JP2022034040A - Copper alloy material, electrical and electronic components, electronic device, and method for manufacturing copper alloy material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce occurrence of metal powder during punching.

SOLUTION: A copper alloy material includes 0.01-0.3 mass% of Sn and the rest composed of copper and inevitable impurities. The copper alloy material is a stripe or plate and has a stretch of 11% or less. A product of tensile strength and stretch is 3700 (MPa %) or more.

SELECTED DRAWING: None

COPYRIGHT: (C)2022,JPO&INPIT

Description

The present invention relates to a copper alloy material, an electric / electronic component, an electronic device, and a method for manufacturing a copper alloy material. More specifically, the present invention relates to a copper alloy material containing Sn, an electric / electronic component, an electronic device, and a method for manufacturing a copper alloy material.

Copper alloy plates and strips are, as the main method, processed into a predetermined shape by press working and incorporated into electrical and electronic parts. Pressing includes punching, bending, drawing, etc. Of these, punching is a part of all stamping.

Metal powder is generated in the process of punching. Patent Document 1 discloses a punching method capable of effectively suppressing the generation of metal powder. More specifically, Patent Document 1 discloses that punching in a plurality of stages (pre-stage punching, post-stage punching) is performed, and that sage processing is performed after the pre-stage punching and before the post-stage punching. ing.

Further, Patent Document 2 discloses a Cu—Zn—Sn—Ca based alloy having improved press punching workability. More specifically, Patent Document 2 discloses that compound particles of MgO or MgS are generated to reduce burrs after press punching.

Further, Patent Document 3 discloses a Cu—Sn-based alloy having improved press punching workability. More specifically, a copper alloy plate in which the ratio (r) of the half-value width obtained from the displacement-load curve in the shear test to the plate thickness is 0.2 ≦ r ≦ 0.7 is disclosed.

Japanese Unexamined Patent Publication No. 2016-163904 Japanese Unexamined Patent Publication No. 2013-185221 Japanese Unexamined Patent Publication No. 2016-191088

Metal powder is generated when punching is performed on copper alloy plates and strips. The presence of this metal powder causes mold wear, dents, etc. in the processing process. In addition, it may become a harmful foreign substance in the processing and processing after the punching process. For example, when an article in which a press-molded product and a resin member are bonded is obtained, metal powder may be mixed as a foreign substance inside the resin, which may deteriorate the quality of the resin or the bonded article.

In some cases, the generated metal powder can be removed by washing the press-molded product. However, even if it is washed, it may remain unintentionally and cause problems. Therefore, an object of the present invention is to provide a copper alloy material in which metal powder is less likely to be generated during punching.

The generation of metal powder is particularly remarkable in the punching process in the press process. The punching process is a process of separating a necessary shape and an unnecessary part from a plate or strip of a copper alloy or the like. Shear breaks the plates and strips at the boundary between the required shape and the unwanted portion. Then, metal powder is generated at the breakage of the plate and the strip.

One embodiment of the generation of metal powder is the generation of burrs, which occur when plates and strips are sheared and broken during punching. The burr is an unevenness of the contour of the broken portion of the plate and the strip. Small parts fall off from the sharp points due to this unevenness and become metal powder. In general, burrs generated in punching are harmful to the quality of pressed products, so press conditions are set to suppress burrs.

If the ductility of plates and strips such as copper alloy is low, burrs are unlikely to occur. The reason for this is that when the ductility is low, the plastic deformation caused by shearing due to the punching process is small, and as a result, the unevenness of the contour of the fractured portion is also small. As a result, the generation of metal powder is suppressed. Therefore, in order to suppress the generation of metal powder, a design may be made to reduce the ductility of plates and strips of copper alloy or the like. For example, attention may be paid to elongation as an index showing ductility, and plates and strips such as copper alloys having low elongation may be designed.

However, as a result of diligent studies by the present inventor, a further problem was found. Specifically, when the ductility is low, this causes a tendency that minute parts are more likely to fall off and metal powder is more likely to be generated.

That is, if the ductility is high, metal powder due to burrs is generated. On the other hand, if the ductility is low, the metal powder caused by burrs is suppressed in principle, but the generation of the metal powder caused by the low ductility is promoted.

Therefore, it has been found that the generation of metal powder can be minimized for the first time by adjusting the ductility of plates and strips of copper alloys and the like within an appropriate range.

The present invention has been completed based on the above findings and includes the following inventions in one aspect.
(Invention 1)
Containing 0.01 to 0.30% by mass of Sn,
The balance is a copper alloy material consisting of copper and unavoidable impurities.
The copper alloy material is a strip or a plate.
Growth is less than 11%
The product of tensile strength and elongation is 3700 (MPa ·%) or more.
Copper alloy material.
(Invention 2)
A copper alloy material according to the invention 1, further containing at least one of the following elements in an amount not exceeding the following upper limit value:
Pb: 0.03% by mass or less Fe: 0.02% by mass or less Zn: 0.10% by mass or less P: 0.020% by mass or less (Invention 3)
An electrical and electronic component comprising the copper alloy material according to invention 1 or 2.
(Invention 4)
An electronic device including the electrical and electronic components of the invention 3.
(Invention 5)
A method for producing a copper alloy material according to the invention 1 or 2.
Including the process of performing strain removal annealing after finish cold rolling,
The strain-removing annealing includes annealing under a condition that the temperature or time corresponding to the maximum spring limit value is higher or longer than that of the maximum spring limit value and the spring limit value decrease rate is 10 to 25%.
The method.

In one aspect, the copper alloy material of the present invention has an elongation of 11% or less and a product of tensile strength and elongation of 3700 (MPa ·%) or more. This makes it possible to reduce the generation of metal powder due to the generation of burrs and the generation of metal powder due to too low ductility.

It is explanatory drawing about the maximum spring limit value and the spring limit value decrease rate. The vertical axis shows the spring limit value, and the horizontal axis shows the temperature.

Hereinafter, specific embodiments for carrying out the present invention will be described. The following description is intended to facilitate understanding of the present invention. That is, it is not intended to limit the scope of the present invention.

1. 1. Copper Alloy Material In one embodiment, the present invention relates to a copper alloy material.

1-1. Shape In one embodiment, the copper alloy material of the present invention is a strip or plate. Normally, strips and boards are defined as follows.
"Stripe" (ribbon) refers to "a rolled product having a uniform wall thickness of 0.1 mm or more, having a rectangular cross section, and being supplied in a slit coil shape".
"Sheet, plate" refers to "a rolled product having a uniform wall thickness of 0.1 mm or more, having a rectangular cross section, and being supplied by a flat plate cut with a shear or a saw (saw)".
However, the article or board in the present specification refers to a thing defined by the content of the above definition in which the portion of "0.1 mm or more" is replaced with "0.05 mm or more".

Further, in a preferred embodiment, the thickness of the copper alloy material of the present invention is 0.05 to 2.0 mm. If it is less than 0.05 mm, the strength may be insufficient for electrical and electronic parts. If it exceeds 2.0 mm, it may not be possible to cope with miniaturization and high definition of electrical and electronic parts.

1-2. Composition In one embodiment, the Sn concentration of the copper alloy material of the present invention is 0.01 to 0.30% by mass. When the Sn concentration is high, the conductivity decreases, and in particular, when the Sn concentration exceeds 0.30% by mass, the conductivity may be less than 70%. On the other hand, when the Sn concentration is high, the 0.2% proof stress and the tensile strength are high. Adjusting the Sn concentration is one of the means for adjusting the tensile strength of the product. Preferably, the Sn concentration is 0.10 to 0.20% by mass. More preferably, it is 0.10 to 0.15% by mass. The balance is Cu and unavoidable impurities.

In one embodiment, the copper alloy material of the present invention may further contain at least one of the following elements in the following amounts in addition to the Sn and Cu described above:
Pb: 0 to 0.03% by mass
Fe: 0 to 0.02% by mass
Zn: 0 to 0.10% by mass
P: 0 to 0.020% by mass (preferably 0.001% by mass or more)

In one embodiment, the copper alloy of the present invention comprises "tin-filled copper" with an alloy number of C1441, as defined in JIS H3100 (2018). The alloy component of C1441 has Sn of 0.10 to 0.20% by mass, which is within the above-mentioned range. Furthermore, the alloy components of C1441 are Pb of 0.03% by mass or less, Fe of 0.02% by mass or less, Zn of 0.10% by mass or less, P of 0.001 to 0.020% by mass, and the balance. It is Cu. However, Pb, Fe, Zn, and P may impair conductivity, although they do not affect the problems and means for solving the metal powder to be solved by the present invention. Pb, Fe, Zn, and P are allowed as long as the conductivity is not impaired.

1-3. Conductivity In one embodiment, the conductivity of the copper alloy material of the present invention is 70% IACS or higher. When the conductivity is 70% IACS or more, excellent conductivity is exhibited when used for electrical and electronic parts. It is preferably 74% IACS or higher, more preferably 78% IACS or higher.

The conductivity is measured by the four-terminal method at 20 ° C. with respect to the test piece collected in the direction in which the longitudinal direction is parallel to the rolling direction. The measuring method conforms to JISH0505 (1975) "Method for measuring volume resistivity and conductivity of non-ferrous metal materials".

1-4. Tensile strength (TS)
In one embodiment, the tensile strength of the copper alloy material of the present invention is 425 MPa to 580 MPa. If the tensile strength is less than 425 MPa, sufficient strength will not be exhibited when used for electrical and electronic components. If the tensile strength exceeds 580 MPa, the bending workability deteriorates. It is preferably 460 MPa or more and / or 540 MPa or less.

1-5. Elongation (EL)
In one embodiment, the upper limit of the elongation rate of the copper alloy material of the present invention is 11.0 (%). On the other hand, the lower limit is defined as follows.
Elongation (%) ≧ 3700 / tensile strength (MPa)

If the elongation is below the lower limit, the elongation is relatively low with respect to the tensile strength. Therefore, the ductility is inferior, and metal powder is likely to be generated in the punching process. On the other hand, if the elongation exceeds the upper limit, burrs are likely to occur in the press working by punching. When burrs are likely to occur, metal powder is also likely to be generated.

Here, the lower limit of elongation is defined in relation to the tensile strength because a constant value is not determined. Specifically, it is specified by the product of tensile strength and elongation as shown in the following equation.
・ Tensile strength (MPa) x elongation (%) ≧ 3700

In the above formula, those having high tensile strength and high elongation are less likely to generate metal powder. The reason why metal powder is less likely to be generated is that if the tensile strength is high and the ductility is high, it is difficult for a minute portion to fall off from the contour of the fractured portion in press working.

Further, in the above formula, the preferable lower limit of the product of the tensile strength and the elongation is 3700 (MPa ·%). When the product of tensile strength and elongation is less than 3700 (MPa ·%), metal powder is likely to be generated due to a decrease in strength and ductility. The upper limit is not particularly specified, but is typically 6000 (MPa ·%) or less.

Tensile strength and elongation are measured by a tensile test. The tensile test is based on JISZ2241 (2011). The test piece is collected in a direction parallel to the rolling direction, and the No. 5 test piece or the No. 13B test piece specified in JISZ2241 is used, and the scoring distance is 50 mm.

If the test piece cannot be collected according to the specified dimensions, a rectangular plate having a width of 5 mm or more and 25 mm or less and a length of 150 mm or more and 250 mm or less may be produced and used as the test piece. Alternatively, for a plate or strip having a product standard of width of 5 mm or more and 25 mm or less, a length of 150 mm or more and 250 mm or less may be cut out from the plate or strip and used as a test piece.

Differences in tensile strength and elongation values may occur depending on the dimensions of the test piece or the setting of various test conditions specified in JISZ2241. In that case, when the tensile strength and elongation are included in the above range due to the dimensions of any one type of test piece or any one type of test condition, the strip or plate is included in the scope of the present invention. It shall be.

2. 2. Manufacturing Method In one embodiment, the present invention relates to a method for manufacturing a copper alloy material. More specifically, the present invention relates to a method for producing a copper alloy material having any of the above-mentioned characteristics.

2-1. Outline of the process of the manufacturing method Cold rolling and recrystallization annealing can be alternately performed on a plate obtained by melt casting, hot rolling, and face milling to perform finish cold rolling. Finish cold rolling is the final cold rolling that adjusts the plate thickness of the product. Finish After cold rolling, strain removal and annealing are performed to obtain a product.

The conditions in each step may be set by using a well-known technique for manufacturing a plate and a strip of a copper alloy or the like, which is a component related to the present invention. Further, in addition to the above steps, at least one or more of a degreasing step, a pickling step, a polishing step, and a rust preventive treatment step may be optionally added. Rolling oil and metal powder can be removed by the degreasing step. The oxide film or the oxide layer can be removed by the pickling and polishing steps. For the rust preventive treatment, a discoloration inhibitor may be used.

2-2. Final recrystallization annealing When the crystal grain size is refined by the final recrystallization annealing and then the finish cold rolling is performed, the 0.2% proof stress and tensile strength are increased. The final recrystallization annealing is one of the means for adjusting the tensile strength of the product. In one embodiment, the grain size obtained by the final recrystallization annealing is, for example, 0.030 mm or less.

2-3. Finish cold rolling The higher the workability of cold rolling, the higher the tensile strength. Here, the degree of processing is calculated by the following formula.
Workability (%) = ((plate thickness before cold rolling-plate thickness after cold rolling) / plate thickness before cold rolling) x 100
The workability of finish cold rolling is one of the means for adjusting the tensile strength of the product. In one embodiment, the degree of processing is, for example, 50% or more.

2-4. Strain relief annealing Generally, in the production of plates and strips of copper alloys and the like, strain relief annealing is performed after finish cold rolling. The purpose of the strain-removing annealing is to improve springiness, strength by low-temperature annealing effect, reduction of residual stress, improvement of thermal expansion and contraction characteristics, improvement of ductility, improvement of bending workability by improvement of ductility, and the like.

In one embodiment, the present invention focuses on the improvement of springiness and ductility among the above, and adjusts the conditions for strain relief annealing. Regarding the relationship between springiness and ductility, if the springiness is high, the ductility may be inferior, and if the ductility is high, the springiness may be inferior. In one embodiment, the present invention ensures the required ductility by performing strain relief annealing under conditions inferior to the best springiness.

Specifically, the spring limit value is adopted as an index indicating the best spring property, and the reduction rate of the spring limit value is adjusted. The spring limit reduction rate is defined and adjusted in the following procedure.
(1) Perform a preliminary experiment of strain annealing under a constant strain annealing time, and collect data on the relationship between the temperature of strain annealing and the spring limit value after strain annealing.
(2) From the obtained data, a curve showing the relationship between the temperature and the spring limit value is created (see FIG. 1). Here, the horizontal axis is the temperature and the vertical axis is the spring limit value.
(3) In the curve, the spring limit value shows the maximum value at a certain temperature. This spring limit value is defined as the maximum spring limit value Kb (MAX). Further, the temperature at which the spring limit value indicates the maximum value is T (Kb (MAX)).
(4) The spring limit value decrease amount ΔKb is defined from the following equation.
ΔKb = Kb (MAX) -Kb
(5) The ratio of the amount of decrease in the spring limit value to the maximum spring limit value is defined as the rate of decrease in the spring limit value.
Spring limit value decrease rate (%) = (ΔKb / Kb (MAX)) × 100 (%)
(6) In one embodiment of the present invention, strain removal annealing is performed at a temperature higher than the temperature T (Kb (MAX)) at which the spring limit value indicates the maximum value and at a temperature at which the spring limit value decrease rate is 10 to 25%. do. High elongation (%) is obtained by strain-removal annealing at a temperature lower than the temperature T (Kb (MAX)) at which the spring limit value indicates the maximum value and at a temperature where the spring limit value decrease rate is 10 to 25%. However, the product of tensile strength and elongation (MPa ·%) is less than the preferable range, and metal powder is likely to be generated in the press working.

In the above, a preliminary experiment may be performed on the relationship between time and the spring limit value. In that case, in the above (1) to (6) and the description in the figure, "temperature" is read as "time" and "high temperature" is read as "long time". For example, the description of (6) states, "In one embodiment of the present invention, the spring limit value is longer than the time t (Kb (MAX)) showing the maximum value, and the spring limit value decrease rate is 10 to 25. It should be read as "The strain is removed and annealed in% time."

In addition, a preliminary experiment in which the temperature and time are changed regularly at the same time, for example, a preliminary experiment on the relationship between the product of temperature and time and the spring limit value under the condition that the ratio of temperature and time is constant. You may.

In addition to the above temperature and time, it is possible that the maximum value of the spring limit value fluctuates and the optimum range of the spring limit value decrease rate fluctuates depending on the method and conditions of the preliminary experiment, but it affects many people. There is no hindrance to the implementation of those skilled in the art. Regarding the spring limit value, a strip-shaped test piece with a width of 10 mm is collected from the material after strain removal and annealing so that the longitudinal direction of the test piece is parallel to the rolling direction, and is specified in JIS H3130. The spring limit value was measured by the existing moment type test.

The preferred range of the spring limit value reduction rate is 10 to 25%. If it is less than 10%, the ductility is lowered and metal powder is likely to be generated. On the other hand, if it exceeds 25%, the ductility becomes high and metal powder is generated due to the generation of burrs.

3. 3. Electrical and electronic parts and electronic devices The copper alloy material may be further processed (eg, press working (punching, bending, etc.)) and / or treated (eg, plating, etc.). Electrical and electronic components (eg, connectors, relays, terminals, etc.) can be manufactured using the copper alloy material. Then, an electronic device can be manufactured by using the electric / electronic component.

Cold rolling and recrystallization annealing were alternately performed on the plates obtained by melt casting, hot rolling, and face milling, and finish cold rolling was performed to obtain a plate having a plate thickness of 0.1 mm. In order to obtain the desired tensile strength, the grain size in the final recrystallization annealing and the workability in the finish cold rolling were adjusted. The Sn concentration was also adjusted according to the conditions shown in Table 1. At the time when the finish cold rolling was completed, the elongation was less than 5% in all cases.

After cold rolling, strain removal and annealing were performed to obtain a product. Strain removal annealing was carried out after conducting a preliminary experiment at a temperature of 300 to 600 ° C. and a time of 1 to 600 seconds, and the amount of decrease in the spring limit value was controlled so as to meet the conditions shown in Table 1.

With the obtained product, conductivity, tensile strength, elongation, metal powder evaluation, and bendability evaluation were performed.

For the evaluation of the metal powder, the metal powder generated in the press working was evaluated. In the press working, a rectangular plate having a length of 100 mm and a width of 10 mm was produced by punching. 100 plates were stacked and bundled, and both ends were fixed with a wire to prepare a test piece of a straight body having a length of 100 mm, a width of 10 mm, and a height of 10 mm. Here, the direction of "length" is a direction parallel to the rolling direction, and the direction of "width" is a direction perpendicular to the rolling direction.

With the obtained rectangular parallelepiped test piece, an adhesive tape was attached to a surface having an exposed fracture surface by press working, that is, a surface having a length of 100 mm and a height of 10 m, and peeled off. In carrying out this method, JISH8504 (1999) "Plating Adhesion Test Method", "g) Peeling Test Method" was referred to.

The adhesive surface of the obtained adhesive tape was observed with an optical microscope, and the case where metal powder was easily observed was regarded as defective (x), and the case where almost no metal powder was observed was regarded as good (◯). A large number of foreign unavoidable and minute foreign substances were also attached to the adhesive surface, and the one with high brightness was judged to be metal powder by an optical microscope.

The bendability was evaluated by the W bending test. As a bending method, BAD WAY, that is, a test piece collected in a direction whose longitudinal direction is perpendicular to the rolling direction was used, and the bending axis was set in a direction parallel to the rolling direction. The width of the test piece was 0.2 mm and the bending radius was 0.0 mm. Refer to the section "7.3 Bending Test" in JISH3100 (2018) "Copper and Copper Alloy Plates".

The evaluation in the W bending test was based on visual finish and photo finish. Specifically, it was evaluated by observing the bent portion with an optical microscope and confirming a photograph of the bent portion taken with an optical microscope. In the bent portion, those in which cracks were observed were regarded as defective, and those in which wrinkles were observed and those in which wrinkles were not observed were regarded as good. Wrinkles suspected to be cracked by adjusting the brightness of the optical microscope were found in the photograph as defective.

The results of evaluating the examples and comparative examples are shown in the table below.

In Table 1, in the examples of the invention, the Sn concentration, the rate of decrease in the spring limit value, and the tensile strength are adjusted within a preferable range, and further, elongation and "product of tensile strength and elongation" are preferable. Values were shown (elongation was 11% or less, product of tensile strength and elongation was 3700 or more). As a result, good results were obtained in the evaluation of the metal powder in the press working and the evaluation of the bendability of the invention example.

Here, the invention example 16 is "tin-containing copper" having an alloy number of C1441, which is defined in JIS H3100 (2018). The alloy components of Invention Example 16 are Sn of 0.15% by mass, Pb of 0.001% by mass, Fe of 0.01% by mass, Zn of 0.05% by mass, P of 0.010% by mass, and the balance of Cu. Met.

In Comparative Example 1, since the Sn concentration is low, the tensile strength is low, and it is expected that sufficient strength will not be exhibited when used for electrical and electronic components. Further, in Comparative Example 1, although the rate of decrease in the spring limit value was appropriate, the Sn concentration was low, so that the softening in the strain-removing annealing was remarkable, and the elongation rate exceeded the upper limit of the preferable range. As a result, the evaluation of the metal powder in the press working was poor.

In Comparative Example 2, since the Sn concentration is low, the tensile strength is low, and it is expected that sufficient strength will not be exhibited when used for electrical and electronic parts. Further, since the rate of decrease of the spring limit value was set to be less than the preferable range, the product of the tensile strength and the elongation was set to be less than the preferable range. As a result, the evaluation of the metal powder in the press working was poor.

In Comparative Example 3, since the rate of decrease in the spring limit value was set to exceed the upper limit of the preferable range, the softening in strain relief annealing was significantly lower than the lower limit of the preferable range of tensile strength, and the elongation rate exceeded the upper limit of the preferable range. .. As a result, the tensile strength is low, and it is expected that sufficient strength will not be exhibited when used for electrical and electronic components. In addition, the evaluation of the metal powder in the press working was poor.

In Comparative Example 4, since the reduction rate of the spring limit value was set to exceed the upper limit of the preferable range, the softening in the strain relief annealing was remarkable, and the elongation rate exceeded the upper limit of the preferable range. As a result, the evaluation of the metal powder in the press working was poor.

In Comparative Example 5, since the rate of decrease in the spring limit value was set to be lower than the lower limit of the preferable range, the product of the tensile strength and the elongation was set to be lower than the preferable range. As a result, the evaluation of the metal powder in the press working was poor.

In Comparative Example 6, since the rate of decrease in the spring limit value was set to exceed the upper limit of the preferable range, the softening in the strain relief annealing was remarkable, and the elongation rate exceeded the upper limit of the preferable range. As a result, the evaluation of the metal powder in the press working was poor.

In Comparative Example 7, since the rate of decrease in the spring limit value was set to be lower than the lower limit of the preferable range, the product of the tensile strength and the elongation was set to be lower than the preferable range. As a result, the evaluation of the metal powder in the press working was poor.

In Comparative Example 8, since the Sn concentration was high, the conductivity was below the lower limit of the preferable range. It is expected that excellent conductivity will not be exhibited when used in electrical and electronic components. Further, in Comparative Example 8, since the Sn concentration is high, the elongation and the “product of tensile strength and elongation” are in the preferable range even though the rate of decrease in the spring limit value is set to exceed the upper limit of the preferable range. rice field. As a result, the evaluation of the metal powder in the press working was good. However, due to its high tensile strength, it was poor in the evaluation of bendability.

In Comparative Example 9, since the Sn concentration was high, the conductivity was below the lower limit of the preferable range. It is expected that excellent conductivity will not be exhibited when used in electrical and electronic components. Further, in Comparative Example 9, since the rate of decrease in the spring limit value was set in a preferable range, elongation and "product of tensile strength and elongation" were in a preferable range. As a result, the evaluation of the metal powder in the press working was good. However, due to its high tensile strength, it was poor in the evaluation of bendability.

In Comparative Example 10, since the Sn concentration was high, the conductivity was below the lower limit of the preferable range. It is expected that excellent conductivity will not be exhibited when used in electrical and electronic components. Further, in Comparative Example 10, since the rate of decrease in the spring limit value was set to be lower than the lower limit of the preferable range, the product of the tensile strength and the elongation was set to be lower than the preferable range. As a result, the evaluation of the metal powder in the press working was poor. Further, since the Sn concentration is high, the tensile strength is high, which is poor in the evaluation of bendability.

Comparative Example 11 is an example in which strain removal annealing is performed at a temperature lower than the temperature T (Kb (MAX)) at which the spring limit value indicates the maximum value and at a temperature at which the spring limit value decrease rate is 10 to 25%. In Comparative Example 11, high elongation (%) could not be obtained, the product of tensile strength and elongation (MPa ·%) was below the preferable range, and the evaluation of the metal powder in the press working was poor.

The specific embodiment of the present invention has been described above. The above embodiment is merely a specific example of the present invention, and the present invention is not limited to the above embodiment. For example, the technical features disclosed in one of the above embodiments can be applied to other embodiments. Further, unless otherwise specified, for a specific method, it is possible to replace some steps with the order of other steps, and a further step may be added between the two specific steps. The scope of the present invention is defined by the claims.

Claims (4)

Containing 0.01 to 0.30% by mass of Sn,
The balance is a copper alloy material consisting of copper and unavoidable impurities.
The copper alloy material is a strip or a plate.
Growth is less than 11%
The product of tensile strength and elongation is 3700 (MPa ·%) or more.
Copper alloy material. An electrical and electronic component comprising the copper alloy material according to claim 1. An electronic device including the electrical and electronic components of claim 2. The method for producing a copper alloy material according to claim 1.
Including the process of performing strain removal annealing after finish cold rolling,
The strain-removing annealing includes annealing under a condition that the temperature or time corresponding to the maximum spring limit value is higher or longer than that of the maximum spring limit value and the spring limit value decrease rate is 10 to 25%.
The method.

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