TW555009U - Non-contact thickness measuring apparatus - Google Patents

Non-contact thickness measuring apparatus

Info

Publication number
TW555009U
TW555009U TW92202803U TW92202803U TW555009U TW 555009 U TW555009 U TW 555009U TW 92202803 U TW92202803 U TW 92202803U TW 92202803 U TW92202803 U TW 92202803U TW 555009 U TW555009 U TW 555009U
Authority
TW
Taiwan
Prior art keywords
measuring apparatus
thickness measuring
contact thickness
contact
thickness
Prior art date
Application number
TW92202803U
Other languages
Chinese (zh)
Inventor
Ting-Chiuan Tang
Ren-Jung Shiau
Huan-Jie Lai
Jing-Liang Fang
Original Assignee
Prec Machinery Res & Dev Cent
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Prec Machinery Res & Dev Cent filed Critical Prec Machinery Res & Dev Cent
Priority to TW92202803U priority Critical patent/TW555009U/en
Publication of TW555009U publication Critical patent/TW555009U/en

Links

TW92202803U 2003-02-24 2003-02-24 Non-contact thickness measuring apparatus TW555009U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92202803U TW555009U (en) 2003-02-24 2003-02-24 Non-contact thickness measuring apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92202803U TW555009U (en) 2003-02-24 2003-02-24 Non-contact thickness measuring apparatus

Publications (1)

Publication Number Publication Date
TW555009U true TW555009U (en) 2003-09-21

Family

ID=31975530

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92202803U TW555009U (en) 2003-02-24 2003-02-24 Non-contact thickness measuring apparatus

Country Status (1)

Country Link
TW (1) TW555009U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110779436A (en) * 2017-12-21 2020-02-11 陈建璋 Non-contact upper and lower layer copper thickness measuring method applied to PCB multi-layer board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110779436A (en) * 2017-12-21 2020-02-11 陈建璋 Non-contact upper and lower layer copper thickness measuring method applied to PCB multi-layer board

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model