CN202956085U - Printed circuit board via hole copper thickness tester based on eddy current method - Google Patents
Printed circuit board via hole copper thickness tester based on eddy current method Download PDFInfo
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- CN202956085U CN202956085U CN 201220665933 CN201220665933U CN202956085U CN 202956085 U CN202956085 U CN 202956085U CN 201220665933 CN201220665933 CN 201220665933 CN 201220665933 U CN201220665933 U CN 201220665933U CN 202956085 U CN202956085 U CN 202956085U
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- Prior art keywords
- via hole
- copper thickness
- hole copper
- oscillator
- circuit board
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 29
- 239000010949 copper Substances 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 16
- 230000010355 oscillation Effects 0.000 claims abstract description 12
- 238000012360 testing method Methods 0.000 claims abstract description 5
- 238000012986 modification Methods 0.000 abstract description 4
- 230000004048 modification Effects 0.000 abstract description 4
- 238000005259 measurement Methods 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 abstract 1
- 238000005253 cladding Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 230000005672 electromagnetic field Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005250 beta ray Effects 0.000 description 1
- 238000003869 coulometry Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
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- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
A printed circuit board via hole copper thickness tester based on an eddy current method comprises an eddy current sensor (1), an LC oscillator (2) and a micro controller (3). The eddy current sensor (1) is connected with an inductor L in the LC oscillator (2) and converts printed circuit board via hole copper thickness into modification quantity of oscillation frequency of the LC oscillator (2). The micro controller (3) is utilized to test modification quantity of the oscillation frequency of the LC oscillator (2), and the modification quantity is converted into the printed circuit board via hole copper thickness by calculation. The tester achieves accurate measurement of the printed circuit board via hole copper thickness, has no damage and reduces waste material and rework cost.
Description
Technical field
The utility model relates to a kind of printed-wiring board (PWB) via hole copper thickness tester based on electric vortex method, is mainly used in the test of printed-wiring board (PWB) via hole copper thickness.
Background technology
The metal cladding method for measuring thickness is a lot, as anodic solution coulometry, X ray spectral measurement method, β ray backscattering method etc., because these checkout equipments are worth too high, use complexity, the layman can not operate, therefore be not suitable for production scene, use, and the metal cladding pachymetries that just are based on electric vortex method that use in a large number at the scene.Utilize the high-frequency alternating electric current to produce the high-frequency alternating electromagnetic field in inductor coil, when this high-frequency alternating elect magnetic field has metal cladding, metal cladding produces current vortex, and the size of this current vortex is relevant with metal cladding thickness.This current vortex produces retroactive effect to inductor coil, by the size of measuring retroactive effect, just can measure metal cladding thickness.
The utility model is the retroactive effect to LC oscillator 2 by the inductor coil in current vortex sensor 1, make the oscillation frequency of LC oscillator 2 produce the change amount, accurately calculated the thickness of tested printed-wiring board (PWB) via hole copper metal cladding by microcontroller 3 according to this change amount.
Summary of the invention
The purpose of this utility model be to provide a kind of by electric vortex method for measuring the concrete application of printed-wiring board (PWB) via hole copper thickness.It is nondestructive that purpose is to utilize a kind of printed-wiring board (PWB) via hole copper thickness tester based on electric vortex method to realize, the precision measurement of the copper thickness that via hole before and after the printed-wiring board (PWB) etching is electroplated.
For achieving the above object, the technical solution adopted in the utility model is as follows:
A kind of printed-wiring board (PWB) via hole copper thickness tester based on electric vortex method, comprise current vortex sensor 1, LC oscillator 2, microcontroller 3.Current vortex sensor 1 is in parallel with inductor L in LC oscillator 2, the oscillation frequency output termination microcontroller 3 of LC oscillator 2.
Described current vortex sensor 1 is for changing printed-wiring board (PWB) via hole copper thickness into the change amount of the oscillation frequency of LC oscillator 2.
Utilize the change amount of the oscillation frequency of microcontroller 3 test LC oscillators 2, be converted into as calculated printed-wiring board (PWB) via hole copper thickness.
The beneficial effects of the utility model are:
Printed-wiring board (PWB) via hole copper thickness tester based on electric vortex method of the present utility model can be realized nondestructive, the precision measurement of the copper thickness that via hole before and after the printed-wiring board (PWB) etching is electroplated, thus reduce scrappage, cost-saving.
The accompanying drawing explanation
Fig. 1 is the structural representation of the printed-wiring board (PWB) via hole copper thickness tester based on electric vortex method of the present utility model.
Fig. 2 is LC oscillator schematic diagram of the present utility model.Current vortex sensor is in parallel with inductor L in the LC oscillator.
In figure: 1 is that current vortex sensor, 2 is that LC oscillator, 3 is microcontroller.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described:
As Fig. 1, a kind of printed-wiring board (PWB) via hole copper thickness tester based on electric vortex method, comprise current vortex sensor 1, LC oscillator 2, microcontroller 3.Current vortex sensor 1 is in parallel referring to Fig. 2 with inductor L in LC oscillator 2.Utilize in the inductor coil of high-frequency alternating electric current in current vortex sensor 1 and produce the high-frequency alternating electromagnetic field, when this high-frequency alternating electromagnetic field approaches printed-wiring board (PWB) via hole copper capping layer, the via hole copper capping layer produces current vortex, and the size of this current vortex is relevant with metal cladding thickness.This current vortex produces retroactive effect to the inductor coil in current vortex sensor 1.Because current vortex sensor 1 is in parallel with inductor L in LC oscillator 2, referring to Fig. 2, the oscillation frequency of LC oscillator 2 has produced variation, be also that current vortex sensor 1 changes printed-wiring board (PWB) via hole copper thickness into the change amount of the oscillation frequency of LC oscillator 2, utilize the oscillation frequency change amount of microcontroller 3 test LC oscillators 2, be converted into as calculated printed-wiring board (PWB) via hole copper thickness and show the thick value of copper for display.
Embodiment recited above is described preferred implementation of the present utility model; not design of the present utility model and scope are limited; do not breaking away under the utility model design concept prerequisite; various modification and improvement that in this area, common engineering technical personnel make the technical solution of the utility model; all should fall into protection domain of the present utility model, the technology contents that the utility model is asked for protection all is documented in claims.
Claims (3)
1. the printed-wiring board (PWB) via hole copper thickness tester based on electric vortex method, it is characterized in that comprising current vortex sensor (1), LC oscillator (2), microcontroller (3), current vortex sensor (1) is in parallel with inductor L in LC oscillator (2), the oscillation frequency output termination microcontroller (3) of LC oscillator (2).
2. the printed-wiring board (PWB) via hole copper thickness tester based on electric vortex method according to claim 1, is characterized in that described current vortex sensor (1) is for changing printed-wiring board (PWB) via hole copper thickness into the change amount of the oscillation frequency of LC oscillator (2).
3. the printed-wiring board (PWB) via hole copper thickness tester based on electric vortex method according to claim 1, is characterized in that utilizing microcontroller (3) to test the change amount of the oscillation frequency of LC oscillator (2), is converted into as calculated printed-wiring board (PWB) via hole copper thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220665933 CN202956085U (en) | 2012-12-06 | 2012-12-06 | Printed circuit board via hole copper thickness tester based on eddy current method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220665933 CN202956085U (en) | 2012-12-06 | 2012-12-06 | Printed circuit board via hole copper thickness tester based on eddy current method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202956085U true CN202956085U (en) | 2013-05-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220665933 Expired - Fee Related CN202956085U (en) | 2012-12-06 | 2012-12-06 | Printed circuit board via hole copper thickness tester based on eddy current method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202956085U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108225168A (en) * | 2018-01-25 | 2018-06-29 | 江西景旺精密电路有限公司 | A kind of PCB aperture copper and face copper online testing device and test method |
| CN110375696A (en) * | 2019-07-23 | 2019-10-25 | 福州瑞华印制线路板有限公司 | A kind of method of quick reckoning PCB via hole hole copper thickness |
| TWI681184B (en) * | 2017-12-21 | 2020-01-01 | 國立虎尾科技大學 | Measuring method of non-contact upper and lower copper thickness applied to PCB multilayer board |
| CN111024020A (en) * | 2019-12-18 | 2020-04-17 | 无锡深南电路有限公司 | Method for measuring thickness of measuring tool plate and circuit board metal layer |
-
2012
- 2012-12-06 CN CN 201220665933 patent/CN202956085U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI681184B (en) * | 2017-12-21 | 2020-01-01 | 國立虎尾科技大學 | Measuring method of non-contact upper and lower copper thickness applied to PCB multilayer board |
| CN110779436A (en) * | 2017-12-21 | 2020-02-11 | 陈建璋 | Non-contact measurement method of copper thickness of upper and lower layers applied to PCB multilayer board |
| CN110779436B (en) * | 2017-12-21 | 2021-07-09 | 陈建璋 | Non-contact measurement method of copper thickness of upper and lower layers applied to PCB multilayer board |
| CN108225168A (en) * | 2018-01-25 | 2018-06-29 | 江西景旺精密电路有限公司 | A kind of PCB aperture copper and face copper online testing device and test method |
| CN110375696A (en) * | 2019-07-23 | 2019-10-25 | 福州瑞华印制线路板有限公司 | A kind of method of quick reckoning PCB via hole hole copper thickness |
| CN110375696B (en) * | 2019-07-23 | 2021-07-09 | 福州瑞华印制线路板有限公司 | Method for rapidly calculating thickness of copper in PCB (printed circuit board) via hole |
| CN111024020A (en) * | 2019-12-18 | 2020-04-17 | 无锡深南电路有限公司 | Method for measuring thickness of measuring tool plate and circuit board metal layer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160621 Address after: 211106, 3 Nanjing, Jiangning economic and Technological Development Zone, Jiangsu, Patentee after: JOINT STARS TECHNOLOGY Co.,Ltd. Address before: 211100 Nanjing, Jiangsu province Jiangning District 3128 printing Avenue Patentee before: JOINT POWER TECHNOLOGY Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130529 Termination date: 20211206 |