JP2022083225A - 電磁波透過性ヒータ - Google Patents
電磁波透過性ヒータ Download PDFInfo
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- JP2022083225A JP2022083225A JP2020194546A JP2020194546A JP2022083225A JP 2022083225 A JP2022083225 A JP 2022083225A JP 2020194546 A JP2020194546 A JP 2020194546A JP 2020194546 A JP2020194546 A JP 2020194546A JP 2022083225 A JP2022083225 A JP 2022083225A
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- 230000020169 heat generation Effects 0.000 abstract description 22
- 239000010410 layer Substances 0.000 description 20
- 239000011347 resin Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 15
- 230000005540 biological transmission Effects 0.000 description 14
- 239000000463 material Substances 0.000 description 6
- 230000002411 adverse Effects 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
- G01S7/40—Means for monitoring or calibrating
- G01S7/4004—Means for monitoring or calibrating of parts of a radar system
- G01S7/4039—Means for monitoring or calibrating of parts of a radar system of sensor or antenna obstruction, e.g. dirt- or ice-coating
- G01S7/4043—Means for monitoring or calibrating of parts of a radar system of sensor or antenna obstruction, e.g. dirt- or ice-coating including means to prevent or remove the obstruction
- G01S7/4047—Heated dielectric lens, e.g. by heated wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
- G01S13/88—Radar or analogous systems specially adapted for specific applications
- G01S13/93—Radar or analogous systems specially adapted for specific applications for anti-collision purposes
- G01S13/931—Radar or analogous systems specially adapted for specific applications for anti-collision purposes of land vehicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/32—Adaptation for use in or on road or rail vehicles
- H01Q1/3208—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used
- H01Q1/3233—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
- H01Q1/422—Housings not intimately mechanically associated with radiating elements, e.g. radome comprising two or more layers of dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
- G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/011—Heaters using laterally extending conductive material as connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
Landscapes
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Computer Security & Cryptography (AREA)
- Surface Heating Bodies (AREA)
- Support Of Aerials (AREA)
- Resistance Heating (AREA)
- Details Of Aerials (AREA)
Abstract
Description
(X-0.28)2/0.282+(Y-11.6)2/3.42≦1 ・・・(1)
(X-0.28)2/0.282+(Y-11.6)2/3.42≦1 ・・・(1)
(X-0.28)2/0.282+(Y-11.6)2/3.42≦1 ・・・(1)
521 ヒータ配線
522 横断配線
523 接続配線
C1 中心線
d1 距離
d2 間隔
L1 長さ
L2 長さ
P1 接続位置
P2 接続位置
P3 接続位置
P4 接続位置
P5 接続位置
P6 接続位置
S1 断面積
S2 断面積
Claims (7)
- 電磁波を透過可能な間隔で配置された複数のヒータ配線と、
各々の前記ヒータ配線の一端と他端にそれぞれ接続された一対の横断配線と、
一対の前記横断配線にそれぞれ接続された一対の接続配線と、を備え、
各々の前記横断配線の断面積は、各々の前記ヒータ配線の断面積よりも大きいことを特徴とする電磁波透過性ヒータ。 - 一対の前記横断配線は、一対の前記横断配線に交差する中心線に線対称に設けられ、
前記横断配線に沿って前記中心線から離れるほど一対の前記横断配線の間隔が狭くなって前記ヒータ配線の長さが短くなっており、
各々の前記接続配線は、前記中心線に線対称な複数の接続位置において各々の前記横断配線に接続されていることを特徴とする請求項1に記載の電磁波透過性ヒータ。 - 複数の前記ヒータ配線は、前記中心線に平行であることを特徴とする請求項2に記載の電磁波透過性ヒータ。
- 一対の前記横断配線の間隔は、一対の前記横断配線の一端と他端の距離よりも小さいことを特徴とする請求項3に記載の電磁波透過性ヒータ。
- 一対の前記横断配線は、前記中心線との交点を頂点とする外側に凸の湾曲形状を有することを特徴とする請求項4に記載の電磁波透過性ヒータ。
- 前記中心線から前記横断配線の一端までの長さに対する前記中心線から前記接続位置までの前記横断配線の長さの比をXとし、前記ヒータ配線の断面積に対する前記横断配線の断面積の比をYとしたときに、以下の式(1)が成立することを特徴とする請求項5に記載の電磁波透過性ヒータ。
(X-0.28)2/0.282+(Y-11.6)2/3.42≦1 ・・・(1) - 複数の前記ヒータ配線において、最大発熱量の前記ヒータ配線の発熱量が最小発熱量の前記ヒータ配線の発熱量の2倍以下であることを特徴とする請求項2に記載の電磁波透過性ヒータ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020194546A JP7334713B2 (ja) | 2020-11-24 | 2020-11-24 | 電磁波透過性ヒータ |
CN202111190380.6A CN114554635B (zh) | 2020-11-24 | 2021-10-13 | 电磁波透射性加热器 |
DE102021128780.4A DE102021128780A1 (de) | 2020-11-24 | 2021-11-05 | Elektromagnetische Wellen übertragende Heizvorrichtung |
US17/523,429 US20220167467A1 (en) | 2020-11-24 | 2021-11-10 | Electromagnetic wave transmitting heater |
Applications Claiming Priority (1)
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JP2020194546A JP7334713B2 (ja) | 2020-11-24 | 2020-11-24 | 電磁波透過性ヒータ |
Publications (2)
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JP2022083225A true JP2022083225A (ja) | 2022-06-03 |
JP7334713B2 JP7334713B2 (ja) | 2023-08-29 |
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JP2020194546A Active JP7334713B2 (ja) | 2020-11-24 | 2020-11-24 | 電磁波透過性ヒータ |
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US (1) | US20220167467A1 (ja) |
JP (1) | JP7334713B2 (ja) |
CN (1) | CN114554635B (ja) |
DE (1) | DE102021128780A1 (ja) |
Families Citing this family (1)
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JP2021169993A (ja) * | 2020-08-18 | 2021-10-28 | 三恵技研工業株式会社 | 車載レーダー装置用レドーム及び車載レーダー構造 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61125859U (ja) * | 1985-01-25 | 1986-08-07 | ||
CN105376884A (zh) * | 2015-09-17 | 2016-03-02 | 福建省万达汽车玻璃工业有限公司 | 带有分流母线的电加热汽车夹层玻璃 |
JP2016115512A (ja) * | 2014-12-15 | 2016-06-23 | 株式会社リコー | ヒータモジュール、定着装置及び画像形成装置 |
JP2019096617A (ja) * | 2017-11-27 | 2019-06-20 | 大日本印刷株式会社 | 透明発熱体、カバー付き発熱体、センサ装置、移動体 |
JP2020005057A (ja) * | 2018-06-26 | 2020-01-09 | Nissha株式会社 | 電磁波透過性カバー及びその製造方法 |
JP2020181742A (ja) * | 2019-04-25 | 2020-11-05 | Jx金属商事株式会社 | 発熱シートのセット、加温システム、及び加温ユニット |
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KR101810815B1 (ko) * | 2017-04-07 | 2017-12-20 | 김병삼 | 마이크로 크랙 및 레이저 타공홀을 포함하는 전파투과성 센서 커버의 제조 방법 및 이를 이용하여 제조된 전파투과성 센서 커버 |
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- 2020-11-24 JP JP2020194546A patent/JP7334713B2/ja active Active
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2021
- 2021-10-13 CN CN202111190380.6A patent/CN114554635B/zh active Active
- 2021-11-05 DE DE102021128780.4A patent/DE102021128780A1/de active Pending
- 2021-11-10 US US17/523,429 patent/US20220167467A1/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61125859U (ja) * | 1985-01-25 | 1986-08-07 | ||
JP2016115512A (ja) * | 2014-12-15 | 2016-06-23 | 株式会社リコー | ヒータモジュール、定着装置及び画像形成装置 |
CN105376884A (zh) * | 2015-09-17 | 2016-03-02 | 福建省万达汽车玻璃工业有限公司 | 带有分流母线的电加热汽车夹层玻璃 |
JP2019096617A (ja) * | 2017-11-27 | 2019-06-20 | 大日本印刷株式会社 | 透明発熱体、カバー付き発熱体、センサ装置、移動体 |
JP2020005057A (ja) * | 2018-06-26 | 2020-01-09 | Nissha株式会社 | 電磁波透過性カバー及びその製造方法 |
JP2020181742A (ja) * | 2019-04-25 | 2020-11-05 | Jx金属商事株式会社 | 発熱シートのセット、加温システム、及び加温ユニット |
Also Published As
Publication number | Publication date |
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JP7334713B2 (ja) | 2023-08-29 |
US20220167467A1 (en) | 2022-05-26 |
CN114554635B (zh) | 2024-08-09 |
CN114554635A (zh) | 2022-05-27 |
DE102021128780A1 (de) | 2022-05-25 |
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