JP2022101016A - ヒートシンク、活性エネルギ照射装置及び活性エネルギ照射システム - Google Patents
ヒートシンク、活性エネルギ照射装置及び活性エネルギ照射システム Download PDFInfo
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- JP2022101016A JP2022101016A JP2020215348A JP2020215348A JP2022101016A JP 2022101016 A JP2022101016 A JP 2022101016A JP 2020215348 A JP2020215348 A JP 2020215348A JP 2020215348 A JP2020215348 A JP 2020215348A JP 2022101016 A JP2022101016 A JP 2022101016A
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- 230000005855 radiation Effects 0.000 claims abstract description 95
- 238000005192 partition Methods 0.000 claims abstract description 93
- 230000017525 heat dissipation Effects 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 5
- 238000010894 electron beam technology Methods 0.000 claims description 5
- 238000009423 ventilation Methods 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 abstract description 16
- 238000000638 solvent extraction Methods 0.000 abstract 1
- 239000011261 inert gas Substances 0.000 description 34
- 239000000758 substrate Substances 0.000 description 16
- 239000004519 grease Substances 0.000 description 5
- 230000001678 irradiating effect Effects 0.000 description 5
- 238000010926 purge Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/08—Fluid driving means, e.g. pumps, fans
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- Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
Description
Claims (17)
- 発熱部と熱的に接続されるベースプレートと、
前記ベースプレートの表面上に立設され、前記表面に沿う第1方向に隙間をあけて並べられた複数の放熱フィンと、
複数の前記放熱フィンと交差するように設けられ、前記表面に沿い且つ前記第1方向と交差する第2方向において複数の前記放熱フィンを仕切る仕切り部材と、を備え、
前記仕切り部材は、複数の前記放熱フィンの間において前記ベースプレート側が前記ベースプレート側とは反対側よりもエアが前記第2方向に通過するように、複数の前記放熱フィンを仕切る、ヒートシンク。 - 前記仕切り部材における前記ベースプレート側の端は、前記ベースプレートから離れている、請求項1に記載のヒートシンク。
- 前記仕切り部材における前記ベースプレート側には、エアを通過させる通気部が設けられている、請求項1又は2に記載のヒートシンク。
- 前記仕切り部材は、メッシュ部を有し、
前記メッシュ部における前記ベースプレート側は、前記メッシュ部における前記ベースプレート側とは反対側よりも開口率が大きい、請求項1~3の何れか一項に記載のヒートシンク。 - 前記仕切り部材は、複数の前記放熱フィンにロウ付けされている、請求項1~4の何れか一項に記載のヒートシンク。
- 複数の前記放熱フィンには、前記ベースプレート側とは反対側に開口するスリットが形成され、
前記仕切り部材は、複数の前記放熱フィンの前記スリットに挟まっている、請求項1~5の何れか一項に記載のヒートシンク。 - 前記第1方向から見て、前記スリットを構成する辺のうち、対向する一対の辺の少なくとも一方は、前記スリットの内側に入り込むように曲がっている、請求項6に記載のヒートシンク。
- 前記仕切り部材は、互いに離れて一対設けられている、請求項1~7の何れか一項に記載のヒートシンク。
- 複数の前記放熱フィンに埋め込まれるように設けられ、複数の前記放熱フィンと熱的に接続されたヒートパイプを備える、請求項1~6の何れか一項に記載のヒートシンク。
- 前記ヒートパイプは、
複数の前記放熱フィンに埋め込まれるように互いに離れて一対設けられた第1ヒートパイプと、
複数の前記放熱フィンにおける一対の前記第1ヒートパイプの間に埋め込まれるように互いに離れて一対設けられ、前記第1ヒートパイプよりも長い第2ヒートパイプと、を有し、
前記仕切り部材は、隣り合う前記第1ヒートパイプの一方と前記第2ヒートパイプの一方との間、及び、隣り合う前記第1ヒートパイプの他方と前記第2ヒートパイプの他方との間のそれぞれに設けられている、請求項9に記載のヒートシンク。 - 複数の前記放熱フィンのそれぞれには、前記ベースプレート側とは反対側に開口する溝が形成されている、請求項1~10の何れか一項に記載のヒートシンク。
- 請求項1~11の何れか一項に記載のヒートシンクと、
前記ヒートシンクの前記ベースプレートと熱的に接続され、少なくとも所定方向に沿って並ぶ複数の活性エネルギ照射部と、
前記ヒートシンク及び前記活性エネルギ照射部を収容する筐体と、を備え、
前記筐体内には、複数の前記放熱フィンの間に前記ベースプレート側とは反対側からエアを流入させる流路が設けられている、活性エネルギ照射装置。 - 請求項8又は10に記載のヒートシンクと、
前記ヒートシンクの前記ベースプレートと熱的に接続され、少なくとも所定方向に沿って並ぶ複数の活性エネルギ照射部と、
前記ヒートシンク及び前記活性エネルギ照射部を収容する筐体と、を備え、
前記ヒートシンクの一対の前記仕切り部材は、前記ヒートシンクの複数の前記放熱フィンを、前記所定方向における外側に位置する一対の外側部分と、一対の前記外側部分の間に位置する内側部分と、に仕切り、
前記筐体内には、一対の前記外側部分における複数の前記放熱フィンの間に前記ベースプレート側とは反対側からエアを流入させる流路が設けられている、活性エネルギ照射装置。 - 請求項11に記載のヒートシンクと、
前記ヒートシンクの前記ベースプレートと熱的に接続され、少なくとも所定方向に沿って並ぶ複数の活性エネルギ照射部と、
前記ヒートシンク及び前記活性エネルギ照射部を収容する筐体と、
前記筐体に設けられ、前記ヒートシンクを通過したエアを前記筐体外へ排出する排気部と、
前記筐体内における前記ヒートシンクと前記排気部との間に設けられ、前記ヒートシンクを通過したエアを前記排気部へ流通させるダクトと、を備え、
前記溝には、前記ダクトにおける前記ベースプレート側の一端部が差し込まれている、活性エネルギ照射装置。 - 前記溝には、前記ダクトにおける前記ベースプレート側の一端部が、熱伝導材を介して差し込まれている、請求項14に記載の活性エネルギ照射装置。
- 前記活性エネルギ照射部は、紫外線又は電子線を照射する、請求項12~15の何れか一項に記載の活性エネルギ照射装置。
- 請求項12~16の何れか一項に記載の活性エネルギ照射装置を複数備え、
複数の前記活性エネルギ照射装置は、前記所定方向において互いに当接するように並べられている、活性エネルギ照射システム。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2020215348A JP7542428B2 (ja) | 2020-12-24 | 2020-12-24 | ヒートシンク、活性エネルギ照射装置及び活性エネルギ照射システム |
US18/268,429 US20230392779A1 (en) | 2020-12-24 | 2021-05-26 | Heatsink, active energy irradiation device, and active energy irradiation system |
PCT/JP2021/020055 WO2022137596A1 (ja) | 2020-12-24 | 2021-05-26 | ヒートシンク、活性エネルギ照射装置及び活性エネルギ照射システム |
EP21909757.3A EP4250351A1 (en) | 2020-12-24 | 2021-05-26 | Heatsink, active energy irradiation device, and active energy irradiation system |
IL303858A IL303858A (en) | 2020-12-24 | 2021-05-26 | Heat extractor, active energy radiation device, and active energy radiation system |
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JP2020215348A JP7542428B2 (ja) | 2020-12-24 | 2020-12-24 | ヒートシンク、活性エネルギ照射装置及び活性エネルギ照射システム |
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US (1) | US20230392779A1 (ja) |
EP (1) | EP4250351A1 (ja) |
JP (1) | JP7542428B2 (ja) |
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JP2024008339A (ja) * | 2022-07-08 | 2024-01-19 | ウシオ電機株式会社 | 光源ユニット、光源装置及び光源ユニットの形成方法 |
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JP3518434B2 (ja) | 1999-08-11 | 2004-04-12 | 株式会社日立製作所 | マルチチップモジュールの冷却装置 |
JP3604310B2 (ja) | 1999-10-20 | 2004-12-22 | 古河電気工業株式会社 | 強制空冷式櫛形ヒートシンク |
JP4920071B2 (ja) | 2009-11-12 | 2012-04-18 | 株式会社日本自動車部品総合研究所 | 半導体素子の冷却装置 |
JP2011138974A (ja) | 2009-12-29 | 2011-07-14 | Fujitsu Ltd | ヒートシンク |
JP5707972B2 (ja) | 2011-01-26 | 2015-04-30 | トヨタ自動車株式会社 | 熱交換器 |
JP2018140342A (ja) | 2017-02-27 | 2018-09-13 | ウシオ電機株式会社 | 光照射装置 |
JP7058095B2 (ja) | 2017-09-22 | 2022-04-21 | 浜松ホトニクス株式会社 | 光源装置 |
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2020
- 2020-12-24 JP JP2020215348A patent/JP7542428B2/ja active Active
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- 2021-05-26 WO PCT/JP2021/020055 patent/WO2022137596A1/ja unknown
- 2021-05-26 EP EP21909757.3A patent/EP4250351A1/en active Pending
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EP4250351A1 (en) | 2023-09-27 |
US20230392779A1 (en) | 2023-12-07 |
JP7542428B2 (ja) | 2024-08-30 |
IL303858A (en) | 2023-08-01 |
WO2022137596A1 (ja) | 2022-06-30 |
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