JP2022000669A - カメラモジュール - Google Patents
カメラモジュール Download PDFInfo
- Publication number
- JP2022000669A JP2022000669A JP2020105725A JP2020105725A JP2022000669A JP 2022000669 A JP2022000669 A JP 2022000669A JP 2020105725 A JP2020105725 A JP 2020105725A JP 2020105725 A JP2020105725 A JP 2020105725A JP 2022000669 A JP2022000669 A JP 2022000669A
- Authority
- JP
- Japan
- Prior art keywords
- imager
- camera module
- lens member
- lens
- image pickup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 claims abstract description 46
- 230000002093 peripheral effect Effects 0.000 claims abstract description 37
- 238000003384 imaging method Methods 0.000 claims abstract description 28
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 21
- 230000003287 optical effect Effects 0.000 claims description 62
- 239000000758 substrate Substances 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 10
- 230000005540 biological transmission Effects 0.000 abstract 2
- 230000010485 coping Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 12
- 230000004048 modification Effects 0.000 description 8
- 238000012986 modification Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 230000000295 complement effect Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000001629 suppression Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910001338 liquidmetal Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Aviation & Aerospace Engineering (AREA)
- Studio Devices (AREA)
- Lens Barrels (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
Abstract
Description
撮像対象範囲の光像(3)を撮像するように、構成されるカメラモジュール(1)であって、
撮像対象範囲から光像(3)が入射するレンズ部材(10)と、
レンズ部材とは反対側へ湾曲する湾曲部(203)を有し、レンズ部材を通して湾曲部に結像される光像を撮影するイメージャ(20)と、
レンズ部材及びイメージャの間を光学的に結合し、レンズ部材からイメージャへ光像を透過させる透光部材(40)と、
イメージャの外周部(202)を保持する保持部(601)、並びに保持部の内周側に形成されて放熱流体(603,2603)の対流する流体空間部(602)を、湾曲部の透光部材とは反対側に有する台座(60)と、を備えるカメラモジュールである。
図1に示す第一実施形態のカメラモジュール1は、撮像対象範囲からの光像3(後述の図2参照)を撮影するように、構成されている。カメラモジュール1は、車両に搭載されることで、当該車両の外界を撮像対象範囲として撮像する。カメラモジュール1は、レンズ部材10、イメージャ20、撮像基板30、透光部材40、鏡筒50及び台座60を備えている。
図4に示すように第二実施形態は、第一実施形態の変形例である。
Claims (10)
- 撮像対象範囲の光像(3)を撮像するように、構成されるカメラモジュール(1)であって、
前記撮像対象範囲から前記光像(3)が入射するレンズ部材(10)と、
前記レンズ部材とは反対側へ湾曲する湾曲部(203)を有し、前記レンズ部材を通して前記湾曲部に結像される前記光像を撮影するイメージャ(20)と、
前記レンズ部材及び前記イメージャの間を光学的に結合し、前記レンズ部材から前記イメージャへ前記光像を透過させる透光部材(40)と、
前記イメージャの外周部(202)を保持する保持部(601)、並びに前記保持部の内周側に形成されて放熱流体(603,2603)の対流する流体空間部(602)を、前記湾曲部の透光部材とは反対側に有する台座(60)と、を備えるカメラモジュール。 - 前記流体空間部には、前記放熱流体(603)としての空気が封入される請求項1に記載のカメラモジュール。
- 前記流体空間部には、前記放熱流体(2603)としての液体が封入される請求項1に記載のカメラモジュール。
- 前記保持部は、前記イメージャにおいて前記撮像対象範囲からの前記光像の結像が外れる前記外周部を、保持する請求項1〜3のいずれか一項に記載のカメラモジュール。
- 前記イメージャとワイヤボンディングされる撮像基板(30)を、さらに備え、
筒状の前記保持部が内周側に形成する前記流体空間部には、前記撮像基板が前記湾曲部とは反対側から露出する請求項1〜4のいずれか一項に記載のカメラモジュール。 - 前記台座と共に前記撮像基板に固定され、前記レンズ部材及び前記透光部材を保持する鏡筒(50)を、さらに備える請求項5に記載のカメラモジュール。
- 前記レンズ部材は、前記イメージャ側へ向かって凸の出射レンズ面(101)を有し、前記光像に対して正のパワーを与える請求項1〜6のいずれか一項に記載のカメラモジュール。
- 前記透光部材は、前記出射レンズ面に対して面合わせされる入射凹面(400)と、前記湾曲部に対して面合わせされる出射凸面(401)とを、有する請求項7に記載のカメラモジュール。
- 前記出射レンズ面と前記入射凹面とは、機械的に接合される請求項8に記載のカメラモジュール。
- 車両の外界における前記撮像対象範囲を撮像するように、構成される請求項1〜9のいずれか一項に記載のカメラモジュール。
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JP2020105725A JP7559372B2 (ja) | 2020-06-19 | 2020-06-19 | カメラモジュール |
US17/348,884 US20210399034A1 (en) | 2020-06-19 | 2021-06-16 | Camera module |
CN202110664323.0A CN113890966A (zh) | 2020-06-19 | 2021-06-16 | 相机模块 |
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US4233645A (en) * | 1978-10-02 | 1980-11-11 | International Business Machines Corporation | Semiconductor package with improved conduction cooling structure |
US6791072B1 (en) * | 2002-05-22 | 2004-09-14 | National Semiconductor Corporation | Method and apparatus for forming curved image sensor module |
JP4424470B2 (ja) | 2003-12-02 | 2010-03-03 | ソニー株式会社 | 固体撮像装置 |
JP2008524832A (ja) | 2004-10-22 | 2008-07-10 | ナノクーラーズ,インコーポレイテッド | 相変化材料を用いた過渡的な熱負荷の熱電冷却および/または緩和 |
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JP2007080579A (ja) * | 2005-09-12 | 2007-03-29 | Toyota Industries Corp | 面発光装置 |
JP2007266380A (ja) | 2006-03-29 | 2007-10-11 | Matsushita Electric Ind Co Ltd | 半導体撮像装置およびその製造方法 |
JP2009297385A (ja) | 2008-06-17 | 2009-12-24 | Olympus Corp | 内視鏡装置及び内視鏡冷却装置 |
TWI483056B (zh) * | 2011-02-21 | 2015-05-01 | Hon Hai Prec Ind Co Ltd | 相機模組 |
US20140168507A1 (en) * | 2012-12-17 | 2014-06-19 | Integrated Micro-Electronics, Inc. | Camera Module With Enhanced Heat Dissipation |
JP2015026946A (ja) | 2013-07-25 | 2015-02-05 | 株式会社東芝 | カメラモジュール |
JP2015031937A (ja) | 2013-08-07 | 2015-02-16 | パナソニック株式会社 | 撮像装置 |
KR102328149B1 (ko) | 2014-10-31 | 2021-11-18 | 에스케이하이닉스 주식회사 | 커브드 이미지 센서, 그 제조방법 및 이를 구비한 전자장치 |
KR102328140B1 (ko) | 2014-12-15 | 2021-11-18 | 에스케이하이닉스 주식회사 | 커브드 이미지 센서, 그 제조방법 및 이를 구비한 전자장치 |
JP6954243B2 (ja) | 2018-07-25 | 2021-10-27 | トヨタ自動車株式会社 | 運転支援装置 |
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