JP2022102826A - 固体材料 - Google Patents

固体材料 Download PDF

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Publication number
JP2022102826A
JP2022102826A JP2020217806A JP2020217806A JP2022102826A JP 2022102826 A JP2022102826 A JP 2022102826A JP 2020217806 A JP2020217806 A JP 2020217806A JP 2020217806 A JP2020217806 A JP 2020217806A JP 2022102826 A JP2022102826 A JP 2022102826A
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JP
Japan
Prior art keywords
elastic modulus
solid
solid material
dimensional structure
sample
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020217806A
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English (en)
Japanese (ja)
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JP2022102826A5 (https=
Inventor
正樹 藤金
Masaki Fujikane
宏平 高橋
Kohei Takahashi
尚基 反保
Naoki Tambo
康幸 内藤
Yasuyuki Naito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2020217806A priority Critical patent/JP2022102826A/ja
Priority to PCT/JP2021/045642 priority patent/WO2022138247A1/ja
Publication of JP2022102826A publication Critical patent/JP2022102826A/ja
Priority to US18/328,807 priority patent/US20230313936A1/en
Publication of JP2022102826A5 publication Critical patent/JP2022102826A5/ja
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L59/00—Thermal insulation in general
    • F16L59/02—Shape or form of insulating materials, with or without coverings integral with the insulating materials
    • F16L59/028—Compositions for or methods of fixing a thermally insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Composite Materials (AREA)
  • Laminated Bodies (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2020217806A 2020-12-25 2020-12-25 固体材料 Pending JP2022102826A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2020217806A JP2022102826A (ja) 2020-12-25 2020-12-25 固体材料
PCT/JP2021/045642 WO2022138247A1 (ja) 2020-12-25 2021-12-10 固体材料
US18/328,807 US20230313936A1 (en) 2020-12-25 2023-06-05 Solid material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020217806A JP2022102826A (ja) 2020-12-25 2020-12-25 固体材料

Publications (2)

Publication Number Publication Date
JP2022102826A true JP2022102826A (ja) 2022-07-07
JP2022102826A5 JP2022102826A5 (https=) 2023-12-12

Family

ID=82157861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020217806A Pending JP2022102826A (ja) 2020-12-25 2020-12-25 固体材料

Country Status (3)

Country Link
US (1) US20230313936A1 (https=)
JP (1) JP2022102826A (https=)
WO (1) WO2022138247A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022102827A (ja) * 2020-12-25 2022-07-07 パナソニックＩｐマネジメント株式会社 赤外線センサ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017223644A (ja) * 2016-06-13 2017-12-21 パナソニックＩｐマネジメント株式会社 赤外線センサ
WO2019225058A1 (ja) * 2018-05-22 2019-11-28 パナソニックＩｐマネジメント株式会社 赤外線センサ及びフォノニック結晶体
WO2020174732A1 (ja) * 2019-02-28 2020-09-03 パナソニックＩｐマネジメント株式会社 赤外線センサ及び赤外線センサアレイ
WO2020174731A1 (ja) * 2019-02-28 2020-09-03 パナソニックＩｐマネジメント株式会社 赤外線センサ、赤外線センサアレイ、及び赤外線センサの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017223644A (ja) * 2016-06-13 2017-12-21 パナソニックＩｐマネジメント株式会社 赤外線センサ
WO2019225058A1 (ja) * 2018-05-22 2019-11-28 パナソニックＩｐマネジメント株式会社 赤外線センサ及びフォノニック結晶体
WO2020174732A1 (ja) * 2019-02-28 2020-09-03 パナソニックＩｐマネジメント株式会社 赤外線センサ及び赤外線センサアレイ
WO2020174731A1 (ja) * 2019-02-28 2020-09-03 パナソニックＩｐマネジメント株式会社 赤外線センサ、赤外線センサアレイ、及び赤外線センサの製造方法

Also Published As

Publication number Publication date
US20230313936A1 (en) 2023-10-05
WO2022138247A1 (ja) 2022-06-30

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