JP2022076587A - Cleaning mechanism, resin molding device, and manufacturing method of resin molded product - Google Patents

Cleaning mechanism, resin molding device, and manufacturing method of resin molded product Download PDF

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JP2022076587A
JP2022076587A JP2020187021A JP2020187021A JP2022076587A JP 2022076587 A JP2022076587 A JP 2022076587A JP 2020187021 A JP2020187021 A JP 2020187021A JP 2020187021 A JP2020187021 A JP 2020187021A JP 2022076587 A JP2022076587 A JP 2022076587A
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resin
resin molding
holding portion
cleaning
cleaning mechanism
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JP7417507B2 (en
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哲郎 池西
Tetsuro Ikenishi
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Towa Corp
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Towa Corp
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Priority to JP2020187021A priority Critical patent/JP7417507B2/en
Priority to CN202180047146.XA priority patent/CN115917717A/en
Priority to KR1020227045298A priority patent/KR20230015449A/en
Priority to PCT/JP2021/040943 priority patent/WO2022102563A1/en
Priority to TW110141434A priority patent/TWI811837B/en
Publication of JP2022076587A publication Critical patent/JP2022076587A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/04—Cleaning by suction, with or without auxiliary action
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1753—Cleaning or purging, e.g. of the injection unit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

To provide a technique for reducing the scattering of resin dust to the surroundings and removing the resin dust adhering to the inside of a holding portion that holds the resin.SOLUTION: A cleaning mechanism 5 includes a suction mechanism 52 that sucks a holding portion 12 of a carrying-in mechanism 1 that holds a solid resin in the holding portion 12 and carries the solid resin into a resin molding portion, a brush 53 driven up and down, and a cover 51 that covers the holding portion.SELECTED DRAWING: Figure 8

Description

本発明は、クリーニング機構、樹脂成形装置及び樹脂成形品の製造方法に関する。 The present invention relates to a cleaning mechanism, a resin molding apparatus, and a method for manufacturing a resin molded product.

特許文献１には、吸引ホースとブラシとを用い、樹脂タブレットを保持する保持部の内側面に付着した樹脂粉を除去する技術が開示されている。 Patent Document 1 discloses a technique of removing resin powder adhering to the inner surface of a holding portion for holding a resin tablet by using a suction hose and a brush.

特開平８－２３８６４４号公報Japanese Unexamined Patent Publication No. 8-238644

上記特許文献１の構成では、搬送機構の保持部の内側面に付着した樹脂粉を除去するとき、樹脂紛が周囲に飛散してしまう可能性がある。このような樹脂紛（樹脂の粉塵）とは、樹脂材料を成形型に搬送する際に、成形型に移送されず搬送機構に付着する残りカス（残滓）のことである。搬送機構に付着する樹脂の粉塵を除去しないまま、その搬送機構によって樹脂材料を搬送して樹脂成形品を製造すると、樹脂紛により樹脂成形装置内が汚染され、不良品発生の原因となってしまうことがある。 In the configuration of Patent Document 1, when the resin powder adhering to the inner surface of the holding portion of the transport mechanism is removed, the resin powder may be scattered around. Such resin powder (resin dust) is residual residue (residue) that is not transferred to the molding die and adheres to the conveying mechanism when the resin material is conveyed to the molding die. If a resin molded product is manufactured by transporting a resin material by the transport mechanism without removing the resin dust adhering to the transport mechanism, the inside of the resin molding device is contaminated by the resin powder, which causes the generation of defective products. Sometimes.

上記の課題を解決するために、本発明のクリーニング機構は、固形樹脂を保持部で保持して樹脂成形部に搬入する搬入機構の前記保持部を吸引する吸引機構と、上下に駆動されるブラシと、前記保持部を覆うカバーとを備える。 In order to solve the above problems, the cleaning mechanism of the present invention includes a suction mechanism that sucks the holding portion of the carrying mechanism that holds the solid resin in the holding portion and carries it into the resin molding portion, and a brush that is driven up and down. And a cover that covers the holding portion.

本発明の樹脂成形装置は、前記クリーニング機構と、前記保持部が設けられた前記搬入機構と、前記搬入機構により搬入される固形樹脂を用いて樹脂成形する樹脂成形部とを備える。 The resin molding apparatus of the present invention includes the cleaning mechanism, the carry-in mechanism provided with the holding part, and a resin molding part for resin molding using the solid resin carried in by the carry-in mechanism.

本発明の樹脂成形品の製造方法は、前記樹脂成形装置を用いて樹脂成形品を製造する方法であって、前記搬入機構が搬入した固形樹脂を用いて樹脂成形する樹脂成形工程と、前記搬入機構の前記保持部を前記クリーニング機構でクリーニングするクリーニング工程と、前記クリーニング工程でクリーニングされた前記搬入機構が固形樹脂を保持して成形型に搬入する搬入工程とを含む。 The method for manufacturing a resin molded product of the present invention is a method for manufacturing a resin molded product using the resin molding apparatus, the resin molding step of resin molding using the solid resin carried in by the carry-in mechanism, and the carry-in. It includes a cleaning step of cleaning the holding portion of the mechanism by the cleaning mechanism, and a carry-in step in which the carry-in mechanism cleaned in the cleaning step holds the solid resin and carries it into the molding die.

本発明によれば、樹脂の粉塵が周囲に飛散することを低減し、樹脂を保持する保持部の内側に付着した樹脂の粉塵を除去する技術を提供することができる。 According to the present invention, it is possible to provide a technique for reducing the scattering of resin dust to the surroundings and removing the resin dust adhering to the inside of the holding portion that holds the resin.

本実施形態の樹脂成形装置の構成を模式的に示す平面図である。It is a top view which shows typically the structure of the resin molding apparatus of this embodiment. 本実施形態の搬入機構を模式的に示す側面図である。It is a side view which shows typically the carrying-in mechanism of this embodiment. 本実施形態の搬入機構を模式的に示す上面図である。It is a top view which shows typically the carry-in mechanism of this embodiment. 本実施形態の搬入機構を模式的に示す上面図の切断線Ａ－Ａで切断した場合の断面図である。It is sectional drawing in the case of cutting at the cutting line AA of the top view schematically showing the carry-in mechanism of this embodiment. 本実施形態の樹脂成形部を模式的に示す側面図である。It is a side view which shows typically the resin molding part of this embodiment. 本実施形態のクリーニング機構を模式的に示す側面図である。It is a side view which shows typically the cleaning mechanism of this embodiment. 本実施形態のクリーニング機構を模式的に示す平面図である。It is a top view which shows typically the cleaning mechanism of this embodiment. 本実施形態のクリーニング機構を模式的に示す平面図の切断線Ｂ－Ｂで切断した場合の断面図である。It is sectional drawing in the case of cutting along the cutting line BB of the plan view which shows typically the cleaning mechanism of this embodiment. 本実施形態のクリーニング機構によるクリーニング動作の様子を示す側面図である。It is a side view which shows the state of the cleaning operation by the cleaning mechanism of this embodiment. 実施形態のクリーニング機構によるクリーニング動作の様子を示す側面図の切断線Ｃ－Ｃで切断した場合の断面図である。It is sectional drawing at the time of cutting at the cutting line CC of the side view which shows the state of the cleaning operation by the cleaning mechanism of embodiment. 実施形態のクリーニング機構によるクリーニング動作の様子を示す側面図の切断線Ｄ－Ｄで切断した場合の断面図である。It is sectional drawing at the time of cutting by the cutting line DD of the side view which shows the state of the cleaning operation by the cleaning mechanism of embodiment.

＜本発明の一実施形態＞
以下、本発明の実施の形態について、図面を参照しながら詳細に説明する。なお、図中同一又は相当部分には同一符号を付してその説明は繰り返さない。 <One Embodiment of the present invention>
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The same or corresponding parts in the drawings are designated by the same reference numerals and the description thereof will not be repeated.

＜樹脂成形装置１００の全体構成＞
本実施形態の樹脂成形装置１００は、トランスファモールド法を使用した樹脂成形装置である。この樹脂成形装置は、例えば、半導体チップが接続された基板を樹脂成形するものであり、樹脂材料として円柱状をなすタブレット状の熱硬化性樹脂（以下、「樹脂タブレット」という。）を使用するものである。 <Overall configuration of resin molding apparatus 100>
The resin molding apparatus 100 of the present embodiment is a resin molding apparatus using the transfer molding method. This resin molding apparatus, for example, resin-molds a substrate to which a semiconductor chip is connected, and uses a cylindrical thermosetting resin (hereinafter referred to as "resin tablet") as a resin material. It is a thing.

なお、「基板」としては、シリコンウェーハ等の半導体基板、プリント配線基板、金属製基板、樹脂製基板、ガラス製基板、セラミック製基板などの一般的な基板及びリードフレームを挙げることができる。また、基板は、ＦＯＷＬＰ（Ｆａｎ Ｏｕｔ Ｗａｆｅｒ Ｌｅｖｅｌ Ｐａｃｋａｇｉｎｇ）、ＦＯＰＬＰ（Ｆａｎ Ｏｕｔ Ｐａｎｅｌ Ｌｅｖｅｌ Ｐａｃｋａｇｉｎｇ）に用いられるキャリアであってもよい。さらにいえば、配線がすでに施されているものでもよいし、未配線のものでもよい。 Examples of the "board" include general boards such as semiconductor boards such as silicon wafers, printed wiring boards, metal boards, resin boards, glass boards, and ceramic boards, and lead frames. Further, the substrate may be a carrier used for FOWLP (Fan Out Wafer Level Packaging) and FOPLP (Fan Out Panel Level Packaging). Furthermore, it may be the one that has already been wired or the one that has not been wired.

具体的に樹脂成形装置１００は、図１に示すように、樹脂封止前の基板Ｗおよび樹脂タブレットＴを供給する供給モジュールＡと、樹脂成形部に相当し樹脂成形する樹脂成形モジュールＢと、樹脂成形品を搬出するための搬出モジュールＣと、制御部ＣＯＭとを、それぞれ構成要素として備えている。なお、構成要素である供給モジュールＡと、樹脂成形モジュールＢと、搬出モジュールＣとは、それぞれ他の構成要素に対して互いに着脱されることができ、かつ、交換されることができる。また、樹脂成形モジュールＢを２つまたは３つに増やすなど、各モジュールを増減することもできる。 Specifically, as shown in FIG. 1, the resin molding apparatus 100 includes a supply module A that supplies the substrate W and the resin tablet T before resin encapsulation, a resin molding module B that corresponds to the resin molding portion and molds the resin, and the resin molding module B. A carry-out module C for carrying out the resin molded product and a control unit COM are provided as constituent elements, respectively. The supply module A, the resin molding module B, and the carry-out module C, which are the components, can be attached to and detached from each other with respect to other components, and can be exchanged with each other. Further, each module can be increased or decreased, such as increasing the number of resin molding modules B to two or three.

また、樹脂成形装置１００は、供給モジュールＡにより供給される基板Ｗ及び樹脂タブレットＴを樹脂成形モジュールＢに一括して搬入する搬入機構１（以下、「ローダ１」という。）と、樹脂成形モジュールＢにより樹脂成形された樹脂成形品を搬出モジュールＣに搬出する搬出機構２（以下、「アンローダ２」という。）とを備えている。 Further, the resin molding apparatus 100 includes a carry-in mechanism 1 (hereinafter referred to as “loader 1”) for collectively carrying the substrate W and the resin tablet T supplied by the supply module A into the resin molding module B, and a resin molding module. It is provided with a carry-out mechanism 2 (hereinafter referred to as “unloader 2”) for carrying out the resin-molded product molded by B to the carry-out module C.

ローダ１は、図２に示すように、基板Ｗを保持する基板保持部１１と、樹脂タブレットＴを保持する樹脂保持部１２とを備えている。 As shown in FIG. 2, the loader 1 includes a substrate holding portion 11 for holding the substrate W and a resin holding portion 12 for holding the resin tablet T.

ローダ１には、基板保持部１１が両端に、樹脂保持部１２が中央部にそれぞれ配置される。図３に示すように、ローダ１は、２枚の基板Ｗを保持する基板保持部１１と、３個の樹脂タブレットを保持する樹脂保持部１２とを備えている。なお、成形型６に供給する基板Ｗの枚数および樹脂タブレットの個数に応じて、基板保持部１１および樹脂保持部１２の個数を変更してもよい。 In the loader 1, a substrate holding portion 11 is arranged at both ends and a resin holding portion 12 is arranged at a central portion. As shown in FIG. 3, the loader 1 includes a substrate holding portion 11 that holds two substrates W and a resin holding portion 12 that holds three resin tablets. The number of substrate holding portions 11 and the number of resin holding portions 12 may be changed according to the number of substrates W and the number of resin tablets supplied to the molding die 6.

基板保持部１１は、基板Ｗを搬入中に、基板Ｗを予備加熱するためのヒータを設けてもよい。これにより、樹脂成形する際に基板Ｗの温度が均一化されて、不均一に熱膨張することで基板が反ることを抑制できる。 The substrate holding portion 11 may be provided with a heater for preheating the substrate W while the substrate W is being carried in. As a result, the temperature of the substrate W is made uniform during resin molding, and it is possible to prevent the substrate from warping due to non-uniform thermal expansion.

樹脂保持部１２は、図２～４に示すように、樹脂タブレットＴを支持するピン状の４本のガイド部材１２ａと開閉部材であるシャッタ１２ｂとを備えている。シャッタ１２ｂは駆動機構（不図示）によって開閉可能である。シャッタ１２ｂはＬ字状に形成され、４本のガイド部材１２ａによって支持された樹脂タブレットＴが閉状態で樹脂タブレットＴの底面を支持して保持する。なお、ガイド部材１２ｂの数は４本でなくてもよく、３本以上であればよい。 As shown in FIGS. 2 to 4, the resin holding portion 12 includes four pin-shaped guide members 12a that support the resin tablet T and a shutter 12b that is an opening / closing member. The shutter 12b can be opened and closed by a drive mechanism (not shown). The shutter 12b is formed in an L shape, and the resin tablet T supported by the four guide members 12a supports and holds the bottom surface of the resin tablet T in a closed state. The number of guide members 12b does not have to be four, but may be three or more.

本実施形態の供給モジュールＡは、基板供給機構３、樹脂供給機構４と、クリーニング機構５とを備えている。 The supply module A of the present embodiment includes a substrate supply mechanism 3, a resin supply mechanism 4, and a cleaning mechanism 5.

基板供給機構３は、基板送出部３１と、基板供給部３２を有している。基板送出部３１は、基板供給部３２に基板Ｗを送り出すものである。基板供給部３２は、基板送出部３１から基板Ｗを受け取り、受け取った基板Ｗを所定方向に整列させて、ローダ１に受け渡すものである。 The board supply mechanism 3 has a board delivery unit 31 and a board supply unit 32. The board delivery unit 31 sends the board W to the board supply unit 32. The board supply unit 32 receives the board W from the board delivery unit 31, aligns the received board W in a predetermined direction, and delivers the board W to the loader 1.

樹脂供給機構４は、樹脂送出部４１と、樹脂供給部４２とを有している。樹脂送出部４１は、樹脂供給部４２に樹脂タブレットＴを送り出すものである。樹脂供給部４２は、樹脂送出部４１から樹脂タブレットＴを受け取り、受け取った樹脂タブレットＴを所定方向に整列させて、ローダ１に受け渡すものである。 The resin supply mechanism 4 has a resin delivery unit 41 and a resin supply unit 42. The resin delivery unit 41 sends out the resin tablet T to the resin supply unit 42. The resin supply unit 42 receives the resin tablet T from the resin delivery unit 41, aligns the received resin tablet T in a predetermined direction, and delivers the received resin tablet T to the loader 1.

クリーニング機構５は、ローダ１が樹脂成形モジュールＢに基板Ｗ及び樹脂タブレットＴを搬入した後、ローダ１に設けられた樹脂タブレットＴを保持する保持部１１を後述するようにクリーニングするものである。 The cleaning mechanism 5 cleans the holding portion 11 for holding the resin tablet T provided in the loader 1 after the loader 1 carries the substrate W and the resin tablet T into the resin molding module B as described later.

樹脂成形モジュールＢは、成形型６と型締め機構７とを有している。成形型６は、図５に示すように、昇降可能な下型６１と、下型６１の上方に対向して固定された上型６２と、下型６１及び上型６２を型締めするための型締め機構７とを有している。下型６１は、可動盤６３の上面に固定されており、上型６２は、上部固定盤６４の下面に固定されている。型締め機構７は、可動盤６３を上下移動させることによって、上型６２及び下型６１を型締め又は型開きするものである。 The resin molding module B has a molding mold 6 and a mold clamping mechanism 7. As shown in FIG. 5, the molding die 6 is for molding the lower die 61 that can be raised and lowered, the upper die 62 fixed facing above the lower die 61, and the lower die 61 and the upper die 62. It has a mold clamping mechanism 7. The lower mold 61 is fixed to the upper surface of the movable platen 63, and the upper mold 62 is fixed to the lower surface of the upper fixed plate 64. The mold clamping mechanism 7 molds or opens the upper mold 62 and the lower mold 61 by moving the movable platen 63 up and down.

下型６１には、ローダ１により搬入された基板Ｗが配置される上面６１ａと、ローダ１により搬入された樹脂タブレットＴが供給される複数のポット６１ｂが形成されている。また、下型６１には、ポット６１ｂ内に樹脂タブレットＴを例えば上型６２に形成された樹脂通路６２ａ及びキャビティ６２ｂに注入するためのプランジャ６１ｃが設けられている。 The lower mold 61 is formed with an upper surface 61a on which the substrate W carried in by the loader 1 is arranged, and a plurality of pots 61b to which the resin tablet T carried in by the loader 1 is supplied. Further, the lower mold 61 is provided with a plunger 61c for injecting the resin tablet T into the resin passage 62a and the cavity 62b formed in the upper mold 62, for example, in the pot 61b.

その他、上型６２と下型６１とには、それぞれヒータ等の加熱部６５が埋め込まれている。この加熱部により上型６２及び下型６１は、通常は１８０℃程度に加熱される。 In addition, a heating portion 65 such as a heater is embedded in each of the upper mold 62 and the lower mold 61. The upper mold 62 and the lower mold 61 are usually heated to about 180 ° C. by this heating unit.

制御部ＣＯＭは、少なくともクリーニング機構５を制御するように構成されている。制御部ＣＯＭは、ＣＰＵ（Ｃｅｎｔｒａｌ Ｐｒｏｃｅｓｓｉｎｇ Ｕｎｉｔ）、ＲＡＭ（Ｒａｎｄｏｍ Ａｃｃｅｓｓ Ｍｅｍｏｒy）およびＲＯＭ（Ｒｅａｄ Ｏｎｌｙ Ｍｅｍｏｒｙ）等を含み、情報処理に応じて各構成要素の制御を行うように構成されている。なお、制御部ＣＯＭは、樹脂成形装置全体を制御するように構成されてもよい。 The control unit COM is configured to control at least the cleaning mechanism 5. The control unit COM includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), and the like, and is configured to control each component according to information processing. The control unit COM may be configured to control the entire resin molding apparatus.

＜樹脂成形装置１００の樹脂成形動作＞
以下、本実施形態の樹脂成形装置１００の樹脂成形の基本動作を説明する。 <Resin molding operation of the resin molding device 100>
Hereinafter, the basic operation of resin molding of the resin molding apparatus 100 of the present embodiment will be described.

図１に示すように、基板送出部３１は、マガジン内の基板Ｗを基板供給部３２に送り出す。基板供給部３２は、受け取った基板Ｗを所定の方向へ整列させて、ローダ１に引き渡す。これと並行して、樹脂送出部４１は、樹脂タブレットＴを樹脂供給部４２に送り出す。樹脂供給部４２は、受け取った樹脂タブレットＴのうち必要な個数（図１では３個）をローダ１に引き渡す。 As shown in FIG. 1, the substrate delivery unit 31 sends the substrate W in the magazine to the substrate supply unit 32. The board supply unit 32 aligns the received board W in a predetermined direction and delivers it to the loader 1. In parallel with this, the resin delivery unit 41 sends the resin tablet T to the resin supply unit 42. The resin supply unit 42 delivers a required number (three in FIG. 1) of the received resin tablets T to the loader 1.

次に、ローダ１が、受け取った２枚の基板Ｗと３個の樹脂タブレットＴとを、成形型６へ同時に搬入する。ローダ１は、基板Ｗを下型６１の上面６１ａに、樹脂タブレットＴを下型６１に形成されたポット１０１ｂの内部に、それぞれ供給する。このとき、ローダ１の樹脂保持部１２に設けられたシャッタ１２ｂを開状態にすることにより、樹脂タブレットＴを樹脂保持部１２から落下させて、成形型６のポット６１ｂに供給することができる。 Next, the loader 1 simultaneously carries the received two substrates W and the three resin tablets T into the molding die 6. The loader 1 supplies the substrate W to the upper surface 61a of the lower mold 61 and the resin tablet T to the inside of the pot 101b formed in the lower mold 61. At this time, by opening the shutter 12b provided in the resin holding portion 12 of the loader 1, the resin tablet T can be dropped from the resin holding portion 12 and supplied to the pot 61b of the molding die 6.

その後、型締め機構７を用いて上型６２と下型６１とを型締めする。そして、各ポット６１ｂ内の樹脂タブレットＴを加熱して溶融させて溶融樹脂を生成し、プランジャ６１ｃによって溶融樹脂を押圧する。これにより、溶融樹脂は、樹脂通路６２ａを通して上型６２に形成されたキャビティ６２ｂの内部に注入される。引き続き、硬化に必要な所要時間だけ溶融樹脂を加熱することによって、溶融樹脂を硬化させて硬化樹脂を形成する。これにより、キャビティ６２ｂ内の半導体チップとその周辺の基板とは、キャビティ６２ｂの形状に対応して成形された硬化樹脂（封止樹脂）内に封止される。 After that, the upper mold 62 and the lower mold 61 are molded by using the mold clamping mechanism 7. Then, the resin tablet T in each pot 61b is heated and melted to generate a molten resin, and the molten resin is pressed by the plunger 61c. As a result, the molten resin is injected into the cavity 62b formed in the upper mold 62 through the resin passage 62a. Subsequently, the molten resin is cured by heating the molten resin for the time required for curing to form a cured resin. As a result, the semiconductor chip in the cavity 62b and the substrate around it are sealed in the cured resin (sealing resin) formed corresponding to the shape of the cavity 62b.

次に、硬化に必要な時間の経過後において、上型６２と下型６１とを型開きして、樹脂成形品である封止済基板Ｐを離型する。その後、アンローダ２を使用して、樹脂成形モジュールＢにより樹脂封止された封止済基板（樹脂成形品）を、搬出モジュールＣの基板収容部８に収容する。 Next, after the time required for curing has elapsed, the upper mold 62 and the lower mold 61 are opened, and the sealed substrate P, which is a resin molded product, is released. After that, the unloader 2 is used to accommodate the sealed substrate (resin molded product) sealed with the resin by the resin molding module B in the substrate accommodating portion 8 of the carry-out module C.

樹脂成形モジュールＢで樹脂成形している間に、基板Ｗおよび樹脂タブレットＴを成形型６に搬入し終えたローダ１は、次の樹脂成形に用いる基板Ｗおよび樹脂タブレットＴを成形型６に搬入するために、基板供給部３２および樹脂供給部４２の位置まで戻る。この所定の位置まで戻る前に、後述するように、クリーニング機構５でローダ１の樹脂保持部１２をクリーニングする。 The loader 1 that has finished carrying the substrate W and the resin tablet T into the molding die 6 while the resin molding module B is performing resin molding carries the substrate W and the resin tablet T to be used for the next resin molding into the molding die 6. In order to do so, it returns to the positions of the substrate supply unit 32 and the resin supply unit 42. Before returning to this predetermined position, the resin holding portion 12 of the loader 1 is cleaned by the cleaning mechanism 5 as described later.

＜クリーニング機構５の構成＞
以下、本実施形態のクリーニング機構５の基本構成を説明する。 <Structure of cleaning mechanism 5>
Hereinafter, the basic configuration of the cleaning mechanism 5 of the present embodiment will be described.

図６に示すように、クリーニング機構５は、カバー５１と、吸引機構５２と、ブラシ５３とを有している。 As shown in FIG. 6, the cleaning mechanism 5 has a cover 51, a suction mechanism 52, and a brush 53.

カバー５１は、ローダ１の樹脂保持部１２に付着する樹脂の粉塵をクリーニングする際に、周囲に粉塵が飛散することを低減するものである。図６～図８で示すように、各カバー５１は、ローダ１の樹脂保持部１２の数に対応した数だけ設けられている。カバー５１は、樹脂保持部１２のガイド部材１２ａを覆い、シャッタ１２ｂをカバー５１に接触しないようにカバー５１の側面に切欠き部５１ａ（図９参照）を設けている。なお、カバー５１の形状は、円筒状でも角筒状でもよい。また、カバー５１の材質は、金属製でも樹脂等の非金属性でもよい。ここで、樹脂保持部１２は共通のローダ１に複数設けられているが、樹脂保持部１２のそれぞれは、カバー５１で覆うことができるように分離されていることになる。 The cover 51 reduces the scattering of resin dust around the resin holding portion 12 of the loader 1 when cleaning the resin dust. As shown in FIGS. 6 to 8, each cover 51 is provided in a number corresponding to the number of resin holding portions 12 of the loader 1. The cover 51 covers the guide member 12a of the resin holding portion 12, and is provided with a notch 51a (see FIG. 9) on the side surface of the cover 51 so that the shutter 12b does not come into contact with the cover 51. The shape of the cover 51 may be cylindrical or square cylinder. The material of the cover 51 may be metal or non-metal such as resin. Here, a plurality of resin holding portions 12 are provided in the common loader 1, but each of the resin holding portions 12 is separated so as to be covered by the cover 51.

吸引機構５２は、ローダ１の樹脂保持部１２に付着する樹脂の粉塵を吸引するものである。吸引機構５２は、図８に示すように、集塵機５２ａと、各カバー５２の底部に開口して接続する接続管５２ｂと、集塵機５２ａ及び接続管５２ｂを接続する吸引路５２ｃとを備えている。 The suction mechanism 52 sucks the resin dust adhering to the resin holding portion 12 of the loader 1. As shown in FIG. 8, the suction mechanism 52 includes a dust collector 52a, a connection pipe 52b that opens and connects to the bottom of each cover 52, and a suction passage 52c that connects the dust collector 52a and the connection pipe 52b.

各接続管５２ｂは、ローダ１の樹脂保持部１２の数に対応した数だけ設けられる。なお、各接続管５２ｂの開口位置は上記に限られず、各部における樹脂の粉塵を集塵できる位置であればよい。 Each connecting pipe 52b is provided in a number corresponding to the number of resin holding portions 12 of the loader 1. The opening position of each connecting pipe 52b is not limited to the above, and may be any position as long as it can collect resin dust in each part.

集塵機５２ａの動作を開始する（電源を入れる）ことで、接続管５２ｂから樹脂の粉塵を吸引して、集塵機５２ａの動作を停止することで接続管５２ｂから樹脂の粉塵を吸引することを停止する。 By starting the operation of the dust collector 52a (turning on the power), the resin dust is sucked from the connecting pipe 52b, and by stopping the operation of the dust collector 52a, the suction of the resin dust from the connecting pipe 52b is stopped. ..

ブラシ５３は、ローダ１の樹脂保持部１２内に挿入して、樹脂保持部１２の内側をクリーニングするものである。ブラシ５３は、支持部５４により支持されている。支持部５４は、ブラシ５３の下端で連結されており、ブラシ５３を同時に上下動させることができる。また、ブラシ５３は、たとえば支持部５４に接続されたエアシリンダで上下駆動する。 The brush 53 is inserted into the resin holding portion 12 of the loader 1 to clean the inside of the resin holding portion 12. The brush 53 is supported by the support portion 54. The support portion 54 is connected at the lower end of the brush 53, and the brush 53 can be moved up and down at the same time. Further, the brush 53 is driven up and down by, for example, an air cylinder connected to the support portion 54.

ブラシ５３は、樹脂保持部１２に設けられた４本のガイド部材１２ａに接触して上下動するように構成されている（図１０及び図１１参照）。ブラシ５３の一例として、ねじりブラシなどが挙げられる。 The brush 53 is configured to come into contact with the four guide members 12a provided on the resin holding portion 12 and move up and down (see FIGS. 10 and 11). An example of the brush 53 is a twisted brush.

＜クリーニング機構５の動作＞
以下、本実施形態のクリーニング機構５の基本動作を説明する。ここで説明する動作は、制御部ＣＯＭで制御する。 <Operation of cleaning mechanism 5>
Hereinafter, the basic operation of the cleaning mechanism 5 of the present embodiment will be described. The operation described here is controlled by the control unit COM.

基板Ｗおよび樹脂タブレットＴを成形型６に搬入し終えたローダ１を、クリーニング機構５上で停止させる。図９に示すように、クリーニング機構５全体が上昇することで、クリーニング機構５のカバー５１がローダ１の樹脂保持部１２を覆う。これにより、樹脂の粉塵が周囲に飛散することを低減する。また、カバー５１で覆うことで、吸引される空間の容積を小さくして、樹脂の粉塵の吸引効率を向上させることができる。 The loader 1 that has finished carrying the substrate W and the resin tablet T into the molding die 6 is stopped on the cleaning mechanism 5. As shown in FIG. 9, the cover 51 of the cleaning mechanism 5 covers the resin holding portion 12 of the loader 1 by raising the entire cleaning mechanism 5. This reduces the scattering of resin dust to the surroundings. Further, by covering with the cover 51, the volume of the space to be sucked can be reduced and the suction efficiency of the resin dust can be improved.

次に、カバー５１で覆われた樹脂保持部１２の内側にクリーニング機構５のブラシ５３を挿入する。ブラシ５３を数回ほど上下動するとともに、吸引機構５２によって樹脂の粉塵を吸引することで、樹脂保持部１２の内側に付着する樹脂の粉塵を除去する。なお、ここで、ブラシ５３を上下動の繰り返し動作に代えて回転動作させてもよいし、上下動の繰り返しおよび回転の両方の動作をさせてもよい。 Next, the brush 53 of the cleaning mechanism 5 is inserted inside the resin holding portion 12 covered with the cover 51. The brush 53 is moved up and down several times, and the resin dust is sucked by the suction mechanism 52 to remove the resin dust adhering to the inside of the resin holding portion 12. Here, the brush 53 may be rotated instead of the repeated vertical movement, or both the repeated vertical movement and the rotation may be performed.

具体的には、図１０および図１１で示すように、ブラシ５３が樹脂保持部１２に設けられた４本のガイド部材１２ａの内側に接触する。そして、ブラシによって除去された樹脂の粉塵を吸引機構５２の接続管５２ｂから吸引することで、効率的に樹脂の粉塵を除去することができる。また、ブラシ５３を上下動することで、カバー５１内に飛散した樹脂の粉塵も吸引機構５２により除去できる。 Specifically, as shown in FIGS. 10 and 11, the brush 53 comes into contact with the inside of the four guide members 12a provided on the resin holding portion 12. Then, by sucking the resin dust removed by the brush from the connection pipe 52b of the suction mechanism 52, the resin dust can be efficiently removed. Further, by moving the brush 53 up and down, the resin dust scattered in the cover 51 can be removed by the suction mechanism 52.

クリーニング機構５による樹脂保持部１２のクリーニングが終わると、クリーニング機構５全体を下降させる。クリーニングされたローダ１は、次の樹脂成形に用いる基板Ｗおよび樹脂タブレットＴを成形型６に搬入するために、基板供給部３２および樹脂供給部４２の位置まで戻る。 When the cleaning of the resin holding portion 12 by the cleaning mechanism 5 is completed, the entire cleaning mechanism 5 is lowered. The cleaned loader 1 returns to the positions of the substrate supply unit 32 and the resin supply unit 42 in order to carry the substrate W and the resin tablet T used for the next resin molding into the molding mold 6.

＜他の実施形態＞
上記実施形態の思想は、以上で説明された実施の形態に限定されない。以下、上記実施形態の思想を適用できる他の実施の形態の一例について説明する。 <Other embodiments>
The idea of the above embodiment is not limited to the embodiment described above. Hereinafter, an example of another embodiment to which the idea of the above embodiment can be applied will be described.

上記実施形態のクリーニング機構５において、カバー５１は、樹脂保持部１２のガイド部材１２ａを覆い、シャッタ１２ｂをカバー５１に接触しないようにカバー５１の側面に切欠き部５１ａを設けている。しかし、切欠き部５１ａを設けず、樹脂保持部１２のガイド部材１２ａ及びシャッタ１２ｂを覆うようにカバー５１を設けてもよい。この場合、ブラシ５３は、ガイド部材１２ａ及びシャッタ１２ｂに接触するように上下動する構成とする。 In the cleaning mechanism 5 of the above embodiment, the cover 51 covers the guide member 12a of the resin holding portion 12, and a notch portion 51a is provided on the side surface of the cover 51 so that the shutter 12b does not come into contact with the cover 51. However, the notch 51a may not be provided, and the cover 51 may be provided so as to cover the guide member 12a and the shutter 12b of the resin holding portion 12. In this case, the brush 53 is configured to move up and down so as to come into contact with the guide member 12a and the shutter 12b.

上記実施形態のクリーニング機構５において、吸引機構５２は、集塵機５２ａを１つ備えていたが、複数（２つ以上）備えてもよい。これにより、より強力に樹脂の粉塵を除去することができる。 In the cleaning mechanism 5 of the above embodiment, the suction mechanism 52 includes one dust collector 52a, but may include a plurality (two or more) of the suction mechanisms 52. This makes it possible to remove resin dust more powerfully.

上記実施形態のクリーニング機構５において、ブラシ５３を同時に上下動するように構成していたが、ブラシ５３を別々に上下動するように構成してもよい。 In the cleaning mechanism 5 of the above embodiment, the brush 53 is configured to move up and down at the same time, but the brush 53 may be configured to move up and down separately.

上記実施形態の樹脂成形装置１００において、搬入機構（ローダ１）と搬出機構（アンローダ２）とを別途設けていたが、搬入機構が搬出機構の機能を備えて、搬入機構により搬入と搬出との両方の動作を行われせるように構成してもよい。 In the resin molding apparatus 100 of the above embodiment, the carry-in mechanism (loader 1) and the carry-out mechanism (unloader 2) are separately provided. It may be configured to perform both operations.

＜実施形態の構成およびその効果＞
上記実施形態のクリーニング機構は、固形樹脂を保持部で保持して樹脂成形部に搬入する搬入機構の前記保持部を吸引する吸引機構と、上下に駆動されるブラシと、前記保持部を覆うカバーとを備える。このクリーニング機構によれば、樹脂の粉塵が周囲に飛散することを低減し、樹脂を保持する保持部の内側に付着した樹脂の粉塵を除去することができる。 <Structure of Embodiment and its effect>
The cleaning mechanism of the above embodiment includes a suction mechanism that sucks the holding portion of the carrying mechanism that holds the solid resin in the holding portion and carries it into the resin molding portion, a brush that is driven up and down, and a cover that covers the holding portion. And prepare. According to this cleaning mechanism, it is possible to reduce the scattering of resin dust to the surroundings and remove the resin dust adhering to the inside of the holding portion that holds the resin.

また、上記実施形態の樹脂成形装置は、前記クリーニング機構と、前記保持部が設けられた前記搬入機構と、前記搬入機構により搬入される固形樹脂を用いて樹脂成形する樹脂成形部とを備える。この樹脂成形装置であれば、装置全体に樹脂の粉塵が飛散することを低減し、樹脂を保持する保持部の内側に付着した樹脂の粉塵を除去することができる。 Further, the resin molding apparatus of the above embodiment includes the cleaning mechanism, the carry-in mechanism provided with the holding part, and a resin molding part for resin molding using the solid resin carried in by the carry-in mechanism. With this resin molding apparatus, it is possible to reduce the scattering of resin dust over the entire apparatus and remove the resin dust adhering to the inside of the holding portion that holds the resin.

具体的な樹脂成形装置の構成として、前記クリーニング機構は、前記搬入機構が前記樹脂成形部に固形樹脂を搬入した後であって、次の樹脂成形で用いる固形樹脂を保持する前にクリーニングする。この構成であれば、装置全体に樹脂の粉塵が飛散することを低減し、樹脂を保持する保持部の内側に付着した樹脂の粉塵を除去することができる。 As a specific configuration of the resin molding apparatus, the cleaning mechanism cleans the solid resin after the carrying-in mechanism carries the solid resin into the resin molding portion and before holding the solid resin to be used in the next resin molding. With this configuration, it is possible to reduce the scattering of resin dust over the entire apparatus and remove the resin dust adhering to the inside of the holding portion that holds the resin.

また、具体的な樹脂成形装置の構成として、複数の前記保持部が共通の前記搬入機構に設けられるとともに、前記ブラシおよび前記カバーが前記保持部の数に対応して設けられ、それぞれの前記保持部は、前記カバーにより覆うことができるように分離されている。この構成であれば、保持部をカバーにより覆う構成を使用することが容易となり、効果的に樹脂の粉塵が飛散することを低減することができる。 Further, as a specific configuration of the resin molding apparatus, a plurality of the holding portions are provided in the common carrying-in mechanism, and the brush and the cover are provided corresponding to the number of the holding portions, and the respective holding portions are provided. The portions are separated so that they can be covered by the cover. With this configuration, it becomes easy to use a configuration in which the holding portion is covered with a cover, and it is possible to effectively reduce the scattering of resin dust.

さらに、具体的な樹脂成形装置の構成として、それぞれの前記保持部は、複数のピン状のガイド部材を含む。この構成であれば、保持部に対する固形樹脂の接触面積を低減して、効果的に樹脂の粉塵が飛散することを低減することができる。 Further, as a specific configuration of the resin molding apparatus, each holding portion includes a plurality of pin-shaped guide members. With this configuration, the contact area of the solid resin with respect to the holding portion can be reduced, and the scattering of resin dust can be effectively reduced.

また、上記実施形態の樹脂成形品の製造方法は、前記樹脂成形装置を用いて樹脂成形品を製造する方法であって、前記搬入機構が搬入した固形樹脂を用いて樹脂成形する樹脂成形工程と、前記搬入機構の前記保持部を前記クリーニング機構でクリーニングするクリーニング工程と、前記クリーニング工程でクリーニングされた前記搬入機構が固形樹脂を保持して成形型に搬入する搬入工程とを含む。この樹脂成形品の製造方法であれば、樹脂の粉塵が周囲に飛散することを低減し、不良品の発生を低減することができる。 Further, the method for manufacturing a resin molded product according to the above embodiment is a method for manufacturing a resin molded product using the resin molding apparatus, and is a resin molding step for resin molding using the solid resin carried in by the carry-in mechanism. It includes a cleaning step of cleaning the holding portion of the carry-in mechanism by the cleaning mechanism, and a carry-in step of the carry-in mechanism cleaned in the cleaning step holding the solid resin and carrying it into the molding die. According to this method for manufacturing a resin molded product, it is possible to reduce the scattering of resin dust to the surroundings and reduce the occurrence of defective products.

以上、本発明の実施形態について例示的に説明した。すなわち、例示的な説明のために、詳細な説明および添付の図面が開示された。よって、詳細な説明および添付の図面に記載された構成要素の中には、課題解決のために必須でない構成要素が含まれることがある。したがって、それらの必須でない構成要素が詳細な説明および添付の図面に記載されているからといって、それらの必須でない構成要素が必須であると直ちに認定されるべきではない。 The embodiments of the present invention have been exemplified above. That is, for illustrative purposes, detailed description and accompanying drawings have been disclosed. Therefore, some of the components described in the detailed description and the attached drawings may include components that are not essential for solving the problem. Therefore, just because those non-essential components are described in detail and in the accompanying drawings should not be immediately determined to be essential.

また、上記実施形態は、あらゆる点において本発明の例示にすぎない。上記実施の形態は、本発明の範囲内において、種々の改良や変更が可能である。すなわち、本発明の実施にあたっては、実施形態に応じて具体的構成を適宜採用することができる。 Moreover, the above embodiment is merely an example of the present invention in all respects. The above-described embodiment can be variously improved or modified within the scope of the present invention. That is, in carrying out the present invention, a specific configuration can be appropriately adopted according to the embodiment.

１００・・・樹脂成形装置
１・・・搬入機構（ローダ）
２・・・搬出機構（アンローダ）
５・・・クリーニング機構
５１・・・カバー
５２・・・吸引機構
５３・・・ブラシ
６・・・成形型
Ａ・・・供給モジュール
Ｂ・・・樹脂成形モジュール（樹脂成形部）
Ｃ・・・搬出モジュール
Ｗ・・・基板
Ｔ・・・樹脂タブレット

100 ... Resin molding device 1 ... Carry-in mechanism (loader)
2 ... Carry-out mechanism (unloader)
5 ... Cleaning mechanism 51 ... Cover 52 ... Suction mechanism 53 ... Brush 6 ... Molding mold A ... Supply module B ... Resin molding module (resin molding part)
C ... Carry-out module W ... Board T ... Resin tablet

Claims (6)

固形樹脂を保持部で保持して樹脂成形部に搬入する搬入機構の前記保持部を吸引する吸引機構と、
上下に駆動されるブラシと、
前記保持部を覆うカバーとを備えるクリーニング機構。 A suction mechanism that sucks the holding part of the carrying mechanism that holds the solid resin in the holding part and carries it into the resin molding part.
Brushes driven up and down,
A cleaning mechanism including a cover that covers the holding portion. 請求項１に記載のクリーニング機構と、
前記保持部が設けられた前記搬入機構と、
前記搬入機構により搬入される固形樹脂を用いて樹脂成形する樹脂成形部とを備える樹脂成形装置。 The cleaning mechanism according to claim 1 and
With the carry-in mechanism provided with the holding portion,
A resin molding apparatus including a resin molding unit for resin molding using a solid resin carried in by the carry-in mechanism. 前記クリーニング機構は、前記搬入機構が前記樹脂成形部に固形樹脂を搬入した後であって、次の樹脂成形で用いる固形樹脂を保持する前にクリーニングする、請求項２に記載の樹脂成形装置。 The resin molding apparatus according to claim 2, wherein the cleaning mechanism cleans the solid resin after the carry-in mechanism carries the solid resin into the resin molding portion and before holding the solid resin to be used in the next resin molding. 複数の前記保持部が共通の前記搬入機構に設けられるとともに、前記ブラシおよび前記カバーが前記保持部の数に対応して設けられ、
それぞれの前記保持部は、前記カバーにより覆うことができるように分離されている、請求項１～３のいずれか１項に記載の樹脂成形装置。 A plurality of the holding portions are provided in the common carrying-in mechanism, and the brush and the cover are provided corresponding to the number of the holding portions.
The resin molding apparatus according to any one of claims 1 to 3, wherein each holding portion is separated so as to be covered by the cover. それぞれの前記保持部は、複数のピン状のガイド部材を含む、請求項４に記載の樹脂成形装置。 The resin molding apparatus according to claim 4, wherein each holding portion includes a plurality of pin-shaped guide members. 請求項２～５のいずれか１項に記載の樹脂成形装置を用いて樹脂成形品を製造する方法であって、
前記搬入機構が搬入した固形樹脂を用いて樹脂成形する樹脂成形工程と、
前記搬入機構の前記保持部を前記クリーニング機構でクリーニングするクリーニング工程と、
前記クリーニング工程でクリーニングされた前記搬入機構が固形樹脂を保持して成形型に搬入する搬入工程とを含む、樹脂成形品の製造方法。 A method for manufacturing a resin molded product using the resin molding apparatus according to any one of claims 2 to 5.
A resin molding process of resin molding using the solid resin carried in by the carry-in mechanism, and
A cleaning step of cleaning the holding portion of the carrying-in mechanism with the cleaning mechanism, and
A method for manufacturing a resin molded product, comprising a carrying-in step in which the carrying-in mechanism cleaned in the cleaning step holds a solid resin and carries it into a molding die.
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JPH0752187A (en) * 1993-08-10 1995-02-28 Fujitsu Miyagi Electron:Kk Semiconductor chip resin sealing device
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