JP2022027457A - 電子機器 - Google Patents
電子機器 Download PDFInfo
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- JP2022027457A JP2022027457A JP2021075787A JP2021075787A JP2022027457A JP 2022027457 A JP2022027457 A JP 2022027457A JP 2021075787 A JP2021075787 A JP 2021075787A JP 2021075787 A JP2021075787 A JP 2021075787A JP 2022027457 A JP2022027457 A JP 2022027457A
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- circuit board
- charging interface
- metal
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- 239000002184 metal Substances 0.000 claims abstract description 83
- 239000003990 capacitor Substances 0.000 claims description 15
- 229910052755 nonmetal Inorganic materials 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 9
- 230000001052 transient effect Effects 0.000 claims description 6
- 230000002457 bidirectional effect Effects 0.000 claims description 5
- 230000005855 radiation Effects 0.000 abstract description 12
- 238000010586 diagram Methods 0.000 description 12
- 239000007769 metal material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 101100489713 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND1 gene Proteins 0.000 description 3
- 101100489717 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND2 gene Proteins 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- -1 Polybutylene Polymers 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6464—Means for preventing cross-talk by adding capacitive elements
- H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/005—Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/20—Circuit arrangements or systems for wireless supply or distribution of electric power using microwaves or radio frequency waves
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0042—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction
- H02J7/0044—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction specially adapted for holding portable devices containing batteries
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
- H05K5/0018—Casings, cabinets or drawers for electric apparatus with operator interface units having an electronic display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0067—Devices for protecting against damage from electrostatic discharge
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J2310/00—The network for supplying or distributing electric power characterised by its spatial reach or by the load
- H02J2310/10—The network having a local or delimited stationary reach
- H02J2310/20—The network being internal to a load
- H02J2310/22—The load being a portable electronic device
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/70—Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1006—Non-printed filter
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Power Engineering (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Physics & Mathematics (AREA)
- Telephone Set Structure (AREA)
- Support Of Aerials (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Details Of Aerials (AREA)
Abstract
Description
外部インターフェースが設置されたハウジングと、
前記ハウジング内に設置され、接地金属を含む回路基板と、
前記接地金属と離間して設置された複数の接地パッドが設置されている金属シェルを含み、前記ハウジング内に設置され、前記外部インターフェースと連通する充電インターフェースと、
前記充電インターフェースに結合されるアンテナユニットと、を含む。
前記アンテナユニットは、前記ハウジングの少なくとも一部によって形成される第1の部分を含む。
(付記1)
外部インターフェースが設置されたハウジングと、
前記ハウジング内に設置され、接地金属を含む回路基板と、
前記接地金属と離間して設置された複数の接地パッドが設置されている金属シェルを含み、前記ハウジング内に設置され、前記外部インターフェースと連通する充電インターフェースと、
前記充電インターフェースに結合されるアンテナユニットと、を含む、
ことを特徴とする電子機器。
前記回路基板は、前記接地金属に隣接するブランク領域を含み、前記充電インターフェースは前記ブランク領域に固定される、
ことを特徴とする付記1に記載の電子機器。
前記回路基板の板面方向に沿って、前記接地パッドと前記接地金属との間に隙間が存在する、
ことを特徴とする付記2に記載の電子機器。
前記ブランク領域は、前記接地パッドに固定的に接続される非金属基板を含む、
ことを特徴とする付記2に記載の電子機器。
前記回路基板は、一端が一つの前記接地パッドに接続され、他端が接地されるフィルタユニットをさらに含む、
ことを特徴とする付記1に記載の電子機器。
前記フィルタユニットは、インダクタとコンデンサとを含み、前記インダクタは、一端が前記接地パッドに接続され、他端が前記コンデンサに接続され、前記コンデンサは接地される、
ことを特徴とする付記5に記載の電子機器。
前記回路基板は、一端が前記フィルタユニットと前記接地パッドとの間に接続され、他端が接地される帯電防止ユニットをさらに含む、
ことを特徴とする付記5に記載の電子機器。
前記帯電防止ユニットは、双方向過渡ダイオードを含む、
ことを特徴とする付記7に記載の電子機器。
前記金属シェルの前記外部インターフェースから離れた角部に前記接地パッドが設置され、前記外部インターフェースから離れているとともに、前記金属シェルの角部に位置する1つの前記接地パッドが前記フィルタユニットに接続される、
ことを特徴とする付記5~8のいずれか一つに記載の電子機器。
前記充電インターフェースは、複数のピンと、前記複数のピンを載置する絶縁部材とをさらに含み、前記金属シェルは前記絶縁部材の外側に取り付けられ、前記金属シェルは前記絶縁部材によって前記複数のピンから分離され、前記複数のピンは、前記回路基板に電気的に接続された接地ピンを含み、及び/又は、
前記アンテナユニットは、前記ハウジングの少なくとも一部によって形成される第1の部分を含む、
ことを特徴とする付記1に記載の電子機器。
Claims (10)
- 外部インターフェースが設置されたハウジングと、
前記ハウジング内に設置され、接地金属を含む回路基板と、
前記接地金属と離間して設置された複数の接地パッドが設置されている金属シェルを含み、前記ハウジング内に設置され、前記外部インターフェースと連通する充電インターフェースと、
前記充電インターフェースに結合されるアンテナユニットと、を含む、
ことを特徴とする電子機器。 - 前記回路基板は、前記接地金属に隣接するブランク領域を含み、前記充電インターフェースは前記ブランク領域に固定される、
ことを特徴とする請求項1に記載の電子機器。 - 前記回路基板の板面方向に沿って、前記接地パッドと前記接地金属との間に隙間が存在する、
ことを特徴とする請求項2に記載の電子機器。 - 前記ブランク領域は、前記接地パッドに固定的に接続される非金属基板を含む、
ことを特徴とする請求項2に記載の電子機器。 - 前記回路基板は、一端が一つの前記接地パッドに接続され、他端が接地されるフィルタユニットをさらに含む、
ことを特徴とする請求項1に記載の電子機器。 - 前記フィルタユニットは、インダクタとコンデンサとを含み、前記インダクタは、一端が前記接地パッドに接続され、他端が前記コンデンサに接続され、前記コンデンサは接地される、
ことを特徴とする請求項5に記載の電子機器。 - 前記回路基板は、一端が前記フィルタユニットと前記接地パッドとの間に接続され、他端が接地される帯電防止ユニットをさらに含む、
ことを特徴とする請求項5に記載の電子機器。 - 前記帯電防止ユニットは、双方向過渡ダイオードを含む、
ことを特徴とする請求項7に記載の電子機器。 - 前記金属シェルの前記外部インターフェースから離れた角部に前記接地パッドが設置され、前記外部インターフェースから離れているとともに、前記金属シェルの角部に位置する1つの前記接地パッドが前記フィルタユニットに接続される、
ことを特徴とする請求項5~8のいずれか1項に記載の電子機器。 - 前記充電インターフェースは、複数のピンと、前記複数のピンを載置する絶縁部材とをさらに含み、前記金属シェルは前記絶縁部材の外側に取り付けられ、前記金属シェルは前記絶縁部材によって前記複数のピンから分離され、前記複数のピンは、前記回路基板に電気的に接続された接地ピンを含み、及び/又は、
前記アンテナユニットは、前記ハウジングの少なくとも一部によって形成される第1の部分を含む、
ことを特徴とする請求項1に記載の電子機器。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010751661.3A CN114070904B (zh) | 2020-07-30 | 2020-07-30 | 电子设备 |
CN202010751661.3 | 2020-07-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022027457A true JP2022027457A (ja) | 2022-02-10 |
JP7305701B2 JP7305701B2 (ja) | 2023-07-10 |
Family
ID=75728673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021075787A Active JP7305701B2 (ja) | 2020-07-30 | 2021-04-28 | 電子機器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11659649B2 (ja) |
EP (1) | EP3945712A1 (ja) |
JP (1) | JP7305701B2 (ja) |
KR (1) | KR102554584B1 (ja) |
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US11659649B2 (en) | 2023-05-23 |
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