CN114070904B - 电子设备 - Google Patents
电子设备 Download PDFInfo
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- CN114070904B CN114070904B CN202010751661.3A CN202010751661A CN114070904B CN 114070904 B CN114070904 B CN 114070904B CN 202010751661 A CN202010751661 A CN 202010751661A CN 114070904 B CN114070904 B CN 114070904B
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- 238000001914 filtration Methods 0.000 claims description 17
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- 239000012212 insulator Substances 0.000 claims description 7
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- 230000009286 beneficial effect Effects 0.000 description 4
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- 101100489713 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND1 gene Proteins 0.000 description 3
- 101100489717 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND2 gene Proteins 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 230000002452 interceptive effect Effects 0.000 description 3
- 229910052755 nonmetal Inorganic materials 0.000 description 3
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6464—Means for preventing cross-talk by adding capacitive elements
- H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/005—Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/20—Circuit arrangements or systems for wireless supply or distribution of electric power using microwaves or radio frequency waves
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0042—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction
- H02J7/0044—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction specially adapted for holding portable devices containing batteries
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
- H05K5/0018—Casings, cabinets or drawers for electric apparatus with operator interface units having an electronic display
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0067—Devices for protecting against damage from electrostatic discharge
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J2310/00—The network for supplying or distributing electric power characterised by its spatial reach or by the load
- H02J2310/10—The network having a local or delimited stationary reach
- H02J2310/20—The network being internal to a load
- H02J2310/22—The load being a portable electronic device
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/70—Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1006—Non-printed filter
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
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- Structure Of Printed Boards (AREA)
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Abstract
本公开提供了一种电子设备。电子设备包括:机壳、线路板、充电接口和天线单元。机壳设有外接口。线路板设于机壳内,线路板包括接地金属。充电接口设于机壳内且与外接口连通,充电接口包括:金属外壳,金属外壳设有多个接地焊盘,接地焊盘与接地金属分离设置。天线单元与充电接口耦合。基于充电接口的金属外壳的多个接地焊盘与接地金属分离设置,这等效于增加了天线单元的净空区域,使该电子设备的天线单元具有较好的天线辐射性能。
Description
技术领域
本公开涉及电子设备技术领域,尤其涉及一种电子设备。
背景技术
随着全面屏的发展,手机等电子设备的底部的净空区域逐渐减小,这导致天线单元的辐射效率降低。因此,有必要在不影响全面屏的前提下增加天线单元的净空区域。目前,充电接口的金属外壳与线路板的接地金属连接,这影响靠近充电接口设置的天线单元的净空区域,不利于提升天线单元的天线性能。
发明内容
本公开提供了一种改进的电子设备。
本公开的一个方面提供一种电子设备,所述电子设备包括:
机壳,设有外接口;
线路板,设于所述机壳内,所述线路板包括接地金属;
充电接口,设于所述机壳内且与所述外接口连通,所述充电接口包括:金属外壳,所述金属外壳设有多个接地焊盘,所述接地焊盘与所述接地金属分离设置;以及
天线单元,与所述充电接口耦合。
可选地,所述线路板包括与所述接地金属相邻的空白区域,所述充电接口固定于所述空白区域。
可选地,沿所述线路板的板面方向,所述接地焊盘与所述接地金属之间具有间隙。
可选地,所述空白区域包括非金属基板,所述非金属基板与所述接地焊盘固定连接。
可选地,所述线路板还包括:滤波单元,所述滤波单元的一端与一个所述接地焊盘连接,另一端接地。
可选地,所述滤波单元包括电感和电容,所述电感的一端与所述接地焊盘连接,另一端与所述电容连接,所述电容接地。
可选地,所述线路板还包括:抗静电单元,所述抗静电单元的一端连接至所述滤波单元和所述接地焊盘之间,另一端接地。
可选地,所述抗静电单元包括:双向瞬态二极管。
可选地,所述金属外壳远离所述外接口的角部设有所述接地焊盘,远离所述外接口且位于所述金属外壳的角部的一个所述接地焊盘与所述滤波单元连接。
可选地,所述充电接口还包括多个引脚和承载多个所述引脚的绝缘件,所述金属外壳套装于所述绝缘件外,所述金属外壳通过所述绝缘件与多个所述引脚隔开,多个所述引脚包括与所述线路板电连接的接地引脚;和/或
所述天线单元包括第一部,所述第一部通过所述机壳的至少部分形成。
本公开提供的技术方案至少具有以下有益效果:
通过将充电接口的金属外壳的接地焊盘与线路板的接地金属分离设置,也即使金属外壳的接地焊盘不接地,这相较于金属外壳的接地焊盘与接地金属连接而言,等效于增加了被充电接口占用的天线单元的净空区域,而且充电接口还与天线单元耦合,这使充电接口的金属外壳可以作为天线辐射体,利于提升天线单元的天线性能。
附图说明
图1所示为本公开根据一示例性实施例示出的电子设备的立体结构示意图;
图2所示为本公开根据一示例性实施例示出的电子设备的局部结构示意图;
图3所示为本公开根据一示例性实施例示出的充电接口的结构示意图;
图4所示为本公开根据一示例性实施例示出的充电接口与线路板之间的相对位置示意图;
图5所示为本公开根据一示例性实施例示出的电子设备的局部电路图;
图6所示为本公开根据一示例性实施例示出的线路板的分布示意图;
图7所示为本公开根据一示例性实施例示出的天线单元的频率与辐射效率之间的关系曲线图。
具体实施方式
这里将详细地对示例性实施例进行说明,其示例表示在附图中。下面的描述涉及附图时,除非另有表示,不同附图中的相同数字表示相同或相似的要素。以下示例性实施例中所描述的实施例并不代表与本公开相一致的所有实施例。相反,它们仅是与如所附权利要求书中所详述的、本公开的一些方面相一致的装置和方法的例子。
在本公开使用的术语是仅仅出于描述特定实施例的目的,而非旨在限制本公开。除非另作定义,本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开说明书以及权利要求书中使用的“第一”“第二”以及类似的词语并不表示任何顺序、数量或者重要性,而只是用来区分不同的组成部分。同样,“一个”或者“一”等类似词语也不表示数量限制,而是表示存在至少一个。除非另行指出,“包括”或者“包含”等类似词语意指出现在“包括”或者“包含”前面的元件或者物件涵盖出现在“包括”或者“包含”后面列举的元件或者物件及其等同,并不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接,而且可以包括电性的连接,不管是直接的还是间接的。
在本公开说明书和所附权利要求书中所使用的单数形式的“一种”、“所述”和“该”也旨在包括多数形式,除非上下文清楚地表示其他含义。还应当理解,本文中使用的术语“和/或”是指并包含一个或多个相关联的列出项目的任何或所有可能组合。
一些实施例中,电子设备包括:中框、充电接口、线路板和天线单元。其中,充电接口包括:金属外壳、多个引脚和承载多个引脚的塑胶体。金属外壳套装于塑胶体和多个引脚外,且塑胶体隔开金属外壳和多个引脚。金属外壳设有多个接地焊盘,多个接地焊盘与线路板的接地金属连接,多个引脚与线路板电连接。中框设有外接口,外接口与充电接口连通。天线单元可以设于中框上,且天线单元靠近充电接口。由于金属外壳的接地焊盘与线路板的接地金属连接,这相当于金属外壳为接地金属,使充电接口所在的区域不是净空区域,这使天线单元的净空区域较小,不利于天线单元的辐射效率。
为了解决上述问题,本公开实施例提供了一种电子设备,以下结合附图进行详细阐述:
在本公开实施例中,电子设备包括但不限于:手机、平板电脑、iPad、数字广播终端、消息收发设备、游戏控制台、医疗设备、健身设备、个人数字助理、智能可穿戴设备、智能电视、扫地机器人和智能音箱等。
图1所示为本公开根据一示例性实施例示出的电子设备的立体结构示意图。图2所示为本公开根据一示例性实施例示出的电子设备的局部结构示意图。结合参考图1和图2,电子设备包括:机壳110、线路板120、充电接口130和天线单元140。
机壳110设有外接口113。示例性地,机壳110包括第一边框111和与第一边框111相对的第二边框112,外接口113设于第一边框111。其中,第一边框111和第二边框112为机壳110的边框的相对两部分,对于其结构不作具体限定。示例性地,机壳110呈长方形结构、正方形结构或其他规则及不规则结构。示例性地,机壳110包括中框,中框包括第一边框111和与第一边框111相对的第二边框112。
线路板120设于机壳110内,线路板120包括接地金属121。其中,线路板120可以与电子设备中的各个功能模组连接,以为功能模组供电。示例性地,线路板120包括射频线路板,射频线路板与天线单元140连接,以控制天线单元140工作。
充电接口130设于机壳110内且与外接口113连通,充电接口130包括:金属外壳131,金属外壳131包括多个接地焊盘132,接地焊盘132与接地金属121分离设置。天线单元140与充电接口130耦合。可以理解的是,天线单元140靠近充电接口130设置,也即天线单元140相对于第二边框112靠近充电接口130设置,这样天线单元140和充电接口130形成耦合关系。
示例性地,第一边框111为电子设备的底部边框,第二边框112为电子设备的顶部边框,其中,“底部”和“顶部”以用户使用电子设备时的方向为基准。在该情形下,充电接口130设于电子设备的底部,天线单元140设于电子设备的底部。示例性地,当机壳110为金属材料时,天线单元140包括第一部141,第一部141通过机壳110的至少部分形成,比如,第一部141通过第一边框111的至少部分形成。这样,更利于减少天线单元140的占用空间,利于电子设备实现全面屏化。天线单元140还可包括第二部142,第二部142靠近充电接口130设置,且第二部142的至少部分可以与第一边框111平行。
基于上述,通过将充电接口130的金属外壳131的接地焊盘132与线路板120的接地金属121分离设置,这相较于金属外壳131的接地焊盘132与接地金属121连接而言,使金属外壳131不接地而不占用天线单元140的净空区域,等效于增加了相关技术中被充电接口130占用的天线单元140的净空区域,而且充电接口130还与天线单元140耦合,这使充电接口130的金属外壳131可以作为天线单元140的天线辐射体,利于提升天线单元140的天线性能。
在一些实施例中,继续参考图2,线路板120包括与接地金属121相邻的空白区域122,充电接口130固定于空白区域122。示例性地,空白区域122可为通过对线路板120切割孔洞而形成。示例性地,空白区域122可以通过非金属材料形成,比如,空白区域122包括非金属基板,非金属基板与接地焊盘132固定连接。其中,非金属基板可以为线路板120去除金属材料之后的板基体。示例性地,非金属基板的材料可以为PBT(PolybutyleneTerephthalate,聚对苯二甲酸丁二醇酯)。通过非金属基板为充电接口130提供支撑,非金属基板与接地焊盘132固定连接,以稳定地固定充电接口130。
在一些实施例中,继续参考图2,沿线路板120的板面方向,接地焊盘132与接地金属121之间具有间隙。这样,确保接地焊盘132与接地金属121分离设置,使充电接口130的金属外壳131不会占用天线单元140的净空区域,利于提升天线单元140的辐射效率。
图3所示为本公开根据一示例性实施例示出的充电接口130的结构示意图,图4所示为本公开根据一示例性实施例示出的充电接口130与线路板120之间的相对位置示意图。在一些实施例中,结合参考图3和图4,充电接口130还包括多个引脚133和承载多个引脚133的绝缘件134,金属外壳131套装于绝缘件134外,金属外壳131通过绝缘件134与多个引脚133隔开,多个引脚133包括与线路板120电连接的接地引脚135。通过绝缘件134将多个引脚133与金属外壳131隔开,且通过接地引脚135与线路板120连接,使金属外壳131不影响多个引脚133的传输工作。
示例性地,充电接口130包括为Mini USB接口、Micro USB接口、Dock接口、Lightning接口或Type-C接口。示例性地,绝缘件134为塑胶件,塑胶件包裹多个引脚133的中部。
图5所示为本公开根据一示例性实施例示出的电子设备的局部电路图。参考图5,多个引脚133包括:引脚VBUS1、引脚VBUS2、引脚CC1、引脚CC2、引脚Dp1、引脚Dp2、引脚Dn1、引脚Dn2、引脚SBU1、引脚SBU2、引脚GND1和引脚GND5。其中,引脚GND1和引脚GND5为接地引脚135。引脚VBUS1和引脚VBUS2与供电端USB_VBUS_CONN连接,供电端USB_VBUS_CONN与引脚VBUS1之间连接有并联的电容和瞬态二极管,以起到滤波作用。
图6所示为本公开根据一示例性实施例示出的线路板120的分布示意图。参考图6,引脚GND1与图6中第一位置101连接,引脚GND5与图6中第二位置102连接,其他引脚133与图6中第三位置103连接。
继续结合参考图5和图6,金属外壳131包括六个接地焊盘132,分别为接地焊盘GND2、接地焊盘GND3、接地焊盘GND4、接地焊盘GND6、接地焊盘GND7和接地焊盘GND8。其中,接地焊盘GND2、接地焊盘GND3、接地焊盘GND4、接地焊盘GND6、接地焊盘GND7和接地焊盘GND8均不与接地金属121连接。接地焊盘GND2与图6中第四位置104连接,接地焊盘GND3与图6中第五位置105连接,接地焊盘GND4与图6中第六位置106连接,接地焊盘GND6与图6中第七位置107连接,接地焊盘GND7与图6中第八位置108连接,接地焊盘GND8与图6中第九位置109连接。其中,第四位置104、第五位置105、第六位置106、第七位置107、第八位置108和第九位置109处均为非金属材料,第一位置101、第二位置102和第三位置103处均为金属材料。
上述提及,由于充电接口130的金属外壳131可以直接作为天线单元140耦合的天线辐射体,当充电接口130中传输数据或电流时,不可避免地会出现杂波而影响天线单元140的辐射性能。为了解决该问题,在一些实施例中,结合参考图4和图5,线路板120还包括:滤波单元123,滤波单元123的一端与一个接地焊盘132连接,另一端接地。示例性地,在图5中,滤波单元123与接地焊盘GND3连接。通过滤波单元123滤除充电接口130产生的杂波,避免影响天线单元140工作,从而提升天线单元140的天线性能。示例性地,滤波单元123包括电感L1和电容C1,电感L1的一端与接地焊盘132连接,另一端与电容C1连接,电容C1接地。这样,电感L1和电容C1配合形成LC滤波电路,通过电感L1和电容C1配合起到滤波作用,以避免杂波干扰天线单元140的天线性能。
由于金属外壳131不接地,这容易产生静电干扰,影响天线单元140的天线性能。在一些实施例中,结合参考图4和图5,线路板120还包括:抗静电单元124,抗静电单元124的一端连接至滤波单元123和接地焊盘132之间,另一端接地。通过抗静电单元124能够起到抗静电作用,避免静电干扰天线单元140的天线性能。另外,抗静电单元124和滤波单元123连接至一个接地焊盘132,利于确保所有接地焊盘132均不接地。需要说明的是,在本公开实施例中,由于滤波单元123和抗静电单元124的阻抗较大,在高频信号时可认为是处于断路状态,这样可以认为与滤波单元123和抗静电单元124连接的接地焊盘132没有接地。
示例性地,抗静电单元124包括:双向瞬态二极管。通过双向瞬态二极管可在正反两个方向吸收瞬时大功率脉冲,并把电压钳制到设定水平,使充电接口130通过允许的最大脉冲,以有效保护充电接口130,避免其产生的静电干扰天线单元140的天线性能。
在一些实施例中,结合参考图2和图4,金属外壳131远离外接口113的角部设有接地焊盘132,远离外接口113且位于金属外壳131的角部的一个接地焊盘132与滤波单元123连接。示例性地,远离外接口113且位于金属外壳131的角部的一个接地焊盘132为接地焊盘GND3,接地焊盘GND3与滤波单元123和抗静电单元124连接。这样,方便在线路板120设置滤波单元123和抗静电单元124。
图7所示为本公开根据一示例性实施例示出的天线单元140的频率与辐射效率之间的关系曲线图。其中,1号曲线表示:相关技术中金属外壳的接地焊盘与线路板的接地金属连接时对应的关系曲线。2号曲线表示:金属外壳131的接地焊盘132与线路板120的接地金属121分离设置时,且一个接地焊盘132与抗静电单元124和滤波单元123连接时对应的关系曲线。由图7可知,在频率约为0.7GHz~2.3GHz的范围内,本公开提供的电子设备的天线单元140的辐射效率高于相关技术中电子设备的天线单元的辐射效率。由此可知,本公开实施例提供的电子设备在低频段的天性性能优于相关技术中提供的电子设备的天线性能。
综上,本公开实施例提供的电子设备,通过将充电接口130的金属外壳131的接地焊盘132与线路板120的接地金属121分离设置,这相较于金属外壳131的接地焊盘132与接地金属121连接而言,使金属外壳131不接地而不占用天线单元140的净空区域,等效于增加了相关技术中被充电接口130占用的净空区域,还使充电接口130的金属外壳131与天线单元140耦合而作为天线辐射体,利于提升天线单元140的天线性能。通过使一个接地焊盘132与滤波单元123和抗静电单元124连接,使滤波单元123滤除干扰杂波,抗静电单元124消除静电,以保证天线单元140的天线性能。
本公开上述各个实施例,在不产生冲突的情况下,可以互为补充。
以上所述仅为本公开的较佳实施例而已,并不用以限制本公开,凡在本公开的精神和原则之内,所做的任何修改、等同替换、改进等,均应包含在本公开保护的范围之内。
Claims (7)
1.一种电子设备,其特征在于,所述电子设备包括:
机壳,设有外接口;
线路板,设于所述机壳内,所述线路板包括接地金属;
充电接口,设于所述机壳内且与所述外接口连通,所述充电接口包括:金属外壳,所述金属外壳设有多个接地焊盘,所述接地焊盘与所述接地金属分离设置;以及
天线单元,与所述充电接口耦合;
所述线路板包括与所述接地金属相邻的空白区域,所述充电接口固定于所述空白区域,所述线路板还包括:滤波单元,所述滤波单元的一端与一个所述接地焊盘连接,另一端接地,所述线路板还包括:抗静电单元,所述抗静电单元的一端连接至所述滤波单元和所述接地焊盘之间,另一端接地。
2.根据权利要求1所述的电子设备,其特征在于,沿所述线路板的板面方向,所述接地焊盘与所述接地金属之间具有间隙。
3.根据权利要求1所述的电子设备,其特征在于,所述空白区域包括非金属基板,所述非金属基板与所述接地焊盘固定连接。
4.根据权利要求1所述的电子设备,其特征在于,所述滤波单元包括电感和电容,所述电感的一端与所述接地焊盘连接,另一端与所述电容连接,所述电容接地。
5.根据权利要求1所述的电子设备,其特征在于,所述抗静电单元包括:双向瞬态二极管。
6.根据权利要求1所述的电子设备,其特征在于,所述金属外壳远离所述外接口的角部设有所述接地焊盘,远离所述外接口且位于所述金属外壳的角部的一个所述接地焊盘与所述滤波单元连接。
7.根据权利要求1所述的电子设备,其特征在于,所述充电接口还包括多个引脚和承载多个所述引脚的绝缘件,所述金属外壳套装于所述绝缘件外,所述金属外壳通过所述绝缘件与多个所述引脚隔开,多个所述引脚包括与所述线路板电连接的接地引脚;和/或
所述天线单元包括第一部,所述第一部通过所述机壳的至少部分形成。
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US20220039251A1 (en) | 2022-02-03 |
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