JP2021509754A - 折り畳み可能な回路線とledが備えられた照明装置及びその製造方法 - Google Patents
折り畳み可能な回路線とledが備えられた照明装置及びその製造方法 Download PDFInfo
- Publication number
- JP2021509754A JP2021509754A JP2019566956A JP2019566956A JP2021509754A JP 2021509754 A JP2021509754 A JP 2021509754A JP 2019566956 A JP2019566956 A JP 2019566956A JP 2019566956 A JP2019566956 A JP 2019566956A JP 2021509754 A JP2021509754 A JP 2021509754A
- Authority
- JP
- Japan
- Prior art keywords
- led
- circuit line
- led module
- sheet
- main sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 230000005611 electricity Effects 0.000 claims abstract description 16
- 239000000835 fiber Substances 0.000 claims abstract description 15
- 239000012777 electrically insulating material Substances 0.000 claims abstract description 6
- 239000007779 soft material Substances 0.000 claims abstract description 6
- 239000000853 adhesive Substances 0.000 claims description 57
- 230000001070 adhesive effect Effects 0.000 claims description 57
- 238000000034 method Methods 0.000 claims description 19
- 238000009958 sewing Methods 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229920006231 aramid fiber Polymers 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000001459 lithography Methods 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 239000004760 aramid Substances 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 2
- 229920006282 Phenolic fiber Polymers 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229920003235 aromatic polyamide Polymers 0.000 claims description 2
- 239000004917 carbon fiber Substances 0.000 claims description 2
- 238000009792 diffusion process Methods 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 239000011133 lead Substances 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 1
- 239000010410 layer Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- -1 polyethylene terephthalate Polymers 0.000 description 5
- 229920000742 Cotton Polymers 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229920002994 synthetic fiber Polymers 0.000 description 4
- 239000012209 synthetic fiber Substances 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 229910001507 metal halide Inorganic materials 0.000 description 3
- 150000005309 metal halides Chemical class 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920001123 polycyclohexylenedimethylene terephthalate Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000011527 polyurethane coating Substances 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 244000062175 Fittonia argyroneura Species 0.000 description 1
- 229920010126 Linear Low Density Polyethylene (LLDPE) Polymers 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004397 blinking Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012210 heat-resistant fiber Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
- F21V33/008—Leisure, hobby or sport articles, e.g. toys, games or first-aid kits; Hand tools; Toolboxes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
- G03B15/02—Illuminating scene
- G03B15/03—Combinations of cameras with lighting apparatus; Flash units
- G03B15/05—Combinations of cameras with electronic flash apparatus; Electronic flash units
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2215/00—Special procedures for taking photographs; Apparatus therefor
- G03B2215/05—Combinations of cameras with electronic flash units
- G03B2215/0514—Separate unit
- G03B2215/0517—Housing
- G03B2215/0521—Housing movable housing, e.g. bounce-light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2215/00—Special procedures for taking photographs; Apparatus therefor
- G03B2215/05—Combinations of cameras with electronic flash units
- G03B2215/0564—Combinations of cameras with electronic flash units characterised by the type of light source
- G03B2215/0567—Solid-state light source, e.g. LED, laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Planar Illumination Modules (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
1.コンピュータ刺繍ミシン[ハスクバーナバイキングRuby Deluxe、svp、中国]を用いて、予め指定されたパターンでもって、アラミド繊維で構成されたメインシートの上面に、回路線を形成した。
実施例と同一の方法で照明装置を製造し、アラミド繊維で構成されたメインシートの代わりに、防炎されていない綿繊維で構成されたメインシートを用いて照明装置を製作した。
実施例と同一の方法で照明装置を製造し、アラミド繊維で構成されたメインシートの代わりに、防炎処理された綿繊維で構成されたメインシートを用いて照明装置を製作した。
実施例と比較例1、2によって製造された照明装置の色と組織感(texture)を比較した。ここで、実施例と比較例1、2によって製作された照明装置を、図9〜図11に示した。
Claims (11)
- 上面に回路線が備えられ、方向性なく折り畳み可能な軟性材質、及び、前記回路線を通じて流れる電気を絶縁させる電気絶縁性材質として形成され、250℃を超える温度に耐えられる繊維で構成されたメインシートと、
前記回路線と電気的に接続されるように、前記メインシートに実装されるLEDモジュールと、
前記メインシートの上面に付着される前面シートと、
を含む折り畳み可能な回路線とLEDが備えられた照明装置。 - 前記回路線とLEDモジュールとの間に備えられ、前記回路線とLEDモジュールを電気的に接続し、LEDモジュールを回路線に固定させる通電用接着物を、更に含むことを特徴とする請求項1に記載の折り畳み可能な回路線とLEDが備えられた照明装置。
- 前記通電用接着物は、金、銀、鉛、亜鉛、銅、錫、又はこれらの混合物であることを特徴とする請求項2に記載の折り畳み可能な回路線とLEDが備えられた照明装置。
- 前記前面シートは、前記LEDモジュールから発光される光を軟らかく拡散させて被写体に照射されるようにする拡散シートであることを特徴とする請求項1に記載の折り畳み可能な回路線とLEDが備えられた照明装置。
- 前記回路線は、導電糸で構成されることを特徴とする請求項1に記載の折り畳み可能な回路線とLEDが備えられた照明装置。
- 前記LEDモジュールには、互いに異なる色温度を有する、第1LEDと第2LEDとが備えられ、前記第1LEDを中心にして第1LEDの左右に、それぞれ通電用接着物が収容される、第1接着物収容ホールが備えられ、前記第2LEDを中心にして第2LEDの左右に、それぞれ通電用接着物が収容される、第2接着物収容ホールが備えられるように構成されることを特徴とする請求項1に記載の折り畳み可能な回路線とLEDが備えられた照明装置。
- 前記LEDモジュールは、前記第1LEDと第2LEDとの間に縫製ホールが備えられ、前記縫製ホールを通して、前記メインシートにLEDモジュールを結わえ付ける縫製ラインを更に含むことを特徴とする請求項6に記載の折り畳み可能な回路線とLEDが備えられた照明装置。
- 前記メインシートは芳香族ポリアミド(アラミド)繊維、ポリイミド繊維、ノボロイド繊維、炭素繊維、フッ素繊維、又はこれらの混紡で構成されることを特徴とする請求項1に記載の折り畳み可能な回路線とLEDが備えられた照明装置。
- 前記メインシートと前面シートとの間に備えられるとともに、メインシートに実装されたLEDモジュールが嵌合され得るように、LEDモジュールと対応する位置にLEDモジュール内挿ホールが形成された、固定シートを、更に含むことを特徴とする請求項1に記載の折り畳み可能な回路線とLEDが備えられた照明装置。
- 方向性なく折り畳み可能な軟性材質、及び、回路線を通じて流れる電気を絶縁させる電気絶縁性材質として形成され、250℃を超える温度に耐えられる繊維で構成されたメインシートの上面に、回路線を形成する回路線形成段階と、
フォトマスクによってリソグラフィを行って、前記回路線に一定間隔で通電用接着物を塗布するプリント段階と、
各通電用接着物にLEDモジュールを実装するLEDモジュール実装段階と、
前記LEDモジュールが実装されたメインシートを、最高温度が150〜250℃となるようにリフロー処理して、各LEDモジュールを回路線に固定させる溶融段階と、
前記メインシートの前面に、前面シートを付着する前面シート付着段階と、
を含む折り畳み可能な回路線とLEDが備えられた照明装置の製造方法。 - 前記溶融段階は、設定された最高温度に到達するまで次第に高くなる温度で、前記LEDモジュールが実装されたメインシートを5分〜10分間加熱する1次加熱過程と、
設定された最高温度で、前記LEDモジュールが実装されたメインシートを4分〜6分間加熱する2次加熱過程と、
常温に到達するまで、前記LEDモジュールが実装されたメインシートを冷却させる冷却過程と、
を含むことを特徴とする請求項10に記載の折り畳み可能な回路線とLEDが備えられた照明装置の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180095151A KR102009346B1 (ko) | 2018-08-14 | 2018-08-14 | 접을 수 있는 회로선과 led가 구비된 조명장치 및 이의 제조방법 |
KR10-2018-0095151 | 2018-08-14 | ||
PCT/KR2018/011475 WO2020036255A1 (ko) | 2018-08-14 | 2018-09-28 | 접을 수 있는 회로선과 led가 구비된 조명장치 및 이의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021509754A true JP2021509754A (ja) | 2021-04-01 |
JP6948411B2 JP6948411B2 (ja) | 2021-10-13 |
Family
ID=67624649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019566956A Active JP6948411B2 (ja) | 2018-08-14 | 2018-09-28 | 折り畳み可能な回路線とledが備えられた照明装置及びその製造方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US10916528B1 (ja) |
EP (1) | EP3636988B1 (ja) |
JP (1) | JP6948411B2 (ja) |
KR (1) | KR102009346B1 (ja) |
CN (1) | CN111051979A (ja) |
DK (1) | DK3636988T3 (ja) |
ES (1) | ES2886257T3 (ja) |
WO (1) | WO2020036255A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3590108B1 (en) * | 2017-03-02 | 2023-11-22 | Media Graph Depot Inc. | Individually controllable light emitting diode modules for displaying defined patterns |
CN109599477B (zh) * | 2018-11-28 | 2020-06-02 | 武汉华星光电技术有限公司 | 网孔的制作方法 |
KR102582383B1 (ko) * | 2021-07-30 | 2023-09-25 | 상명대학교산학협력단 | Led 텍스타일 제조방법과 이를 이용한 광조사 웨어러블 디바이스 |
WO2023149744A1 (ko) * | 2022-02-04 | 2023-08-10 | 주식회사 오딧세이글로벌 | 식물 생장용 조명장치 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004290626A (ja) * | 2003-03-25 | 2004-10-21 | Tamurakku:Kk | 携帯用収納具照明装置 |
JP2006127993A (ja) * | 2004-10-29 | 2006-05-18 | Toshiba Lighting & Technology Corp | 照明装置 |
JP2011090849A (ja) * | 2009-10-21 | 2011-05-06 | Atex Co Ltd | フレキシブル発光装置およびその製造方法 |
KR101120460B1 (ko) * | 2011-08-29 | 2012-03-13 | (주)현대포멕스 | 휴대가 용이한 폴더블 타입의 led를 이용한 조명장치 |
JP2013522839A (ja) * | 2010-03-16 | 2013-06-13 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 光を発する布様の構造部材 |
JP2013537370A (ja) * | 2010-09-21 | 2013-09-30 | コーニンクレッカ フィリップス エヌ ヴェ | 電子テキスタイル及び電子テキスタイルの製造方法 |
JP3193436U (ja) * | 2014-07-23 | 2014-10-02 | 株式会社Shindo | Led実装テープおよびそれを装着した衣服 |
JP2016162829A (ja) * | 2015-02-27 | 2016-09-05 | 日亜化学工業株式会社 | 発光装置 |
US20180038578A1 (en) * | 2015-02-24 | 2018-02-08 | Teddykorea Co., Ltd. | Flexible lighting panel |
JP2019139978A (ja) * | 2018-02-12 | 2019-08-22 | セーレン株式会社 | 発光部材 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4067801B2 (ja) * | 2001-09-18 | 2008-03-26 | 松下電器産業株式会社 | 照明装置 |
JP2005268648A (ja) * | 2004-03-19 | 2005-09-29 | Auto Network Gijutsu Kenkyusho:Kk | 回路構成体 |
DE502005002224D1 (de) * | 2005-05-13 | 2008-01-24 | Sefar Ag | Leiterplatte und Verfahren zu deren Herstellung |
CN100469220C (zh) * | 2007-06-14 | 2009-03-11 | 江南大学 | 一种以无纺织布为基底制备柔性电路的方法 |
US8030676B2 (en) * | 2008-03-31 | 2011-10-04 | Yuan Lin | Substrate structrue for light-emitting diode |
US8865489B2 (en) * | 2009-05-12 | 2014-10-21 | The Board Of Trustees Of The University Of Illinois | Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays |
DE102010054068A1 (de) * | 2010-12-10 | 2012-06-14 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Bauelements und Bauelement |
US8585243B2 (en) * | 2011-06-28 | 2013-11-19 | Osram Sylvania Inc. | LED lighting apparatus, systems and methods of manufacture |
US20140048824A1 (en) * | 2012-08-15 | 2014-02-20 | Epistar Corporation | Light-emitting device |
JP2015028918A (ja) * | 2013-06-27 | 2015-02-12 | 株式会社半導体エネルギー研究所 | 発光装置、カメラ |
KR101627186B1 (ko) | 2014-04-04 | 2016-06-13 | 송창환 | 연성 led 영상 조명 장치 |
CN203967124U (zh) * | 2014-07-24 | 2014-11-26 | 王定锋 | 一种倒装封装多面发光的led灯 |
CN204300734U (zh) * | 2014-10-31 | 2015-04-29 | 胡兴伟 | 一种led智能照明纺织布 |
KR102182521B1 (ko) * | 2014-12-30 | 2020-11-24 | 코오롱글로텍주식회사 | 고유연성 배리어 섬유기판 및 그의 제조방법 |
GB201501297D0 (en) * | 2015-01-27 | 2015-03-11 | Mas Active Trading Pvt Ltd | Device |
KR101708550B1 (ko) * | 2015-02-24 | 2017-02-21 | 송인실 | 플렉시블 조명 패널 |
CN112822840A (zh) * | 2015-08-20 | 2021-05-18 | 苹果公司 | 具有电子部件阵列的基于织物的物品 |
US9936581B1 (en) * | 2016-10-11 | 2018-04-03 | Flex Ltd. | Mechanical and electrical interconnects between conductive threads in fabrics to PCB, FPC, and rigid-flex circuits |
JP6776855B2 (ja) * | 2016-12-06 | 2020-10-28 | 日亜化学工業株式会社 | 発光装置 |
US10490507B1 (en) * | 2018-05-31 | 2019-11-26 | Loomia Technologies, Inc. | Electronic components for soft, flexible circuitry layers and methods therefor |
US10593852B2 (en) * | 2018-06-20 | 2020-03-17 | Innolux Corporation | Display device having a plurality of main pads, a plurality of redundant pads, and a light-emitting device |
-
2018
- 2018-08-14 KR KR1020180095151A patent/KR102009346B1/ko active IP Right Grant
- 2018-09-28 US US16/313,250 patent/US10916528B1/en active Active
- 2018-09-28 CN CN201880034140.7A patent/CN111051979A/zh active Pending
- 2018-09-28 ES ES18919402T patent/ES2886257T3/es active Active
- 2018-09-28 DK DK18919402.0T patent/DK3636988T3/da active
- 2018-09-28 WO PCT/KR2018/011475 patent/WO2020036255A1/ko unknown
- 2018-09-28 EP EP18919402.0A patent/EP3636988B1/en active Active
- 2018-09-28 JP JP2019566956A patent/JP6948411B2/ja active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004290626A (ja) * | 2003-03-25 | 2004-10-21 | Tamurakku:Kk | 携帯用収納具照明装置 |
JP2006127993A (ja) * | 2004-10-29 | 2006-05-18 | Toshiba Lighting & Technology Corp | 照明装置 |
JP2011090849A (ja) * | 2009-10-21 | 2011-05-06 | Atex Co Ltd | フレキシブル発光装置およびその製造方法 |
JP2013522839A (ja) * | 2010-03-16 | 2013-06-13 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 光を発する布様の構造部材 |
JP2013537370A (ja) * | 2010-09-21 | 2013-09-30 | コーニンクレッカ フィリップス エヌ ヴェ | 電子テキスタイル及び電子テキスタイルの製造方法 |
KR101120460B1 (ko) * | 2011-08-29 | 2012-03-13 | (주)현대포멕스 | 휴대가 용이한 폴더블 타입의 led를 이용한 조명장치 |
JP3193436U (ja) * | 2014-07-23 | 2014-10-02 | 株式会社Shindo | Led実装テープおよびそれを装着した衣服 |
US20180038578A1 (en) * | 2015-02-24 | 2018-02-08 | Teddykorea Co., Ltd. | Flexible lighting panel |
JP2016162829A (ja) * | 2015-02-27 | 2016-09-05 | 日亜化学工業株式会社 | 発光装置 |
JP2019139978A (ja) * | 2018-02-12 | 2019-08-22 | セーレン株式会社 | 発光部材 |
Also Published As
Publication number | Publication date |
---|---|
ES2886257T3 (es) | 2021-12-16 |
EP3636988B1 (en) | 2021-07-14 |
KR102009346B1 (ko) | 2019-08-12 |
US10916528B1 (en) | 2021-02-09 |
DK3636988T3 (da) | 2021-09-13 |
EP3636988A4 (en) | 2020-06-17 |
WO2020036255A1 (ko) | 2020-02-20 |
EP3636988A1 (en) | 2020-04-15 |
JP6948411B2 (ja) | 2021-10-13 |
CN111051979A (zh) | 2020-04-21 |
US20210020612A1 (en) | 2021-01-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6948411B2 (ja) | 折り畳み可能な回路線とledが備えられた照明装置及びその製造方法 | |
US11703191B2 (en) | LED lamp | |
KR101120460B1 (ko) | 휴대가 용이한 폴더블 타입의 led를 이용한 조명장치 | |
US9980329B2 (en) | Light emitting diode (LED) tube lamp | |
US9261243B2 (en) | Light emitting apparatus and light emitting unit | |
JP3965419B1 (ja) | 照明装置 | |
US20180038578A1 (en) | Flexible lighting panel | |
US8434897B2 (en) | LED-based lighting fixtures for surface illumination with improved heat dissipation and manufacturability | |
CN103032724B (zh) | 照明装置以及照明装置的控制方法 | |
KR101708555B1 (ko) | 플렉시블 조명 패널 | |
JP2009032625A (ja) | 照明装置 | |
KR101708550B1 (ko) | 플렉시블 조명 패널 | |
KR102111721B1 (ko) | 플렉서블한 led 라이트에 대한 체결 편리성을 향상시킨 led 조명장치 | |
JP2011100557A (ja) | Led照明装置および照明方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20191129 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210309 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210517 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210914 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210917 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6948411 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |