic device mounting package 100 of the comparative example, the outer surface S of the projecting portion 112 has a shape corresponding to a flat end surface S1 and a part of a cylindrical surface. The edge E is formed by connecting the end surface S1 and the side surface S2 at an angle of 90 degrees. In this specification, an edge E is a ridge line formed by two surfaces and the two surfaces form an angle of 90 degrees or less. Also, in this specification, the angle formed by two surfaces refers to the angle inside the member forming the two surfaces, and does not include the angle formed by virtual surfaces that are extensions of the respective surfaces. .

As described above, in the electronic device mounting package 100a of the comparative example in which the edge E is formed on the protruding portion 112, when a signal is transmitted at a predetermined resonance frequency corresponding to the shapes of the protruding portion 112 and the lid body 20, Especially around the edge E, electric field coupling is likely to occur between the projecting portion 112 and the lid body 20, and an electric field is generated intensively. Hereinafter, a phenomenon in which an electric field concentrates between the projecting portion 112 and the lid 20 at the resonance frequency is referred to as resonance. The protruding portion 112 and the lid 20 play a role as a ground, but since a potential difference occurs between the grounds at the resonance frequency, they do not function as a stable ground, resulting in power loss of the transmission signal.

On the other hand, in the electronic device mounting package 100 of the present embodiment, the connecting portion of the end surface S1 of the projecting portion 112 with the side surface S2 is a curved surface S1c, so that the outer surface S of the projecting portion 112 faces the edge E. The curved surface S1c is smoothly connected to the first sub-end surface S1a and the side surface S2 at an angle that does not form a ridgeline. In addition, this ensures a wide gap between the projecting portion 112 and the lid 20 at the position where electric field coupling is likely to occur (the position corresponding to the edge E in the comparative example). In this manner, the outer surface S of the projecting portion 112 has a shape that does not have an edge E on which an electric field tends to concentrate, and a wide gap is secured between the projecting portion 112 and the lid body 20 . Electric field coupling between and is less likely to occur, and resonance is less likely to occur. As a result, power loss at the resonance frequency is less likely to occur, and deterioration in signal transmission characteristics is suppressed.

FIG. 4 is a diagram showing results of a simulation in which the insertion loss with respect to the signal frequency was calculated in the electronic device mounting package 100 of the example according to the present embodiment and the electronic device mounting package 100a of the comparative example. Among them, FIG. 4(a) shows the insertion loss of the comparative example, and FIG. 4(b) shows the insertion loss of the example.

As shown in FIG. 4A, in the electronic device mounting package 100a of the comparative example, in the high frequency band near 53 GHz (resonant frequency) indicated by the dashed ellipse, the insertion loss (the larger the absolute value of the loss, the large) is significantly larger. On the other hand, as shown in FIG. 4B, in the electronic device mounting package 100 of the example, the insertion loss at the resonance frequency is kept smaller than that of the comparative example.

FIG. 5 is a diagram showing results of a simulation in which reflection loss with respect to signal frequency was calculated in the electronic device mounting package 100 of the example and the electronic device mounting package 100a of the comparative example. Among them, FIG. 5(a) shows the reflection loss of the comparative example, and FIG. 5(b) shows the reflection loss of the example.

As shown in FIG. 5(a), in the electronic device mounting package 100a of the comparative example, in the high frequency band around 53 GHz (resonance frequency) indicated by the dashed ellipse, the reflection loss is large and the loss increases). On the other hand, as shown in FIG. 5B, in the electronic device mounting package 100 of the example, the insertion loss at the resonance frequency is suppressed to be smaller than that of the comparative example.

(Modification 1)
Next, Modification 1 of the above embodiment will be described. This modification differs from the above-described embodiment in the shape of the outer surface S of the projecting portion 112 . Differences from the above embodiment will be described below.

FIG. 6A is a perspective view showing the shape of the base 11 according to the example of Modification 1. FIG. In this modified example, the side surface S2 of the protruding portion 112 is composed of two flat portions S2a forming an angle of 90 degrees and a curved portion S2b smoothly connecting the two flat portions S2a at an angle that does not form a ridgeline. Therefore, the cross section parallel to the first surface 111a of the projecting portion 112 has the shape of an isosceles right triangle with curved vertices corresponding to the curved surface portion S2b. Further, as in the above-described embodiment, the end surface S1 of the projecting portion 112 has a first sub-end surface S1a which is a plane parallel to the first surface 111a, and an angle formed between the first sub-end surface S1a and the side surface S2 such that no ridge line is formed. and a curved surface S1c that connects smoothly.

In the electronic device mounting package 100 having such a configuration, the edge E is not formed on the projecting portion 112, and the distance between the projecting portion 112 and the lid body 20 is kept wide. Electric field coupling with the lid 20 is less likely to occur, and resonance is less likely to occur. As a result, power loss at the resonance frequency is less likely to occur, and deterioration in signal transmission characteristics is suppressed.

Below, the effect of the configuration of Modification 1 will be described in comparison with a comparative example according to the prior art corresponding to Modification 1. FIG.
FIG. 6B is a perspective view showing the shape of the base 11 according to the comparative example corresponding to Modification 1. As shown in FIG. In this comparative example, the side surface S2 of the projecting portion 112 has a shape in which two plane portions forming an angle of 90 degrees are connected at an angle of 90 degrees so as to form an edge E. FIG. Therefore, the cross section parallel to the first surface 111a of the projecting portion 112 has the shape of an isosceles right triangle. In addition, the end surface S1 of the protruding portion 112 consists of one plane parallel to the first surface 111a. Therefore, the end surface S1 and the side surface S2 form an edge E that is connected at an angle of 90 degrees. In such a configuration of the comparative example, electric field coupling is likely to occur between the projecting portion 112 and the lid 20 around the edge E, and resonance is likely to occur.

FIG. 7 is a diagram showing simulation results of insertion loss and reflection loss in the electronic device mounting package 100 of the example according to Modification 1 and the electronic device mounting package 100a of the comparative example. Of these, FIG. 7(a) shows insertion loss, FIG. 7(b) is an enlarged view of area A1 in FIG. 7(a), and FIG. 7(c) shows reflection loss. . As shown in FIGS. 7A and 7B, it can be seen that the increase in insertion loss due to resonance near 53 GHz (resonant frequency) is suppressed in the example more than in the comparative example. Further, as shown in FIG. 7(c), in the electronic device mounting package 100a of the comparative example, the reflection loss increases in the high frequency band around 39 GHz in addition to 53 GHz. On the other hand, in the electronic device mounting package 100 of the example, it can be seen that the reflection loss is suppressed to a low level, especially around 39 GHz.

(Modification 2)
Next, Modification 2 of the above embodiment will be described. This modification differs from the above-described embodiment in the shape of the outer surface S of the projecting portion 112 . Differences from the above embodiment will be described below.

FIG. 8A is a perspective view showing the shape of the base 11 according to the example of Modification 2. FIG. In this modification, the side surface S2 of the projecting portion 112 is composed of three planar portions connected to form a ridgeline r. Here, the angle formed by the planar portions forming each ridge r is an obtuse angle of 135 degrees or more. Therefore, the cross section parallel to the first surface 111a of the protrusion 112 has a quadrangular shape with two obtuse angles. Further, the end surface S1 of the projecting portion 112 is formed of a curved surface S1c smoothly connected to the side surface S2 at an angle that does not form a ridgeline.

In the electronic device mounting package 100 having such a configuration, the edge E is not formed on the projecting portion 112, and the distance between the projecting portion 112 and the lid body 20 is kept wide. Electric field coupling with the lid 20 is less likely to occur, and resonance is less likely to occur. As a result, power loss at the resonance frequency is less likely to occur, and deterioration in signal transmission characteristics is suppressed. Although the ridgeline r is formed on the side surface S2, the planar portions forming each ridgeline r are connected to each other so as to form an obtuse angle. Electric field coupling with the lid 20 is less likely to occur. Therefore, even with the configuration of Modification 2, it is possible to sufficiently suppress the occurrence of resonance.

Below, the effect of the configuration of Modification 2 will be described in comparison with a comparative example according to the prior art corresponding to Modification 2. FIG.
FIG. 8B is a perspective view showing the shape of the base 11 according to the comparative example corresponding to Modification 2. As shown in FIG. In this comparative example, the side surface S2 of the protrusion 112 consists of three planar portions connected to form a ridge r. In addition, the end surface S1 of the protruding portion 112 consists of one plane parallel to the first surface 111a. Therefore, the end surface S1 and the side surface S2 form an edge E that is connected at an angle of 90 degrees. In such a configuration of the comparative example, electric field coupling is likely to occur between the projecting portion 112 and the lid 20 around the edge E, and resonance is likely to occur.

FIG. 9 is a diagram showing simulation results of insertion loss and reflection loss in the electronic device mounting package 100 of the example according to Modification 2 and the electronic device mounting package 100a of the comparative example. Of these, FIG. 9(a) shows insertion loss, FIG. 9(b) is an enlarged view of area A2 in FIG. 9(a), and FIG. 9(c) shows reflection loss. . As shown in FIGS. 9A and 9B, it can be seen that the increase in insertion loss due to resonance near 53 GHz (resonant frequency) is suppressed in the example more than in the comparative example. Further, as shown in FIG. 9C, in the electronic device mounting package 100a of the comparative example, the reflection loss is large in the high frequency band around 39 GHz in addition to 53 GHz. On the other hand, in the electronic device mounting package 100 of the example, it can be seen that the reflection loss is suppressed to a low level, especially around 39 GHz.

(Modification 3)
Next, Modification 3 of the above embodiment will be described. This modification differs from the above-described embodiment in the shape of the outer surface S of the projecting portion 112 . Differences from the above embodiment will be described below.

FIG. 10 is an overall perspective view of an electronic device 1 and an electronic element mounting package 100 according to Modification 3. As shown in FIG.
FIG. 11 is a diagram showing a cross section perpendicular to the base portion 111 of the electronic device 1 and the electronic device mounting package 100 according to Modification 3. As shown in FIG.

The side surface S2 of the projecting portion 112 of this modified example has a shape corresponding to a portion of a cylindrical surface, as in the above-described embodiment. Further, the end surface S1 has a first sub-end surface S1a that is a plane parallel to the first surface 111a, and a second sub-end surface S1b that connects the first sub-end surface S1a and the side surface S2. Of these, the second sub-end surface S1b is not a rounded curved surface that protrudes toward the lid body 20, but is formed by connecting the edge E of the end surface S1 and the side surface S2 connected at an angle of 90 degrees to each other at an angle of 45 degrees. It corresponds to the surface obtained by chamfering with Therefore, the first sub-end surface S1a and the second sub-end surface S1b are connected so as to form a first ridgeline r1, and the second sub-end surface S1b and the side surface S2 are connected so as to form a second ridgeline r2. It is connected. A second sub-end surface S1b in a cross section perpendicular to the side surface S2 and the first surface 111a (for example, the cross section shown in FIG. 11) forms a straight line connecting the first sub-end surface S1a and the side surface S2. In the cross section, the angle a1 formed between the first sub-end surface S1a and the second sub-end surface S1b is an obtuse angle of 135 degrees, and the angle a2 formed between the second sub-end surface S1b and the side surface S2 is also an obtuse angle of 135 degrees. is.

In this manner, the outer surface S of the protruding portion 112 of this modified example has a shape in which two surfaces forming an arbitrary ridgeline r form an obtuse angle. Here, the obtuse angle formed by each surface has a size of 135 degrees. Electric field coupling with the lid 20 is less likely to occur around the ridgeline r than around the edge E forming an angle of 90 degrees or less. Therefore, even with the configuration of Modification 3, it is possible to sufficiently suppress the occurrence of resonance.

10 and 11, the example in which the second sub-end surface S1b consisting of one surface is formed between the side surface S2 and the first sub-end surface S1a has been described. , may consist of a plurality of surfaces with different angles. That is, the shape of the second sub-end surface S1b may be a shape in which a plurality of surfaces are chamfered in stages such that the inclination angle with respect to the side surface S2 gradually increases. For example, as shown in FIG. 12, the second sub-end surface S1b has a surface forming an obtuse angle of 150 degrees with respect to the side surface S2 and a surface forming an obtuse angle of 150 degrees with respect to the first sub-end surface S1a. may In this case, three ridgelines r are formed on the outer surface S, and the two surfaces forming each ridgeline r are connected at an obtuse angle of 150 degrees. By increasing the number of surfaces included in the second sub-end surface S1b in this manner, the obtuse angle formed by the two surfaces forming the ridgeline r can be increased, and electric field coupling can be made more difficult to occur.

As described above, the electronic device mounting package 100 of the present embodiment includes the base 111 including the base 111 having the first surface 111a and the projecting portion 112 projecting from the first surface 111a and having the second surface 112a. , the wiring board 14 positioned on the second surface 112a, and the lid body 20 covering the projecting portion 112 and the wiring substrate 14, and the outer surface S of the projecting portion 112 excluding the second surface 112a forms a ridge line. It has a shape that does not have a shape, or a shape that forms an obtuse angle between two surfaces forming an arbitrary ridge.
If the outer surface S of the projecting portion 112 has an edge E (a ridge line formed by two surfaces forming an angle of 90 degrees or less), there will be an edge between the projecting portion 112 and the lid 20 when a signal of the resonance frequency is transmitted. Of these, the electric field tends to concentrate around the edge E, but the outer surface S of the protruding portion 112 can be prevented from having the edge E by adopting the configuration described above. As a result, it is possible to suppress the occurrence of electric field coupling due to the concentration of the electric field between the protruding portion 112 and the lid 20, thereby suppressing the occurrence of resonance. As a result, power loss at the resonance frequency can be made less likely to occur, and degradation in signal transmission characteristics can be suppressed.

In addition, the outer surface S of the projecting portion 112 extends from the end surface S1 of the projecting portion 112 opposite to the base portion 111 side and the first surface 111a in a direction perpendicular to the first surface 111a. At least a portion of the end surface S1 connected to the side surface S2 is a curved surface S1c. Conventionally, the connecting portion between the end surface S1 and the side surface S2 has a shape having an edge E, which tends to concentrate electric fields and cause electric field coupling. Electric field coupling can be made difficult to occur, and the occurrence of resonance can be suppressed. As a result, deterioration in signal transmission characteristics at the resonance frequency can be effectively suppressed.

Also, the end surface S1 and the side surface S2 are connected at an angle that does not form a ridgeline. According to this, it is possible to more reliably suppress the occurrence of electric field coupling at the connecting portion between the end surface S1 and the side surface S2, so that deterioration of the signal transmission characteristics can be suppressed more effectively.

Also, the curvature radius R of the curved surface S1c is ⅓ or more and ⅔ or less of the thickness T of the projecting portion 112 in the direction perpendicular to the second surface 112a. By providing the curved surface S1c having such a radius of curvature R at the connection portion of the end surface S1 with the side surface S2, it is possible to more effectively suppress the occurrence of electric field coupling due to the concentration of the electric field at the connection portion. .

The radius of curvature R of the curved surface S1c is defined by T representing the thickness of the protrusion 112 in the direction perpendicular to the second surface 112a, and D representing the distance between the protrusion 112 and the lid 20 in the direction perpendicular to the second surface 112a. , the relationship D+R>2T/3 is satisfied. According to this, the curvature radius R of the curved surface S1c is set to a size that can appropriately suppress the occurrence of electric field concentration and electric field coupling, taking into account the distance D between the projecting portion 112 and the lid 20. can be done. That is, according to the above relational expression, when the distance D is small and the electric field coupling is likely to occur at the distance D, the curvature radius R is ensured to be large, and the curved surface S1c is less prone to electric field coupling. On the other hand, the larger the distance D, the more difficult it is for electric field coupling to occur at the distance D, so the radius of curvature R can be reduced within a range in which electric field coupling is less likely to occur.

Further, in the electronic device mounting package 100 according to Modification 3, the edge line r2 is formed by the end surface S1 and the side surface S2, and the angle formed by the portions forming the edge line r2 of the end surface S1 and the side surface S2 is an obtuse angle. be. In this way, by forming an obtuse angle between the two surfaces forming the ridgeline r2 on the outer surface S, it is possible to suppress the concentration of the electric field and the occurrence of electric field coupling around the ridgeline r2. Therefore, even with such a configuration, deterioration in signal transmission characteristics due to resonance can be more effectively suppressed.

In addition, in the electronic device mounting package 100 according to Modification 3, the end face S1 is connected to the second sub-end face S1b connected to the side face S2 and to the side opposite to the side face S2 of the second sub-end face S1b. The first sub-end surface S1a and the second sub-end surface S1b form a first ridgeline r1. The angle formed by the portions forming r1 is an obtuse angle, the second ridgeline r2 is formed by the second sub-end surface S1b and the side surface S2, and the second ridgeline is formed by the second sub-end surface S1b and the side surface S2. The angle between the parts is an obtuse angle. According to this, the simple configuration of chamfering the connecting portion between the end surface S1 and the side surface S2 can suppress the concentration of the electric field and the occurrence of the electric field coupling at the connecting portion. Therefore, even with such a configuration, deterioration in signal transmission characteristics due to resonance can be more effectively suppressed.

Moreover, the side surface S2 has the shape of a part of a cylindrical surface or the shape of a part of an elliptical cylindrical surface. According to this, since the side surface S2 has a shape that does not have a ridgeline, it is possible to suppress the occurrence of electric field concentration and electric field coupling on the side surface S2. Therefore, deterioration of signal transmission characteristics due to resonance can be more effectively suppressed.

In addition, in the electronic device mounting packages 100 according to Modifications 1 and 2, the side surface S2 is composed of two or more planar portions S2a and curved surface portions S2b connecting the two or more planar portions S2a. According to this, even if the side surface S2 has the flat portion S2a, the edge E can be prevented from being generated on the side surface S2, so that the concentration of the electric field and the occurrence of the electric field coupling on the side surface S2 can be suppressed. . Therefore, deterioration of signal transmission characteristics due to resonance can be more effectively suppressed.

Further, by setting the obtuse angle to 135 degrees or more, it is possible to suppress the occurrence of electric field concentration and electric field coupling around the ridgeline. Therefore, deterioration of signal transmission characteristics due to resonance can be more effectively suppressed.

The electronic device mounting package 100 also includes glass 30 as a dielectric positioned between the projecting portion 112 and the lid 20 . In such a configuration in which a dielectric is sandwiched between the projecting portion 112 and the lid 20, electric field coupling is more likely to occur than in a configuration without a dielectric. By doing so, it is possible to suppress the occurrence of electric field coupling and more effectively suppress deterioration in signal transmission characteristics due to resonance.

Further, the electronic device 1 of the present embodiment includes the electronic element mounting package 100 described above and the electronic element 200 that is bonded to the wiring board 14 . In such an electronic device 1, deterioration of signal transmission characteristics due to resonance can be suppressed.

Note that the above-described embodiment is an example, and various modifications are possible.
For example, the shape of the outer surface S of the protruding portion 112 is not limited to those described in the above embodiment and modifications, and may be a shape without a ridgeline, or an obtuse angle formed by two surfaces forming an arbitrary ridgeline. As long as it has a shape, it can be of any shape. For example, the entire outer surface S may consist of a smooth continuous curved surface.

In the above-described embodiment, in the configuration in which the end surface S1 has the curved surface S1c (FIGS. 1, 2, 6A, and 8A), the curved surface S1c and the side surface S2 form a smooth angle that does not form a ridgeline. , but the curved surface S1c and the side surface S2 may be connected at an angle forming a ridgeline. In this case, by forming an obtuse angle between the surfaces forming the ridgeline, it is possible to suppress the occurrence of electric field concentration and electric field coupling around the ridgeline.

Further, the extending direction of the second surface 112a and the side surface S2 of the projecting portion 112 does not necessarily have to be the direction perpendicular to the first surface 111a. direction).

Further, the electronic device mounting package 100 does not have to have a dielectric such as the glass 30 inside the lid 20 .

Further, the shape of the lid body 20 is not limited to the cylindrical shape shown in the above-described embodiment, and may be appropriately changed according to the shape of the electronic element 200, the application, and the like.

Further, if the wiring pattern 141 on the upper surface of the wiring board 14 and the metal protruding portion 112 can constitute the microstrip line L2, the wiring pattern 142 may be omitted.

Further, in the above embodiment, silver sintering paste or copper sintering paste is used as the conductive bonding material 16, but other conductive bonding materials may be used as long as they are bonded to the wiring board 14. may

In addition, specific details such as configurations, structures, positional relationships, and shapes shown in the above embodiments can be changed as appropriate without departing from the scope of the present disclosure.

1 electronic device 11 substrate 111 base 111a first surface 111b through hole 112 protrusion 112a second surface 12 signal line 14 wiring board 15 insulating member 16 conductive bonding material 20 lid 20a opening 30 glass (dielectric)
100 Electronic device mounting package 141, 142 Wiring pattern 200 Electronic device E Edge L1 Coaxial line L2 Microstrip line S Outer surface S1 End surface S1a First sub-end surface S1b Second sub-end surface S1c Curved surface S2 Side surface S2a Plane portion S2b Curved surface portion r Ridgeline r1 First edge r2 Second edge

Claims (12)

a base including a base having a first surface and a projection projecting from the first surface and having a second surface;
a wiring board located on the second surface;
a lid covering the projecting portion and the wiring substrate;
with
Of the surfaces of the protrusion, the outer surface excluding the second surface has a shape without a ridgeline, or a shape in which two surfaces forming an arbitrary ridgeline form an obtuse angle.
Package for mounting electronic elements. The outer surface of the protrusion is
an end surface of the projecting portion on the side opposite to the base portion;
a side surface extending from the first surface in a direction intersecting the first surface and connecting the first surface and the end surface;
consists of
2. The electronic device mounting package according to claim 1, wherein at least a portion of said end surface connected to said side surface is curved. 3. The electronic device mounting package according to claim 2, wherein said end face and said side face are connected at an angle that does not form a ridge line. 4. The electronic device mounting package according to claim 2, wherein the radius of curvature of said curved surface is 1/3 or more and 2/3 or less of the thickness of said protrusion in the direction perpendicular to said second surface. As for the radius of curvature of the curved surface, R is the radius of curvature, T is the thickness of the protrusion in the direction perpendicular to the second surface, and the protrusion and the lid are in the direction perpendicular to the second surface. 5. The package for mounting an electronic element according to claim 2, wherein the relationship D+R>2T/3 is satisfied, where D is the interval between the two. The outer surface of the protrusion is
an end surface of the projecting portion on the side opposite to the base portion;
a side surface extending from the first surface in a direction intersecting the first surface and connecting the first surface and the end surface;
consists of
2. The package for mounting an electronic element according to claim 1, wherein a ridge is formed by said end face and said side face, and an angle formed by said end face and said side face forming said ridge line is an obtuse angle. the end surface comprises a second sub-end surface connected to the side surface and a first sub-end surface connected to the side opposite to the side surface of the second sub-end surface;
A first ridge line is formed by the first sub-end surface and the second sub-end surface, and an obtuse angle is formed between portions of the first sub-end surface and the second sub-end surface that form the first ridge line. ,
7. The apparatus according to claim 6, wherein a second ridge line is formed by said second minor end surface and said side surface, and an angle formed by portions of said second minor end surface and said side surface forming said second ridge line is an obtuse angle. electronic device mounting package. 8. The electronic device mounting package according to claim 2, wherein said side surface has a partial shape of a cylindrical surface or a partial shape of an elliptical cylindrical surface. 8. The electronic device mounting package according to claim 2, wherein said side surface comprises two or more flat portions and a curved portion connecting said two or more flat portions. 10. The electronic device mounting package according to claim 1, wherein said obtuse angle is 135 degrees or more. The electronic device mounting package according to any one of claims 1 to 10, further comprising a dielectric positioned between said protrusion and said lid. An electronic device mounting package according to any one of claims 1 to 11;
an electronic element bonded to the wiring substrate;
An electronic device comprising:

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