JP2022020815A - Method for measuring copper thickness of non-contact type upper/lower layer applied to pcb multilayer board - Google Patents

Method for measuring copper thickness of non-contact type upper/lower layer applied to pcb multilayer board Download PDF

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JP2022020815A
JP2022020815A JP2021187482A JP2021187482A JP2022020815A JP 2022020815 A JP2022020815 A JP 2022020815A JP 2021187482 A JP2021187482 A JP 2021187482A JP 2021187482 A JP2021187482 A JP 2021187482A JP 2022020815 A JP2022020815 A JP 2022020815A
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pcb multilayer
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JP7304589B2 (en
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建璋 陳
Jian Zhang Chen
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National Formosa University
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
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Abstract

PROBLEM TO BE SOLVED: To provide a method for measuring the copper thicknesses of non-contact type upper/lower layers applied to the PCB multilayer board.
SOLUTION: A method for measuring the copper thicknesses of non-contact type upper/lower layers applied to the PCB multilayer board comprises steps of: preparing a first detection unit provided on the upper layer of the PCB multilayer board and a second detection unit provided on the lower layer thereof; generating induced electromotive forces or electric fields toward the surfaces of the upper and lower layers by the first and second detection units to form eddy currents or reflection signals by the impedances of the metal surfaces of the upper and lower layers; measuring the eddy currents or the reflection signals by the first and second detection units to acquire first and second impedance values; generating counter electromotive forces or re-reflection signals reflected by the eddy currents or reflection signals of the upper and lower layers to measure the counter electromotive forces or the re-reflection signals by the first and second detection units and acquire third and fourth impedance values; and calculating the thicknesses using the first, second, third and fourth impedance values in a processing unit to acquire the first thickness of the upper layer and the second thickness of the lower layer.
SELECTED DRAWING: Figure 2
COPYRIGHT: (C)2022,JPO&INPIT

Description

本発明は、測量方法に関し、特に、ＰＣＢ多層板に応用した非接触式上下層銅厚の測量方法に関する。 The present invention relates to a surveying method, and more particularly to a non-contact type upper and lower layer copper thickness surveying method applied to a PCB multilayer plate.

半導体プロセス技術が絶え間なく発展するとともに、金属コーティングプロセスとエッチング又は研磨プロセスの組合せは、集積回路の接続導通を作製することに多く使われていて、既に先進プロセスの重要技術になっている。 With the constant development of semiconductor process technology, the combination of metal coating process and etching or polishing process is often used to create connection conduction of integrated circuits and has already become an important technology of advanced processes.

従来の薄膜測量機器による金属薄膜の厚さの測量の多くは、接触式の測量技術を主とする。しかし、金属薄膜は、光透過性を有していないので、破壊性、接触式の四点プローブ測量方法を用いて塗膜の厚さを測量することが多く、且つ、接触式の測量方式は、金属薄膜に触るので薄膜本体に損傷を与える。したがって、従来の測量技術は、通常まず見本の一部を取って、静的な方式で測量を行う。その上、従来の測量機器の精度は、単一の金属層の薄膜の厚さしか測量できず、多層薄膜構造に対して測量を行うことができない。 Most of the conventional thin film surveying instruments for measuring the thickness of metal thin films are mainly contact-type surveying techniques. However, since the metal thin film does not have light transmittance, the thickness of the coating film is often measured by using a destructive, contact-type four-point probe surveying method, and the contact-type surveying method is used. Since it touches the metal thin film, it damages the thin film body. Therefore, in the conventional surveying technique, a part of the sample is usually taken first and the survey is performed by a static method. Moreover, the accuracy of conventional surveying instruments can only measure the thickness of a single metal layer thin film, not a multi-layered thin film structure.

近年、塗膜の厚さに対して非接触式測量を行う方法は、ますます重視されている。従来の技術には、金属薄膜の特定領域に特定の熱量を与え、金属薄膜の温度変化からその厚さを推算する方法、金属薄膜にパルスエネルギーを与え、生じた音波振幅及び周波数から金属薄膜の厚さを推算する方法、金属薄膜にコイル磁界（ｍａｇｎｅｔｉｃ ｆｉｅｌｄ ｏｆ Ｈｅｌｍｈｏｌｔｚ ｃｏｉｌ）を与え、渦電流（ｅｄｄｙ ｃｕｒｒｅｎｔ）損
失量から金属薄膜の厚さを推算する方法がある。上述の測量方法は、金属薄膜の厚さを推算するために、完全な理論模型及び比較データベースを確立する必要がある。したがって、如何に多層薄膜構造について、より速やかに且つ正確に測量を行う方法を設計するかが本分野における、現在の重要な課題である。 In recent years, the method of performing non-contact surveying on the thickness of the coating film has been increasingly emphasized. Conventional techniques include a method of applying a specific amount of heat to a specific region of a metal thin film and estimating its thickness from a temperature change of the metal thin film, applying pulse energy to the metal thin film, and using the generated sonic amplitude and frequency to determine the thickness of the metal thin film. There is a method of estimating the thickness, a method of applying a coil magnetic field (magnetic field of Helmholtz coil) to the metal thin film, and a method of estimating the thickness of the metal thin film from the amount of eddy current loss. The above-mentioned surveying method requires the establishment of a complete theoretical model and comparative database in order to estimate the thickness of the metal thin film. Therefore, how to design a method for surveying a multilayer thin film structure more quickly and accurately is an important issue at present in this field.

これに鑑みて、本発明は、ＰＣＢ多層板に応用した非接触式上下層銅厚の測量方法を提供することを目的とし、以下のステップを含む。 In view of this, the present invention aims to provide a non-contact type upper and lower layer copper thickness measuring method applied to a PCB multilayer plate, and includes the following steps.

まず、ＰＣＢ多層板の上層に設けられた第一検出ユニット及び該ＰＣＢ多層板の下層に設けられた第二検出ユニットを用意し、次に、該第一、第二検出ユニットはそれぞれ交番磁界を生じ、該ＰＣＢ多層板の上、下層表面に誘導起電力を生じ、渦電流を形成し、該第一検出ユニットは該渦電流を測量することにより、該上層の第一インピーダンス値を取得し、該第二検出ユニットは該渦電流を測量することにより、該下層の第二インピーダンス値を取得する。同様の動作を繰り返し、上層の第三インピーダンス値と、下層の第四インピーダンス値を取得する。処理ユニットは該第一、第二検出ユニットと電気的に接続され、該第一検出ユニットが取得した第一インピーダンス値と第三インピーダンス値との差分を用いてＰＣＢ多層板の上層の第一の厚さを計算し、第二検出ユニットが取得した第二インピーダンス値と第四インピーダンス値との差分を用いてＰＣＢ多層板の下層の第二の厚さを取得する。 First, a first detection unit provided on the upper layer of the PCB multilayer plate and a second detection unit provided on the lower layer of the PCB multilayer plate are prepared, and then the first and second detection units generate alternating magnetic fields, respectively. Generated, an induced electromotive force is generated on the surface of the upper and lower layers of the PCB multilayer plate to form an eddy current, and the first detection unit obtains the first impedance value of the upper layer by measuring the eddy current. The second detection unit acquires the second impedance value of the lower layer by measuring the eddy current. The same operation is repeated to acquire the third impedance value of the upper layer and the fourth impedance value of the lower layer. The processing unit is electrically connected to the first and second detection units, and the difference between the first impedance value and the third impedance value acquired by the first detection unit is used to make the first of the upper layers of the PCB multilayer board. The thickness is calculated, and the difference between the second impedance value and the fourth impedance value acquired by the second detection unit is used to acquire the second thickness of the lower layer of the PCB multilayer plate.

本発明の別の技術手段において、該第一の厚さの計算とは該上層の第一、第三インピーダンス値の差分を該第一、第二検出ユニットの該上層、下層表面に向けて誘導起電力又は電界を生じる作用面積で除することであり、該第二の厚さの計算とは該下層の第二、第四インピーダンス値の差分を該第一、第二検出ユニットの該上層、下層表面に向けて誘導起電力又は電界を生じる作用面積で除することである。 In another technical means of the present invention, the calculation of the first thickness is to guide the difference between the first and third impedance values of the upper layer toward the surface of the upper layer and the lower layer of the first and second detection units. Dividing the electromotive force or electric field by the area of action that produces it, the calculation of the second thickness is the difference between the second and fourth impedance values of the lower layer, the upper layer of the first and second detection units. Dividing by the area of action that produces an induced electromotive force or electric field towards the lower surface.

本発明のもう１つの技術手段において、上記第一検出ユニット及び第二検出ユニットのビーム幅（Ｂｅａｍ Ｗｉｄｔｈ）はＸであり、上記第一検出ユニットと該ＰＣＢ多層板の上層との間隔をｄ１とし、上記第二検出ユニットと該ＰＣＢ多層板の下層との間隔をｄ２とし、電界が該ＰＣＢ多層板の上層における作用面積Ａ１は、（（ｔａｎ（Ｘ／２）×ｄ１）×２）２であり、電界が該ＰＣＢ多層板の下層における作用面積Ａ２は、（（ｔａｎ（Ｘ／２）×ｄ２）×２）２である。 In another technical means of the present invention, the beam width (Beam Wide) of the first detection unit and the second detection unit is X, and the distance between the first detection unit and the upper layer of the PCB multilayer plate is d1. The distance between the second detection unit and the lower layer of the PCB multilayer plate is d2, and the working area A1 in the upper layer of the PCB multilayer plate is ((tan (X / 2) × d1) × 2) 2 . The working area A2 in the lower layer of the PCB multilayer plate is ((tan (X / 2) × d2) × 2) 2 .

本発明のさらにもう１つの技術手段において、上述の第一、第二検出ユニットのビーム幅Ｘは６１度である。 In yet another technical means of the present invention, the beam width X of the first and second detection units described above is 61 degrees.

本発明の別の技術手段において、上述の第一、第二検出ユニットと該ＰＣＢ多層板の上、下層との間隔は０．１ｍｍ～１０ｍｍである。 In another technical means of the present invention, the distance between the above-mentioned first and second detection units and the upper and lower layers of the PCB multilayer plate is 0.1 mm to 10 mm.

本発明のもう１つの技術手段において、上述の第一、第二検出ユニットは該上層、下層の金属層の厚さに対して非接触式測量を行うために用いられたマイクロストリップアンテナであり、第一面及び反対になる第二面を有した基板、該基板の第二面に設けられた金属グラウンド層、該基板の第一面に設けられた輻射体、該基板の第一面に設けられたマイクロストリップライン、及び、送込み部を含み、該輻射体は第一輻射部、第二輻射部、第三輻射部及び第四輻射部を有し、該マイクロストリップラインは第一隔壁及び該第一隔壁と垂直に交わって接続した第二隔壁を有し、該送込み部は該金属グラウンド層に接続された接続端、及び該第一面に位置して且つ該接続端及び該マイクロストリップラインに接続された送込み端を有する。 In another technical means of the present invention, the first and second detection units described above are microstrip antennas used to perform non-contact surveys on the thickness of the upper and lower metal layers. A substrate having a first surface and an opposite second surface, a metal ground layer provided on the second surface of the substrate, a radiator provided on the first surface of the substrate, and provided on the first surface of the substrate. The microstrip line and the feeding part are included, and the radiator has a first radiation part, a second radiation part, a third radiation part and a fourth radiation part, and the microstrip line has a first partition and a fourth radiation part. It has a second partition perpendicularly intersecting and connected to the first partition, the feeding portion is a connection end connected to the metal ground layer, and is located on the first surface and the connection end and the micro. It has a feed end connected to a stripline.

本発明のさらにもう１つの技術手段において、上述の基板はさらに第一辺、該第一辺と対向して設けられた第二辺、該第一辺と第二辺との間に位置した第三辺、及び該第三辺と対向して設けられた第四辺を有し、該マイクロストリップラインの第一隔壁は第一短辺及び対向した第二短辺を有し、該第二隔壁は第三短辺及び対向した第四短辺を有し、該第一短辺は該第一辺に接続しないが、該第二短辺は該第二辺に接続され、該第一、第二隔壁は四つの輻射区を規定し、該第一、第二、第三、第四輻射部は別々に該四つの輻射区に設けられる。 In yet another technical means of the present invention, the above-mentioned substrate is further located on the first side, the second side provided facing the first side, and the second side located between the first side and the second side. It has three sides and a fourth side provided facing the third side, and the first partition wall of the microstrip line has a first short side and a second short side facing the third side, and the second partition wall. Has a third short side and an opposite fourth short side, the first short side does not connect to the first side, but the second short side is connected to the second side and the first, first The two partition walls define four radiation zones, and the first, second, third, and fourth radiation sections are separately provided in the four radiation zones.

本発明の別の技術手段において、上述の第一、第三輻射部の片側及び該第二隔壁の第三短辺から該第三辺までの距離は同じであり、該第二、第四輻射部の片側及び該第二隔壁の第四短辺から該第四辺までの距離は同じであり、該第一隔壁の第一短辺から該第一辺までの距離は該第一、第二輻射部の片側から該第一辺までの距離より大きい。 In another technical means of the present invention, the distance from one side of the above-mentioned first and third radiation portions and the third short side of the second partition wall to the third side is the same, and the second and fourth radiations are the same. The distance from one side of the portion and the fourth short side of the second partition wall to the fourth side is the same, and the distance from the first short side of the first partition wall to the first side is the first and second. It is larger than the distance from one side of the radiating part to the first side.

本発明のもう１つの技術手段において、上述の第一、第三輻射部の片側及び該第三短辺から該第三辺までの距離と該第二、第四輻射部の片側及び該第四短辺から該第四辺までの距離は該第一、第二輻射部の片側から該第一辺までの距離と該第三、四輻射部の片側から該第二辺までの距離より大きい。 In another technical means of the present invention, the distance from one side of the first and third radiating portions and the third short side to the third side and one side of the second and fourth radiating portions and the fourth side are described. The distance from the short side to the fourth side is larger than the distance from one side of the first and second radiating portions to the first side and the distance from one side of the third and fourth radiating portions to the second side.

本発明のさらにもう１つの技術手段において、上述の第一、第二検出ユニットの放射周波数は１ＭＨｚ～２．５ＧＨｚである。 In yet another technical means of the present invention, the radiation frequency of the first and second detection units described above is 1 MHz to 2.5 GHz.

本発明の別の技術手段において、上述のＰＣＢ多層板の層数は２層～１６層である。 In another technical means of the present invention, the number of layers of the above-mentioned PCB multilayer board is 2 to 16 layers.

本発明のもう１つの技術手段において、上述のＰＣＢ多層板の上層、下層構造は金属層であり、且つ該上層は該第一の厚さを有し、該下層は該第二の厚さを有するとともに、順番に内部へ少なくとも一つの絶縁層と少なくとも一つの粘着層から該ＰＣＢ多層板までの予定層数が積み上げられている。 In another technical means of the present invention, the upper layer and the lower layer structure of the above-mentioned PCB multilayer plate are a metal layer, and the upper layer has the first thickness, and the lower layer has the second thickness. At the same time, at least one insulating layer and at least one adhesive layer to the PCB multilayer board are sequentially stacked inside.

本発明の有利な効果は、該第一、第二検出ユニットが該ＰＣＢ多層板の二つの表面の金属層の厚さに対して非接触式測量を行い、且つ該ＰＣＢ多層板の層数は２層～１６層であってよいことにより、いろいろな産業の要求を満足する。また、該マイクロストリップアンテナの特殊設計により、該第一、第二検出ユニットの該上層、下層表面に向けて誘導起電力を生じる作用面積に均一性を持たせて、該ＰＣＢ多層板の上、下層銅厚を正確に測量して計算するという最終目標を達成する。 The advantageous effect of the present invention is that the first and second detection units perform non-contact surveying on the thickness of the metal layers on the two surfaces of the PCB multilayer board, and the number of layers of the PCB multilayer board is. By having 2 to 16 layers, the demands of various industries are satisfied. In addition, due to the special design of the microstrip antenna, the working area that generates the induced electromotive force toward the upper and lower layers of the first and second detection units is made uniform, and the top of the PCB multilayer plate. Achieve the ultimate goal of accurately measuring and calculating the thickness of the underlying copper.

本発明のＰＣＢ多層板に応用した非接触式上下層銅厚の測量方法の好ましい実施例を説明する模式図である。It is a schematic diagram explaining a preferable embodiment of the non-contact type upper and lower layer copper thickness measuring method applied to the PCB multilayer board of this invention. この好ましい実施例における流れを説明する工程図である。It is a process drawing explaining the flow in this preferable Example. この好ましい実施例におけるマイクロストリップアンテナの態様を説明する模式図である。It is a schematic diagram explaining the embodiment of the microstrip antenna in this preferred embodiment. 該マイクロストリップアンテナの別の視角態様を説明する模式図である。It is a schematic diagram explaining another viewing angle aspect of the microstrip antenna. ２Ｄ輻射パターン模擬図を示す模式図である。It is a schematic diagram which shows the 2D radiation pattern simulation diagram. ３Ｄ輻射パターン模擬図を示す模式図である。It is a schematic diagram which shows the 3D radiation pattern simulation diagram.

本発明の関連した請求特許の特徴と技術内容について、以下の図面を参照した好ましい実施例に詳しい且つ明確な説明を行う。 The features and technical contents of the claimed patents related to the present invention will be described in detail and clearly with reference to the following drawings.

図１、図２を参照して、本発明のＰＣＢ（Ｐｒｉｎｔｅｄ Ｃｉｒｃｕｉｔ Ｂｏａｒｄ、印刷回路板）多層板に応用した非接触式上下層銅厚の測量方法の好ましい実施例は、以下のステップを含む。 With reference to FIGS. 1 and 2, a preferred embodiment of a non-contact upper and lower copper thickness measuring method applied to a PCB (Printed Circuit Board) multilayer board of the present invention includes the following steps.

まず、ステップ９１を行い、ＰＣＢ多層板１の上層１１に設けられた第一検出ユニット２及び該ＰＣＢ多層板１の下層１２に設けられた第二検出ユニット３を用意する。本発明の測量方法の測量対象はいろいろな、表面コーティングの材料は金属であるＰＣＢ多層板１構造であってよい。 First, step 91 is performed to prepare a first detection unit 2 provided on the upper layer 11 of the PCB multilayer board 1 and a second detection unit 3 provided on the lower layer 12 of the PCB multilayer board 1. The surveying object of the surveying method of the present invention may be various, and the surface coating material may be a PCB multilayer board 1 structure made of metal.

ここで、該ＰＣＢ多層板１の層数は２層～１６層であり、該ＰＣＢ多層板１の最上層１１と最下層１２との構造はいずれも金属層であり、その材料は銅、鉄などの導電性材料であってよく、さらに、該上層１１は第一の厚さを有し、該下層１２は第二の厚さを有し、順番に内部へ少なくとも一つの絶縁層１３と少なくとも一つの粘着層１４から該ＰＣＢ多層板１までの予定層数が積み上げられている。 Here, the number of layers of the PCB multilayer plate 1 is 2 to 16 layers, and the structures of the uppermost layer 11 and the lowermost layer 12 of the PCB multilayer plate 1 are both metal layers, and the materials thereof are copper and iron. The upper layer 11 has a first thickness, the lower layer 12 has a second thickness, and in turn has at least one insulating layer 13 and at least one inward. The planned number of layers from one adhesive layer 14 to the PCB multilayer board 1 is stacked.

好ましくは、該第一、第二検出ユニット２、３と該ＰＣＢ多層板１の上、下層１１、１２の間隔は０．１ｍｍ～１０ｍｍである。なお、該第一、第二検出ユニット２、３の放射周波数は１ＭＨｚ～２．５ＧＨｚである。 Preferably, the distance between the first and second detection units 2 and 3 and the upper and lower layers 11 and 12 of the PCB multilayer plate 1 is 0.1 mm to 10 mm. The radiation frequencies of the first and second detection units 2 and 3 are 1 MHz to 2.5 GHz.

この好ましい実施例において、該第一、第二検出ユニット２、３はマイクロストリップアンテナ５であり、該ＰＣＢ多層板１の最上層１１と最下層１２との金属層の厚さに対して非接触式測量を行うために用いられ、具体的には、該第一、第二検出ユニット２、３は該ＰＣＢ多層板１の上層１１と該下層１２に近付くが触れないように別々に設けられる。 In this preferred embodiment, the first and second detection units 2 and 3 are microstrip antennas 5 and are non-contact with respect to the thickness of the metal layer between the top layer 11 and the bottom layer 12 of the PCB multilayer plate 1. It is used for performing a formula survey, and specifically, the first and second detection units 2 and 3 are separately provided so as to approach but not touch the upper layer 11 and the lower layer 12 of the PCB multilayer plate 1.

再度、図３、図４を参照する。該マイクロストリップアンテナ５は、第一面５１１及び反対になる第二面５１２を有する基板５１、該基板５１の第二面５１２に設けられた金属グラウンド層５２、該基板５１の第一面５１１に設けられた輻射体５３、該基板５１の第一面５１１に設けられたマイクロストリップライン５４、及び、送込み部５５を含む。 Refer to FIGS. 3 and 4 again. The microstrip antenna 5 is attached to a substrate 51 having a first surface 511 and an opposite second surface 512, a metal ground layer 52 provided on the second surface 512 of the substrate 51, and a first surface 511 of the substrate 51. It includes a radiator 53 provided, a microstrip line 54 provided on the first surface 511 of the substrate 51, and a feeding portion 55.

該基板５１はＤｕｒｏｉｄ高周波マイクロウェーブ回路板であり、さらに第一辺５１３、該第一辺５１３と対向して設けられた第二辺５１４、該第一、第二辺５１３、５１４の間に位置した第三辺５１５、及び該第三辺５１５と対向して設けられた第四辺５１６を有する。該金属グラウンド層５２は印刷又はエッチングプロセスで該第二面５１２に形成されたり、打抜きと彫刻プロセスで該金属グラウンド層５２を形成してから該第二面５１２に設けて全体のグラウンド面としたりすることができる。 The substrate 51 is a Duroid high-frequency microwave circuit board, and is further located between the first side 513, the second side 514 provided facing the first side 513, and the first and second sides 513, 514. It has a third side 515 and a fourth side 516 provided opposite to the third side 515. The metal ground layer 52 may be formed on the second surface 512 by a printing or etching process, or may be provided on the second surface 512 after the metal ground layer 52 is formed by a punching and engraving process to form an entire ground surface. can do.

該輻射体５３はそれぞれほぼ立方体をし、第一輻射部５３１、第二輻射部５３２、第三輻射部５３３及び第四輻射部５３４を有し、該輻射体５３は印刷又はエッチングプロセスで該第一面５１１に設けたり、打抜きと彫刻プロセスとで該輻射体５３を形成してから該第一面５１１に設けたりする。 Each of the radiator 53 is substantially cubic and has a first radiation unit 531 and a second radiation unit 532, a third radiation unit 533 and a fourth radiation unit 534, and the radiation body 53 is the first in a printing or etching process. It may be provided on one surface 511, or the radiator 53 may be formed by punching and engraving process and then provided on the first surface 511.

該マイクロストリップライン５４はほぼ十字形をし、第一隔壁５４１及び該第一隔壁５４１と垂直に交わって接続する第二隔壁５４２を有し、該マイクロストリップライン５４の第一隔壁５４１は第一短辺５４１１及び対向した第二短辺５４１２を有し、該第二隔壁５４２は第三短辺５４２１及び対向した第四短辺５４２２を有し、該第一短辺５４１１は該第一辺５１３と接続せず、該第二短辺５４１２は該第二辺５１４と接続し、該第一、第二隔壁５４１、５４２は四つの輻射区５４３を規定し、該第一、第二、第三、第四輻射部５３１、５３２、５３３、５３４は別々に該四つの輻射区５４３の中に設けられる。 The microstrip line 54 is substantially cross-shaped and has a first partition wall 541 and a second partition wall 542 that vertically intersects and connects the first partition wall 541, and the first partition wall 541 of the microstrip line 54 is the first. The second partition wall 542 has a third short side 5421 and an opposed fourth short side 5422, and the first short side 5411 has the first side 513. The second short side 5412 is connected to the second side 514, and the first, second partition walls 541, 542 define four radiation zones 543, the first, second, and third. , Fourth radiation unit 531, 532, 533, 534 are separately provided in the four radiation zones 543.

さらに、該第一、第三輻射部５３１、５３３の片側及び該第二隔壁５４２の第三短辺５
４２１から該第三辺５１５までの距離は同じであり、該第二、第四輻射部５３２、５３４の片側及び該第二隔壁５４２の第四短辺５４２２から該第四辺５１６までの距離は同じであり、該第一隔壁５４１の第一短辺５４１１から該第一辺５１３までの距離は該第一、第二輻射部５３１、５３２の片側から該第一辺５１３までの距離より大きい。 Further, one side of the first and third radiation portions 531 and 533 and the third short side 5 of the second partition wall 542
The distance from 421 to the third side 515 is the same, and the distance from one side of the second and fourth radiation portions 532 and 534 and the fourth short side 5422 of the second partition wall 542 to the fourth side 516 is the same. It is the same, and the distance from the first short side 5411 of the first partition wall 541 to the first side 513 is larger than the distance from one side of the first and second radiation portions 531 and 532 to the first side 513.

次に、ステップ９２を行い、該第一、第二検出ユニット２、３はそれぞれ交番磁界を生じ、該ＰＣＢ多層板１の上、下層１１、１２の表面に向けて誘導起電力又は電界を生じ、該上層、下層１１、１２の金属面のインピーダンスは該上層、下層１１、１２の表面に位置した渦電流又は第一反射信号を形成し、該第一、第二検出ユニット２、３は該渦電流又は第一反射信号を測量して、該上層１１に位置した第一インピーダンス値及び該下層１２に位置した第二インピーダンス値を取得する。 Next, step 92 is performed, and the first and second detection units 2 and 3 generate alternating magnetic fields, respectively, and generate an induced electromotive force or an electric field toward the surfaces of the upper and lower layers 11 and 12 of the PCB multilayer plate 1. The impedance of the metal surface of the upper layer and the lower layers 11 and 12 forms an eddy current or a first reflected signal located on the surface of the upper layer and the lower layers 11 and 12, and the first and second detection units 2 and 3 form the first reflected signal. The eddy current or the first reflected signal is measured to obtain the first impedance value located in the upper layer 11 and the second impedance value located in the lower layer 12.

該送込み部５５は信号を送込むために用いられ、該金属グラウンド層５２に接続された接続端５５１及び該第一面５１１に位置し且つ該接続端５５１と該マイクロストリップライン５４に接続された送込み端５５２を有する。 The feed 55 is used to feed a signal, located at a connection end 551 connected to the metal ground layer 52 and the first surface 511, and connected to the connection end 551 and the microstrip line 54. It has a feed end 552.

次に、ステップ９２を行い、該第一および第二検出ユニット２、３はそれぞれ交番磁界を生じ、該ＰＣＢ多層板１の上層および下層１１、１２の表面に誘導起電力を生じさせ、該上層および下層１１、１２の表面に渦電流を形成し、該第一および第二検出ユニット２、３は該渦電流を測量して、該上層１１の第一インピーダンス値及び該下層１２の第二インピーダンス値をそれぞれ取得する。 Next, step 92 is performed, the first and second detection units 2 and 3 generate alternating magnetic fields, respectively, and an induced electromotive force is generated on the surfaces of the upper layer and the lower layers 11 and 12 of the PCB multilayer plate 1, and the upper layer is generated. And eddy currents are formed on the surfaces of the lower layers 11 and 12, and the first and second detection units 2 and 3 measure the eddy currents to measure the eddy currents to obtain the first impedance value of the upper layer 11 and the second impedance of the lower layer 12. Get each value.

そして、ステップ９３をステップ９２と同様に行い、上層１１の第三インピーダンス値及び該下層１２の第四インピーダンス値をそれぞれ取得する。 Then, step 93 is performed in the same manner as in step 92 to acquire the third impedance value of the upper layer 11 and the fourth impedance value of the lower layer 12, respectively.

最後に、ステップ９４を行い、処理ユニット６は該第一および第二検出ユニット２、３に電気的接続され、該第一および第二検出ユニット２、３が取得した第一、第二、第三、第四インピーダンス値によって厚さの計算を実行して、該ＰＣＢ多層板１の上層１１の第一の厚さ及び該下層１２の第二の厚さを取得する。 Finally, step 94 is performed, and the processing unit 6 is electrically connected to the first and second detection units 2, 3 and acquired by the first and second detection units 2, 3 first, second, first. Third, the thickness is calculated by the fourth impedance value to obtain the first thickness of the upper layer 11 of the PCB multilayer plate 1 and the second thickness of the lower layer 12.

その中、該第一の厚さの計算とは該上層１１の第一インピーダンス値と、第三インピーダンス値の差分を該第一検出ユニット２の上層１１の表面で誘導起電力を生じる作用面積で除することであって、該第二の厚さの厚さ計算とは該下層１２の第二インピーダンス値と、第四インピーダンス値の差分を該第二検出ユニット３の該下層１２の表面で誘導起電力を生じる作用面積で除することである。 Among them, the calculation of the first thickness is the difference between the first impedance value of the upper layer 11 and the third impedance value by the working area where the induced electromotive force is generated on the surface of the upper layer 11 of the first detection unit 2. The thickness calculation of the second thickness is to derive the difference between the second impedance value of the lower layer 12 and the fourth impedance value on the surface of the lower layer 12 of the second detection unit 3. It is to divide by the working area where the electromotive force is generated.

上述の測量方法によりまず該第一、第二検出ユニット２、３の該上層、下層１１、１２に対する異なった間隔、異なった厚さ、放射周波数、ＰＣＢ多層板１の材料などの条件の第一、第二、第三、第四インピーダンス値を測量して、標準曲線数値を取得し、実際操作の時に標準曲線数値はその標準値を当て嵌めることで厚さの計算を行ってよい。 According to the above-mentioned surveying method, first of all, the conditions such as different intervals, different thicknesses, radiation frequencies, materials of the PCB multilayer plate 1 of the first and second detection units 2 and 3 with respect to the upper layer and the lower layers 11 and 12 are first. , The second, third, and fourth impedance values are measured to obtain a standard curve value, and the standard curve value may be applied to the standard value at the time of actual operation to calculate the thickness.

さらに、該第一検出ユニット２と第二検出ユニット３のビーム幅（Ｂｅａｍ Ｗｉｄｔｈ）はＸであり、前記第一検出ユニットと該ＰＣＢ多層板の上層との間隔をｄ１とし、前記第二検出ユニットと該ＰＣＢ多層板の下層との間隔をｄ２とし、電界の該ＰＣＢ多層板の上層における作用面積Ａ１は、（（ｔａｎ（Ｘ／２）×ｄ１）×２）２であり、電界の該ＰＣＢ多層板の下層における作用面積Ａ２は、（（ｔａｎ（Ｘ／２）×ｄ２）×２）２であり、その中、該第一検出ユニット２と第二検出ユニット３のビーム幅Ｘは６１度である。 Further, the beam width (Beam Wide) of the first detection unit 2 and the second detection unit 3 is X, the distance between the first detection unit and the upper layer of the PCB multilayer plate is d1, and the second detection unit. The distance between the PCB and the lower layer of the PCB multilayer plate is d2, the working area A1 of the electric field in the upper layer of the PCB multilayer plate is ((tan (X / 2) × d1) × 2) 2 , and the PCB of the electric field is The working area A2 in the lower layer of the multilayer plate is ((tan (X / 2) × d2) × 2) 2 , and the beam width X of the first detection unit 2 and the second detection unit 3 is 61 degrees. Is.

該ＰＣＢ多層板１と該上層、下層１１、１２との間隔は２ｍｍであることを例にとって、該値を上述の数式（（ｔａｎ３０．５°×２ｍｍ）×２）２に当て嵌め、得られた該第一検出ユニット２、３の該上層、下層１１、１２の表面に向けて誘導起電力又は電界を生じる作用面積は約５．１２ｍｍであり、該上層１１の第一、第三インピーダンス値の差分を該作用面積数値で除して該第一の厚さを取得し、該下層１２の第二、第四インピーダンス値の差分を該作用面積数値で除して該第二の厚さを取得する。 Taking the case where the distance between the PCB multilayer plate 1 and the upper layer, the lower layers 11 and 12 is 2 mm as an example, the value is applied to the above-mentioned mathematical formula ((tan 30.5 ° × 2 mm) × 2) 2 and obtained. The working area of the first detection units 2 and 3 for generating an induced electromotive force or an electric field toward the surfaces of the upper layers 11 and 12 is about 5.12 mm, and the first and third impedance values of the upper layer 11 are high. The difference between the two and fourth impedance values of the lower layer 12 is divided by the working area value to obtain the first thickness, and the difference between the second and fourth impedance values is divided by the working area value to obtain the second thickness. get.

図５はＹ－Ｚ平面の２Ｄ輻射パターン模擬図であり、該第一、第二隔壁５４１、５４２の設置によって、該マイクロストリップアンテナ５のビーム幅（Ｂｅａｍ Ｗｉｄｔｈ）を６１度として、メッセージは反射信号の生じた位相差のため信号の干渉を受けることを低減できて、該ＰＣＢ多層板１の銅厚測量に有効に応用できる。 FIG. 5 is a simulated 2D radiation pattern on the YZ plane, and the message is reflected with the beam width (Beam Width) of the microstrip antenna 5 being 61 degrees by installing the first and second partition walls 541 and 542. It is possible to reduce the interference of the signal due to the phase difference generated by the signal, and it can be effectively applied to the copper thickness measurement of the PCB multilayer plate 1.

再度、３Ｄ輻射パターン模擬図である図６を参照し、該第一、第二隔壁５４１、５４２が垂直に交わって十字形のマイクロストリップライン５４を形成し且つ別々に該第一、第二、第三、第四輻射部５３１、５３２、５３３、５３４間に設けられることで、パターン均一の効果を達成できる。従って、該マイクロストリップアンテナ５の特殊設計によって該第一、第二検出ユニット２、３の該上層、下層１１、１２の表面に向けて誘導起電力又は電界を生じる作用面積に均一性を持たせて、該ＰＣＢ多層板１の上、下層１１、１２の銅厚を正確に測量して計算するという最終目標を達成する。 Again, referring to FIG. 6, which is a simulated 3D radiation pattern, the first and second partition walls 541 and 542 vertically intersect to form a cross-shaped microstrip line 54 and separately the first and second partitions. By providing it between the third and fourth radiation units 531, 532, 533, and 534, the effect of pattern uniformity can be achieved. Therefore, by specially designing the microstrip antenna 5, the working area for generating an induced electromotive force or an electric field toward the surfaces of the upper layer, the lower layer 11 and 12 of the first and second detection units 2 and 3 is made uniform. Therefore, the final goal of accurately measuring and calculating the copper thicknesses of the upper and lower layers 11 and 12 of the PCB multilayer plate 1 is achieved.

以上をまとめると、本発明のＰＣＢ多層板に応用した非接触式上下層銅厚の測量方法において、該第一、第二検出ユニット２、３は該ＰＣＢ多層板１の二つの表面の金属層の厚さに対して非接触式測量を行い、該第一、第二検出ユニット２、３が取得した第一、第二、第三、第四インピーダンス値に基づいて厚さの計算を実行して、該ＰＣＢ多層板１の上層１１の第一の厚さと該下層１２の第二の厚さを取得し、且つ該ＰＣＢ多層板１の層数は２層～１６層であってよく、いろいろな産業の要求を満足できる上に、速やかに且つ正確に金属層の厚さを取得でき、故に本発明の目的を確実に達成できる。 Summarizing the above, in the non-contact type upper and lower layer copper thickness measuring method applied to the PCB multilayer plate of the present invention, the first and second detection units 2 and 3 are the metal layers on the two surfaces of the PCB multilayer plate 1. A non-contact survey is performed on the thickness of the above, and the thickness is calculated based on the first, second, third, and fourth impedance values acquired by the first and second detection units 2 and 3. Therefore, the first thickness of the upper layer 11 and the second thickness of the lower layer 12 of the PCB multilayer board 1 may be obtained, and the number of layers of the PCB multilayer board 1 may be 2 to 16 layers. In addition to satisfying the demands of various industries, the thickness of the metal layer can be obtained quickly and accurately, and therefore the object of the present invention can be surely achieved.

上述したのは本発明の好ましい実施例に過ぎず、本発明を制限するものではない。本発明の請求範囲と明細書の内容によって行った簡単な同等変化と修飾はいずれも本発明の請求範囲内にある。 The above is only a preferred embodiment of the present invention and does not limit the present invention. Both the claims of the present invention and the simple equivalent changes and modifications made according to the contents of the specification are within the claims of the present invention.

本発明の有利な効果は、該第一、第二検出ユニットが該ＰＣＢ多層板の二つの表面の金属層の厚さに対して非接触式測量を行い、且つ該ＰＣＢ多層板の層数は２層～１６層であってよいことにより、いろいろな産業の要求を満足する。また、該マイクロストリップアンテナの特殊設計により、該第一、第二検出ユニットの該上層、下層表面に向けて誘導起電力を生じる作用面積に均一性を持たせて、該ＰＣＢ多層板の上、下層銅厚を正確に測量して計算するという最終目標を達成する。 The advantageous effect of the present invention is that the first and second detection units perform non-contact surveying on the thickness of the metal layers on the two surfaces of the PCB multilayer board, and the number of layers of the PCB multilayer board is. By having 2 to 16 layers, the demands of various industries are satisfied. In addition, due to the special design of the microstrip antenna, the working area that generates the induced electromotive force toward the upper and lower layers of the first and second detection units is made uniform, and the top of the PCB multilayer plate. Achieve the ultimate goal of accurately measuring and calculating the thickness of the underlying copper.

１ ＰＣＢ多層板
１１ 上層
１２ 下層
１３ 絶縁層
１４ 粘着層
２ 第一検出ユニット
３ 第二検出ユニット
５ マイクロストリップアンテナ
５１ 基板
５１１ 第一面
５１２ 第二面
５１３ 第一辺
５１４ 第二辺
５１５ 第三辺
５１６ 第四辺
５２ 金属グラウンド層
５３ 輻射体
５３１ 第一輻射部
５３２ 第二輻射部
５３３ 第三輻射部
５３４ 第四輻射部
５４ マイクロストリップライン
５４１ 第一隔壁
５４１１ 第一短辺
５４１２ 第二短辺
５４２ 第二隔壁
５４２１ 第三短辺
５４２２ 第四短辺
５４３ 輻射区
５５ 送込み部
５５１ 接続端
５５２ 送込み端
６ 処理ユニット
９１～９４ ステップ 1 PCB multilayer plate 11 Upper layer 12 Lower layer 13 Insulation layer 14 Adhesive layer 2 First detection unit 3 Second detection unit 5 Microstrip antenna 51 Board 511 First surface 512 Second surface 513 First side 514 Second side 515 Third side 516 Fourth side 52 Metal ground layer 53 Radiator 531 First radiation part 532 Second radiation part 533 Third radiation part 534 Fourth radiation part 54 Microstrip line 541 First partition wall 5411 First short side 5412 Second short side 542 2nd partition 5421 3rd short side 5422 4th short side 543 Radiation zone 55 Sending part 551 Connection end 552 Sending end 6 Processing unit 91-94 Steps

本発明のもう１つの技術手段において、上記第一検出ユニット及び第二検出ユニットのビーム幅（Ｂｅａｍ Ｗｉｄｔｈ）はＸであり、上記第一検出ユニットと該ＰＣＢ多層板の上層との間隔をｄ１とし、上記第二検出ユニットと該ＰＣＢ多層板の下層との間隔をｄ２とし、電界が該ＰＣＢ多層板の上層における作用面積Ａ１は、（（ｔａｎ（Ｘ／２）×ｄ１）×２） ２ であり、電界が該ＰＣＢ多層板の下層における作用面積Ａ２は、（（ｔａ ｎ（Ｘ／２）×ｄ２）×２） ２ である。 In another technical means of the present invention, the beam width (Beam Wide) of the first detection unit and the second detection unit is X, and the distance between the first detection unit and the upper layer of the PCB multilayer plate is d1. The distance between the second detection unit and the lower layer of the PCB multilayer plate is d2, and the working area A1 in the upper layer of the PCB multilayer plate is ((tan (X / 2) × d1) × 2) 2 . The working area A2 in the lower layer of the PCB multilayer plate is ((tan (X / 2) × d2) × 2) 2 .

さらに、該第一検出ユニット２と第二検出ユニット３のビーム幅（Ｂｅａｍ Ｗｉｄｔｈ）はＸであり、前記第一検出ユニットと該ＰＣＢ多層板の上層との間隔をｄ１とし、前記第二検出ユニットと該ＰＣＢ多層板の下層との間隔をｄ２とし、電界の該ＰＣＢ多層板の上層における作用面積Ａ１は、（（ｔａｎ（Ｘ／２）×ｄ１）×２） ２ であり、電界の該ＰＣＢ多層板の下層における作用面積Ａ２は、（（ｔａｎ（Ｘ／２）×ｄ２）×２） ２ であり、その中、該第一検出ユニット２と第二検出ユニット３のビーム幅Ｘは６１度である。

Further, the beam width (Beam Wide) of the first detection unit 2 and the second detection unit 3 is X, the distance between the first detection unit and the upper layer of the PCB multilayer plate is d1, and the second detection unit. The distance between the PCB and the lower layer of the PCB multilayer plate is d2, the working area A1 of the electric field in the upper layer of the PCB multilayer plate is ((tan (X / 2) × d1) × 2) 2 , and the PCB of the electric field is The working area A2 in the lower layer of the multilayer plate is ((tan (X / 2) × d2) × 2) 2 , and the beam width X of the first detection unit 2 and the second detection unit 3 is 61 degrees. Is.

Claims (10)

（Ａ）ＰＣＢ多層板の上層に設けられた第一検出ユニット及び該ＰＣＢ多層板の下層に設けられた第二検出ユニットを用意する第１ステップと、
（Ｂ）前記第一検出ユニットと第二検出ユニットはそれぞれ交番磁界を生じることにより、前記ＰＣＢ多層板の上層、下層表面に誘導起電力による渦電流を形成し、該第一検出ユニットは、前記上層の前記渦電流を測量することにより、該上層の第一インピーダンス値を取得し、前記第二検出ユニットは、前記下層の前記渦電流を測量することにより、該下層の第二インピーダンス値を取得する第２ステップと、
（Ｃ）前記第２ステップと同様の動作を繰り返し、前記上層の第三インピーダンス値と、前記下層の第四インピーダンス値を取得する第３ステップと、
（Ｄ）処理ユニットは該第一検出ユニット、第二検出ユニットと電気的に接続され、該第一検出ユニットが取得した前記第一インピーダンス値と第三インピーダンス値との差分を用いて前記ＰＣＢ多層板の上層の第一の厚さを計算し、前記第二検出ユニットが取得した前記第二インピーダンス値と第四インピーダンス値との差分を用いて前記ＰＣＢ多層板の下層の第二の厚さを計算する第４ステップと、
を含み、
前記第一検出ユニットと前記第二検出ユニットは、いずれもマイクロストリップアンテナであり、当該マイクロストリップアンテナは、第一面及び反対になる第二面を有する基板、該基板の第二面に設けられた金属グラウンド層、該基板の第一面に設けられた輻射体、該基板の第一面に設けられたマイクロストリップライン、及び、送込み部を備え、
前記輻射体は、第一輻射部、第二輻射部、第三輻射部及び第四輻射部を有し、
前記マイクロストリップラインは、第一隔壁及び該第一隔壁と垂直に交わって接続する第二隔壁を有し、
前記送込み部は、前記金属グラウンド層に接続された接続端、及び該第一面に位置し且つ該接続端と該マイクロストリップラインに接続された送込み端を有し、
前記第一の厚さの計算とは該上層の第一、第三インピーダンス値の差分を該第一検出ユニット、第二検出ユニットの該上層、下層表面に向けて電界を生じる作用面積で除することであって、該第二の厚さの計算とは該下層の第二、第四インピーダンス値の差分を該第一、第二検出ユニットの該上層、下層表面に向けて電界を生じる作用面積で除することであることを特徴とする、ＰＣＢ多層板に応用した非接触式上下層銅厚の測量方法。 (A) The first step of preparing a first detection unit provided on the upper layer of the PCB multilayer plate and a second detection unit provided on the lower layer of the PCB multilayer plate.
(B) The first detection unit and the second detection unit generate alternating magnetic fields, respectively, to form eddy currents due to induced electromotive forces on the upper and lower surfaces of the PCB multilayer plate, and the first detection unit is described. The first impedance value of the upper layer is acquired by measuring the eddy current of the upper layer, and the second detection unit acquires the second impedance value of the lower layer by measuring the eddy current of the lower layer. The second step to do and
(C) A third step of acquiring the third impedance value of the upper layer and the fourth impedance value of the lower layer by repeating the same operation as the second step.
(D) The processing unit is electrically connected to the first detection unit and the second detection unit, and the PCB multilayer is used by using the difference between the first impedance value and the third impedance value acquired by the first detection unit. The first thickness of the upper layer of the board is calculated, and the difference between the second impedance value and the fourth impedance value acquired by the second detection unit is used to determine the second thickness of the lower layer of the PCB multilayer board. The 4th step to calculate and
Including
The first detection unit and the second detection unit are both microstrip antennas, and the microstrip antenna is provided on a substrate having a first surface and an opposite second surface, and a second surface of the substrate. It is provided with a metal ground layer, a radiator provided on the first surface of the substrate, a microstrip line provided on the first surface of the substrate, and a feeding portion.
The radiator has a first radiation unit, a second radiation unit, a third radiation unit, and a fourth radiation unit.
The microstrip line has a first partition and a second partition perpendicularly intersecting and connecting to the first partition.
The feeding portion has a connecting end connected to the metal ground layer and a feeding end located on the first surface and connected to the connecting end and the microstrip line.
The calculation of the first thickness is to divide the difference between the first and third impedance values of the upper layer by the area of action that generates an electric field toward the surface of the first detection unit and the upper layer and the lower layer of the second detection unit. That is, the calculation of the second thickness means that the difference between the second and fourth impedance values of the lower layer is directed toward the upper and lower surfaces of the first and second detection units to generate an electric field. A non-contact type upper and lower layer copper thickness measuring method applied to a PCB multilayer plate, which is characterized by being divided by. 前記第一検出ユニット及び第二検出ユニットのビーム幅（Ｂｅａｍ Ｗｉｄｔｈ）はＸであり、前記第一検出ユニットと該ＰＣＢ多層板の上層との間隔をｄ１とし、前記第二検出ユニットと該ＰＣＢ多層板の下層との間隔をｄ２とし、電界の該ＰＣＢ多層板の上層における作用面積Ａ１は、（（ｔａｎ（Ｘ／２）×ｄ１）×２）２であり、電界の該ＰＣＢ多層板の下層における作用面積Ａ２は、（（ｔａｎ（Ｘ／２）×ｄ２）×２）２である、請求項１に記載のＰＣＢ多層板に応用した非接触式上下層銅厚の測量方法。 The beam width (Beam Width) of the first detection unit and the second detection unit is X, the distance between the first detection unit and the upper layer of the PCB multilayer plate is d1, and the second detection unit and the PCB multilayer plate are set to d1. The distance from the lower layer of the plate is d2, the working area A1 of the electric field in the upper layer of the PCB multilayer plate is ((tan (X / 2) × d1) × 2) 2 , and the lower layer of the PCB multilayer plate of the electric field is (tan (X / 2) × d1) × 2) 2. The working area A2 in the above is ((tan (X / 2) × d2) × 2) 2 , which is a non-contact type upper and lower layer copper thickness measuring method applied to the PCB multilayer plate according to claim 1. 該第一検出ユニット、第二検出ユニットのビーム幅Ｘは６１度であることを特徴とする、請求項２に記載のＰＣＢ多層板に応用した非接触式上下層銅厚の測量方法。 The non-contact type upper and lower layer copper thickness measuring method applied to the PCB multilayer plate according to claim 2, wherein the beam width X of the first detection unit and the second detection unit is 61 degrees. 該第一検出ユニットと該ＰＣＢ多層板の上層との間隔は０．１ｍｍ～１０ｍｍであり、
該第二検出ユニットと該ＰＣＢ多層板の下層との間隔は０．１ｍｍ～１０ｍｍであることを特徴とする、請求項２に記載のＰＣＢ多層板に応用した非接触式上下層銅厚の測量方法。 The distance between the first detection unit and the upper layer of the PCB multilayer plate is 0.1 mm to 10 mm.
The non-contact type upper and lower copper thickness measurement applied to the PCB multilayer plate according to claim 2, wherein the distance between the second detection unit and the lower layer of the PCB multilayer plate is 0.1 mm to 10 mm. Method. 該基板はさらに第一辺、該第一辺と対向して設けられた第二辺、該第一辺と第二辺との間に位置した第三辺、及び該第三辺と対向して設けられた第四辺を有し、該マイクロストリップラインの第一隔壁は第一短辺及び対向した第二短辺を有し、該第二隔壁は第三短辺及び対向した第四短辺を有し、該第一短辺は該第一辺に接続しないが、該第二短辺は該第二辺に接続され、該第一、第二隔壁は四つの輻射区を規定し、該第一、第二、第三、第四輻射部は別々に該四つの輻射区に設けられる、請求項１に記載のＰＣＢ多層板に応用した非接触式上下層銅厚の測量方法。 The substrate is further opposed to the first side, the second side provided facing the first side, the third side located between the first side and the second side, and the third side. The first partition of the microstrip line has a first short side and an opposite second short side, and the second partition has a third short side and an opposite fourth short side. The first short side is not connected to the first side, but the second short side is connected to the second side, and the first and second partition walls define four radiation zones. The non-contact type upper and lower layer copper thickness measuring method applied to the PCB multilayer plate according to claim 1, wherein the first, second, third, and fourth radiation units are separately provided in the four radiation areas. 該第一、第三輻射部の片側及び該第二隔壁の第三短辺から該第三辺までの距離は同じであり、該第二、第四輻射部の片側及び該第二隔壁の第四短辺から該第四辺までの距離は同じであり、該第一隔壁の第一短辺から該第一辺までの距離は該第一、第二輻射部の片側から該第一辺までの距離より大きい、請求項５に記載のＰＣＢ多層板に応用した非接触式上下層銅厚の測量方法。 The distance from one side of the first and third radiating portions and the third short side of the second partition wall to the third side is the same, and one side of the second and fourth radiating portions and the second partition wall of the second partition wall are the same. The distance from the four short sides to the fourth side is the same, and the distance from the first short side of the first partition wall to the first side is from one side of the first and second radiating portions to the first side. The non-contact type upper and lower layer copper thickness measuring method applied to the PCB multilayer plate according to claim 5, which is larger than the distance of. 該第一、第三輻射部の片側及び該第三短辺から該第三辺までの距離と該第二、第四輻射部の片側及び該第四短辺から該第四辺までの距離とは、該第一、第二輻射部の片側から該第一辺までの距離と該第三、四輻射部の片側から該第二辺までの距離とより大きい、請求項６に記載のＰＣＢ多層板に応用した非接触式上下層銅厚の測量方法。 The distance from one side of the first and third radiating parts and the third short side to the third side and the distance from one side of the second and fourth radiating parts and the fourth short side to the fourth side. 6 is the PCB multilayer according to claim 6, which is larger than the distance from one side of the first and second radiating portions to the first side and the distance from one side of the third and fourth radiating portions to the second side. Non-contact type upper and lower layer copper thickness measurement method applied to plates. 該第一検出ユニット、第二検出ユニットの電界放射周波数は１ＭＨｚ～２．５ＧＨｚである、請求項１に記載のＰＣＢ多層板に応用した非接触式上下層銅厚の測量方法。 The non-contact type upper and lower layer copper thickness measuring method applied to the PCB multilayer plate according to claim 1, wherein the field emission frequencies of the first detection unit and the second detection unit are 1 MHz to 2.5 GHz. 該ＰＣＢ多層板の層数は２層～１６層である、請求項１に記載のＰＣＢ多層板に応用した非接触式上下層銅厚の測量方法。 The non-contact type upper and lower layer copper thickness measuring method applied to the PCB multilayer plate according to claim 1, wherein the number of layers of the PCB multilayer plate is 2 to 16. 該ＰＣＢ多層板の上層、下層構造は金属層であり、且つ該上層は該第一の厚さを有し、該下層は該第二の厚さを有するとともに、順番に内部へ少なくとも一つの絶縁層と少なくとも一つの粘着層から該ＰＣＢ多層板までの予定層数が積み上げられている、請求項１に記載のＰＣＢ多層板に応用した非接触式上下層銅厚の測量方法。 The upper and lower structures of the PCB multilayer board are metal layers, and the upper layer has the first thickness, the lower layer has the second thickness, and at least one insulation in order is provided inside. The non-contact type upper and lower layer copper thickness measuring method applied to the PCB multilayer board according to claim 1, wherein the planned number of layers from the layer and at least one adhesive layer to the PCB multilayer board is stacked.
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