JP3924463B2 - Surface mount electronic components - Google Patents

Surface mount electronic components Download PDF

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Publication number
JP3924463B2
JP3924463B2 JP2001392933A JP2001392933A JP3924463B2 JP 3924463 B2 JP3924463 B2 JP 3924463B2 JP 2001392933 A JP2001392933 A JP 2001392933A JP 2001392933 A JP2001392933 A JP 2001392933A JP 3924463 B2 JP3924463 B2 JP 3924463B2
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electronic component
circuit board
component element
shield case
heat
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JP2003197838A (en
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忠 村上
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品素子を搭載した表面実装型電子部品に関するものである。
【０００２】
【従来の技術】
近年における各種の電子機器に対しては小型化や薄型化・高機能化・低コスト化等の要求が絶えることがない。それらの要求を実現するために、電子機器に用いられる表面実装型電子部品に対しても同様に小型化・薄型化・高機能化・低コスト化の検討が急速に押し進められている。その中で、表面実装型電子部品は、電子機器のマザーボードへの実装性において、高密度化の効果が大きいため特に小型化が求められる用途において主流となっているものである。
【０００３】
かかる表面実装型電子部品の断面図を図４に示す。図４において、回路基板４２の表面側にはコンデンサなどのチップ部品４３を搭載し、回路基板４２に形成されたキャビティ７２内にはＩＣなどの電子部品素子４１を搭載して封止樹脂７１により封止され、回路基板４２と側面で固定したシールドケース４５により保護されている。回路基板４２は、絶縁層４２ａ〜４２ｆの積層部品であり、下面若しくは側面には端子電極４６、内部にはビアホール導体４９などの内部導体が形成されている。電子部品素子４１は、ボンディングワイヤ４８によって回路基板４２と電気的に接続し、樹脂７１により封止されている。
【０００４】
一方、近年においては表面実装型電子部品にも多くの機能が求められており、ＳＡＷ素子などのフィルタ特性のある電子部品素子を搭載したものが製品化されている。このような表面実装型電子部品の断面図を図5に示す。
【０００５】
図５において、回路基板５２の上面にはコンデンサなどのチップ部品５３とＳＡＷ素子などの電子部品素子５４が搭載され、シールドケース５５により保護されている。電子部品素子５４は回路基板５２に形成されたキャビティ７３に収容され、ボンディングワイヤ５８により回路基板５２と接続され、蓋体５７により気密封止されている。
【０００６】
【発明が解決しようとする課題】
表面実装型電子部品を組合せることで、さらなる高機能化と低コスト化が実現できる。前出した二つの表面実装型電子部品を組合せた構成についても検討が進められている。
【０００７】
ところが、これら二つの表面実装型電子部品を組合せた構造は、次の２つの特性が対立するため、実現が困難である。
【０００８】
１つには、ＩＣなどの電子部品素子４１はその動作時に熱を発生することである。その発生する熱が電子部品素子４１にたまると電子部品素子４１の温度が上昇し、動作効率が悪くなってしまう。従来は、発生する熱をビアホール導体４９で吸収し基板に熱を放熱することにより、電子部品素子４１の温度が上昇するのを防いでいた。
【０００９】
２つには、ＳＡＷ素子などの電子部品素子５４は、熱が加えられると通過特性が変動することである。これは、ＳＡＷ素子などの電子部品素子５４は形状の変化によりその特性が変動するためである。ＳＡＷ素子などの電子部品素子５４は、固定している回路基板５２とそれぞれの熱膨張係数が異なるために、熱が加えられたときに熱膨張差が生じ、微小な変形が起きる。この変形によって、電子部品素子５４に反りなどが発生し、特性を変動させてしまう。また、ＳＡＷ素子などの電子部品素子５４は表面波振動する面が空間にある必要があり、気密性の高い金属製の蓋体５７を溶接することで封止している。また、回路基板５２と蓋体５７の熱膨張差により変形する可能性も考えられる。封止には気密性が求められるため、回路基板５２の熱膨張に追従できる樹脂封止などは使えない。
【００１０】
以上のように、ＩＣなどの電子部品素子とＳＡＷ素子などの電子部品素子を組合せた構成については、一方から発生する熱が、他方の特性を変動させるため、実現が困難であった。
【００１１】
本発明は上述の課題に鑑みて案出されたものであり、その目的は、発熱性が大きい電子部品素子と熱により電気特性が変動する電子部品素子を同じ回路基板に用いても、小型で充分な接合強度が得られ、すぐれた特性を持つ表面実装型電子部品を提供するものである。
【００１２】
【課題を解決するための手段】
以上の問題を解決するために請求項１記載の発明は、回路基板と、該回路基板の上面に搭載した発熱性が大きい第１の電子部品素子と、前記回路基板の上面又は下面に搭載した熱により電気特性が変動する第２の電子部品素子と、前記回路基板の下面に形成した、マザーボードと接合する複数の端子電極と、前記回路基板の上面を覆うキャップ部を有するとともに、該キャップ部の内面と前記第１の電子部品素子とを接合したシールドケースとから成る表面実装型部品において、前記シールドケースは前記キャップ部から前記回路基板の側面に対向するように延出した脚部を有しており、前記回路基板の側面と前記シールドケースの脚部の間に間隙が形成されており、前記脚部の先端が前記マザーボードに接合可能に形成されていることを特徴とする。
【００１３】
さらに請求項２記載の発明では、請求項１記載の発明において、前記第１の電子部品素子は前記回路基板の上面にフェイスダウンボンディングにより接合して成ることを特徴とする。
【００１４】
【作用】
本発明の請求項１によれば回路基板の上面を覆うシールドケースのキャップ部内面に発熱性の大きい第１の電子部品素子を接合している。この構造であれば、第１の電子部品素子から発生した熱は、キャップ部の内面からシールドケース全体に伝わって外部に放熱され、第１の電子部品素子の温度の上昇が抑えられる。また、回路基板の側面とシールドケースの脚部の間に間隙が形成されている。この構造であれば、第１の電子部品素子からシールドケースに伝わった熱が回路基板に伝えられにくいので、第２の電子部品素子は温度の上昇がさらに抑えられ、電気特性の変動は少なくなる。
【００１５】
また、シールドケースはキャップ部から回路基板の側面に対向するように延出した脚部を有しており、回路基板の側面とシールドケースの脚部の間に間隙が形成されており、脚部の先端がマザーボードに接合可能に形成されている。この構造であれば、複数の端子電極とシールドケースの脚部とにより接合強度を高めることができる。しかも、シールドケースに伝わった熱は、マザーボードと接合する半田にも伝熱することができるとともに、回路基板に伝えられにくいので、シールドケースの温度の上昇が抑えられる。このため、第１の電子部品素子から発生する熱はさらにシールドケースに伝わりやすくなり、回路基板へは熱が伝わりにくい。従って、回路基板自体の温度上昇が抑えられ、第２の電子部品素子に熱が伝わりにくいので電気特性の変動が少ない。
【００１６】
また本発明の請求項２によれば、第１の電子部品は回路基板の上面にフェイスダウンボンディングされている。この構造であれば、第１の電子部品とシールドケースは隣接するので、第１の電子部品から発生する熱は、効率よくシールドケースに伝えられる。
【００１７】
さらに、第１の電子部品と回路基板を電気的に接合するバンプは、回路基板の下面に形成されている複数の端子電極とシールドケースの脚部の先端がマザーボードに接合されることにより、保持力が強化されている。
【００１９】
【発明の実施の形態】
本発明の実施の形態を、図を用いて説明する。図１は本発明の表面実装型電子部品の外観斜視図であり、図２は本発明の表面実装型電子部品をマザーボードに実装した断面図である。
【００２０】
表面実装型電子部品１０は、回路基板２の上面に電子部品素子１とチップ部品３が搭載され、電子部品素子４は回路基板２の上面に形成されたキャビティ２４に搭載収納されて蓋体７により気密封止されている。そして、シールドケース５により、回路基板２の上面を覆っている。個々の部品について以下に詳説する。
【００２１】
回路基板２は、絶縁層２ａ〜２ｆが積層された、高い気密性でパッケージングができるセラミック多層基板であり、不図示であるが所望の配線を内蔵することで実装密度を高めることができる。内蔵配線には主としてタングステン（Ｗ）やモリブデン（Ｍｏ）などが使われてきたが、最近では気密性が高い低温焼成セラミックスが出現し、銀（Ａｇ）や銅（Ｃｕ）などの低インピーダンス材料も使われている。回路基板２の下面には複数の端子電極６が形成され、マザーボード２２と半田２１を介して接合される。また、端子電極６の上面は防錆や半田濡れ性を考慮してメッキ処理される。このようなメッキ処理は金（Ａｕ）メッキが一般的であり、例えば、金（Ａｕ）メッキの下にニッケル（Ｎｉ）などの中間メッキを形成することが望ましい。
【００２２】
電子部品素子１は、発熱性が大きいＩＣなどの半導体素子であり、材料はＳｉＯ2やＧａＡｓなどの基板にアルミニウム（Ａｌ）などの配線が形成され、電気信号の増幅回路などに用いられ複数のトランジスタで構成されている。第１の電子部品素子１はバンプ２３によって、回路基板２の上面にフェイスダウンボンディングされている。また、電子部品素子１と回路基板２との間にアンダーフィル樹脂２４を形成して接合力を強化している。
【００２３】
電子部品素子４は、熱により電気特性が変動するＳＡＷ素子などの圧電振動素子であり、リチウムタンタレート（ＬｉＴａＯ3）などの圧電基板の表面にアルミニウム（Ａｌ）などの櫛歯電極が形成されている。そして、圧電振動素子の櫛歯電極形成面に特定の共振周波数で表面波振動することで共振器を構成している。ＳＡＷ素子は、表面波が超音波振動であるため、電磁波に比べて非常に小型の共振器にすることができる。水蒸気等により周波数特性が変動するので、特に気密性が求められる。そのため、回路基板２に形成されたキャビティ２４に搭載され、蓋体７により気密封止している。そして、回路基板２とボンディングワイヤ８により電気的に接合されている。
【００２４】
蓋体７は、熱膨張係数が回路基板２の熱膨張係数に近似する材料が選択され、平板形状となっている。例えば、回路基板２が低温焼成セラミックス（熱膨張係数が９〜１１×１０-6／℃）であれば、蓋体７は熱膨張係数が８×１０-6／℃の４５アロイなどが用いられる。また、蓋体７の内面側の全面または外周部には、ニッケル（Ｎｉ）メッキ、金（Ａｕ）メッキで被覆され、封止するためのろう付けが可能となるようにしている。封止工程は、酸素濃度２０ｐｐｍ以下に管理されたＮ2チャンバー内で行われ、表面波の特性を信頼性的に保持しつつ気密封止される。
【００２５】
シールドケース５は、キャップ部５ａと脚部５ｂで構成している。キャップ部５ａは回路基板２の上面を覆い、表面実装型電子部品１０を物理的に保護するだけでなく、電磁波を遮蔽する作用を有する。脚部５ｂはキャップ部から回路基板２の側面に対向するように延出し、脚部５ｂの先端がマザーボードと２２と半田２１を介して接合される。そして、シールドケース５は電磁波を遮蔽するため金属材料であるが、特にりん青銅などが使われる。また、表面には、半田濡れのためにスズ（Ｓｎ）メッキなどが形成されている。
【００２６】
かくして、本発明の表面実装型電子部品１０によれば、シールドケース５の回路基板２の上面を覆うキャップ５ａ部の内面と発熱性の大きい第１の電子部品素子１とを接合している。第１の電子部品素子１は上述のように電気信号の増幅に用いられる複数のトランジスタが集まったＩＣであるので、その動作とともに熱が発生する。そして、この熱により第１の電子部品自体の温度を上昇させるため、その動作の効率を著しく劣化させてしまう。しかし、本発明の構造では、第１の電子部品素子１から発生した熱は、熱伝導性の良いシールドケース５のキャップ部５ａの内面から吸収し、シールドケース５全体に熱が伝わり、第１の電子部品素子１の温度の上昇を抑えている。
【００２７】
一方、この構造であれば、第１の電子部品素子１は、発生する熱がシールドケース５に多くを吸収され回路基板２内の、温度の上昇が低減される。そして、回路基板２内に伝熱する熱量が少なくなり、回路基板２は温度の上昇が抑えられるので、第２の電子部品素子４に熱が伝わりにくくなる。従って、第２の電子部品素子４は温度の上昇が低減され、電気特性の変動は少なくなる。
【００２８】
さらに、シールドケース５から回路基板２の側面に対向するように延出した脚部５ｂの先端がマザーボード２２と半田２１によりに接合している。この構造であれば、第１の電子部品素子１からシールドケース５に伝わった熱は、マザーボード２２と接合する半田２１に伝熱することができる。そして、その熱は、マザーボード２２上面の電極に伝熱するので、シールドケース５の温度は大きく上昇することがない。従って、第１の電子部品素子１は発生する熱がよりシールドケース５に吸収されやすくなり、動作の効率が保持される。そして、第２の電子部品素子４は温度の上昇がより低減され、電気特性の変動がより少なくなる。
【００２９】
また、第１の電子部品素子１とシールドケース５は直接接合するので、第１の電子部品１から発生する熱は、効率よくシールドケース５に伝えられる。
【００３０】
さらに、第１の電子部品１と回路基板２を電気的に接合するバンプ２３は、アンダーフィル樹脂２４が形成されながら接合の信頼性が不安定である。この構造であれば、回路基板２の下面に形成されている複数の端子電極６とシールドケース５の脚部５ｂの先端がマザーボード２２と半田２１により接合されるので、間接的に回路基板２と第１の電子部品１の保持力が強化されている。
【００３１】
さらに、シールドケース５との接合する面にグランド電極が形成されていれば、シールドケース５をグランド電位とすることで第１の電子部品１の接地性が向上する。
【００３２】
また、回路基板２の側面とシールドケース５の立脚部の間に間隙が形成されている。この間隙により、回路基板２とシールドケース５の熱は分離される。そして、シールドケース５の脚部５ｂのみでマザーボード２２と半田２１により接合できる。この構造であれば、シールドケース５及び半田２１の熱が側面から回路基板２に伝えられることを防ぐことができる。
【００３３】
次に本発明の他の実施の形態を図３を用いて説明する。
図３は本発明の表面実装型電子部品をマザーボードに実装した他の断面図である。図１の構成と異なるところは、第２の電子部品素子４の回路基板２への搭載は上面に搭載する構造に代えて、回路基板２の下面に搭載することにある。即ち、回路基板２の下面のデッドスペースにキャビティ３４を形成し、電子部品素子４を搭載している。この構造であれば、上面に集中していた部品の搭載を、一部下面に搭載できるのでさらに小型の表面実装型電子部品が構成できる。
【００３４】
【発明の効果】
以上のように本発明によれば、発熱性が大きい電子部品素子と熱により電気特性が変動する電子部品素子を同じ回路基板に搭載しても、発生する熱をシールドケースに吸収して回路基板の温度の上昇を低減することができるとともに、小型で接合強度が高くすぐれた特性を持つ表面実装型電子部品を提供するものである。
【図面の簡単な説明】
【図１】本発明の表面実装型電子部品の外観斜視図である。
【図２】本発明の表面実装型電子部品をマザーボードに実装した断面図である。
【図３】本発明の表面実装型電子部品をマザーボードに実装した他の断面図である。
【図４】従来の表面実装型電子部品の断面図である。
【図５】従来の表面実装型電子部品の他の断面図である。
【符号の説明】
１、４１・・・第１の電子部品素子
２ａ〜２ｆ・・・絶縁層
２、４２、５２・・・回路基板
３、４３、５３・・・チップ部品
４、５４・・・第２の電子部品素子
５、４５、５５・・・シールドケース
５ａ・・・キャップ部
５ｂ・・・脚部
６、４６、５６・・・端子電極
７、５７・・・蓋体
８、４８、５８・・・ボンディングワイヤ
４９・・・ビアホール導体
２１、３１・・・半田
２２、３２・・・マザーボード
２３、３３・・・バンプ
２４、３４、７２、７３・・・キャビティ
２６、３６・・・アンダーフィル樹脂
７１・・・封止樹脂
１０・・・表面実装型電子部品[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface mount electronic component on which an electronic component element is mounted.
[0002]
[Prior art]
In recent years, various electronic devices have been constantly demanded for reduction in size, thickness, functionality, and cost. In order to realize these requirements, studies on miniaturization, thinning, high functionality, and low cost are being rapidly promoted for surface mount electronic components used in electronic devices. Among them, surface mount type electronic components are mainly used in applications where downsizing is particularly required because the effect of high density is large in the mountability of electronic devices to a mother board.
[0003]
A cross-sectional view of such a surface mount electronic component is shown in FIG. In FIG. 4, a chip component 43 such as a capacitor is mounted on the surface side of the circuit board 42, and an electronic component element 41 such as an IC is mounted in a cavity 72 formed in the circuit board 42, and is sealed by a sealing resin 71. It is sealed and protected by a shield case 45 fixed to the circuit board 42 on the side surface. The circuit board 42 is a laminated part of insulating layers 42a to 42f. A terminal electrode 46 is formed on a lower surface or a side surface, and an internal conductor such as a via-hole conductor 49 is formed inside. The electronic component element 41 is electrically connected to the circuit board 42 by a bonding wire 48 and is sealed with a resin 71.
[0004]
On the other hand, in recent years, many functions are also required for surface-mounted electronic components, and products equipped with electronic component elements having filter characteristics such as SAW elements have been commercialized. A cross-sectional view of such a surface mount electronic component is shown in FIG.
[0005]
In FIG. 5, a chip component 53 such as a capacitor and an electronic component element 54 such as a SAW element are mounted on the upper surface of a circuit board 52 and protected by a shield case 55. The electronic component element 54 is accommodated in a cavity 73 formed in the circuit board 52, connected to the circuit board 52 by a bonding wire 58, and hermetically sealed by a lid 57.
[0006]
[Problems to be solved by the invention]
By combining surface mount electronic components, higher functionality and lower cost can be realized. Studies are also underway on a combination of the two surface mount electronic components described above.
[0007]
However, a structure in which these two surface mount electronic components are combined is difficult to realize because the following two characteristics conflict.
[0008]
For one, the electronic component element 41 such as an IC generates heat during its operation. When the generated heat accumulates in the electronic component element 41, the temperature of the electronic component element 41 rises and the operation efficiency deteriorates. Conventionally, the generated heat is absorbed by the via-hole conductor 49 and the heat is dissipated to the substrate, thereby preventing the temperature of the electronic component element 41 from rising.
[0009]
Second, the electronic component element 54 such as a SAW element changes its pass characteristic when heat is applied. This is because the characteristics of the electronic component element 54 such as a SAW element vary due to a change in shape. Since the electronic component element 54 such as the SAW element has a different thermal expansion coefficient from the fixed circuit board 52, a difference in thermal expansion occurs when heat is applied, and minute deformation occurs. Due to this deformation, a warp or the like occurs in the electronic component element 54 and the characteristics are changed. The electronic component element 54 such as a SAW element needs to have a surface that vibrates in a surface wave in the space, and is sealed by welding a highly airtight metal lid 57. Further, there is a possibility that the circuit board 52 and the lid 57 are deformed due to a difference in thermal expansion. Since sealing requires airtightness, resin sealing that can follow the thermal expansion of the circuit board 52 cannot be used.
[0010]
As described above, it is difficult to realize a configuration in which an electronic component element such as an IC and an electronic component element such as a SAW element are combined because heat generated from one side changes the other characteristic.
[0011]
The present invention has been devised in view of the above-described problems. The purpose of the present invention is to reduce the size even if an electronic component element having a large exothermic property and an electronic component element whose electric characteristics vary due to heat are used on the same circuit board. The present invention provides a surface mount type electronic component that has sufficient bonding strength and excellent characteristics.
[0012]
[Means for Solving the Problems]
In order to solve the above problems, the invention according to claim 1 is provided with a circuit board, a first electronic component element having high heat generation mounted on the upper surface of the circuit board, and mounted on the upper or lower surface of the circuit board. A second electronic component element whose electrical characteristics fluctuate due to heat; a plurality of terminal electrodes formed on the lower surface of the circuit board; and a cap portion that covers the upper surface of the circuit board; in part inner surface and the surface mount components consisting of said first electronic element bonding the shield case, the shield case legs extending so as to face a side surface of said circuit board from said cap portion has, JP said being a gap between the legs of the the side surface of the circuit board shield case formed, the tips of the legs are bonded can form on the motherboard To.
[0013]
Furthermore, the invention according to claim 2 is characterized in that, in the invention according to claim 1, the first electronic component element is joined to the upper surface of the circuit board by face-down bonding.
[0014]
[ Action]
According to the first aspect of the present invention, the first electronic component element having high heat generation is joined to the inner surface of the cap portion of the shield case covering the upper surface of the circuit board. With this structure, the heat generated from the first electronic component element is transmitted from the inner surface of the cap portion to the entire shield case and dissipated to the outside, and the temperature rise of the first electronic component element is suppressed. A gap is formed between the side surface of the circuit board and the leg of the shield case. With this structure, the heat transmitted from the first electronic component element to the shield case is difficult to be transmitted to the circuit board, so that the temperature rise of the second electronic component element is further suppressed, and fluctuations in electrical characteristics are reduced. .
[0015]
Further, the shield case has a leg portion extending so as to face the side surface of the circuit board from the cap portion, and a gap is formed between the legs of the side surface of the circuit board and the shield case, the legs The tip of is formed so that it can be joined to the motherboard. With this structure, the bonding strength can be increased by the plurality of terminal electrodes and the legs of the shield case. In addition, the heat transferred to the shield case can be transferred to the solder joined to the mother board, and is difficult to be transferred to the circuit board, so that the temperature rise of the shield case can be suppressed. For this reason, the heat generated from the first electronic component element is more easily transmitted to the shield case, and the heat is not easily transmitted to the circuit board. Therefore, the temperature rise of the circuit board itself is suppressed, and heat is not easily transmitted to the second electronic component element, so that the variation in electrical characteristics is small.
[0016]
According to claim 2 of the present invention, the first electronic component is face-down bonded to the upper surface of the circuit board. With this structure, since the first electronic component and the shield case are adjacent to each other, the heat generated from the first electronic component is efficiently transmitted to the shield case.
[0017]
Furthermore, the bump for electrically joining the first electronic component and the circuit board is retained by joining the terminal electrodes formed on the lower surface of the circuit board and the tips of the legs of the shield case to the motherboard. Power is strengthened.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described with reference to the drawings. 1 is an external perspective view of a surface mount electronic device of the present invention, FIG 2 is a cross-sectional view of the table result, surface mount type electronic component mounted on a mother board of the present invention.
[0020]
In the surface-mount type electronic component 10, the electronic component element 1 and the chip component 3 are mounted on the upper surface of the circuit board 2, and the electronic component element 4 is mounted and accommodated in the cavity 24 formed on the upper surface of the circuit board 2. Is hermetically sealed. The shield case 5 covers the upper surface of the circuit board 2. The individual parts are described in detail below.
[0021]
Circuit board 2, the insulating layer 2a~2f are stacked, a ceramic multilayer substrate capable packaged with high airtightness, although not shown it is possible to increase the packing density by incorporating a desired wiring. Tungsten (W), molybdenum (Mo), etc. have been mainly used for the built-in wiring, but recently low-temperature fired ceramics with high airtightness have appeared , and low impedance materials such as silver (Ag) and copper (Cu) are also available. It is used. A plurality of terminal electrodes 6 are formed on the lower surface of the circuit board 2 and joined to the mother board 22 via solder 21. The upper surface of the terminal electrode 6 are plating in consideration of rust and solder wettability. Such a plating process is generally gold (Au) plating. For example, it is desirable to form an intermediate plating such as nickel (Ni) under the gold (Au) plating.
[0022]
The electronic component element 1 is a semiconductor element such as an IC having a large heat generation property. The material is a wiring made of aluminum (Al) or the like formed on a substrate such as SiO 2 or GaAs, and is used for an electric signal amplification circuit or the like. It is composed of transistors. The first electronic component element 1 is face-down bonded to the upper surface of the circuit board 2 by bumps 23. In addition, an underfill resin 24 is formed between the electronic component element 1 and the circuit board 2 to strengthen the bonding force.
[0023]
The electronic component element 4 is a piezoelectric vibration element such as a SAW element whose electrical characteristics fluctuate due to heat, and a comb-like electrode such as aluminum (Al) is formed on the surface of a piezoelectric substrate such as lithium tantalate (LiTaO 3 ). Yes. And the resonator is comprised by carrying out the surface wave vibration with the specific resonance frequency on the comb electrode formation surface of a piezoelectric vibration element. Since the SAW element is an ultrasonic vibration, the SAW element can be a very small resonator compared to the electromagnetic wave. Since the frequency characteristics fluctuate due to water vapor or the like, particularly airtightness is required. Therefore, it is mounted in the cavity 24 formed on the circuit board 2 and hermetically sealed by the lid 7. The circuit board 2 and the bonding wire 8 are electrically joined.
[0024]
The lid body 7 has a flat plate shape selected from materials whose thermal expansion coefficient approximates the thermal expansion coefficient of the circuit board 2. For example, if the circuit board 2 is a low-temperature fired ceramic (thermal expansion coefficient is 9 to 11 × 10 −6 / ° C.), the lid 7 is made of 45 alloy having a thermal expansion coefficient of 8 × 10 −6 / ° C. . Further, the entire inner surface or outer peripheral portion of the lid 7 is coated with nickel (Ni) plating or gold (Au) plating so that brazing for sealing is possible. The sealing step is performed in an N 2 chamber controlled to an oxygen concentration of 20 ppm or less, and hermetically sealed while maintaining the surface wave characteristics in a reliable manner.
[0025]
The shield case 5 includes a cap part 5a and a leg part 5b. The cap part 5a covers the upper surface of the circuit board 2 and not only physically protects the surface-mounted electronic component 10, but also functions to shield electromagnetic waves. The leg portion 5 b extends from the cap portion so as to face the side surface of the circuit board 2, and the tip of the leg portion 5 b is joined to the mother board 22 and the solder 21. The shield case 5 is a metal material for shielding electromagnetic waves, and phosphor bronze is particularly used. Further, tin (Sn) plating or the like is formed on the surface for solder wetting.
[0026]
Thus, according to the surface-mounted electronic component 10 of the present invention, the inner surface of the cap 5a portion that covers the upper surface of the circuit board 2 of the shield case 5 and the first electronic component element 1 having high heat generation are joined. Since the first electronic component element 1 is an IC in which a plurality of transistors used for amplification of electric signals are collected as described above, heat is generated with the operation. And since the temperature of the first electronic component itself is raised by this heat, the efficiency of the operation is remarkably deteriorated. However, in the structure of the present invention, the heat generated from the first electronic component element 1 is absorbed from the inner surface of the cap portion 5a of the shield case 5 having good thermal conductivity, and the heat is transmitted to the entire shield case 5 so that the first An increase in the temperature of the electronic component element 1 is suppressed.
[0027]
On the other hand, with this structure, the first electronic component element 1 absorbs much of the generated heat in the shield case 5 and the temperature rise in the circuit board 2 is reduced. Then, the amount of heat transferred to the circuit board 2 is reduced, and the temperature rise of the circuit board 2 is suppressed, so that heat is not easily transferred to the second electronic component element 4. Therefore, the temperature rise of the second electronic component element 4 is reduced, and fluctuations in electrical characteristics are reduced.
[0028]
Furthermore, the tips of the leg portions 5 b extending from the shield case 5 so as to face the side surfaces of the circuit board 2 are joined to the mother board 22 and the solder 21. With this structure, the heat transferred from the first electronic component element 1 to the shield case 5 can be transferred to the solder 21 joined to the mother board 22. Then, since the heat is transferred to the electrode on the upper surface of the mother board 22, the temperature of the shield case 5 does not increase greatly. Therefore, the heat generated in the first electronic component element 1 is more easily absorbed by the shield case 5 and the operation efficiency is maintained. In the second electronic component element 4, the temperature rise is further reduced and the variation in electrical characteristics is further reduced.
[0029]
Further, since the first electronic component element 1 and the shield case 5 are directly joined, the heat generated from the first electronic component 1 is efficiently transmitted to the shield case 5.
[0030]
Further, the bump 23 that electrically bonds the first electronic component 1 and the circuit board 2 has unstable bonding reliability while the underfill resin 24 is formed. With this structure, since the plurality of terminal electrodes 6 formed on the lower surface of the circuit board 2 and the tips of the leg portions 5b of the shield case 5 are joined by the mother board 22 and the solder 21, the circuit board 2 is indirectly connected. The holding power of the first electronic component 1 is enhanced.
[0031]
Furthermore, if the ground electrode is formed on the surface to be joined to the shield case 5, the grounding property of the first electronic component 1 is improved by setting the shield case 5 to the ground potential.
[0032]
In addition, a gap is formed between the side surface of the circuit board 2 and the standing leg portion of the shield case 5. The heat of the circuit board 2 and the shield case 5 is separated by this gap. And it can join with the motherboard 22 and the solder 21 only by the leg part 5b of the shield case 5. FIG. With this structure, the heat of the shield case 5 and the solder 21 can be prevented from being transferred to the circuit board 2 from the side surface.
[0033]
Next, another embodiment of the present invention will be described with reference to FIG.
FIG. 3 is another cross-sectional view of the surface mount electronic component of the present invention mounted on a motherboard. The difference from the configuration of FIG. 1 is that the mounting of the second electronic component element 4 on the circuit board 2 is mounted on the lower surface of the circuit board 2 instead of the structure mounted on the upper surface. That is, the cavity 34 is formed in the dead space on the lower surface of the circuit board 2 and the electronic component element 4 is mounted. With this structure, the mounting of components concentrated on the upper surface can be partially mounted on the lower surface, so that a smaller surface mount electronic component can be configured.
[0034]
【The invention's effect】
As described above, according to the present invention, even when an electronic component element having a large exothermic property and an electronic component element whose electrical characteristics fluctuate due to heat are mounted on the same circuit board, the generated heat is absorbed by the shield case and the circuit board It is possible to provide a surface-mounted electronic component that can reduce the temperature rise and has a small size, high bonding strength, and excellent characteristics.
[Brief description of the drawings]
FIG. 1 is an external perspective view of a surface mount electronic component according to the present invention.
FIG. 2 is a cross-sectional view of the surface mount electronic component of the present invention mounted on a motherboard.
FIG. 3 is another cross-sectional view of the surface mount electronic component of the present invention mounted on a motherboard.
FIG. 4 is a cross-sectional view of a conventional surface mount electronic component.
FIG. 5 is another cross-sectional view of a conventional surface mount electronic component.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1, 41 ... 1st electronic component element 2a-2f ... Insulating layer 2, 42, 52 ... Circuit board 3, 43, 53 ... Chip components 4, 54 ... 2nd electronic Component elements 5, 45, 55 ... Shield case 5a ... Cap portion 5b ... Leg portions 6, 46, 56 ... Terminal electrodes 7, 57 ... Cover bodies 8, 48, 58 ... Bonding wire 49 ... via hole conductors 21, 31 ... solder 22, 32 ... motherboard 23, 33 ... bumps 24, 34, 72, 73 ... cavities 26, 36 ... underfill resin 71 ... Seal resin 10 ... Surface mount electronic components

Claims (2)

回路基板と、該回路基板の上面に搭載した発熱性が大きい第１の電子部品素子と、前記回路基板の上面又は下面に搭載した熱により電気特性が変動する第２の電子部品素子と、前記回路基板の下面に形成した、マザーボードと接合する複数の端子電極と、前記回路基板の上面を覆うキャップ部を有するとともに、該キャップ部の内面と前記第１の電子部品素子とを接合したシールドケースとから成る表面実装型部品において、前記シールドケースは前記キャップ部から前記回路基板の側面に対向するように延出した脚部を有しており、前記回路基板の側面と前記シールドケースの脚部の間に間隙が形成されており、前記脚部の先端が前記マザーボードに接合可能に形成されていることを特徴とする表面実装型電子部品。A circuit board, a first electronic component element having a large exothermic property mounted on the upper surface of the circuit board, a second electronic component element whose electrical characteristics fluctuate due to heat mounted on the upper surface or the lower surface of the circuit board, A shield formed on the lower surface of the circuit board, having a plurality of terminal electrodes to be bonded to the mother board, a cap portion covering the upper surface of the circuit board, and bonding the inner surface of the cap portion and the first electronic component element in surface mount component consisting of a casing, the shield case has a leg portion extending so as to face a side surface of said circuit board from said cap portion, the legs of the side surface and the shield case of the circuit board A surface-mount type electronic component characterized in that a gap is formed between the portions, and the tip of the leg portion is formed so as to be connectable to the mother board. 前記第１の電子部品素子は前記回路基板の上面にフェイスダウンボンディングにより接合して成ることを特徴とする請求項１記載の表面実装型電子部品。  2. The surface-mount type electronic component according to claim 1, wherein the first electronic component element is bonded to the upper surface of the circuit board by face-down bonding.
JP2001392933A 2001-12-25 2001-12-25 Surface mount electronic components Expired - Lifetime JP3924463B2 (en)

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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001392933A JP3924463B2 (en) 2001-12-25 2001-12-25 Surface mount electronic components

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JP3924463B2 true JP3924463B2 (en) 2007-06-06

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