JP2021502710A - バックグラインディングテープ - Google Patents
バックグラインディングテープ Download PDFInfo
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- JP2021502710A JP2021502710A JP2020526380A JP2020526380A JP2021502710A JP 2021502710 A JP2021502710 A JP 2021502710A JP 2020526380 A JP2020526380 A JP 2020526380A JP 2020526380 A JP2020526380 A JP 2020526380A JP 2021502710 A JP2021502710 A JP 2021502710A
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- meth
- acrylate
- back grinding
- grinding tape
- polymer resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Abstract
Description
本出願は2018年6月4日付韓国特許出願第10−2018−0064315号に基づいた優先権の利益を主張し、当該韓国特許出願の文献に開示された全ての内容は本明細書の一部として含まれる。
回復率1は、常温で前記バックグラインディングテープのいずれか一つの方向(第1方向)に5%延伸時長さに対する前記延伸後に回復した長さの比率である。
(1)高分子樹脂層の製造
ポリカーボネートウレタンアクリレート(分子量3万g/mol)25g、2−エチルヘキシルアクリレート(2−EHA)30g、2−ヒドロキシエチルアクリレート(2−HEA)15g、O−フェニルフェノキシエチルアクリレート(OPPEA、ガラス転移温度33℃)15gおよびイソボルニルアクリレート(IBOA、ガラス転移温度94℃)15gを投入して混合した。
2−エチルヘキシルアクリレート(2−EHA)68.5重量部、メチルアクリレート(MA)8.5重量部とヒドロキシエチルアクリレート(HEA)23重量部から構成される単量体の混合物から共重合された(メタ)アクリレート系高分子樹脂100gにTDI系イソシアネート硬化剤7g、および光開始剤(Irgacure 184)3gを混合して粘着剤組成物を製造した。
(1)高分子樹脂層の製造
ポリカーボネートウレタンアクリレート(分子量3万g/mol)25g、2−エチルヘキシルアクリレート(2−EHA)10g、2−ヒドロキシエチルアクリレート(2−HEA)15g、O−フェニルフェノキシエチルアクリレート(OPPEA)17gおよびイソボルニルアクリレート(IBOA)33gを混合した点を除いて、前記実施例1と同様な方法で高分子樹脂層を含む半製品を製造した。
前記実施例1と同様な方法で前記製造された前記半製品上に厚さ20μmの粘着層を形成した。
前記実施例および比較例で製造したバックグラインディングテープに対して下記の方法で回復率を測定し、その結果を下記表1に示した。
回復率(%)=(回復した長さ/伸びた長さ)*100
Claims (12)
- ガラス転移温度が0℃以上である(メタ)アクリレート単量体またはオリゴマーに由来した繰り返し単位10〜40重量%を含むウレタン(メタ)アクリレート樹脂を含む高分子樹脂層を含み、
前記高分子樹脂層のガラス転移温度が−30℃〜0℃である、バックグラインディングテープ。 - 前記ガラス転移温度が0℃以上である(メタ)アクリレート単量体またはオリゴマーは、O−フェニルフェノキシエチルアクリレート(O−Phenyl phenoxyethyl acrylate)、イソボルニル(メタ)アクリレート(Isobornyl (meth)acrylate)、メチルアクリレート(Methyl acrylate)およびシクロヘキシル(メタ)アクリレート(Cyclohexyl (meth)acrylate)からなる群より選択された1種以上の化合物を含む、請求項1に記載のバックグラインディングテープ。
- 前記ウレタン(メタ)アクリレート樹脂は、前記ガラス転移温度が0℃以上である(メタ)アクリレート単量体またはオリゴマーに由来した繰り返し単位と共に、炭素数2〜12のアルキル基を有する(メタ)アクリレート系繰り返し単位または架橋性官能基を含有した(メタ)アクリレート系繰り返し単位をさらに含む、請求項1または2に記載のバックグラインディングテープ。
- 前記バックグラインディングテープ高分子樹脂層に対する下記回復率1および回復率2の差の絶対値が10%以下である、請求項1〜3のいずれか一項に記載のバックグラインディングテープ:
回復率1は、常温で前記バックグラインディングテープ高分子樹脂層の第1方向に5%延伸時長さに対する前記延伸後に回復した長さの比率であり、
回復率2は、常温で前記バックグラインディングテープ高分子樹脂層の第1方向と垂直の第2方向に5%延伸時長さに対する前記延伸後に回復した長さの比率である。 - 前記バックグラインディングテープ高分子樹脂層に対する前記回復率1および回復率2の差の絶対値が5%以下である、請求項4に記載のバックグラインディングテープ。
- 前記第1方向は前記バックグラインディングテープに含まれる高分子樹脂層のMD方向であり、前記第2方向は前記高分子樹脂層のTD方向である、請求項4または5に記載のバックグラインディングテープ。
- 前記高分子樹脂層の厚さは、5μm〜200μmである、請求項1〜6のいずれか一項に記載のバックグラインディングテープ。
- 前記高分子樹脂層1μm〜100μmの厚さを有する粘着層をさらに含む、請求項1〜7のいずれか一項に記載のバックグラインディングテープ。
- 5μm〜200μmの厚さを有する光透過性基材をさらに含む、請求項1〜8のいずれか一項に記載のバックグラインディングテープ。
- 前記光透過性基材の一面に前記高分子樹脂層が形成され、前記光透過性基材の他の一面に前記粘着層が形成される、請求項9に記載のバックグラインディングテープ。
- 前記バックグラインディングテープは、50um以下の厚さを有する薄膜ウエハーの研磨に使用される、請求項1〜10のいずれか一項に記載のバックグラインディングテープ。
- 請求項1〜11のいずれか一項のバックグラインディングテープを用いたウエハーの研削方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180064315A KR102239210B1 (ko) | 2018-06-04 | 2018-06-04 | 백 그라인딩 테이프 |
KR10-2018-0064315 | 2018-06-04 | ||
PCT/KR2019/006708 WO2019235805A1 (ko) | 2018-06-04 | 2019-06-04 | 백 그라인딩 테이프 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021502710A true JP2021502710A (ja) | 2021-01-28 |
JP7008817B2 JP7008817B2 (ja) | 2022-01-25 |
Family
ID=68769621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020526380A Active JP7008817B2 (ja) | 2018-06-04 | 2019-06-04 | バックグラインディングテープ |
Country Status (7)
Country | Link |
---|---|
US (1) | US11424153B2 (ja) |
EP (1) | EP3696242A4 (ja) |
JP (1) | JP7008817B2 (ja) |
KR (1) | KR102239210B1 (ja) |
CN (1) | CN111433306B (ja) |
TW (1) | TWI791842B (ja) |
WO (1) | WO2019235805A1 (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012191098A (ja) * | 2011-03-14 | 2012-10-04 | Lintec Corp | ダイシングシートおよび半導体チップの製造方法 |
JP2012530375A (ja) * | 2009-06-15 | 2012-11-29 | エルジー・ケム・リミテッド | ウェーハ加工用基材 |
US20140045319A1 (en) * | 2011-02-14 | 2014-02-13 | Lg Chem, Ltd. | Substrate film and method of manufacturing the same |
WO2016151911A1 (ja) * | 2015-03-23 | 2016-09-29 | リンテック株式会社 | 半導体加工用シートおよび半導体装置の製造方法 |
KR20170099695A (ko) * | 2016-02-24 | 2017-09-01 | 주식회사 엘지화학 | 반도체 웨이퍼 표면 보호용 점착 필름 |
KR20170109390A (ko) * | 2016-03-21 | 2017-09-29 | 주식회사 엘지화학 | 반도체 웨이퍼 표면 보호용 점착 필름 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005105857A1 (en) * | 2004-04-27 | 2005-11-10 | Ashland Inc. | Polyester-polyether hybrid urethane acrylate oligomer for uv curing pressure sensitive adhesives |
US20050244631A1 (en) * | 2004-04-28 | 2005-11-03 | Mitsui Chemicals, Inc. | Surface protecting film for semiconductor wafer and method of protecting semiconductor wafer using the same |
JP4574234B2 (ja) | 2004-06-02 | 2010-11-04 | リンテック株式会社 | 半導体加工用粘着シートおよび半導体チップの製造方法 |
CN102027085B (zh) * | 2008-05-14 | 2014-06-11 | Lg化学株式会社 | 粘合剂组合物、粘合片以及用于半导体晶片的背磨方法 |
KR101242237B1 (ko) | 2009-08-25 | 2013-03-12 | (주)엘지하우시스 | 아크릴 필름의 제조 방법 및 아크릴 필름 |
JP4851613B2 (ja) * | 2009-12-22 | 2012-01-11 | 古河電気工業株式会社 | 半導体ウエハ表面保護用粘着テープ |
JP5762781B2 (ja) * | 2011-03-22 | 2015-08-12 | リンテック株式会社 | 基材フィルムおよび該基材フィルムを備えた粘着シート |
CN104073179B (zh) * | 2013-03-29 | 2019-05-07 | 日东电工(上海松江)有限公司 | 电化学装置用粘合带 |
US10370568B2 (en) * | 2013-12-27 | 2019-08-06 | Mitsubishi Chemical Corporation | Double-sided pressure-sensitive adhesive tape for fixing aircraft parts |
KR102335290B1 (ko) | 2014-04-11 | 2021-12-03 | 린텍 가부시키가이샤 | 백그라인드 테이프용 기재 및 백그라인드 테이프 |
JP6559150B2 (ja) | 2014-10-23 | 2019-08-14 | リンテック株式会社 | 表面保護用シート |
TWI586780B (zh) * | 2015-03-23 | 2017-06-11 | 阿科瑪法國公司 | 壓敏性黏合劑 |
JP6583991B2 (ja) * | 2015-05-18 | 2019-10-02 | 藤森工業株式会社 | 接着性樹脂層及び接着性樹脂フィルム |
JP6791626B2 (ja) * | 2015-12-14 | 2020-11-25 | デクセリアルズ株式会社 | 熱硬化性接着シート、及び半導体装置の製造方法 |
-
2018
- 2018-06-04 KR KR1020180064315A patent/KR102239210B1/ko active IP Right Grant
-
2019
- 2019-06-03 TW TW108119152A patent/TWI791842B/zh active
- 2019-06-04 WO PCT/KR2019/006708 patent/WO2019235805A1/ko unknown
- 2019-06-04 CN CN201980006221.0A patent/CN111433306B/zh active Active
- 2019-06-04 JP JP2020526380A patent/JP7008817B2/ja active Active
- 2019-06-04 US US16/964,364 patent/US11424153B2/en active Active
- 2019-06-04 EP EP19814242.4A patent/EP3696242A4/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012530375A (ja) * | 2009-06-15 | 2012-11-29 | エルジー・ケム・リミテッド | ウェーハ加工用基材 |
US20140045319A1 (en) * | 2011-02-14 | 2014-02-13 | Lg Chem, Ltd. | Substrate film and method of manufacturing the same |
JP2012191098A (ja) * | 2011-03-14 | 2012-10-04 | Lintec Corp | ダイシングシートおよび半導体チップの製造方法 |
WO2016151911A1 (ja) * | 2015-03-23 | 2016-09-29 | リンテック株式会社 | 半導体加工用シートおよび半導体装置の製造方法 |
KR20170099695A (ko) * | 2016-02-24 | 2017-09-01 | 주식회사 엘지화학 | 반도체 웨이퍼 표면 보호용 점착 필름 |
KR20170109390A (ko) * | 2016-03-21 | 2017-09-29 | 주식회사 엘지화학 | 반도체 웨이퍼 표면 보호용 점착 필름 |
Also Published As
Publication number | Publication date |
---|---|
EP3696242A1 (en) | 2020-08-19 |
JP7008817B2 (ja) | 2022-01-25 |
CN111433306A (zh) | 2020-07-17 |
KR102239210B1 (ko) | 2021-04-09 |
US11424153B2 (en) | 2022-08-23 |
CN111433306B (zh) | 2022-05-10 |
EP3696242A4 (en) | 2021-02-17 |
TWI791842B (zh) | 2023-02-11 |
KR20190138139A (ko) | 2019-12-12 |
US20210035847A1 (en) | 2021-02-04 |
WO2019235805A1 (ko) | 2019-12-12 |
TW202003746A (zh) | 2020-01-16 |
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