JP2021523563A - ウエハチャックアセンブリ - Google Patents
ウエハチャックアセンブリ Download PDFInfo
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- JP2021523563A JP2021523563A JP2020561823A JP2020561823A JP2021523563A JP 2021523563 A JP2021523563 A JP 2021523563A JP 2020561823 A JP2020561823 A JP 2020561823A JP 2020561823 A JP2020561823 A JP 2020561823A JP 2021523563 A JP2021523563 A JP 2021523563A
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- KJFBVJALEQWJBS-XUXIUFHCSA-N maribavir Chemical compound CC(C)NC1=NC2=CC(Cl)=C(Cl)C=C2N1[C@H]1O[C@@H](CO)[C@H](O)[C@@H]1O KJFBVJALEQWJBS-XUXIUFHCSA-N 0.000 claims description 3
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Images
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6835—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Abstract
【選択図】図3
Description
本願は、共に全文が本明細書に参照として援用される、2018年5月4日出願の米国仮特許出願第62/667,190号、および、2018年12月10日出願の米国特許出願第16/215,608号の優先権の利益を主張する。
Claims (15)
- ウエハを支持するためのウエハチャックアセンブリであって、
チャックハブと、
前記チャックハブ内に配置されたセンタリングハブと、
係合位置と非係合位置との間で動作可能な係合装置であって、それぞれ、前記チャックハブを前記センタリングハブと係合して、その間の時計回り回転方向もしくは反時計回り回転方向の相対動作を防ぐ、または、その間のいずれかの回転方向の相対動作を可能にする、係合装置と、
ウエハ処理動作およびウエハセンタリング動作の間に、前記係合装置の前記係合位置または前記非係合位置に基づいて、前記チャックハブおよび/または前記センタリングハブを選択的に回転させるためのチャックモータと、
前記チャックハブに取り付けられた複数のチャックアームであって、各チャックアームは、前記チャックハブに隣接する近位端とそこから離れた先端との間で径方向に伸びる、複数のチャックアームと、
複数のセンタリングカムであって、各センタリングカムは、チャックアームの先端に、または先端に向けて取り付けられ、前記チャックハブに対する前記センタリングハブの回転動作に応答して支持されたウエハのエッジを係合するまたは解放するように、前記センタリングハブに対して径方向内向きまたは外向きに動作可能である、複数のセンタリングカムと、
を備える、ウエハチャックアセンブリ。 - 請求項1に記載のウエハチャックアセンブリであって、
前記チャックモータは、前記ウエハセンタリング動作の間に、前記センタリングハブと前記チャックハブとの間に相対回転動作を加えるように構成されている、ウエハチャックアセンブリ。 - 請求項2に記載のウエハチャックアセンブリであって、
前記センタリングハブは、前記ウエハセンタリング動作中は前記チャックモータに固定され、前記チャックモータは、前記ウエハセンタリング動作中に前記チャックハブを第1の回転方向に回転させるように構成されている、ウエハチャックアセンブリ。 - 請求項3に記載のウエハチャックアセンブリであって、
前記チャックモータは、前記ウエハ処理動作中に前記センタリングハブおよび前記チャックハブを一緒に同一回転方向に回転させるように構成されている、ウエハチャックアセンブリ。 - 請求項4に記載のウエハチャックアセンブリであって、
前記ウエハ処理動作中の前記センタリングハブおよび前記チャックハブの前記同一回転方向は、前記ウエハセンタリング動作中の前記チャックハブの前記第1の回転方向とは反対である、ウエハチャックアセンブリ。 - 請求項1に記載のウエハチャックアセンブリであって、
前記センタリングハブは、その外面に少なくとも1つのカム面を含む、ウエハチャックアセンブリ。 - 請求項6に記載のウエハチャックアセンブリであって、
各チャックアームは、前記センタリングハブの前記少なくとも1つのカム面と、前記複数のセンタリングカムの各チャックアームの先端に配置されたセンタリングカムとの間に動作的に配置された、それぞれの細長い作動棒を備える、ウエハチャックアセンブリ。 - 請求項7に記載のウエハチャックアセンブリであって、
各細長い作動棒は、その近位端に、前記センタリングハブの前記少なくとも1つのカム面を係合するための軸受面を備える、ウエハチャックアセンブリ。 - 請求項7に記載のウエハチャックアセンブリであって、
各細長い作動棒は、その前記先端に、それぞれのチャックアームのそれぞれのセンタリングカムとの連結部を備える、ウエハチャックアセンブリ。 - 請求項9に記載のウエハチャックアセンブリであって、
前記センタリングハブの回転動作により、前記センタリングハブのそれぞれのカム面が、それぞれの細長い作動棒を径方向外向きに促すことで、前記連結部を介してそれぞれのセンタリングカムを作動させる、ウエハチャックアセンブリ。 - 請求項1に記載のウエハチャックアセンブリであって、さらに、
前記ウエハセンタリング動作および/または前記ウエハ処理動作の間に前記ウエハを支持するための少なくとも1つの真空パッドを備える、ウエハチャックアセンブリ。 - 請求項11に記載のウエハチャックアセンブリであって、
前記少なくとも1つの真空パッドは、前記ウエハが前記複数のセンタリングカムに解放されたときに、少なくとも前記ウエハ処理動作の間は、前記ウエハチャックアセンブリのセンタリングされた位置に前記ウエハを維持するように構成されている、ウエハチャックアセンブリ。 - 請求項11に記載のウエハチャックアセンブリであって、
前記少なくとも1つの真空パッドは、前記複数のチャックアームのうちの少なくとも1つに設けられる、ウエハチャックアセンブリ。 - 請求項11に記載のウエハチャックアセンブリであって、
前記複数のチャックアームの各々は、前記少なくとも1つの真空パッドに真空圧を供給するための真空ラインを備える、ウエハチャックアセンブリ。 - 請求項14に記載のウエハチャックアセンブリであって、
前記少なくとも1つの真空パッドにおける真空圧の有無は、検出されて、前記ウエハチャックアセンブリ内の前記ウエハの有無、または欠陥ウエハの存在に関連付けられる、ウエハチャックアセンブリ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023183644A JP2024001262A (ja) | 2018-05-04 | 2023-10-26 | ウエハチャックアセンブリ |
JP2023183646A JP2024001263A (ja) | 2018-05-04 | 2023-10-26 | ウエハチャックアセンブリ |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862667190P | 2018-05-04 | 2018-05-04 | |
US62/667,190 | 2018-05-04 | ||
US16/215,608 US10811299B2 (en) | 2018-05-04 | 2018-12-10 | Wafer chuck assembly |
US16/215,608 | 2018-12-10 | ||
PCT/US2019/030616 WO2019213533A1 (en) | 2018-05-04 | 2019-05-03 | Wafer chuck assembly |
Related Child Applications (2)
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JP2023183644A Division JP2024001262A (ja) | 2018-05-04 | 2023-10-26 | ウエハチャックアセンブリ |
JP2023183646A Division JP2024001263A (ja) | 2018-05-04 | 2023-10-26 | ウエハチャックアセンブリ |
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JP2021523563A true JP2021523563A (ja) | 2021-09-02 |
JP7376507B2 JP7376507B2 (ja) | 2023-11-08 |
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JP2020561823A Active JP7376507B2 (ja) | 2018-05-04 | 2019-05-03 | ウエハチャックアセンブリ |
JP2023183644A Pending JP2024001262A (ja) | 2018-05-04 | 2023-10-26 | ウエハチャックアセンブリ |
JP2023183646A Pending JP2024001263A (ja) | 2018-05-04 | 2023-10-26 | ウエハチャックアセンブリ |
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JP2023183644A Pending JP2024001262A (ja) | 2018-05-04 | 2023-10-26 | ウエハチャックアセンブリ |
JP2023183646A Pending JP2024001263A (ja) | 2018-05-04 | 2023-10-26 | ウエハチャックアセンブリ |
Country Status (6)
Country | Link |
---|---|
US (3) | US10811299B2 (ja) |
JP (3) | JP7376507B2 (ja) |
KR (3) | KR20240042132A (ja) |
CN (1) | CN112368820A (ja) |
TW (1) | TWI826441B (ja) |
WO (1) | WO2019213533A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11508609B2 (en) | 2018-05-04 | 2022-11-22 | Lam Research Corporation | Wafer chuck assembly |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI766105B (zh) | 2017-09-28 | 2022-06-01 | 美商魯道夫科技股份有限公司 | 晶圓級封裝組裝體處置 |
US11524392B2 (en) * | 2020-11-24 | 2022-12-13 | Applied Materials, Inc. | Minimal contact gripping of thin optical devices |
WO2023114729A1 (en) * | 2021-12-16 | 2023-06-22 | Lam Research Corporation | Hexapod-based pedestal systems for use in semiconductor processing operations |
CN117080155B (zh) * | 2023-10-13 | 2024-04-09 | 无锡星微科技有限公司 | 晶圆检测用多自由度移动装置 |
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JPH11163094A (ja) * | 1997-12-01 | 1999-06-18 | Sugai:Kk | 基板チャッキング装置および基板洗浄装置 |
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US20100219920A1 (en) * | 2009-02-27 | 2010-09-02 | Novellus Systems, Inc. | Magnetically actuated chuck for edge bevel removal |
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2019
- 2019-04-29 TW TW108114847A patent/TWI826441B/zh active
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US11508609B2 (en) | 2018-05-04 | 2022-11-22 | Lam Research Corporation | Wafer chuck assembly |
Also Published As
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US20200411358A1 (en) | 2020-12-31 |
US20210183684A1 (en) | 2021-06-17 |
KR20240042132A (ko) | 2024-04-01 |
TWI826441B (zh) | 2023-12-21 |
JP2024001263A (ja) | 2024-01-09 |
TW202018856A (zh) | 2020-05-16 |
JP2024001262A (ja) | 2024-01-09 |
WO2019213533A1 (en) | 2019-11-07 |
KR102649646B1 (ko) | 2024-03-21 |
KR20200140926A (ko) | 2020-12-16 |
JP7376507B2 (ja) | 2023-11-08 |
US20190341290A1 (en) | 2019-11-07 |
KR20240042133A (ko) | 2024-04-01 |
US11508609B2 (en) | 2022-11-22 |
US10811299B2 (en) | 2020-10-20 |
CN112368820A (zh) | 2021-02-12 |
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