JP2021162666A - Method for manufacturing substrate having wiring electrode - Google Patents

Abstract

To reduce the period of time required for forming a light shielding layer as compared with the conventional manufacturing method even when a part of wiring electrodes needs to be exposed when manufacturing a substrate having the wiring electrodes including the light shielding layer.SOLUTION: A method for manufacturing a substrate having wiring electrodes comprises steps of: forming opaque wiring electrodes on a transparent substrate; applying a positive type photosensitive composition to the surfaces of the opaque wiring electrodes; exposing the positive type photosensitive composition from the application surface side of the positive type photosensitive composition using an exposure mask; exposing the positive type photosensitive composition from the side of the surface opposite to the application surface using the opaque wiring electrodes as a mask; and forming a light shielding layer in a desired region on the opaque wiring electrodes by developing the positive type photosensitive composition exposed from both surfaces.SELECTED DRAWING: Figure 1

Description

The present invention relates to a method for manufacturing a substrate with wiring electrodes.

In recent years, a touch panel has been widely used as an input means. The touch panel is composed of a display unit such as a liquid crystal panel and a touch panel sensor or the like that detects information input at a specific position. The touch panel method is roughly classified into a resistive film method, a capacitance method, an optical method, an electromagnetic induction method, an ultrasonic method, and the like, depending on the input position detection method. Among them, a capacitance type touch panel is widely used because of its optical brightness, excellent design, simple structure, and excellent functionality.

The capacitance type touch panel sensor has a second electrode that is orthogonal to the first electrode via an insulating layer, and a voltage is applied to the electrodes on the touch panel surface, and the capacitance when a conductor such as a finger touches the sensor. The contact position obtained by detecting the change is output as a signal. As the touch panel sensor used in the capacitance method, for example, a structure in which electrodes and external connection terminals are formed on a pair of opposing transparent substrates, or electrodes and external connection terminals are formed on both sides of one transparent substrate, respectively. The structure is known. As the wiring electrode used for the touch panel sensor, a transparent electrode using an ITO electrode or the like is generally used from the viewpoint of making the wiring electrode difficult to see. Opaque wiring electrodes using metal materials are widespread.

A touch panel sensor having an opaque wiring electrode made of a metal material has a problem that the opaque wiring electrode is visually recognized due to the metallic luster of the opaque wiring electrode. As a method of making the opaque wiring electrode difficult to see, as proposed in Patent Document 1, a black positive light-shielding material is applied on the opaque wiring electrode, and the opaque wiring electrode is exposed and developed as a mask to make the opaque wiring electrode opaque. A method of forming a light-shielding layer on a wiring electrode has been proposed.

International Publication No. 2018/168325

However, in the method of forming the light-shielding layer described in Patent Document 1, since the light-shielding layer is formed on the entire opaque wiring electrode portion, for example, in a terminal portion where it is necessary to secure continuity with an external element. However, there was a problem that a light-shielding layer was formed and continuity could not be ensured. Therefore, when trying to remove the light-shielding layer in the portion where the opaque wiring electrode is to be exposed, such as the terminal portion, an additional operation such as inverting the substrate and exposing / developing it again is required, which requires a process and time. There was a problem with mass productivity.

In the present invention, when manufacturing a substrate with a wiring electrode having a light-shielding layer, even when it is necessary to expose a part of the wiring electrode, the time required for forming the light-shielding layer is shortened as compared with the conventional manufacturing method. The purpose is to do.

In order to solve the above problems, the present invention mainly has the following configurations.

The process of forming opaque wiring electrodes on a transparent substrate,
A step of applying a positive photosensitive composition to the opaque wiring electrode forming surface,
A step of exposing the positive photosensitive composition from the coated surface side of the positive photosensitive composition using an exposure mask.
A step of exposing the positive photosensitive composition from the surface opposite to the coated surface using the opaque wiring electrode as a mask.
A method for producing a substrate with a wiring electrode, which comprises a step of forming a light-shielding layer at a desired portion on the opaque wiring electrode by developing the positive photosensitive composition exposed from both sides.

According to the present invention, in manufacturing a substrate with wiring electrodes having a light-shielding layer, even when it is necessary to expose a part of the wiring electrodes, the time required for forming the light-shielding layer is shortened as compared with the conventional manufacturing method. can do.

It is the schematic which shows the substrate with the wiring electrode which concerns on 1st Embodiment. It is the schematic which shows the manufacturing method of the substrate with the wiring electrode which concerns on 1st Embodiment. It is the schematic which shows the substrate with the wiring electrode which concerns on 2nd Embodiment. It is the schematic which shows the substrate with the wiring electrode which concerns on 3rd Embodiment. It is the schematic which shows the substrate with the wiring electrode which concerns on 4th Embodiment. It is a top view of the substrate with wiring electrodes which concerns on Example 2. FIG.

Hereinafter, embodiments for carrying out the method for manufacturing a substrate with wiring electrodes according to the present invention (hereinafter, referred to as “embodiments”) will be described with reference to the drawings. The drawings are schematic. Further, the present invention is not limited to the embodiments described below.

[First Embodiment]
FIG. 1 is a schematic view of a substrate with a wiring electrode having an opaque wiring electrode 2 on a transparent substrate 1 and a light-shielding layer 3 at a desired portion on the opaque wiring electrode 2. FIG. 2 shows a schematic view of an example of a method for manufacturing a substrate with wiring electrodes according to the present embodiment.

The method for manufacturing a substrate with wiring electrodes according to this embodiment is
Step of forming an opaque wiring electrode on a transparent substrate (FIG. 2 (a)),
A step of applying a positive photosensitive composition to the opaque wiring electrode forming surface (FIG. 2B).
A step of exposing the positive photosensitive composition from the coated surface side of the positive photosensitive composition using an exposure mask (FIG. 2 (c)).
A step of exposing the positive photosensitive composition from the surface opposite to the coated surface using the opaque wiring electrode as a mask (FIG. 2 (d)).
It also has a step (FIG. 2 (e)) of forming a light-shielding layer at a desired portion on the opaque wiring electrode by developing the positive photosensitive composition exposed from both sides.

Here, the "desired portion on the opaque wiring electrode" means a portion where the opaque wiring electrode is not to be visually recognized. For example, in the case of manufacturing a touch panel sensor, a portion where the opaque wiring electrode is not to be visually recognized is an area having a touch panel function. On the other hand, it is necessary to provide a light-shielding layer in a portion in the peripheral region of the screen where the opaque wiring electrode is not visible, a portion where continuity with an external element needs to be ensured, a portion where an alignment mark is formed, and the like. No.

<Process of forming opaque wiring electrode>
The method for manufacturing a substrate with wiring electrodes according to the present embodiment includes a step of forming an opaque wiring electrode on a transparent substrate.

Examples of the method for forming the opaque wiring electrode include a method of forming a pattern by a photolithography method using a photosensitive conductive composition described later, screen printing using a conductive composition (conductive paste), gravure printing, inkjet and the like. A method of forming a pattern by means of a metal, a metal composite, a composite of a metal and a metal compound, a method of forming a film of a metal alloy or the like, and a method of forming by a photolithography method using a resist and the like can be mentioned. Among these, since fine wiring can be formed, a method of forming by a photolithography method using a photosensitive conductive composition is preferable.

The transparent substrate preferably has transparency with respect to the irradiation energy of the exposure light. Specifically, the transmittance of light having a wavelength of 365 nm on the transparent substrate is preferably 50% or more, more preferably 80% or more. By setting the transmittance of light having a wavelength of 365 nm to 50% or more, the positive photosensitive composition can be efficiently exposed. The transmittance of the transparent substrate at a wavelength of 365 nm can be measured using an ultraviolet-visible spectrophotometer (manufactured by Hitachi High-Technologies Corporation, U-3310).

Examples of the transparent substrate include a transparent substrate having no flexibility and a transparent substrate having flexibility. Examples of the transparent substrate having no flexibility include glass substrates such as quartz glass, soda glass, chemically strengthened glass, and "Pylex (registered trademark)" glass, synthetic quartz plates, epoxy resin substrates, and polyetherimide resin substrates. , Polyetherketone resin substrate, polysulfone resin substrate and the like.

Examples of the flexible transparent substrate include a transparent film made of a resin such as a polyethylene terephthalate film (hereinafter, “PET film”), a cycloolefin polymer film, a polyimide film, a polyester film, and an aramid film, and an optical resin plate. Can be mentioned. A plurality of these may be stacked and used, and for example, a plurality of transparent substrates may be used by adhering them together with an adhesive layer. Further, an insulating layer may be provided on the surface of these transparent substrates.

The thickness of the transparent substrate is appropriately selected depending on the material within the range in which the opaque wiring electrode can be stably supported and has the above-mentioned transparency. For example, from the viewpoint of more stably supporting the opaque wiring electrode, in the case of a transparent substrate having no flexibility such as glass, 0.3 mm or more is preferable, and in the case of a transparent substrate having flexibility such as PET film. , 25 μm or more is preferable. On the other hand, from the viewpoint of further improving the transparency of the exposure light, 1.5 mm or less is preferable in the case of a transparent substrate having no flexibility such as glass, and 1.5 mm or less is preferable in the case of a transparent substrate having flexibility such as PET film. It is preferably 300 μm or less.

The opaque wiring electrode preferably has a light-shielding property with respect to the irradiation energy of the exposure light. Specifically, the transmittance of the opaque wiring electrode at a wavelength of 365 nm is preferably 20% or less, more preferably 10% or less. By setting the transmittance of light having a wavelength of 365 nm to 20% or less, the effect of the opaque wiring electrode as a mask is increased, and it becomes easier to form a light-shielding layer at a portion corresponding to the opaque wiring electrode. The transmittance can be measured by a micro-plane spectroscopic color difference meter (VSS 400: manufactured by Nippon Denshoku Kogyo Co., Ltd.) for an opaque wiring electrode of 0.1 mm square or more on the transparent substrate.

Examples of the material constituting the opaque wiring electrode include metals such as silver, gold, copper, platinum, lead, tin, nickel, aluminum, tungsten, molybdenum, chromium, titanium and indium, and conductive particles such as alloys thereof. Can be mentioned. Among these, silver, copper and gold are preferable from the viewpoint of conductivity.

As the conductor, it is preferable to use conductive particles, and the average particle size thereof is preferably 0.01 μm or more from the viewpoint of improving the dispersibility of the conductive particles, and from the viewpoint of sharpening the end of the pattern of the opaque wiring electrode. , 1.0 μm or less is preferable.

The opaque wiring electrode may contain an organic component together with the above-mentioned conductive particles. The opaque wiring electrode may be formed from, for example, a cured product of a photosensitive conductive composition containing conductive particles, an alkali-soluble resin, and a photopolymerization initiator. In this case, the opaque wiring electrode may be formed of a photopolymerization initiator and a photopolymerization initiator. / Or contains a photodegradable product thereof. The photosensitive conductive composition may contain additives such as a thermosetting agent and a leveling agent, if necessary.

Examples of the pattern shape of the opaque wiring electrode include a mesh shape and a stripe shape. Examples of the mesh shape include a grid shape in which the unit shape is a triangle, a quadrangle, a polygon, a circle, or the like, or a grid shape in which the unit shape is a combination of these unit shapes. Above all, a mesh shape is preferable from the viewpoint of making the conductivity of the pattern uniform. The opaque wiring electrode is more preferably a metal mesh composed of the above-mentioned metal and having a mesh-like pattern.

The thickness of the opaque wiring electrode is preferably 0.01 μm or more, more preferably 0.05 μm or more, still more preferably 0.1 μm or more, from the viewpoint of further improving the light-shielding property. On the other hand, the thickness of the opaque wiring electrode is preferably 10 μm or less, more preferably 5 μm or less, still more preferably 3 μm or less, from the viewpoint of forming fine wiring.

The line width of the wiring electrode is preferably 1 to 10 μm. The line width of the wiring electrode is preferably 1 μm or more, more preferably 1.5 μm or more, still more preferably 2 μm or more, from the viewpoint of improving conductivity. On the other hand, the line width of the wiring electrode is preferably 10 μm or less, preferably 7 μm or less, and even more preferably 6 μm or less, from the viewpoint of making the wiring electrode less visible.

<Step of applying positive photosensitive composition>
The method for manufacturing a substrate with wiring electrodes according to the present embodiment includes a step of applying a positive photosensitive composition to an opaque wiring electrode forming surface.

The positive photosensitive composition refers to a composition having positive photosensitive in which the light irradiation portion dissolves in a developing solution. For example, it preferably contains a photosensitive agent (dissolution inhibitor) and an alkali-soluble resin.

Since the positive photosensitive composition is used for forming a light-shielding layer as described later, it is preferable to contain, for example, a colorant.

Examples of the colorant include dyes, organic pigments, inorganic pigments and the like. Two or more of these may be contained.

Examples of the dye include oil-soluble dyes, disperse dyes, reactive dyes, acid dyes, direct dyes and the like. Examples of the skeleton structure of the dye include anthraquinone-based, azo-based, phthalocyanine-based, methine-based, oxazine-based, and metal-containing complex salts thereof. Specific examples of dyes include, for example, "SUMIPLAST (registered trademark)" dye (trade name, manufactured by Sumitomo Chemical Industries, Ltd.), Zapon, "Neozapon (registered trademark)" (trade name, manufactured by BASF Co., Ltd.). , Kayaset, Kayakalan dye (trade name, manufactured by Nippon Kayaku Co., Ltd.), Varifastcolors dye (trade name, manufactured by Orient Chemical Industry Co., Ltd.), Savinyl (trade name, manufactured by Clariant) and the like.

As the organic pigment, carbon black is preferable. Specific examples of carbon black include furnace black, thermal black, channel black, acetylene black and the like.

Examples of the inorganic pigment include manganese oxide, titanium oxide, titanium oxynitride, chromium oxide, vanadium oxide, iron oxide, cobalt oxide, niobium oxide and the like.

The content of the colorant in the positive photosensitive light-shielding composition is preferably 1% by mass or more in the total solid content from the viewpoint of further reducing the reflectance of the light-shielding layer and making the opaque wiring electrode less visible. 2% by mass or more is more preferable. On the other hand, from the viewpoint of effectively advancing the photoreaction of the positive photosensitive light-shielding composition and suppressing the residue, the content of the colorant is preferably 30% by mass or less, more preferably 20% by mass or less in the total solid content. preferable.

As the photosensitive agent (dissolution inhibitor), one that generates an acid by exposure energy is preferable. For example, a diazodisulfone compound, a triphenylsulfonium compound, a quinonediazide compound and the like can be mentioned. Examples of the diazodisulfone compound include bis (cyclohexylsulfonyl) diazomethane, bis (talshalbutylsulfonyl) diazomethane, and bis (4-methylphenylsulfonyl) diazomethane. Examples of the triphenyl sulfonium compound include diphenyl-4-methylphenyl sulfonium trifluoromethane sulfonate, diphenyl-2,4,6-trimethylphenyl sulfonium p-toluene sulfonate, and diphenyl (4-methoxy). Phenyl) Sulfonium Trifluoromethane Sulfonate and the like can be mentioned. Examples of the quinonediazide compound include a polyhydroxy compound in which quinonediazide sulfonic acid is ester-bonded, a polyamino compound in which quinonediazide sulfonic acid is sulfonate-bonded, and a polyhydroxypolyamino compound in which quinonediazide sulfonic acid is ester-bonded and /. Alternatively, those having a sulfonamide bond can be mentioned. Two or more of these may be contained.

The content of the photosensitive agent (dissolution inhibitor) in the positive photosensitive composition is preferably 5 parts by mass or more with respect to 100 parts by mass of the alkali-soluble resin from the viewpoint of suppressing the dissolution of the alkali-soluble resin in the unexposed portion. , 15 parts by mass or more is more preferable. On the other hand, from the viewpoint of suppressing excessive light absorption by the photosensitive agent (dissolution inhibitor) in the exposed portion and suppressing the generation of residues, the content of the photosensitive agent (dissolution inhibitor) is 100 parts by mass of the alkali-soluble resin. , 40 parts by mass or less, more preferably 30 parts by mass or less.

Examples of the alkali-soluble resin include resins having a hydroxy group and / or a carboxyl group.

Examples of the resin having a hydroxy group include a phenol novolac resin having a phenolic hydroxy group, a novolac resin such as cresol novolac resin, a polymer of a monomer having a hydroxy group, a monomer having a hydroxy group and styrene, an acrylonitrile, an acrylic monomer and the like. And the copolymer with.

Examples of the monomer having a hydroxy group include a monomer having a phenolic hydroxy group such as 4-hydroxystyrene and hydroxyphenyl (meth) acrylate; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate. , (Meta) acrylate 3-methyl-3-hydroxybutyl, (meth) acrylate 1,1-dimethyl-3-hydroxybutyl, (meth) acrylate 1,3-dimethyl-3-hydroxybutyl, (meth) 2,2,4-trimethyl-3-hydroxypentyl acrylate, 2-ethyl-3-hydroxyhexyl (meth) acrylate, glycerin mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, polyethylene glycol mono (meth) Examples thereof include monomers having a non-phenolic hydroxy group such as acrylate.

Examples of the resin having a carboxyl group include a carboxylic acid-modified epoxy resin, a carboxylic acid-modified phenol resin, a polyamic acid, a carboxylic acid-modified siloxane resin, a polymer of a monomer having a carboxyl group, a monomer having a carboxyl group and styrene, and acrylonitrile. Examples thereof include a copolymer with an acrylic monomer and the like.

Examples of the monomer having a carboxyl group include acrylic acid, methacrylic acid, maleic acid, fumaric acid, crotonic acid, itaconic acid, citraconic acid, and cinnamon acid.

Examples of the resin having a hydroxy group and a carboxyl group include a copolymer of a monomer having a hydroxy group and a monomer having a carboxyl group, a monomer having a hydroxy group, a monomer having a carboxyl group, and styrene, acrylonitrile, an acrylic monomer, and the like. Copolymers can be mentioned. Two or more of these may be contained.

Of these, a resin containing a phenolic hydroxy group and a carboxyl group is preferable. When a quinone diazide compound is used as a photosensitive agent (dissolution inhibitor) by containing a phenolic hydroxy group, the phenolic hydroxy group and the quinone diazide compound form a hydrogen bond, and the unexposed portion of the positive photosensitive composition layer is formed. The solubility in a developing solution can be reduced, the difference in solubility between the unexposed portion and the exposed portion becomes large, and the development margin can be widened. Further, by containing a carboxyl group, the solubility in a developing solution is improved, and the development time can be easily adjusted by the content of the carboxyl group.

The acid value of the alkali-soluble resin having a carboxyl group is preferably 50 mgKOH / g or more from the viewpoint of solubility in a developing solution, and preferably 250 mgKOH / g or less from the viewpoint of suppressing excessive dissolution of an unexposed portion. The acid value of the alkali-soluble resin having a carboxyl group can be measured according to JIS K 0070 (1992).

The positive photosensitive composition may contain a thermosetting compound. Since the hardness of the light-shielding layer is improved by containing the thermosetting compound, it is possible to suppress chipping and peeling due to contact with other members and improve the adhesion to the opaque wiring electrode. Examples of the thermosetting compound include a monomer having an epoxy group, an oligomer, a polymer, and the like.

The positive photosensitive composition preferably contains a solvent, whereby the viscosity of the composition can be adjusted to a desired range. Examples of the solvent include N, N-dimethylacetamide, N, N-dimethylformamide, N-methyl-2-pyrrolidone, 2-pyrrolidone, dimethylimidazolidinone, dimethylsulfoxide, diethylene glycol monoethyl ether, and diethylene glycol monoethyl ether acetate. , Diethylene glycol monomethyl ether acetate, γ-butyl lactone, ethyl lactate, 1-methoxy-2-propanol, ethylene glycol mono-n-propyl ether, diacetone alcohol, tetrahydrofurfuryl alcohol, propylene glycol monomethyl ether acetate and the like. Two or more of these may be contained.

The positive photosensitive composition may contain a plasticizer, a leveling agent, a surfactant, a silane coupling agent, a defoaming agent, a stabilizer and the like as long as the desired properties are not impaired. Examples of the plasticizer include dibutyl phthalate, dioctyl phthalate, polyerylene glycol, glycerin and the like. Examples of the leveling agent include a special vinyl polymer and a special acrylic polymer. Examples of the silane coupling agent include methyltrimethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, hexamethyldisilazane, 3-methacryloxypropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, and vinyltri. Examples thereof include methoxysilane.

Examples of the method for applying the positive photosensitive composition include rotary coating using a spinner, spray coating, roll coating, screen printing, offset printing, gravure printing, letterpress printing, flexographic printing, blade coater, die coater, and calendar coater. , A method using a menis cascot or a bar coater can be mentioned.

When the positive photosensitive composition contains a solvent, it is preferable to dry the applied positive photosensitive composition film to volatilize and remove the solvent. Examples of the drying method include heat drying and vacuum drying. The heating / drying device may be one that heats by electromagnetic waves or microwaves, and examples thereof include an oven, a hot plate, an electromagnetic wave ultraviolet lamp, an infrared heater, and a halogen heater. The heating temperature is preferably 50 ° C. or higher, more preferably 70 ° C. or higher, from the viewpoint of suppressing residual solvent. On the other hand, the heating temperature is preferably 150 ° C. or lower, more preferably 110 ° C. or lower, from the viewpoint of suppressing the deactivation of the photosensitive agent (dissolution inhibitor). The heating time is preferably from 1 minute to several hours, more preferably from 1 minute to 50 minutes.

The coating film thickness of the positive photosensitive composition is preferably 0.1 μm or more, more preferably 0.5 μm or more, and even more preferably 1 μm or more. On the other hand, the coating film thickness is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less. Here, when the positive photosensitive composition contains a solvent, the coating film thickness means the film thickness after drying.

<Exposure process using an exposure mask>
The method for manufacturing a substrate with wiring electrodes according to the present embodiment includes a step of exposing the positive photosensitive composition from the coated surface side of the positive photosensitive composition using an exposure mask.

Specifically, among the light-shielding layers coated on the opaque wiring electrode, the portion that does not require the light-shielding layer is used as the opening of the exposure mask to expose from the coated surface side of the positive photosensitive composition. As a result, the positive photosensitive composition at the portion that does not require the light-shielding layer is removed through the subsequent developing step, so that the step of separately exposing and developing by inverting the substrate can be omitted.

The exposure light preferably emits light in an ultraviolet region that matches the absorption wavelength of the photosensitive agent (dissolution inhibitor) contained in the positive photosensitive composition, that is, in a wavelength region of 200 nm to 450 nm. Examples of the light source for obtaining such exposure light include mercury lamps, halogen lamps, xenon lamps, LED lamps, semiconductor lasers, KrF or ArF excimer lasers, and the like. Among these, the i-line (wavelength 365 nm) of the mercury lamp is preferable. From the viewpoint of the solubility of the exposed portion in the developing solution, the exposure amount is ^{preferably 50 mJ / cm 2} or more, more preferably 100 mJ / cm ² or more, and even more preferably 200 mJ / cm ^{2 or more in terms of wavelength 365 nm.}

<Process of exposing the opaque wiring electrode as a mask>
The method for manufacturing a substrate with a wiring electrode according to the present embodiment includes a step of exposing the positive photosensitive composition from the surface opposite to the coated surface using the opaque wiring electrode as a mask.

As a result, the positive photosensitive composition at the portion where the opaque wiring electrode is not formed can be accurately removed by the subsequent developing step. Further, by combining with the exposure from the coated surface side of the positive photosensitive composition, a light-shielding layer can be formed at a desired portion on the opaque wiring electrode.

In the step of exposing the positive photosensitive composition from the surface opposite to the coated surface, it is preferable to use an LED lamp as a light source from the viewpoint of space saving of the apparatus.

Although LED lamps irradiate only a single wavelength due to their characteristics, LED lamps that irradiate wavelengths corresponding to i-line (wavelength 365 nm) and h-line (wavelength 405 nm) widely used in exposure equipment using general mercury lamps. Is preferable because it exhibits versatility for processing various photosensitive materials having photosensitivity to the current exposure machine.

As the LED lamp, it is preferable to use a device such as a line type UV irradiator (CKL-500365, manufactured by CCS). Irradiance is preferably 2.5 W / cm ² or more, irradiance 3.5 W / cm ² or more is more preferable.

The LED lamp is preferably installed at the bottom of the substrate transfer line. By doing so, after setting the substrate on the substrate transfer jig, it is possible to irradiate the LED light when the substrate passes through the LED lamp installation portion, and the substrate is positive in a series of steps without being inverted. The mold photosensitive composition can be exposed.

Due to the characteristics of the device, the LED lamp has a characteristic that the irradiation intensity is greatly attenuated as the irradiation distance increases. Therefore, the distance from the transparent substrate to be irradiated is preferably 20 mm or less, more preferably 10 mm or less.

<Step of forming a light-shielding layer>
The method for manufacturing a substrate with a wiring electrode according to the present embodiment includes a step of forming a light-shielding layer at a desired portion on the opaque wiring electrode by developing a positive photosensitive composition exposed from both sides.

By developing the coating film of the exposed positive photosensitive composition, the exposed portion can be removed and a light-shielding layer can be formed at a desired portion on the opaque wiring electrode. The developing solution is preferably one that does not interfere with the conductivity of the opaque wiring electrode, and is preferably an alkaline developing solution.

Examples of the alkaline developing solution include tetramethylamethylene hydroxide, diethanolamine, diethylamine, diethylaminoethanol, sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, triethylamine, diethylamine, methylamine, dimethylamine, and dimethylaminoethyl acetate. Examples thereof include aqueous solutions of alkaline substances such as dimethylaminoethanol, dimethylaminoethylmethacrylate, cyclohexylamine, ethylenediamine and hexamethylenediamine. In these aqueous solutions, polar solvents such as N-methyl-2-pyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, dimethylsulfoxide, and γ-butyllactone; alcohols such as methanol, ethanol, and isopropanol; lactic acid. Esters such as ethyl and propylene glycol monomethyl ether acetate; ketones such as cyclopentanone, cyclohexanone, isobutyl ketone and methyl isobutyl ketone; surfactants may be added.

As a developing method, for example, a method of spraying a developing solution on the surface of a coating film of a positive photosensitive composition while allowing, rotating or transporting a substrate on which a coating film of a positive photosensitive composition is formed is allowed to stand, rotate or convey. Examples thereof include a method of immersing the coating film of the sex composition in a developing solution and a method of applying ultrasonic waves while immersing the coating film of the positive photosensitive composition in the developing solution.

The pattern obtained by development may be rinsed with a rinsing liquid. Examples of the rinsing solution include water; an aqueous solution of alcohols such as ethanol and isopropyl alcohol; and an aqueous solution of esters such as ethyl lactate and propylene glycol monomethyl ether acetate.

It is preferable that the opaque wiring electrode includes the terminal portion and the positive photosensitive composition on the terminal portion is removed by development. This is because the light-shielding layer on the opaque wiring electrode in the terminal portion where it is necessary to ensure continuity with the external terminal can be removed in a short time.

The obtained light-shielding layer may be further heated at 100 ° C. to 250 ° C. By heating, the hardness of the light-shielding layer can be improved, chipping or peeling due to contact with other members can be suppressed, and the adhesion to the opaque wiring electrode can be improved. Examples of the heating device include those exemplified as a heating / drying device for a positive photosensitive composition film.

The light-shielding layer is preferably made of a photocured product of a positive-type photosensitive light-shielding composition containing a colorant. By doing so, the opaque wiring electrode is less likely to be visually recognized.

It is preferable that the light-shielding layer is formed at a portion corresponding to the opaque wiring electrode to reduce the reflectance of the opaque wiring electrode. Specifically, the reflectance of the light-shielding layer at a wavelength of 550 nm is preferably 25% or less, more preferably 10% or less. By setting the reflectance of the light-shielding layer to 25% or less, it is possible to suppress the reflection of the opaque wiring electrode and make the wiring electrode less visible. The reflectance of the light-shielding layer can be measured with a reflectance meter (VSR-400: manufactured by Nippon Denshoku Kogyo Co., Ltd.) for a light-shielding layer of 0.1 mm square or more on a transparent substrate.

Examples of the method for setting the reflectance of light having a wavelength of 550 nm in the light-shielding layer within the above range include a method using the positive-type photosensitive light-shielding composition having the above-mentioned preferable composition and a method for setting the film thickness of the light-shielding layer within the preferable range described later. How to do it.

The film thickness of the light-shielding layer is preferably 0.1 μm or more, more preferably 0.5 μm or more, still more preferably 1 μm or more, from the viewpoint of further reducing the reflectance of the opaque wiring electrode. On the other hand, from the viewpoint of suppressing the residue and forming a fine pattern, 20 μm or less is preferable, 10 μm or less is more preferable, and 5 μm or less is further preferable.

[Second Embodiment]
FIG. 3 shows an opaque wiring electrode 2 (first opaque wiring electrode), a light-shielding layer 3 (first light-shielding layer), and an insulating layer 4 on a transparent substrate 1, and an opaque wiring electrode 5 (a first opaque wiring electrode 5) on the insulating layer 4. It is the schematic of the substrate with the wiring electrode which has the 2nd opaque wiring electrode) and the light-shielding layer 6 (the 2nd light-shielding layer). In the substrate with wiring electrodes shown in FIG. 3, a first opaque wiring electrode and a first light-shielding layer are formed on one side of the transparent substrate according to the first embodiment, and then an insulating layer and a second opaque wiring electrode are formed, respectively. Then, the positive photosensitive composition is further applied, and it can be obtained through the steps of exposure and development in the same manner as the first time.

That is, in the method for manufacturing a substrate with a wiring electrode according to the present embodiment, the opaque wiring electrode is the first opaque wiring electrode.
After the step of forming a light-shielding layer at a desired portion on the first opaque wiring electrode,
The step of forming an insulating layer on the first opaque wiring electrode forming surface,
A step of forming a second opaque wiring electrode on the insulating layer,
The step of applying the second positive photosensitive composition to the second opaque wiring electrode forming surface,
A step of exposing the second positive photosensitive composition from the coated surface side of the second positive photosensitive composition using an exposure mask.
A step of exposing the second positive photosensitive composition from a surface opposite to the coated surface using the second opaque wiring electrode as a mask.
Then, by developing the second positive photosensitive composition exposed from both sides, a second light-shielding layer is formed at desired portions on the first opaque wiring electrode and the second opaque wiring electrode. Has a process to do.

Examples of the method for forming the insulating layer include a method in which an insulating composition (insulating paste) is applied and dried, and a method in which a transparent substrate is attached to the opaque wiring electrode forming surface side via an adhesive. In the latter case, the adhesive and the transparent substrate form the insulating layer.

Examples of the method of applying the insulating paste include rotary coating using a spinner, spray coating, roll coating, screen printing, offset printing, gravure printing, letterpress printing, flexographic printing, blade coater, die coater, calendar coater, and menis cascotr. Alternatively, a method using a bar coater can be mentioned. In the method of applying an insulating paste and drying, the dried film can be cured by UV treatment and / or heat treatment. As a method of bonding the transparent substrate via the adhesive, for example, the adhesive may be formed on the base material with the opaque wiring electrode and the transparent substrate may be bonded, or the transparent base material with the adhesive may be bonded. May be good. Examples of the transparent substrate to be bonded include those exemplified above as the transparent substrate.

The insulating paste preferably contains, for example, a resin that imparts insulating properties such as an acrylic resin, a polyimide resin, a cardo resin, an epoxy resin, a melamine resin, a urethane resin, a silicon resin, and a fluorine resin. Two or more of these may be contained.

[Third Embodiment]
FIG. 4 has an opaque wiring electrode 2 (first opaque wiring electrode) and an insulating layer 4 on a transparent substrate 1, and an opaque wiring electrode 5 (second opaque wiring electrode) and a light-shielding layer 6 on the insulating layer 4. It is the schematic of the substrate with the wiring electrode which has. In the substrate with wiring electrodes shown in FIG. 4, a first opaque wiring electrode is formed on one side of the transparent substrate in the first embodiment, and then an insulating layer and a second opaque wiring electrode are formed to form a positive photosensitive composition. It can be obtained through the steps of coating, exposing and developing as in other embodiments.

That is, the method for manufacturing a substrate with wiring electrodes according to the present embodiment is a step of forming a first opaque wiring electrode on a transparent substrate.
The step of forming an insulating layer on the first opaque wiring electrode,
A step of forming a second opaque wiring electrode on the insulating layer,
The step of applying the positive photosensitive composition to the second opaque wiring electrode forming surface,
A step of exposing the positive photosensitive composition from the coated surface side of the positive photosensitive composition using an exposure mask.
A step of exposing the positive photosensitive composition from a surface opposite to the coated surface using the first opaque wiring electrode and the second opaque wiring electrode as masks.
Further, there is a step of forming a light-shielding layer at desired portions on the first opaque wiring electrode and the second opaque wiring electrode by developing the positive photosensitive composition exposed from both sides.

[Fourth Embodiment]
FIG. 5 shows an opaque wiring electrode 2 (first opaque wiring electrode) and an insulating layer 4 on a transparent substrate 1, and an opaque wiring electrode 5 (second opaque wiring electrode) and a second opaque wiring electrode 5 on the insulating layer 4. In the schematic view of a substrate with a wiring electrode having an insulating layer 7 and further having a light-shielding layer 8 at a desired portion on the first opaque wiring electrode and the second opaque wiring electrode on the second insulating layer 7. be. In the substrate with wiring electrodes shown in FIG. 5, after forming the first opaque wiring electrode on one side of the transparent substrate in the first embodiment, the first insulating layer, the second opaque wiring electrode, and the second insulating layer are formed. Can be obtained through the steps of forming a positive photosensitive composition, applying the positive photosensitive composition, and exposing and developing the same as in other embodiments.

That is, the method for manufacturing a substrate with wiring electrodes according to the present embodiment is a step of forming a first opaque wiring electrode on a transparent substrate.
A step of forming a first insulating layer on the first opaque wiring electrode forming surface,
A step of forming a second opaque wiring electrode on the first insulating layer,
A step of forming a second insulating layer on the second opaque wiring electrode forming surface,
A step of applying a positive photosensitive composition to the second insulating layer forming surface,
A step of exposing the positive photosensitive composition from the coated surface side of the positive photosensitive composition using an exposure mask.
A step of exposing the positive photosensitive composition from a surface opposite to the coated surface using the first opaque wiring electrode and the second opaque wiring electrode as masks.
Further, there is a step of forming a light-shielding layer at desired portions on the first opaque wiring electrode and the second opaque wiring electrode by developing the positive photosensitive composition exposed from both sides.

The substrate with wiring electrodes obtained by the manufacturing method according to each of the above-described embodiments can be suitably used for applications in which it is necessary that the wiring electrodes are difficult to see. Applications that are particularly required to suppress the visibility of wiring electrodes include, for example, touch panel members, electromagnetic shield members, transparent LED light members, and the like. Above all, it can be suitably used as a touch panel member for which miniaturization and making the wiring electrodes less visible are required.

Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited thereto.

The materials used in each example are as follows. The transmittance of the transparent substrate at a wavelength of 365 nm was measured using an ultraviolet-visible spectrophotometer (manufactured by Hitachi High-Technologies Corporation, U-3310).

(Transparent board)
Transparent substrate (soda glass. Thickness: 1.1 mm, light transmittance of light having a wavelength of 365 nm 90%) (a).

(Colorant)
Carbon black (MA100 manufactured by Mitsubishi Chemical Corporation) (b).

(Photosensitive conductive paste)
Photosensitive conductive paste (Type: SFAG-M200 manufactured by Toray Industries, Inc., containing silver conductive particles) (c). Low viscosity (2.7 mPa · s) paste for coating coaters.

(Kinone diazide compound)
Under a dry nitrogen stream, α, α, -bis (4-hydroxyphenyl) -4- (4-hydroxy-α, α-dimethyldimethylbenzylethylbenzene (trade name: TrisP-PA, manufactured by Honshu Chemical Industry Co., Ltd.)) 21.22 g (0.05 mol) and 33.58 g (0.125 mol) of 5-naphthoquinonediazidesulfonyl acid chloride were dissolved in 450 g of 1,4-dioxane, brought to room temperature, and 15.18 g of triethylamine mixed with 50 g of 1,4-dioxane. Was added dropwise so that the temperature inside the system did not exceed 35 ° C. After the addition, the mixture was stirred at 30 ° C. for 2 hours. The triethylamine salt was filtered, the filtrate was added to water, and the precipitated precipitate was collected by filtration. A quinonediazide compound (D-1) obtained by drying the precipitate with a vacuum dryer.

(Acrylic copolymer)
150 g of diethylene glycol monoethyl ether acetate (hereinafter, “DMEA”) was charged in a reaction vessel having a nitrogen atmosphere, and the temperature was raised to 80 ° C. using an oil bath. To this, 20 g of ethyl acrylate (hereinafter, "EA"), 40 g of 2-ethylhexyl methacrylate (hereinafter, "2-EHMA"), 20 g of styrene (hereinafter, "St"), and 15 g of acrylic acid (hereinafter, "St"). Hereinafter, a mixture consisting of 0.8 g of 2,2'-azobisisobutyronitrile and 10 g of DMEA was added dropwise over 1 hour, and after completion, a polymerization reaction was further carried out for 6 hours. Then, 1 g of hydroquinone monomethyl ether was added to terminate the polymerization reaction. Subsequently, a mixture consisting of 5 g of glycidyl methacrylate (hereinafter, "GMA"), 1 g of triethylbenzylammonium chloride and 10 g of DMEA was added dropwise over 0.5 hours. After completion of the dropping, an addition reaction was carried out for another 2 hours. An acrylic copolymer (D-2) obtained by purifying the obtained reaction solution with methanol to remove unreacted impurities and then vacuum-drying the obtained reaction solution for 24 hours.

(Positive Photosensitive Composition)
In a 100 mL clean bottle, 3.09 g of photosensitive polymer WR-101 (manufactured by DIC Corporation), 0.77 g of quinone diazide compound (D-1), and 40.14 g of propylene glycol monomethyl ether acetate (hereinafter, "PGMEA"). ) (Manufactured by Kuraray Co., Ltd.) was added and mixed with a rotation-revolution vacuum mixer "Awatori Rentaro ARE-310" (manufactured by Shinky Corporation) to obtain 44.0 g of a resin solution. 44.0 g of the obtained resin solution, 0.6 g of carbon black (b), 0.18 g of the acrylic copolymer (D-2) and 0.36 g of the leveling agent BYK-LP21116 (manufactured by Big Chemie). The positive mold obtained by mixing and kneading using an Ultra Apex mill (manufactured by Kotobuki Kogyo Co., Ltd.) equipped with a centrifuge separator filled with 70% by volume of 0.05 mmφ zirconia beads (manufactured by Toray Industries, Inc.). Photosensitive composition (d).

(Insulation paste)
Insulation paste (Type: OCM-1000 manufactured by Toray Industries, Inc.) (e).

(Example 1)
<Formation of opaque wiring electrode>
The photosensitive conductive paste (c) was printed on one side of the transparent substrate (a) with a spin coater so that the film thickness was 1 μm after drying, and dried at 90 ° C. for 8 minutes. An exposure amount of 200 mJ / using an exposure device (PEM-6M; manufactured by Union Optical Co., Ltd.) via an exposure mask having a mesh shape with a pitch of 300 μm and a mesh line width of 4 μm and a terminal pattern having a length of 500 μm and a width of 1000 μm. Exposure was performed at cm ² (wavelength 365 nm conversion). Then, spin development is performed for 80 seconds with an aqueous solution of 0.08 mass% tetramethylammonium hydroxide (hereinafter, “TMAH”), further rinsed with ultrapure water, and then heated in an IR heater furnace at 240 ° C. for 60 minutes. Then, a substrate with an opaque wiring electrode was obtained. As a result of measuring the line width of the opaque wiring electrode with an optical microscope, it was 4 μm. The transmittance of the terminal portion at a wavelength of 365 nm was 5%. The transmittance of the opaque wiring electrode was measured by a micro-plane spectroscopic color difference meter (VSS 400: manufactured by Nippon Denshoku Kogyo Co., Ltd.).

<Application of positive photosensitive composition>
The positive photosensitive composition (d) was printed on the surface of the obtained substrate with the opaque wiring electrode on which the opaque wiring electrode was formed by a spin coater so that the film thickness after drying was 1 μm, and the thickness was 5 at 80 ° C. It was dried for a minute to obtain a substrate with a positive photosensitive composition. When the reflectance of the obtained substrate with the positive photosensitive composition was measured using a reflectance meter (VSR-400: manufactured by Nippon Denshoku Kogyo Co., Ltd.), the reflectance at a wavelength of 550 nm was 7%. there were.

<Exposure using a mask>
The obtained substrate with the positive photosensitive composition was exposed from the upper surface of the substrate with the positive photosensitive composition by arranging an exposure mask on the same side as the surface coated with the positive photosensitive composition using the above-mentioned exposure apparatus. The exposure conditions were an exposure amount of 200 mJ / cm ² (wavelength 365 nm conversion). The exposure mask used was molded so that the opening was irradiated only to the positive photosensitive composition on the terminal portion.

<Exposure from the side opposite to the coated surface>
The obtained substrate with a positive photosensitive composition was set on a substrate transfer jig so that the transparent substrate was on the lower surface. An LED lamp is set in the jig at a predetermined position at the bottom of the substrate transfer line. When the substrate with the positive photosensitive composition passed through the LED lamp installation portion, it was irradiated with LED light. The LED lamp was manufactured by CCS (L037), the irradiation wavelength was 365 nm, and the light emitting surface was 5 mm × 190 mm.

<Development>
The obtained substrate with the exposed positive photosensitive composition was shower-developed with a 0.08% TMAH solution to have a light-shielding layer on the mesh-shaped pattern of the opaque wiring electrode, and a light-shielding layer on the terminal portion. A substrate with a wiring electrode shown in FIG. 1 was obtained.

(Example 2)
<Formation of insulating layer>
The insulating paste (e) was printed on the substrate with wiring electrodes obtained in Example 1 with a spin coater so that the film thickness would be 0.5 μm after drying, and dried at 80 ° C. for 5 minutes to provide an insulating layer. Was formed. The obtained substrate with an insulating layer was exposed to an exposure amount of 100 mJ / cm ² (wavelength 365 nm conversion) using the above-mentioned exposure apparatus via an exposure mask. The exposure mask used was molded so that the terminal portion of the above-mentioned opaque wiring electrode (first opaque wiring electrode in this embodiment) was not exposed. Then, it was shower-developed with 0.08 mass% TMAH aqueous solution for 80 seconds to develop the insulating layer.

<Formation of second opaque wiring electrode>
A second opaque wiring electrode was formed on the obtained insulating layer by using the photosensitive conductive paste (c) in the same manner as for forming the opaque wiring electrode described above.

<Application of second positive photosensitive composition>
The positive photosensitive composition (d) was printed on the second opaque wiring electrode forming surface of the obtained substrate with the opaque wiring electrode by a spin coater so that the film thickness after drying was 1 μm, and the temperature was 80 ° C. The substrate was dried for 5 minutes to obtain a substrate with a second positive photosensitive composition.

<Exposure using a mask>
Using the above-mentioned exposure apparatus, an exposure mask is placed on the same side as the surface coated with the second positive photosensitive composition, and the obtained substrate with the second positive photosensitive composition is exposed from the upper surface thereof. bottom. As the exposure mask, one formed so that the opening was located at the portion of the second positive photosensitive composition on the terminal portion was used.

<Exposure from the side opposite to the coated surface>
The obtained substrate with the second positive photosensitive composition was set on the substrate transfer jig so that the transparent substrate side was the lower surface. An LED lamp is set in the jig at a predetermined position at the bottom of the substrate transfer line. When the second substrate with the positive photosensitive composition passed through the LED lamp installation portion, it was irradiated with LED light. The LED lamp was manufactured by CCS (L037), the irradiation wavelength was 365 nm, and the light emitting surface was 5 mm × 190 mm.

<Development>
The obtained substrate with the exposed second positive photosensitive composition was shower-developed with 0.08% TMAH solution, and the corresponding positions of the mesh-shaped patterns of the first opaque wiring electrode and the second opaque wiring electrode were obtained. A substrate with a wiring electrode shown in FIG. 3 having a light-shielding layer and no light-shielding layer on the terminal portion was obtained. As shown in the top view shown in FIG. 6, the terminal portion of the first opaque wiring electrode can secure continuity from the portion exposed from the insulating paste.

(Example 3)
<Formation of insulating layer>
In Example 1, after forming the opaque wiring electrode (the first opaque wiring electrode in this embodiment), the insulating paste (e) is printed by a spin coater so that the film thickness becomes 0.5 μm after drying. , 80 ° C. for 5 minutes to form an insulating layer. The obtained substrate with an insulating layer was exposed to an exposure amount of 100 mJ / cm ² (wavelength 365 nm conversion) using the above-mentioned exposure apparatus via an exposure mask. The exposure mask used was molded so that the terminal portion of the first opaque wiring electrode was not exposed. Then, it was shower-developed with 0.08 mass% TMAH aqueous solution for 80 seconds to develop the insulating layer.

<Formation of second opaque wiring electrode>
A second opaque wiring electrode was formed on the obtained insulating layer by using the photosensitive conductive paste (c) in the same manner as for forming the opaque wiring electrode described above.

<Application of positive photosensitive composition>
The positive photosensitive composition (d) was printed on the second opaque wiring electrode forming surface of the obtained substrate with the opaque wiring electrode by a spin coater so that the film thickness after drying was 1 μm, and the temperature was 80 ° C. The substrate was dried for 5 minutes to obtain a substrate with a positive photosensitive composition.

<Exposure using a mask>
The obtained substrate with the positive photosensitive composition was exposed from the upper surface of the substrate with the positive photosensitive composition by arranging an exposure mask on the same side as the surface coated with the positive photosensitive composition using the above-mentioned exposure apparatus. The exposure mask used was formed so that the opening was located at the portion of the positive photosensitive composition on the terminal portion.

<Exposure from the side opposite to the coated surface>
The obtained substrate with a positive photosensitive composition was set on a substrate transfer jig so that the transparent substrate side was the lower surface. An LED lamp is set in the jig at a predetermined position at the bottom of the substrate transfer line. When the substrate with the positive photosensitive composition passed through the LED lamp installation portion, it was irradiated with LED light. The LED lamp was manufactured by CCS (L037), the irradiation wavelength was 365 nm, and the light emitting surface was 5 mm × 190 mm.

<Development>
The obtained substrate with the exposed positive photosensitive composition was shower-developed with a 0.08% TMAH solution, and a light-shielding layer was formed at the corresponding positions of the mesh-shaped patterns of the first opaque wiring electrode and the second opaque wiring electrode. A substrate with a wiring electrode shown in FIG. 4 was obtained, which had a light-shielding layer on the terminal portion.

(Example 4)
<Formation of insulating layer>
In Example 1, after forming the opaque wiring electrode (the first opaque wiring electrode in this embodiment), the insulating paste (e) is printed by a spin coater so that the film thickness becomes 0.5 μm after drying. , 80 ° C. for 5 minutes to form an insulating layer. Further, the exposure was performed with an exposure amount of 100 mJ / cm ² (wavelength 365 nm conversion) using the above-mentioned exposure apparatus via an exposure mask. The exposure mask used was molded so that the terminal portion of the first opaque wiring electrode was not exposed. Then, it was shower-developed with 0.08 mass% TMAH aqueous solution for 80 seconds to develop the insulating layer.

<Formation of second opaque wiring electrode>
A second opaque wiring electrode was formed on the obtained insulating layer by using the photosensitive conductive paste (c) in the same manner as for forming the opaque wiring electrode described above.

<Formation of second insulating layer>
The insulating paste (e) was printed on the obtained substrate with an opaque wiring electrode by a spin coater so that the film thickness was 0.5 μm after drying, and dried at 80 ° C. for 5 minutes to obtain a second insulating layer. Was formed. Further, the exposure was performed with an exposure amount of 100 mJ / cm ² (wavelength 365 nm conversion) using the above-mentioned exposure apparatus via an exposure mask. The exposure mask used was molded so that the terminals of the first opaque wiring electrode and the second opaque wiring electrode were not exposed. Then, it was shower-developed with 0.08 mass% TMAH aqueous solution for 80 seconds to develop the second insulating layer.

<Application of positive photosensitive composition>
The positive photosensitive composition (d) was printed on the second insulating layer forming surface of the obtained substrate with the opaque wiring electrode by a spin coater so that the film thickness after drying was 1 μm, and the temperature was adjusted to 80 ° C. The mixture was dried for 5 minutes to obtain a substrate with a positive photosensitive composition.

<Exposure using a mask>
The obtained substrate with the positive photosensitive composition was exposed from the upper surface of the substrate with the positive photosensitive composition by arranging an exposure mask on the same side as the surface coated with the positive photosensitive composition using the above-mentioned exposure apparatus. The exposure mask used was formed so that the opening was located at the portion of the positive photosensitive composition on the terminal portion.

<Exposure from the side opposite to the coated surface>
The obtained substrate with a positive photosensitive composition was set on a substrate transfer jig so that the substrate side was the lower surface. An LED lamp is set in the jig at a predetermined position at the bottom of the substrate transfer line. When the substrate with the positive photosensitive composition passed through the LED lamp installation portion, it was irradiated with LED light. The LED lamp was manufactured by CCS (L037), the irradiation wavelength was 365 nm, and the light emitting surface was 5 mm × 190 mm.

<Development>
The obtained substrate with the exposed positive photosensitive composition was shower-developed with a 0.08% TMAH solution, and a mesh-shaped pattern of the first opaque wiring electrode and the second opaque wiring electrode on the second insulating layer was performed. A substrate with a wiring electrode shown in FIG. 5 having a light-shielding layer at the corresponding position and having no light-shielding layer on the terminal portion was obtained.

1 Transparent substrate 2 Opaque wiring electrode 3 Light-shielding layer 4 Insulation layer 5 Opaque wiring electrode 6 Light-shielding layer 7 Insulation layer 8 Light-shielding layer

Claims (12)

The process of forming opaque wiring electrodes on a transparent substrate,
A step of applying a positive photosensitive composition to the opaque wiring electrode forming surface,
A step of exposing the positive photosensitive composition from the coated surface side of the positive photosensitive composition using an exposure mask.
A step of exposing the positive photosensitive composition from the surface opposite to the coated surface using the opaque wiring electrode as a mask.
A method for producing a substrate with a wiring electrode, which comprises a step of forming a light-shielding layer at a desired portion on the opaque wiring electrode by developing the positive photosensitive composition exposed from both sides. The opaque wiring electrode is the first opaque wiring electrode.
After the step of forming a light-shielding layer at a desired portion on the first opaque wiring electrode,
The step of forming an insulating layer on the first opaque wiring electrode forming surface,
A step of forming a second opaque wiring electrode on the insulating layer,
The step of applying the second positive photosensitive composition to the second opaque wiring electrode forming surface,
A step of exposing the second positive photosensitive composition from the coated surface side of the second positive photosensitive composition using an exposure mask.
A step of exposing the second positive photosensitive composition from a surface opposite to the coated surface using the second opaque wiring electrode as a mask.
Then, by developing the second positive photosensitive composition exposed from both sides, a second light-shielding layer is formed at desired portions on the first opaque wiring electrode and the second opaque wiring electrode. The method for manufacturing a substrate with a wiring electrode according to claim 1, further comprising a step of performing the wiring electrode. The process of forming the first opaque wiring electrode on the transparent substrate,
The step of forming an insulating layer on the first opaque wiring electrode,
A step of forming a second opaque wiring electrode on the insulating layer,
The step of applying the positive photosensitive composition to the second opaque wiring electrode forming surface,
A step of exposing the positive photosensitive composition from the coated surface side of the positive photosensitive composition using an exposure mask.
A step of exposing the positive photosensitive composition from a surface opposite to the coated surface using the first opaque wiring electrode and the second opaque wiring electrode as masks.
And with a wiring electrode having a step of forming a light-shielding layer at a desired portion on the first opaque wiring electrode and the second opaque wiring electrode by developing the positive photosensitive composition exposed from both sides. Substrate manufacturing method. The process of forming the first opaque wiring electrode on the transparent substrate,
A step of forming a first insulating layer on the first opaque wiring electrode forming surface,
A step of forming a second opaque wiring electrode on the first insulating layer,
A step of forming a second insulating layer on the second opaque wiring electrode forming surface,
A step of applying a positive photosensitive composition to the second insulating layer forming surface,
A step of exposing the positive photosensitive composition from the coated surface side of the positive photosensitive composition using an exposure mask.
A step of exposing the positive photosensitive composition from a surface opposite to the coated surface using the first opaque wiring electrode and the second opaque wiring electrode as masks.
A wiring electrode having a step of forming a light-shielding layer at desired portions on the first opaque wiring electrode and the second opaque wiring electrode by developing the positive photosensitive composition exposed from both sides. Manufacturing method of attached substrate. The method for manufacturing a substrate with a wiring electrode according to any one of claims 1 to 4, wherein the opaque wiring electrode includes a terminal portion, and the positive photosensitive composition on the terminal portion is removed by the development. The method for manufacturing a substrate with a wiring electrode according to any one of claims 1 to 5, wherein an LED lamp is used as a light source in the step of exposing the positive photosensitive composition from the surface opposite to the coated surface. The method for manufacturing a substrate with a wiring electrode according to any one of claims 1 to 6, wherein the transmittance of the opaque wiring electrode at a wavelength of 365 nm is 20% or less. The method for producing a substrate with a wiring electrode according to any one of claims 1 to 7, wherein the opaque wiring electrode contains a photopolymerization initiator and / or a photodecomposable product thereof. The method for producing a substrate with a wiring electrode according to any one of claims 1 to 8, wherein the light-shielding layer is made of a photocurable product of a positive photosensitive light-shielding composition containing a colorant. The method for manufacturing a substrate with a wiring electrode according to any one of claims 1 to 9, wherein the light-shielding layer has a reflectance of 25% or less at a wavelength of 550 nm. The method for manufacturing a substrate with a wiring electrode according to any one of claims 1 to 10, wherein the line width of the wiring electrode is 1 to 10 μm. The method for manufacturing a substrate with wiring electrodes according to any one of claims 1 to 11, wherein the substrate with wiring electrodes is a touch panel member.

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