JP2021518481A - 紙ブッシングの含浸に使用するための組成物 - Google Patents
紙ブッシングの含浸に使用するための組成物 Download PDFInfo
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- 239000000203 mixture Substances 0.000 title claims abstract description 86
- 238000005470 impregnation Methods 0.000 title claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 35
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims abstract description 23
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 claims abstract description 16
- -1 alkylamine aminoethyl alcohols Chemical group 0.000 claims abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 16
- 239000004593 Epoxy Substances 0.000 claims description 13
- YSAANLSYLSUVHB-UHFFFAOYSA-N 2-[2-(dimethylamino)ethoxy]ethanol Chemical compound CN(C)CCOCCO YSAANLSYLSUVHB-UHFFFAOYSA-N 0.000 claims description 4
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 claims description 4
- 229940043276 diisopropanolamine Drugs 0.000 claims description 4
- 229940102253 isopropanolamine Drugs 0.000 claims description 4
- LSYBWANTZYUTGJ-UHFFFAOYSA-N 2-[2-(dimethylamino)ethyl-methylamino]ethanol Chemical compound CN(C)CCN(C)CCO LSYBWANTZYUTGJ-UHFFFAOYSA-N 0.000 claims description 3
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 150000003973 alkyl amines Chemical group 0.000 claims description 3
- CSHJJWDAZSZQBT-UHFFFAOYSA-N 7a-methyl-4,5-dihydro-3ah-2-benzofuran-1,3-dione Chemical compound C1=CCCC2C(=O)OC(=O)C21C CSHJJWDAZSZQBT-UHFFFAOYSA-N 0.000 claims 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 abstract description 12
- 150000002170 ethers Chemical class 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 14
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 14
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 12
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- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 6
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- 229920003326 Araldite® GY 280 Polymers 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
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- 239000003431 cross linking reagent Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 231100000615 substance of very high concern Toxicity 0.000 description 2
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- 230000002588 toxic effect Effects 0.000 description 2
- 239000003440 toxic substance Substances 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- QDCPNGVVOWVKJG-VAWYXSNFSA-N 2-[(e)-dodec-1-enyl]butanedioic acid Chemical compound CCCCCCCCCC\C=C\C(C(O)=O)CC(O)=O QDCPNGVVOWVKJG-VAWYXSNFSA-N 0.000 description 1
- FAUAZXVRLVIARB-UHFFFAOYSA-N 4-[[4-[bis(oxiran-2-ylmethyl)amino]phenyl]methyl]-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC(CC=2C=CC(=CC=2)N(CC2OC2)CC2OC2)=CC=1)CC1CO1 FAUAZXVRLVIARB-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
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- 230000009286 beneficial effect Effects 0.000 description 1
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- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 235000019504 cigarettes Nutrition 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
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- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000036541 health Effects 0.000 description 1
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- 239000011810 insulating material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
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- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002121 nanofiber Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 231100000167 toxic agent Toxicity 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L75/04—Polyurethanes
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H17/00—Non-fibrous material added to the pulp, characterised by its constitution; Paper-impregnating material characterised by its constitution
- D21H17/20—Macromolecular organic compounds
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- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
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- H01B3/52—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials wood; paper; press board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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Abstract
Description
−ビス(3−ジメチルアミノプロピル)−N−イソプロパノールアミン、2−(2−ジメチルアミノエトキシ)エタノール、N,N,N’−トリメチルアミノエチル−エタノールアミン、N,N−ジメチルエタノールアミン、又はそれらの組み合わせを含む。
、樹脂は、少なくとも一部分のより長い分子、即ち1つを超えるビスフェノール単位を有する分子を含む。この特定の選択により、実施例からより詳細に理解できるように、硬化した生成物の卓越した特性がもたらされる。
Araldite(登録商標)MY 740樹脂:エポキシ指数(ISO 3001)5.25〜5.55eq/kgを有するBADGE
Aradur(登録商標)HY 1102硬化剤:MHHPA
Accelerator DY 062促進剤:BDMA
XB 5860:3〜7重量%の4,4’−メチレン−ビス[N,N−ビス(2,3−エポキシプロピル)アニリン]を含む、BADGEに基づく樹脂配合物
Aradur(登録商標)HY 1235硬化剤:HHPAとMHHPAの混合物
Aradur(登録商標)HY 918−1硬化剤:ISO 12058に従って25℃で50〜80mPasの粘度を有する、MTHPAの様々な異性体の混合物
Araldite(登録商標)GY 280樹脂:エポキシ指数(ISO 3001)3.57〜4.45eq/kgを有するBADGE
Araldite(登録商標)GY 281樹脂:エポキシ指数(ISO 3001)5.80〜6.30eq/kgを有するビスフェノール−F−ジグリシジルエーテル(BFDGE)
JEFFCAT(登録商標)ZF 10促進剤:N,N,N’−トリメチル−N’−ヒドロキシエチル−ビスアミノ−エチルエーテル
200gのAraldite(登録商標)MY 740樹脂を金属反応器に入れた。次いで、180gのAradur(登録商標)HY 1102硬化剤及び0.1gのAccelerator DY 062促進剤を加えた。次いで、アンカースターラーを用いて成分を周囲温度で約15分間撹拌した。最後に、反応器を真空に供して混合物から全て又は実質的に全ての気泡を除去した。
って決定した。
200gのXB 5860を金属反応器に入れた。次いで、170gのAradur(登録商標)HY 1235硬化剤を加えた。次いで、アンカースターラーを用いて成分を周囲温度で約15分間撹拌した。最後に、反応器を真空に供して混合物から全て又は実質的に全ての気泡を除去した。
200gのAraldite(登録商標)MY 740樹脂を金属反応器に入れた。次いで、170gのAradur(登録商標)HY 918−1硬化剤及び0.1gのAccelerator DY 062促進剤を加えた。次いで、アンカースターラーを用いて成分を周囲温度で約15分間撹拌した。最後に、反応器を真空に供して混合物から全て又は実質的に全ての気泡を除去した。
200gのAraldite(登録商標)MY 740樹脂を金属反応器に入れた。次いで、170gのAradur(登録商標)HY 918−1硬化剤及び0.4gのAccelerator DY 062促進剤を加えた。次いで、アンカースターラーを用いて成分を周囲温度で約15分間混合した。最後に、反応器を真空に供して混合物から全て又は実質的に全ての気泡を除去した。
160gのAraldite(登録商標)GY 280樹脂及び40gのAraldite(登録商標)GY 281樹脂を金属反応器に入れた。次いで、180gのAradur(登録商標)HY 918−1硬化剤及び0.14gのJEFFCAT(登録商標)ZF 10促進剤を加えた。次いで、アンカースターラーを用いて成分を周囲温度で約15分間混合した。最後に、反応器を真空に供して全て又は実質的に全ての気泡を除去した。
δを低下させること、更に、より容易な含浸のために粘度を低下させることが所望される。
Claims (15)
- 紙ブッシングの含浸に使用するための硬化性混合物であって、(i)ビスフェノール−A−ジグリシジルエーテル(BADGE)及びビスフェノール−F−ジグリシジルエーテル(BFDGE)を含む樹脂混合物と、(ii)硬化剤としてのメチルテトラヒドロフタル酸無水物(MTHPA)と、(iii)第3級アルキルアミンアミノエチルアルコール及び/又はその対応するエーテルから選択される促進剤とを含む、硬化性組成物。
- ISO 3001によるBADGEのエポキシ指数が、3〜5eq/kgの範囲である、請求項1に記載の硬化性混合物。
- ISO 3001によるBADGEのエポキシ指数が、3.5〜4.5eq/kgの範囲である、請求項2に記載の硬化性混合物。
- ISO 3001によるBFDGEのエポキシ指数が、5〜6.45eq/kgである、請求項1〜3のいずれか一項に記載の硬化性混合物。
- ISO 3001によるBFDGEのエポキシ指数が、5.3〜6.3eq/kgである、請求項4に記載の硬化性混合物。
- BADGE及びBFDGEが、1:10〜10:1の重量比で樹脂混合物中に存在する、先行する請求項のいずれか一項に記載の硬化性混合物。
- 硬化性混合物が、樹脂混合物を基準とした化学量論量の80重量%〜120重量%に相当する量のMTHPAを含む、先行する請求項のいずれか一項に記載の硬化性混合物。
- 硬化性混合物が、樹脂混合物を基準とした化学量論量に相当する量のMTHPAを含む、請求項7に記載の硬化性混合物。
- 硬化性混合物が、100pbwの樹脂混合物を基準として<0.2pbwの量の促進剤を含む、先行する請求項のいずれか一項に記載の硬化性混合物。
- 硬化性混合物が、100pbwの樹脂混合物を基準として0.01〜0.10pbwの量の促進剤を含む、請求項9に記載の硬化性混合物。
- 促進剤が、N,N,N’−トリメチル−N’−ヒドロキシエチル−ビスアミノエチルエーテル、N−(3−ジメチルアミノプロピル)−N,N−ジイソプロパノールアミン、N,N−ビス(3−ジメチルアミノプロピル)−N−イソプロパノールアミン、2−(2−ジメチルアミノエトキシ)エタノール、N,N,N’−トリメチルアミノエチル−エタノールアミン、N,N−ジメチルエタノールアミン、又はそれらの組み合わせから選択される、先行する請求項のいずれか一項に記載の硬化性混合物。
- 促進剤が、N,N,N’−トリメチル−N’−ヒドロキシエチル−ビスアミノエチルエーテルである、請求項11に記載の硬化性混合物。
- 先行する請求項のいずれか一項に記載の組成物を含浸させた紙ブッシング。
- 紙ブッシングが、高電圧用途のためのブッシングである、請求項13に記載の紙ブッシング。
- 特に高電圧用途のための、紙ブッシング用の含浸系としての請求項1〜10のいずれか一項に記載の硬化性混合物の使用。
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PCT/EP2019/054430 WO2019174891A1 (en) | 2018-03-16 | 2019-02-22 | Compositions for use in impregnation of paper bushings |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0523001A1 (de) * | 1991-06-20 | 1993-01-13 | Ciba-Geigy Ag | Härtbare Epoxidharz-Zusammensetzung enthaltend einen blockierten Beschleuniger |
JPH1160696A (ja) * | 1997-08-14 | 1999-03-02 | Tosoh Corp | エポキシ樹脂組成物 |
JP2010523747A (ja) * | 2007-04-03 | 2010-07-15 | アーベーベー・リサーチ・リミテッド | 硬化性エポキシ樹脂組成物 |
JP2018012745A (ja) * | 2016-07-19 | 2018-01-25 | 住友ベークライト株式会社 | 注型用エポキシ樹脂組成物及び電気・電子部品 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3271509A (en) | 1963-04-12 | 1966-09-06 | Westinghouse Electric Corp | Electrical insulation for condenser bushings and the like |
EP1754733A1 (en) * | 2005-07-26 | 2007-02-21 | Huntsman Advanced Materials (Switzerland) GmbH | Composition |
ATE522912T1 (de) | 2005-12-14 | 2011-09-15 | Abb Research Ltd | Hochspannungsdurchführung |
CN103649160B (zh) | 2011-05-13 | 2016-01-13 | 陶氏环球技术有限责任公司 | 绝缘制剂 |
WO2013017149A1 (en) | 2011-07-29 | 2013-02-07 | Abb Research Ltd | Curable epoxy resin composition |
ITTO20111208A1 (it) | 2011-12-23 | 2013-06-24 | Bridgestone Corp | Mescola di gomma per pneumatici |
KR102172296B1 (ko) * | 2014-04-30 | 2020-10-30 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄회로기판 |
WO2017157591A1 (en) * | 2016-03-15 | 2017-09-21 | Huntsman Advanced Materials Licensing (Switzerland) Gmbh | A process for the preparation of insulation systems for electrical engineering, the articles obtained therefrom and the use thereof |
DE102016006910A1 (de) * | 2016-06-08 | 2017-12-14 | Hexion GmbH | Zusammensetzung enthaltend ein Polymer auf der Basis von Epoxidverbindungen |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0523001A1 (de) * | 1991-06-20 | 1993-01-13 | Ciba-Geigy Ag | Härtbare Epoxidharz-Zusammensetzung enthaltend einen blockierten Beschleuniger |
JPH1160696A (ja) * | 1997-08-14 | 1999-03-02 | Tosoh Corp | エポキシ樹脂組成物 |
JP2010523747A (ja) * | 2007-04-03 | 2010-07-15 | アーベーベー・リサーチ・リミテッド | 硬化性エポキシ樹脂組成物 |
JP2018012745A (ja) * | 2016-07-19 | 2018-01-25 | 住友ベークライト株式会社 | 注型用エポキシ樹脂組成物及び電気・電子部品 |
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