JP2022027523A - Lead type piezoelectric oscillator - Google Patents

Abstract

To provide a lead type piezoelectric oscillator which integrally mounts a surface mounting type piezoelectric oscillator and a surface mounting type electronic component to a lead terminal in an effective state, and improves characteristics.SOLUTION: A lead type piezoelectric oscillator 100 has a first lead terminal 1, a second lead terminal 2 and a third lead terminal 3 which are formed with pad parts and external connection parts, a surface mounting type piezoelectric oscillator 4 and a surface mounting type electronic component 5 which are conductively joined to the pad parts (first pad part 10, second pad part 20 and third pad part 30) of the lead terminal, and a resin package part 6 covering them. The surface mounting type piezoelectric oscillator and the surface mounting type electronic component are electrically connected to each other through the pad parts of the plurality of the lead terminals.SELECTED DRAWING: Figure 3

Description

The present invention is one of a surface mount type piezoelectric oscillator provided with external terminals and a plurality of pad portions in which each external terminal of the surface mount type piezoelectric oscillator is electrically and mechanically connected by a conductive bonding material. The present invention relates to a lead-type piezoelectric oscillator including a plurality of lead terminals integrally formed with the pad portion and electrically connected, and a surface mount type piezoelectric oscillator and a resin package portion for sealing the pad portion with a resin.

As an example of the conventional read-type piezoelectric oscillator, there is one disclosed in Patent Document 1. That is, a surface mount type piezoelectric oscillator bonded electrically and mechanically to a lead terminal made of a metal lead frame using a conductive bonding material such as solder, and further molded and coated with a resin material (resin package portion). (Equipment) is disclosed.

Patent Document 1 discloses a device in which the shape of the lead terminal is devised in order to reduce the influence of external noise in the lead type piezoelectric oscillator.
Japanese Unexamined Patent Publication No. 2017-85450

In the lead type piezoelectric oscillator as in Patent Document 1, the characteristics as a single unit have already been completed at the time of manufacturing the built-in surface mount type piezoelectric oscillator, and the noise component is removed from the external power supply through the lead terminal and piezoelectric. Usually, no consideration is given to improving the characteristics of the oscillator. Further, in the case of removing the noise component from the external power supply or improving the characteristics of the piezoelectric oscillator for the finally completed read-type piezoelectric oscillator, generally, the characteristic improvement component is mounted on the external circuit later. This is achieved by connecting to an oscillator circuit. However, the lead-type piezoelectric oscillator has a problem that the effect of improving these characteristics is small because the conduction path with the external circuit board is longer than that of the surface-mounted piezoelectric oscillator.

The present invention was devised to solve such a problem, and an object thereof is to improve the characteristics by integrally attaching a surface mount type piezoelectric oscillator and a surface mount type electronic component to a lead terminal in an effective state. The purpose of the present invention is to provide a lead type piezoelectric oscillator.

In order to achieve the above object, as shown in claim 1 of the present invention,
A plurality of lead terminals having a plurality of pad portions formed at one end and an external connection portion formed at the other end, and a plurality of external terminals formed on an outer surface, and a part of the plurality of pad portions and the plurality of the above. It is provided with a surface mount type piezoelectric oscillator in which the external terminals of the above are conductively bonded, a plurality of external terminals are formed on the outer surface, and a part of the plurality of pad portions and the plurality of external terminals are conductively bonded. It has a surface mount type electronic component that is electrically connected to the surface mount type piezoelectric oscillator, and covers the pad portions of the plurality of lead terminals, the surface mount type piezoelectric oscillator, and the surface mount type electronic component. A lead-type piezoelectric oscillator characterized in that a resin package portion is formed.

With the above configuration, the external terminals of the surface mount type piezoelectric oscillator are conductively bonded to a part of the pad portion of the lead terminal, and the external terminals of the surface mount type electronic component are conductively bonded to a part of the pad portion of the lead terminal. Surface mount electronic components can be electrically connected very close to the surface mount piezoelectric oscillator. Therefore, a surface-mounted piezoelectric oscillator and a surface-mounted electronic component have a lower impedance and a closer electrical connection relationship, and as a result, an effective configuration can be obtained by improving the characteristics of the lead-type piezoelectric oscillator. In addition, by creating a lead-type piezoelectric oscillator by diverting general-purpose parts whose characteristics are secured as a surface mount type piezoelectric oscillator, it is not necessary to reconstruct the characteristics as a piezoelectric oscillator, and it can be manufactured in a small size and at low cost. Can be done.

Further, as shown in Patent Claim 2 of the present invention, the surface mount type electronic component has a smaller surface area than the surface mount type piezoelectric oscillator, and the plurality of pad portions are a plurality of external terminals of the surface mount type piezoelectric oscillator. A main pad portion conductively bonded to the main pad portion, a sub pad portion conductively bonded to a plurality of external terminals of the surface mount type electronic component, and a main pad portion formed between the main pad portion and the sub pad portion. And a region having a weaker mechanical strength than the sub pad portion may be formed.

In the lead type piezoelectric oscillator, the lead terminal forming the pad portion, the surface mount type piezoelectric oscillator conductively bonded to the lead terminal, and the surface mount type electronic component are covered with resin, so that the resin is used when forming the resin package portion. Thermal stress could occur in the area inside the package. In the present invention, according to the above configuration, a surface mount type electronic component having a small surface surface is conductively bonded from a main pad portion (a region having relatively strong mechanical strength) in which a surface mount type piezoelectric oscillator having a larger thermal stress is conductively bonded. Even if it is transmitted to the sub-pad section (region where the mechanical strength is relatively weak), the mechanical strength of the lead terminal between the main pad section and the sub-pad section is higher than that of the main pad section and the sub-pad section. Since such a weak region is formed, such thermal stress can be relieved, and it is possible to protect the region of the sub-pad portion having relatively weak strength and the surface mount type electronic component conductively bonded to this region. can. As a result, it is possible to eliminate peeling of the conductive bonding material in the auxiliary pad portion where the surface mount type electronic component having a small bonding area is conductively bonded, or destruction of the surface mount type electronic component conductively bonded.

Further, as shown in Patent Claim 3 of the present invention, the surface mount type electronic component has a smaller number of external terminals than the surface mount type piezoelectric oscillator, and the plurality of pad portions are a plurality of the surface mount type piezoelectric oscillator. A main pad portion that is conductively bonded to the external terminal of the above, a sub pad portion that is conductively bonded to a plurality of external terminals of the surface mount type electronic component and has a smaller number of pads than the main pad portion, and a main pad portion. A region formed between the main pad portion and the sub pad portion and having a weaker mechanical strength than the main pad portion and the sub pad portion may be formed.

In the lead type piezoelectric oscillator, the lead terminal forming the pad portion, the surface mount type piezoelectric oscillator conductively bonded to the lead terminal, and the surface mount type electronic component are covered with resin, so that the resin is used when forming the resin package portion. Thermal stress could occur in the area inside the package. In the present invention, according to the above configuration, a surface mount type electronic component having few joint points can be obtained from a main pad portion (a region having relatively strong mechanical strength) in which a surface mount type piezoelectric oscillator having more joint points with thermal stress is conductively bonded. Even if it is transmitted to the conductively bonded sub-pad part (region where the mechanical strength is relatively weak), the lead terminal is mechanically connected between the main pad part and the sub-pad part rather than the main pad part and the sub-pad part. Since a region with low strength is formed, such thermal stress can be relaxed, and the region of the sub-pad portion having relatively weak strength and the surface mount type electronic component conductively bonded to this region are protected. Can be done. As a result, it is possible to eliminate the peeling of the conductive bonding material in the auxiliary pad portion where the surface mount type electronic component having few bonding points is conductively bonded, or the destruction of the surface mount type electronic component conductively bonded.

Further, as shown in claim 4 of the present invention,
The region where the mechanical strength of the lead terminal is weak may be formed by a narrow portion having a narrow width on the main surface of the pad portion of the lead terminal.

With the above configuration, in addition to the above-mentioned effects, the narrow portion of the pad portion can be easily processed and can function as a region having weak mechanical strength. Thermal stress can be relaxed by this narrow portion, and it can also function as a stress absorbing portion due to mechanical deformation of the lead terminal.

Further, as shown in claim 5 of the present invention,
An arc-shaped R-processed portion was formed at a corner portion serving as a connection portion of the narrow portion of the lead terminal.

With the above configuration, in addition to the above-mentioned effects and effects, by forming an R-processed portion at the corner portion that is the connection portion of the narrow portion of the lead terminal, stress concentration at the corner portion due to mechanical deformation of the lead terminal is performed. It is possible to reduce the occurrence of cracks and breaks in the lead terminal. As a result, it is possible to eliminate non-oscillation due to disconnection of the connection with the surface mount type piezoelectric oscillator and destruction of the resin package portion surrounding the lead terminal and the like.

Further, as shown in claim 6 of the present invention,
The surface mount type electronic component may be a capacitor.

With the above configuration, in addition to the above-mentioned effects, the capacitor can be attached at a position extremely close to the surface mount type piezoelectric oscillator in which the IC is built, so that the effect of removing noise from the external power supply can be enhanced.

As described above, in the present invention, the surface mount type piezoelectric oscillator and the surface mount type electronic component are integrally attached to the lead terminal in an effective state, so that the characteristics of the surface mount type piezoelectric oscillator are improved and the lead type piezoelectric oscillator is more reliable. Can be provided.

It is a schematic block diagram which showed the state which mounted the lead type piezoelectric oscillator which concerns on embodiment of this invention on a wiring board. It is a schematic block diagram of the lead terminal which concerns on embodiment of this invention. It is a schematic block diagram of the lead type piezoelectric oscillator which concerns on embodiment of this invention. It is a schematic block diagram of the surface mount type piezoelectric oscillator which concerns on embodiment of this invention. FIG. 3 is a schematic cross-sectional view taken along the line XX of FIG. 3 according to the embodiment of the present invention. It is a schematic block diagram of the lead terminal which concerns on other embodiment of this invention. It is a schematic block diagram of the lead terminal which concerns on other embodiment of this invention.

Hereinafter, embodiments of the lead-type piezoelectric oscillator of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic configuration diagram showing a state in which the lead-type piezoelectric oscillator 100 according to the embodiment of the present invention is mounted on the wiring board 7 (external circuit board), and the lead-type piezoelectric oscillator 100 is soldered to the wiring board 7. It is implemented using (not shown). A wiring pattern (not shown) and a through hole 71, a through hole 72, and a through hole 73 (through holes 71, 72, 73) are formed on the wiring board 7. The through holes 71, 72, and 73 are through holes having a plating layer (not shown) provided on the inner wall and penetrating both main surfaces of the wiring board 7.

That is, with respect to the through holes 71, 72, 73 of the wiring board, the first lead terminal 1, the second lead terminal 2, and the third lead terminal 3 of the lead type piezoelectric oscillator (hereinafter referred to as lead terminals 1, 2, 3). The first external connection portion 15, the second external connection portion 25, and the third external connection portion 35 (hereinafter referred to as external connection portions 15, 25, 35) are inserted, and the plating layer of the inner wall and solder are used. It is electrically and mechanically joined.

FIG. 2 is a schematic configuration diagram of lead terminals 1, 2, and 3 according to the embodiment of the present invention. The lead terminals 1, 2, and 3 are formed with external connection portions 15, 25, and 35 inserted into the through holes of the external circuit board at the other end portions, and are in the same direction from the other end portions (+ Y-axis direction in this embodiment, respectively). ), And a first pad portion 10, a second pad portion 20, and a third pad portion 30 (hereinafter referred to as pad portions 10, 20, and 30) are formed at one end thereof, respectively. Each pad portion has a mounting surface (front and back main surfaces) which is a plate-shaped XY plane composed of an X axis and an Y axis orthogonal to the X axis.

In the present embodiment, one end of the lead terminal 1 on the pad portion 10 side is used as the base end, the other end of the external connection portion 15 side is used as the tip end, and the pad portion 20 side of both ends of the lead terminal 2 is used. The other end on the external connection portion 25 side is the tip, the other end on the pad portion 30 side is the base end, and the other end on the external connection portion 35 side is the tip. ..

The pad portions 10, 20 and 30 are a portion where the surface mount type piezoelectric oscillator 4 described later and the surface mount type electronic component 5 described later are joined and a peripheral portion thereof (a portion indicated by the region D0), and the pad portion 10 , 20 and 30 widths (dimensions in the X-axis direction (+ X-axis direction and −X-axis direction)) are dimensions in the widths of the lead terminals 1, 2 and 3 (dimensions in the X-axis direction (+ X-axis direction and −X-axis direction)). ) It is wider than W0 and is formed in a plate shape. A surface-mounted piezoelectric oscillator 4 and a surface-mounted electronic component 5, which will be described later, are mounted on the plate-shaped mounting surfaces of the pad portions 10, 20 and 30, respectively, and the pad portions 10, 20 and 30 and the surface-mounted piezoelectric component 5 are mounted. The oscillator 4 and the surface mount type electronic component 5 are electrically connected by a conductive bonding material H such as solder.

The tip of the first pad portion 10 is joined to two external terminals 40 out of four of the four surface mount type piezoelectric oscillators described later, and the surface area of the first pad portion 10 is large. And the second 12 of the first main pad portion are formed in parallel with the notch portion 14 interposed therebetween. The portion of the first pad portion 10 close to the first external connection portion 15 is joined to the external terminal 50 of one of the two surface mount electronic components described later, and the surface area occupied by the first pad portion 10 is small. The first sub pad portion 13 is formed. That is, the surface area of the first main pad portion (11 of the first main pad portion and 22 of the first main pad portion) is formed to be larger than that of the first sub pad portion 13.

In this embodiment, the first main pad section (11 of the first main pad section and the second 12 of the first main pad section), which has two points with many connection points, and the first sub pad section, which has one point with few connection points. Between 13, the width of the main surface of the pad portion is narrowed as a region where the mechanical strength of the first lead terminal 2 is weaker than that of the first main pad portion 212 and the first sub pad portion 13. The portion 16 is formed.

With the above configuration, the external terminals of the surface mount type piezoelectric oscillator 4 having a large number of external terminals on the first main pad portion (11 of the first main pad portion and 22 of the first main pad portion) are made of the conductive bonding material H. Since they are joined, the mounting positioning of the surface mount type piezoelectric oscillator 4 on the lead terminal 1 is stable, and the configuration is such that stronger fixing can be realized. Further, since the region where the external terminals of the surface mount type electronic component 5 having a small number of external terminals are joined is formed in the first sub pad portion 13, it invades the mounting region of the surface mount type piezoelectric oscillator 4 as the main component. It is easy to secure a mounting area for the surface mount type electronic component 5, and it is possible to save space in the mounting area. Further, since the narrow portion 16 is formed between the first main pad portion (11 of the first main pad portion and the second 12 of the first main pad portion) and the first sub pad portion 13, the resin is formed. The first main pad portion (11 of the first main pad portion and the first main pad portion) to which the surface mount type piezoelectric oscillator 4 having more junction points such as thermal stress generated when forming the package portion 6 is conductively bonded is conducted. Even if the surface mount type electronic component 5 having few bonding points is transmitted from (2) 12) to the first sub-pad portion 13 conductively bonded, the stress between the two can be relaxed.

In order to improve the stress relaxation performance transmitted to the lead terminal, the width of the main surface of the narrow portion 16 is set to W1 (see FIG. 2), and the thickness of the narrow portion 16 is set to T1 (see FIG. 5). The ratio T1 / W1 is preferably set within the range of 0.8 to 1.2. As a result, the aspect ratio between the width of the main surface of the narrow portion 16 and the thickness becomes small, and the cross-sectional shape of the narrow portion 16 approaches a square shape. Since it is easy to displace in the plane direction, it is easy to relax stress. In this embodiment, for example, the width W1 is set to 4.5 mm, the thickness T1 is set to 4 mm, and the dimensional ratio is set to 0.88.

Further, as shown in FIG. 6, R-processed portions 161R and 162R processed into an arc shape may be formed at a corner portion which is a connecting portion of the narrow portion 16 of the lead terminal 1. The diameter of the R processed portion is formed, for example, about 0.1 to 0.2 mm. With this configuration, stress concentration at the corners due to mechanical deformation of the lead terminal 1 is eliminated, and the occurrence of cracks and breaks in the lead terminal 1 can be reduced. It should be noted that this R-processed portion may be formed not only at the corner portion that is the connection portion of the narrow portion 16 but also at all the corner portions of the lead terminal 1. Further, the C surface processed portion may be formed so that the corner portion has an obtuse angle instead of the R processed portion.

The tip portion of the second pad portion 20 is joined to an external terminal 40 of one of four surface mount type piezoelectric oscillators described later, and a second main pad portion 21 having a large surface area occupying the second pad portion 10 is formed. Has been done. The portion of the second pad portion 20 close to the second external connection portion 15 is joined to the external terminal 50 of one of the two surface mount electronic components described later, and the surface area occupied by the second pad portion 20 is small. The second sub pad portion 22 is formed. That is, the surface area of the second main pad portion 21 is formed to be larger than that of the second sub pad portion 22.

In this embodiment, between the second main pad portion 21 having a large surface area and the second sub pad portion 22 having a small surface area, the second lead terminal 2 is mechanically located more than the second main pad portion 21 and the second sub pad portion 22. As a region with low strength, a narrow portion 23 having a narrow width on the main surface of the pad portion is formed.

With the above configuration, since the external terminal of the surface mount type piezoelectric oscillator 4 having a large surface area is bonded to the second main pad portion 21 having a large surface area by the conductive bonding material H, the surface mount type piezoelectric oscillator 4 to the lead terminal 1 is bonded. The mounting positioning of the device is stable, and a stronger fixing can be achieved. Further, since a region to which the external terminal of the surface mount type electronic component 5 having a small surface area is bonded is formed in the second sub pad portion 22 having a small surface area, the mounting region of the surface mount type piezoelectric oscillator 4 as the main component can be used. It is easy to secure a mounting area for the surface mount type electronic component 5 without invading, and it is possible to save space in the mounting area. Further, since the narrow portion 23 is formed between the second main pad portion 21 and the second sub pad portion 22, thermal stress generated when the resin package portion 6 is formed is a surface having a larger surface area. Even if the surface mount type electronic component 5 having a small surface area is transmitted from the second main pad portion 21 to which the mountable piezoelectric oscillator 4 is conductively bonded to the second sub pad portion 22 to which the surface mount type electronic component 5 is conductively bonded, the stress between them is transmitted to each other. Can be relaxed.

Further, as shown in FIG. 6, among the corner portions that are the connection portions of the narrow portion 23 of the lead terminal 2, the portions having an angle smaller than 120 degrees, where stress is relatively easy to concentrate, are the R processed portions 231R and 232R. May be formed. The diameter of the R processed portion is formed, for example, about 0.1 to 0.2 mm. With this configuration, stress concentration at the corners due to mechanical deformation of the lead terminal 2 is eliminated, and the occurrence of cracks and breaks in the lead terminal 1 can be reduced. It should be noted that this R-processed portion may be formed on a portion having an angle larger than 120 degrees among the corner portions serving as the connection portion of the narrow portion 23, and may be formed on all the corner portions of the lead terminal 2. May be good. Further, the C surface processed portion may be used instead of the R processed portion so that the corner portion has an obtuse angle.

A third main pad portion 31 having a large surface area occupying the third pad portion 10 is formed at the tip portion of the third pad portion 30 by being joined to an external terminal 40 of one of four surface mount type piezoelectric oscillators described later. Has been done.

In this embodiment, Cu (copper), 42 alloy (Ni (nickel) alloy) or the like is used as the base material of the lead terminals 1, 2 and 3. The surface of the base material is subjected to base plating such as Ni, and then further subjected to Ag (silver) plating, Au (gold) plating and the like.

In the lead type piezoelectric oscillator 100, as shown in FIGS. 3 and 5, pad portions 10, 20, and 30, a surface mount type piezoelectric oscillator 4 and a surface mount type electronic component 5 are formed by using an insulating resin. It is resin-sealed by the resin package portion 6. Here, a part of each of the lead terminals 1, 2 and 3 on the base end side is also resin-sealed by the resin package portion 6. In this embodiment, the shape of the resin package portion 6 is a rectangular parallelepiped shape along the main surface of the pad portion of the lead terminal, but the shape is not limited to this, and the pad portions 10, 20, 30 and the surface mount type are not limited to this. As long as the piezoelectric oscillator 4 and the surface mount type electronic component 5 can be sealed with resin, other shapes may be used.

The lead terminals 1, 2, and 3 are arranged adjacent to each other in order along the + X-axis direction. The lead terminal 1 extends from the first pad portion 10 in the −Y axis direction, the lead terminal 2 extends from the second pad portion 20 in the −Y axis direction, and the lead terminal 3 extends from the third pad portion 30 to −Y. It extends in the axial direction. That is, these lead terminals 1, 2, and 3 extend from the pad portions 10, 20, and 30 in the same direction as the −Y axis direction. In this embodiment, the lead terminal 1 is a lead terminal for inputting a power supply voltage, the lead terminal 2 is a ground terminal for grounding, and the lead terminal 3 is a lead terminal for taking out an output frequency signal. .. The combination (extended state) of the lead terminals 1, 2 and 3 and the pad portions 10, 20 and 30 shown in the present embodiment is only an example, and can be arbitrarily changed according to the specifications of the lead type piezoelectric oscillator 100 and the like. It is possible.

Further, although not shown, the plating layer on the inner wall of the through holes 71, 72, 73 and the lead terminals 1, 2, and 3 are electrically connected to each other by using solder or the like.

When used as the surface mount type piezoelectric oscillator 4, the surface mount type piezoelectric oscillator can be widely used as a lead type piezoelectric oscillator, and the manufacturing cost of electronic components can be reduced.

In the present embodiment, a case where a surface mount type crystal oscillator including an electronic component element composed of a crystal vibrating piece 54 is used as the surface mount type piezoelectric oscillator 4 will be described. FIG. 4 is a cross-sectional view showing an embodiment of the surface mount type piezoelectric oscillator 4 according to the embodiment of the present invention, in which an insulating base 34 made of a ceramic multilayer substrate and a lid 24 covering the opening portion of the stepped recess 341 are shown. It has a housing 14 composed of and.

In this surface mount type piezoelectric oscillator 4, the contact portion (outer peripheral edge portion) between the base 34 and the lid 24 is joined by a sealing joining material (not shown), and the inside (cavity) of the housing 14 is formed by this joining. It is hermetically sealed.

The lid 24 is formed by using a conductive material such as metal, and is electrically connected to a pad portion 20 integrally formed with a lead terminal 2 for grounding, so that noise can be removed. The lid 24 is not limited to the conductive material, and may be formed by using an insulating material such as ceramic. Further, although not shown, the lid 24 and the pad portion 20 are preferably electrically connected via a wiring pattern, wires, or the like formed on the housing 14.

The base 34 is provided with a stepped recess 341 as a cavity on one surface (the surface on the upper side of the paper surface (hereinafter referred to as the upper side)).

Two steps are provided in the stepped recess 341. A crystal vibrating piece 54 having a pair of excitation electrodes (not shown) formed on both main surfaces is placed on the upper portion of the stepped recess 341 (the step portion on the side closest to the opening portion of the stepped recess 341). The end of the crystal vibrating piece 54 is supported by at least a part of the upper portion 342.

A plurality of electrode pads (not shown) are provided in the upper portion 342 of the stepped recess 341, and each excitation electrode of the crystal vibrating piece 54 uses the conductive bonding material 741 and the conductive bonding material 742 in the plurality of electrode pads. It is joined. The two conductive bonding materials 741 and 742 are arranged at the same positions in the cross-sectional view shown in FIG. 4, and are located on the front side of the paper surface (hereinafter referred to as the front side) and the back side of the paper surface (hereinafter referred to as the back side). It is arranged. As the conductive bonding materials 741 and 742, a resin adhesive, a metal bump, a plated bump, or the like may be used.

An integrated circuit element 64 (IC) including an oscillation circuit such as CMOS and an amplifier circuit is mounted on the bottom surface 343 of the stepped recess 341. The integrated circuit element 64 includes a plurality of external terminals (not shown), and the plurality of external terminals of the integrated circuit element 64 are provided on the lower surface portion (bottom surface 343 side of the upper stage portion 342) of the stepped recess 341. (Stepped portion) 344 is wire-bonded to a plurality of electrode pads (not shown) via a plurality of wires 84, respectively. Instead of the wire bond using the wire 84, flip chip bonding (FCB) using a metal bump may be used.

The surface mount type piezoelectric oscillator 4 shown in FIG. 4 includes four external terminals 40 (see FIG. 3). These external terminals 40 are formed on the surface of the outside of the base 34 (lower side of the paper surface (hereinafter referred to as lower side)). For example, the external terminal 40 is electrically connected to an external terminal for inputting the power supply voltage of the integrated circuit element 64 and to an external terminal for controlling the output of the integrated circuit element 64. It is divided into those that are electrically connected to the external terminal for grounding of the integrated circuit element 64 and those that are electrically connected to the external terminal for extracting the output signal of the integrated circuit element 64. ..

At least a part of the excitation electrode of the crystal vibrating piece 54 mounted on the upper portion 342 of the stepped recess 341 and the external terminal of the integrated circuit element 64 mounted on the lower portion 343 of the stepped recess 341. At least a part of the above is electrically connected according to the specifications of the surface mount type piezoelectric oscillator 4.

In the lead type piezoelectric oscillator 100 shown in FIGS. 3 and 4, the external terminal 40 of the surface mount type piezoelectric oscillator 4 is provided on the mounting surface (one main surface side of the front and back main surfaces) of the pad portions 10, 20 and 30. It is mounted face-to-face (opposite). In such a state, in the lead-type piezoelectric oscillator 100, the surface of the pad portion 10 (11 of the first main pad portion and the 22 of the first main pad portion) and the external terminal 40 are two surfaces of the pad portion 20 (the first). 2 One of the external terminals 40 is fixed to the main pad portion 21), and one of the external terminals 40 is fixed to the surface of the pad portion 30 (third main pad portion 31) by using a conductive bonding material H such as solder. Has been done.

The surface mount type electronic component 5 has a smaller surface area than the surface mount type piezoelectric oscillator 4, and is composed of, for example, a chip capacitor, and has two external terminals 50 on the outer surface at both ends in the long side direction (see FIG. 3). ). In the lead-type piezoelectric oscillator 100 shown in FIGS. 3 and 4, the external terminal 50 of the surface mount type electronic component 5 faces the mounting surface (one main surface side of the front and back main surfaces) of the pad portions 10 and 20 (the external terminal 50 faces the surface mount type electronic component 5). It is mounted in a state of facing each other. In such a state, in the lead type piezoelectric oscillator 100, the surface of the pad portion 10 (first sub pad portion 13) and one of the external terminals 50 are on the surface of the pad portion 20 (second sub pad portion 22) of the external terminal 50. One is fixed and connected by using a conductive bonding material H such as solder.

That is, in the chip capacitor (surface-mounted electronic component 5) of the present embodiment, a portion electrically connected to an external terminal for inputting the power supply voltage of the integrated circuit element 64 of the surface-mounted piezoelectric oscillator 4 and an integrated circuit. The element 64 is connected in parallel with the external terminal for grounding and the portion electrically connected in a state of being extremely close to each other. Therefore, when functioning as a bypass capacitor, the effect of removing noise from an external power source can be enhanced. Further, in the case of an IC using a CMOS oscillation circuit as in this embodiment, by interposing a bypass capacitor, even if the potential supplied to the IC changes suddenly, it can be supplemented by the electric charge stored in the bypass capacitor. Therefore, it is possible to suppress an abnormality in the output waveform of the oscillator.

In the lead-type piezoelectric oscillator 100 shown in FIGS. 1 and 3, two external terminals 40 (power supply terminal and output control terminal) are commonly connected to the surface of the pad portion 10 to input a power supply voltage. Further, one external terminal 40 (ground terminal) is connected to the surface of the pad portion 20, and one external terminal 40 (output terminal) is connected to the surface of the pad portion 30. As a result, the lead terminal 1 of the lead-type piezoelectric oscillator 100 functions as a power supply terminal, the lead terminal 2 of the lead-type piezoelectric oscillator 100 functions as a ground terminal, and the lead terminal 3 of the lead-type piezoelectric oscillator 100 functions as an output terminal. .. However, in the present invention, the number of the pad portions, the number of the lead terminals, and the connection state between the pad portions 10, 20, 30 and the external terminal 40 are not limited to those shown in FIGS. 2 and 3. The lead type piezoelectric oscillator 100 can be appropriately changed according to the specifications.

Further, in the present embodiment, as the conductive bonding material H for electrically and mechanically bonding the pad portions 10, 20, 30 and the external terminal 40 or the external terminal 50, a solder material that can be firmly bonded at low cost is disclosed. However, the material is not limited to these materials, and a conductive adhesive may be used, or FCB using Au bumps may be used.

As shown in FIGS. 2 and 3, the lead terminals 1, 2 and 3 have a narrow pitch portion where the pitch between adjacent lead terminals is narrow (a portion indicated by region D1 in the figure) and a pitch between adjacent lead terminals. Each has a wide wide pitch portion (a portion shown by region D3 in the figure). The narrow pitch portion is arranged on the base end side (pad portion 10, 20, 30 side) of each of the lead terminals 1, 2, and 3 with respect to the wide pitch portion. In the lead type piezoelectric oscillator 100 shown in FIG. 1, in order to provide the narrow pitch portion and the wide pitch portion, the lead terminal 1 and the lead terminal 3 are arranged between the narrow pitch portion and the wide pitch portion. The oscillated portion (the portion indicated by the region D2 in the figure) is composed of an oblique portion that is separated from the lead terminal 2 from the proximal end side toward the distal end side.

The pitch of the lead terminals 1, 2 and 3 (the dimension of the gap between the lead terminals 1, 2 and 3 in the X-axis direction) is the surface mount type piezoelectric oscillator 4 mounted on the pad portions 10, 20 and 30. It is appropriately set according to the specifications (for example, the external dimensions, the dimensions of the external terminals, etc.) and the specifications of the wiring board 7 (for example, the spacing between the through holes 71 to 73, etc.).

According to the embodiment of the present invention, the surface mount type piezoelectric oscillator 4 and the surface mount type electronic component 5 are integrally attached to the lead terminals 1, 2, and 3 in an effective state, whereby the characteristics are improved and the reliability is higher. A high lead type piezoelectric oscillator 100 can be provided.

In the above embodiment, the narrow portions 16 and 23 in which the width of the lead terminal is narrowed are configured as the mechanically weak portions between the main pad portion and the sub pad portion, but the configuration also includes a through hole. Often, it may be configured by a thin portion in which the thickness of the lead terminal is partially reduced. Further, the narrow portion 16 and the narrow portion 23 are formed corresponding to the portions of the surface mount type electronic component 5 close to the two external terminals 50 and 50, respectively, but only one of them is formed. There may be.

Further, in the above embodiment, the one equipped with only one surface mount type electronic component 5 is disclosed, but the present invention is not limited to these and can be applied to the one equipped with a plurality of surface mount type electronic components. As the surface mount type electronic component 5, a capacitor is taken as an example, but if the characteristics of the surface mount type piezoelectric oscillator 4 such as a resistor and a coil can be improved, the present invention is not limited to this, and a plurality of surface mount type electronic components are mounted. It can also be applied to things.

Further, in the above embodiment, an example is obtained in which an R-processed portion is formed at a corner portion which is a connection portion of a narrow portion of the lead terminal 1 and the lead terminal 2, but as shown in FIG. 7, the lead terminal 1 and the lead terminal 1 have an R-processed portion. The lead terminal 2 and the lead terminal 3 may have an R-processed portion or a C-plane processed portion formed at all the corner portions thereof. In the lead terminal 1 of the present embodiment, a narrow portion is not formed between the first main pad portion (12 of the first main pad portion) and the first sub pad portion 13. As an example. In the present invention, even if only the narrow portion 23 of the lead terminal 2 is configured (a region having a weak mechanical strength is configured in only one of the pair of lead terminals) as in the present invention, the lead terminal 1 and the lead are connected. It is possible to function as a stress absorbing part by relaxing the thermal stress in the terminal 2 and mechanically deforming the lead terminal.

It should be noted that the present invention can be carried out in various other forms without departing from its spirit, gist or main characteristics. Therefore, the above examples are merely exemplary in all respects and should not be construed in a limited way. The scope of the present invention is shown by the scope of claims, and is not bound by the text of the specification. Further, all modifications and modifications belonging to the equivalent scope of the claims are within the scope of the present invention.

The present invention can be applied to a piezoelectric oscillating oscillator with a lead.

1 1st lead terminal 10 1st pad part 11 1st main pad part 12 1st main pad part 2 13 1st sub pad part 14 notch 15 1st external connection part 2 2nd lead terminal 20 2nd pad Part 21 2nd main pad part 22 2nd sub pad part 25 2nd external connection part 3 3rd lead terminal 30 3rd pad part 31 3rd main pad part 35 3rd external connection part 4 Surface mount type piezoelectric oscillator 40 External terminal 5 Surface mount type electronic component 50 External terminal 6 Resin package part 7 Wiring board 100 Lead type piezoelectric oscillator H Conductive bonding material

Claims (6)

A plurality of lead terminals having a plurality of pad portions formed at one end and an external connection portion formed at the other end.
It is equipped with a surface mount type piezoelectric oscillator in which a plurality of external terminals are formed on the outer surface, and a part of the plurality of pad portions and the plurality of external terminals are conductively bonded.
A surface mount type electron that is electrically connected to the surface mount type piezoelectric oscillator by forming a plurality of external terminals on the outer surface and conducting a conductive bond between a part of the plurality of pad portions and the plurality of external terminals. Have parts,
A lead-type piezoelectric oscillator characterized in that a resin package portion that covers the pad portions of the plurality of lead terminals, the surface-mounted piezoelectric oscillator, and the surface-mounted electronic component is formed. The read-type piezoelectric oscillator according to claim 1.
The surface mount type electronic component has a smaller surface area than the surface mount type piezoelectric oscillator.
The above multiple pad parts
A main pad portion that is conductively bonded to a plurality of external terminals of the surface mount type piezoelectric oscillator,
A sub-pad portion that is conductively bonded to a plurality of external terminals of the surface mount type electronic component,
A lead-type piezoelectric oscillator formed between the main pad portion and the sub pad portion, wherein a region having a weaker mechanical strength than the main pad portion and the sub pad portion is formed. The read-type piezoelectric oscillator according to claim 1 or 2.
The surface mount type electronic component has a smaller number of external terminals than the surface mount type piezoelectric oscillator.
The above multiple pad parts
A main pad portion that is conductively bonded to a plurality of external terminals of the surface mount type piezoelectric oscillator,
A sub-pad portion that is conductively bonded to a plurality of external terminals of the surface mount type electronic component and has a smaller number of pad portions than the main pad portion.
A lead-type piezoelectric oscillator formed between the main pad portion and the sub pad portion, wherein a region having a weaker mechanical strength than the main pad portion and the sub pad portion is formed. The read-type piezoelectric oscillator according to any one of claims 1 to 3.
A lead-type piezoelectric oscillator, wherein a region of weak mechanical strength of the lead terminal is formed by a narrow portion having a narrow width on the main surface of the pad portion of the lead terminal. The lead-type piezoelectric oscillator according to claim 4.
A lead-type piezoelectric oscillator characterized in that an R-processed portion is formed at a corner portion that is a connection portion of the narrow portion of the lead terminal. The read-type piezoelectric oscillator according to any one of claims 1 to 5.
A lead-type piezoelectric oscillator characterized in that the surface-mounted electronic component is a capacitor.

Images