WO2020174767A1

WO2020174767A1 - Pattern-added substrate manufacturing method, circuit board manufacturing method, touch panel manufacturing method, and laminate

Info

Publication number: WO2020174767A1
Application number: PCT/JP2019/044334
Authority: WO
Inventors: 山田　悟
Original assignee: 富士フイルム株式会社
Priority date: 2019-02-28
Filing date: 2019-11-12
Publication date: 2020-09-03
Also published as: CN113474728A; JPWO2020174767A1

Abstract

Provided are a pattern-added substrate manufacturing method and an application for same, the manufacturing method including a step for bringing a photosensitive resin composition layer that contains an acid decomposable resin the glass transition temperature of which is 50℃ or higher in a photosensitive transfer material comprising a temporary support and the photosensitive resin composition layer into contact with a polyimide substrate and pasting the photosensitive transfer material and the polyimide substrate together.

Description

\¥0 2020/174767 1 ?€1/^2019/044334

Specification

Title of invention:

Method for manufacturing patterned substrate, method for manufacturing circuit board, method for manufacturing touch panel, and laminated body

Technical field

The present disclosure relates to a method for manufacturing a patterned substrate, a method for manufacturing a circuit board, a method for manufacturing a touch panel, and a laminate.

Background technology

[0002] A technique for forming a conductive pattern such as a metal wiring is widely used, for example, in manufacturing a touch panel and in manufacturing a printed wiring board.

[0003] In a display device having a touch panel such as a capacitance type input device (for example, an organic electroluminescence (M!!) display device and a liquid crystal display device), various conductive patterns are provided inside the touch panel. Has been. Examples of the conductive pattern include an electrode pattern corresponding to the sensor of the visual recognition portion, peripheral wiring, and extraction wiring. In forming conductive patterns, because of the small number of processes, for example, a technique of forming a desired pattern through pattern exposure, development, and etching after applying a photosensitive transfer material to a substrate is used. It is possible (for example, refer to Japanese Patent Laid-Open No. 20 1 7-1 5 6 7 3 5).

As a substrate on which a conductive pattern is formed in a touch panel, polyethylene terephthalate (Mending) film or the like is usually used from the viewpoint of visibility.

On the other hand, in a printed wiring board, a heat resistant insulating film such as an aromatic polyimide film is used (see, for example, Japanese Unexamined Patent Publication No. 20000_2 1 2 8 0 2).

Summary of the invention

Problems to be Solved by the Invention 〇 2020/174767 2 (:171?2019/044334

[0006] However, for example, a photosensitive resin composition containing a polymer having a low glass transition temperature, such as the photosensitive transfer material described in Japanese Patent Application Laid-Open No. 20 1 715 6 7 35 When a pattern is formed on a substrate using a photosensitive transfer material having a layer, the time from the exposure process to the next process can be set when the substrate is allowed to stand from the exposure process to the next process (eg, development process). There may be a problem that the line width of the obtained pattern decreases with the passage of time. To solve this problem,

0 6 I )/ ^' ) with when 〇

[0007] Furthermore, when the conventional photosensitive transfer material and the substrate are bonded at high temperature, for example, the adhesion between the photosensitive transfer material and the substrate is deteriorated, and the substrate is deformed (for example, elongation and wrinkle). There is. The above-mentioned problems tend to occur particularly when the photosensitive transfer material and the substrate are bonded together by the mouth-to-roll ([^ 〇丨 I 〇 [^ 〇丨)) method.

[0008] Moreover, for example, the conventional polyimide film described in Japanese Patent Laid-Open Publication No. 2000-212128 is colored, and therefore can be applied to a display device having a touch panel. Considered difficult. Therefore, the above-mentioned polyimide film has not been studied as a substrate for pattern formation used in a touch panel.

[0009] The present disclosure has been made in view of the above circumstances.

An aspect of the present disclosure is to provide a method for producing a patterned substrate that can suppress a decrease in the line width of the pattern due to the passage of time after exposure and that has excellent laminate suitability under high temperature conditions.

Another aspect of the present disclosure is to provide a method for manufacturing a circuit board that can suppress a decrease in the line width of circuit wiring due to the passage of time after exposure and that is excellent in laminate suitability under high temperature conditions. To do.

Another aspect of the present disclosure is to provide a method for manufacturing a touch panel including the method for manufacturing a circuit board.

Another aspect of the present disclosure is to provide a method for manufacturing a touch panel using a circuit board manufactured by the method for manufacturing a circuit board. 〇 2020/174767 3 卩 (：171?2019/044334

Another aspect of the present disclosure is to provide a laminate capable of suppressing a decrease in the line width of a pattern due to the passage of time after exposure.

Means for solving the problem

Means for solving the above problems include the following modes.

<1> The above-mentioned photosensitive resin composition layer in a photosensitive transfer material comprising a temporary support and a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50 ^° or higher, and a polyimide. A method for producing a patterned substrate, which comprises a step of bringing the above-mentioned photosensitive transfer material and the above-mentioned polyimide substrate into contact with each other by bringing the printed substrate into contact with each other.

<2> The glass transition temperature of the acid-decomposable resin is 50° to 90° and the heating temperature is 120° to 150° in the process of bonding the photosensitive transfer material and the polyimide substrate. ° 〇 and the transfer speed is 2.5 / min ~ 5.

The method for producing a patterned substrate according to <1>, which is 0 / min.

<3> The method for producing a patterned substrate according to <1> or <2>, wherein the acid-decomposable resin has a glass transition temperature of 55° to 90°.

<4> The acid value of the acid-decomposable resin is

9. A method for manufacturing a patterned substrate according to any one of <1> to <3>.

<5> The acid-decomposable resin has a linear alkyl group having 1 to 3 carbon atoms at the ester position (meth)acrylate compound, and has a branched alkyl group having 1 to 3 carbon atoms at the ester position (meth) An acrylate compound, a (meth)acrylate compound having a cyclic alkyl group having a carbon number of 4 to 20 at the ester position, and a (meth)acrylate compound having a cyclic ether group having a carbon number of 4 to 20 at the ester position. 90% by mass or more of the structural unit derived from at least one (meth) acrylate compound based on the total mass of the acid-decomposable resin, and at least selected from the group consisting of acrylic acid and an acrylate compound. The composition according to any one of <1> to <4>, containing 0% by mass to 30% by mass of the total amount of the acid-decomposable resin containing one acrylic compound-derived structural unit 020/174767 4 卩 (: 171?2019/044334

A method of manufacturing a substrate with turns.

<6> The method for producing a patterned substrate according to any one of <1> to <5>, in which the haze of the polyimide substrate is 0.5% or less.

<7> The method for producing a patterned substrate according to any one of <1> to <6>, in which the total light transmittance of the polyimide substrate is 85% or more.

<8> A step of pattern-exposing the photosensitive resin composition layer after the step of laminating, and a step of developing the photosensitive resin composition layer subjected to the above/<<turn exposure to form a pattern of the photosensitive resin composition layer. The method for producing a patterned substrate according to any one of <1> to <7>, including the step of:

<9> The method for producing a patterned substrate according to any one of <1> to <8>, in which the polyimide substrate has a conductive layer.

<1 0> A step of producing a patterned substrate by the method for producing a patterned substrate according to <9>, and exposing the patterned substrate to a region of the photosensitive resin composition layer where the pattern is not formed. A method for manufacturing a circuit board, comprising: a step of etching a conductive layer; and a step of removing the pattern of the photosensitive resin composition layer, in this order.

<11> The method for producing a circuit board according to <10>, which has a step of exposing the entire surface of the photosensitive resin composition layer between the etching step and the removing step.

<12> The method for producing a circuit board according to <10> or <11>, wherein the conductive layer is a copper layer or a silver layer.

<13> A method for manufacturing a touch panel, including the method for manufacturing a circuit board according to any one of <10> to <12>.

<14> A touch panel manufacturing method including a step of preparing a circuit board manufactured by the circuit board manufacturing method according to any one of <10> to <12>.

<15> A laminate comprising a polyimide substrate and a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50° or higher. 〇 2020/174767 5 ((171?2019/044334)

[001 1] According to one embodiment of the present disclosure, there is provided a method for producing a patterned substrate, which can suppress a decrease in the line width of the pattern due to the passage of time after exposure and which is excellent in laminating suitability under high temperature conditions. be able to.

According to another aspect of the present disclosure, it is possible to provide a method for manufacturing a circuit board that can suppress a decrease in the line width of circuit wiring due to the passage of time after exposure and that is excellent in laminate suitability under high temperature conditions. ..

According to another aspect of the present disclosure, it is possible to provide a method for manufacturing a touch panel including the method for manufacturing the circuit board.

According to another aspect of the present disclosure, it is possible to provide a method for manufacturing a touch panel using a circuit board manufactured by the method for manufacturing a circuit board described above.

According to another aspect of the present disclosure, it is possible to provide a laminate capable of suppressing a decrease in the line width of a pattern due to the passage of time after exposure.

Brief description of the drawings

[0012] [FIG. 1] FIG. 1 is a schematic view showing an example of a layer structure of a photosensitive transfer material according to the present disclosure.

[Fig. 2] Fig. 2 is a schematic view showing an example of a pattern.

[FIG. 3] FIG. 3 is a schematic view showing an example of a pattern.

MODE FOR CARRYING OUT THE INVENTION

[0013] Hereinafter, embodiments of the present disclosure will be described in detail. It should be noted that the present disclosure is not limited to the following embodiments and can be implemented with appropriate modifications within the scope of the object of the present disclosure.

[0014] In the present disclosure, the numerical range represented by using "to" means a range including the numerical values described before and after "to" as the lower limit value and the upper limit value. In the numerical ranges described stepwise in the present disclosure, the upper limit value or the lower limit value described in a certain numerical range may be replaced with the upper limit value or the lower limit value of another stepwise described numerical range. Further, in the numerical range described in the present disclosure, the upper limit value or the lower limit value described in a certain numerical range may be replaced with the value shown in the examples. 〇 2020/174767 6 卩 (: 171?2019/044334

Yes.

In the present disclosure, “(meth)acrylic” means both and/or one of acrylic and methacrylic, and “(meth)acrylate” means both acrylate and methacrylate, or either. Means either side. In the present disclosure, the amount of each component in the composition means the total amount of the plurality of substances present in the composition, unless there is a plurality of substances corresponding to each component in the composition, unless otherwise specified. To do.

In the present disclosure, the term “process” is included in this term as long as the intended purpose of the process is achieved not only as an independent process but also when it cannot be clearly distinguished from other processes. ..

In the notation of a group (atomic group) in the present disclosure, the notation in which substitution and non-substitution are not included includes not only those having no substituent but also those having a substituent. For example, the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).

In the present disclosure, “mass %” and “weight %” have the same meaning, and “mass part” and “part by weight” have the same meaning.

In the present disclosure, a combination of two or more preferred embodiments is a more preferred embodiment.

In the present disclosure, the chemical structural formula may be described as a simplified structural formula in which a hydrogen atom is omitted.

In the present disclosure, “exposure” includes not only exposure using light but also drawing using a particle beam such as an electron beam or an ion beam, unless otherwise specified. The light used for exposure is not particularly limited. For example, a bright line spectrum of a mercury lamp, deep ultraviolet rays represented by an excimer laser, extreme ultraviolet rays (IIV light), X-rays, electron rays, etc. Actinic rays (active energy rays) can be mentioned.

[001 5] <Pattern manufacturing method>

A method of manufacturing a patterned substrate according to the present disclosure includes a temporary support, a glass transition temperature 〇 2020/174767 7 卩 (：171?2019/044334

A photosensitive resin composition layer containing an acid-decomposable resin having a degree of rotation of 50° or more, and the photosensitive resin composition layer in a photosensitive transfer material having, and a polyimide substrate. Then, there is a step of bonding the photosensitive transfer material and the polyimide substrate (hereinafter, also referred to as “bonding step”).

[0016] The method for manufacturing a patterned substrate according to the present disclosure can suppress a decrease in the line width of a pattern due to the passage of time after exposure, and has excellent laminating suitability under high temperature conditions. The reason why the method for manufacturing a patterned substrate according to the present disclosure exerts the above effects is not clear, but is presumed as follows.

The decrease in the line width of the pattern over time after exposure is considered to occur due to excessive decomposition of the photosensitive resin composition layer. The photosensitive transfer material applied to the method for manufacturing a patterned substrate according to the present disclosure has a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50 ^° C. or higher, thereby exposing Since it is possible to suppress the excessive diffusion of the acid in the photosensitive resin composition layer later, it is possible to suppress the excessive acid decomposition reaction of the photosensitive resin composition layer. The method for producing a substrate with butterflies according to the present disclosure is a photosensitive resin composition comprising: a temporary support; and a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50 ^° C. or higher. By including the step of bringing the photosensitive resin composition layer in the transfer material into contact with the polyimide substrate and bonding the photosensitive transfer material and the polyimide substrate, even under high temperature conditions, It is considered that the photosensitive transfer material and the polyimide substrate can be adhered to each other without the polyimide substrate deforming. Therefore, the adhesion between the photosensitive transfer material and the polyimide substrate can be improved. Therefore, it is considered that the method for manufacturing a patterned substrate according to the present disclosure can suppress the decrease in the line width of the pattern due to the passage of time after exposure, and is excellent in the suitability for lamination under high temperature conditions.

[0018] [Laminating process]

A method for manufacturing a patterned substrate according to the present disclosure is a photosensitive transfer comprising: a temporary support; and a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50° or higher. The photosensitive resin composition layer of the material and the polyimide substrate are brought into contact with each other, and the photosensitive transfer material and the polyimide substrate are bonded together. 〇2020/174767 8 卩(：171?2019/044334

Have steps.

[0019] The method of bonding the photosensitive transfer material and the polyimide substrate is not limited, and a known method can be applied. The bonding of the photosensitive transfer material and the polyimide substrate is preferably performed by applying pressure and heating using, for example, a mouth. Further, in the laminating step, known laminators such as a laminator, a vacuum laminator, and a talented laminator capable of increasing productivity can be used. The laminating step is preferably a mouth-to-roll method, that is, a method in which a mouth-shaped photosensitive transfer material and a mouth-shaped polyimide substrate are bonded.

[0020] In the bonding step, the heating temperature is preferably 100 ^° 〇 to 150 ^° 〇, more preferably 1 1 0 ^° 〇 to 1 50 ^° 〇, more preferably 1 20 ^° 〇 to 1 More preferably, it is 5°°, and particularly preferably 120°° to 140°°. When the heating temperature is 100 ^° C. or higher, the photosensitive transfer material can be easily attached to the polyimide substrate. When the heating temperature is 150 ^° C. or lower, deterioration of the film quality of the polyimide substrate can be suppressed.

When a contact-type heating means (for example, a mouth) is used in the bonding step, the heating temperature in the bonding step refers to the surface temperature of the contact-type heating means.

Further, when a non-contact type heating means (for example, a heater) is used in the bonding step, the heating temperature in the bonding step is the same as that of the photosensitive transfer material or the polyimide up to the contact point between the photosensitive transfer material and the polyimide substrate. The temperature reached on each surface of the printed circuit board.

[0022] In the laminating step, the transport speed is preferably 2.5 /min to 5.0 /min, more preferably 3.0 /min to 5.0 /min. The above-mentioned transportation speed refers to each transportation speed of the photosensitive transfer material and the polyimide substrate transported in the bonding step.

[0023] Among the above, have you when bonding the photosensitive transfer material and the polyimide substrate, the heating temperature is 1 20 ^° 〇 ~ 1 50 ^° 〇, and the conveying speed, 2. 〇 2020/174767 9 卩 (：171?2019/044334

/Min to 5.0 m/min, heating temperature is 120 °C to 140 °C, and transport speed is 2.5 m/min to 5. Om/min Is more preferable.

[0024] In the method for producing a patterned substrate according to the present disclosure, in addition to the bonding step, a step of pattern-exposing the photosensitive resin composition layer after the bonding step (hereinafter, also referred to as "exposure step") ) And a step of developing the pattern-exposed photosensitive resin composition layer to form a pattern of the photosensitive resin composition layer (hereinafter, also referred to as “developing step”). ..

[0025] The exposure step and the development step will be described below.

[0026] [Exposure step]

The method for producing a patterned substrate according to the present disclosure preferably has a step of pattern-exposing the photosensitive resin composition layer after the attaching step.

[0027] As the light source used for the exposure, a light source capable of irradiating light in a wavelength range capable of exposing the photosensitive resin composition layer (for example, 365 nm or 405 nm) is preferable. Examples of the light source include an ultra-high pressure mercury lamp, a high pressure mercury lamp, a metal halide lamp, and an LED (Light Emitting Diode).

[0028] The exposure dose is preferably 5 mJ/cm ² to 200 mJ/cm ² ,

More preferably, it is OmJ/cm ² to 100 mJ/cm ² .

[0029] Further, the pattern exposure may be exposure through a mask or direct exposure using a laser or the like.

[0030] In the exposure step, pattern exposure may be performed after peeling the temporary support from the photosensitive resin composition layer, and pattern exposure may be performed via the temporary support before peeling the temporary support. After that, the temporary support may be peeled off. When exposing through a mask, in order to prevent mask contamination due to contact between the photosensitive resin composition layer and the mask and to avoid the influence of foreign matter adhering to the mask on the exposure, remove the temporary support. It is preferable to carry out the pattern exposure without using it.

In the present disclosure, the detailed arrangement and specific size of the pattern are not limited, and may be set appropriately according to the purpose. For example, in a display device such as a touch panel 〇 2020/174767 10 卩 (：171?2019/044334

In order to improve the display quality and minimize the area occupied by the extraction wiring, at least a part of the pattern (particularly the electrode pattern of the touch panel and the extraction wiring) is a fine wire of 100 or less. Is preferable, and a thin line of 70 or less is more preferable.

[0032] [Development process]

The method for producing a patterned substrate according to the present disclosure preferably has a step of developing the pattern-exposed light-sensitive resin composition layer to form a pattern of the photosensitive resin composition layer.

[0033] When the photosensitive transfer material has an intermediate layer described below, the exposed intermediate layer is removed together with the exposed photosensitive resin composition layer in the developing step. Further, in the developing step, the intermediate layer in the unexposed area may also be removed by dissolving or dispersing it in a developing solution.

The development of the photosensitive resin composition layer that has been subjected to pattern exposure can be performed using a developer.

The developing solution is not limited as long as it is a developing solution capable of removing the exposed photosensitive resin composition layer. For example, known developing solutions such as the developing solution described in JP-A-5-72724 can be used. A liquid can be used. The developing solution is preferably a developing solution in which the exposed portion (in the case of a positive type) of the photosensitive resin composition layer has a dissolution type developing behavior. The developing solution is, for example, an alkaline aqueous solution type developing solution containing a compound of <3 = 7 to 13 at a concentration of 0. 05 0 10 丨 / 1_ (litre) to 5 0 10 丨 / !-. Preferably. The developing solution may further contain a water-soluble organic solvent and a surfactant. Examples of the developer suitably used in the present disclosure include the developers described in paragraph 0 19 4 of International Publication No. 20 15/093 2 7 1.

As the developing solution, it is also possible to use a developing solution in which the unexposed portion (in the case of a negative type) of the photosensitive resin composition layer has a dissolution type developing behavior. Examples of such a developer include organic solvents such as butyl acetate.

[0035] Examples of development methods include paddle development, shower development, shower and spray. 〇 2020/174 767 1 1 卩 (: 171?2019/044334

Either pin development or dip development may be used. Explaining shower development here, the exposed portion can be removed by spraying a developing solution onto the photosensitive resin composition layer after exposure with a shower. Further, after development, it is preferable to remove a development residue while spraying a cleaning agent or the like with a shower and rubbing with a brush or the like. The liquid temperature of the developer is preferably 20 ^{° to} 40 ^° .

The method for producing a patterned substrate according to the present disclosure may have a post-baking step in which a pattern containing a photosensitive resin composition layer obtained by development is heat-treated.

Temperature of the post baking is preferably 8 0 ^° 〇 ~ 2 5 0 ^° 〇, more preferably 1 1 0 ° 〇 ~ 1 7 0 ° 〇, 1 3 0 ° 〇 ~ 1 5 Particularly preferred is 0°.

The post-baking time is preferably 1 minute to 30 minutes, more preferably 2 minutes to 10 minutes, and particularly preferably 2 minutes to 4 minutes. Post bake may be performed in an air environment or a nitrogen substitution environment.

Further, when the photosensitive transfer material has a protective film described later, the method for producing a patterned substrate according to the present disclosure includes a step of peeling off the protective film of the photosensitive transfer material (hereinafter , “Protective film peeling step”). The protective film peeling step will be described in the section "Method for manufacturing circuit board" described later.

[0038] The patterned substrate produced by the method for producing a patterned substrate according to the present disclosure includes at least a polyimide substrate and a photosensitive resin composition layer in this order.

Next, a polyimide substrate and a photosensitive transfer material applied to the method for manufacturing a patterned substrate according to the present disclosure will be described.

[0040] [Substrate]

In the method of manufacturing a patterned substrate according to the present disclosure, a polyimide substrate is used as the substrate. In the method for manufacturing a patterned substrate according to the present disclosure 〇 2020/174767 12 卩 (：171?2019/044334

In particular, by bonding a polyimide substrate and a photosensitive transfer material described below, excellent laminating suitability can be realized under high temperature conditions.

[0041] The polyimide forming the polyimide substrate is not limited as long as it is a polymer compound containing an imide bond, and a known polyimide can be used. Further, the polyimide substrate may be a commercially available product. Polyimide substrates are available, for example, as follows: IV IV! 0 (registered trademark) Ding _{7 6} (made by A.S.T. Co., Ltd.) Ding [¾ 1\/1 M 0 0 Ding _{7 6} 3 (I.D. .S.T.) or Kapton (registered trademark) 1001 ^to 1 (manufactured by Toray DuPont Co., Ltd.). Among the above-mentioned commercial products, the polyimide substrate is suitable for optical characteristics.

It is preferable that the value is X, or □ [¾ 1\/1 刳 0 蔚 zo 63.

[0042] The haze of the polyimide substrate is preferably 3.0% or less, more preferably 2.0% or less, still more preferably 1.0% or less, 0.5 It is particularly preferably not more than %. When the haze of the polyimide substrate is 3.0% or less, light scattering can be suppressed. Therefore, for example, the display characteristics (for example, brightness) of the display device can be improved. The lower limit of haze for polyimide substrates is not limited. The haze of the polyimide substrate may be set appropriately in the range of 0% or more, for example.

[0043] The haze of the polyimide substrate is measured using a haze meter (for example, 0 1 ^to 1200, manufactured by Nippon Denshoku Industries Co., Ltd.).

[0044] The total light transmittance of the polyimide substrate is preferably 85% or more, more preferably 88% or more, further preferably 90% or more, and 95% or more. It is particularly preferable that The light transmittance of the polyimide substrate can be improved because the total light transmittance of the polyimide substrate is 85% or more. Therefore, for example, the display characteristics (eg, brightness) of the display device can be improved. The upper limit of the total light transmittance of the polyimide substrate is not limited. The total light transmittance of the polyimide substrate may be set appropriately in the range of 100% or less, for example.

[0045] The total light transmittance of the polyimide substrate is measured using a spectrophotometer (for example, II V_210, manufactured by Shimadzu Corporation). 〇2020/174767 13 卩(：171?2019/044334

[0046] The polyimide substrate may have a conductive layer. When the polyimide substrate has a conductive layer, it is preferable that the polyimide substrate has a conductive layer on at least one surface thereof. When the polyimide substrate has a conductive layer, it is preferable that at least the surface of the polyimide substrate on which the photosensitive transfer material is attached has conductivity. Since the polyimide substrate has the conductive layer, for example, a conductive pattern can be formed.

[0047] In the present disclosure, "conductivity" means that the volume resistivity is less than 1 X 10 ⁶ Qcm, and the volume resistivity is less than 1 X 10 ⁴ Q cm. preferable.

[0048] Examples of the conductive layer formed on the polyimide base material include any conductive layer used for general circuit wiring or touch panel wiring.

[0049] The conductive layer is selected from the group consisting of a metal layer, a conductive metal oxide layer, a graphene layer, a carbon nanotube layer, and a conductive polymer layer from the viewpoints of conductivity and fine wire forming property. At least one layer is preferable, at least one layer selected from the group consisting of a metal layer, and a conductive metal oxide layer is more preferable, and a metal layer is further preferable. A copper layer or a silver layer is particularly preferable.

[0050] Examples of the material forming the metal layer include aluminum, zinc, copper, iron, nickel, chromium, molybdenum, silver, and gold.

The material constituting the [0051] conductive metal oxide layer, for example, I TO (I ndium T in Ox ide), IZ_〇 (I ndium Z inc 〇_Xide), and S i 〇 _2.

[0052] The polyimide substrate may have one conductive layer, or may have two or more conductive layers. When the polyimide substrate has two or more conductive layers, it is preferable that the polyimide substrate have conductive layers made of different materials. Further, when the polyimide substrate has two or more conductive layers, at least one conductive layer of the two or more conductive layers preferably contains a conductive metal oxide.

[0053] As the conductive layer, a sensor of a visual recognition portion used in a capacitive touch panel 〇 2020/174767 14 卩 (：171?2019/044334

It is preferable that it is the wiring of the electrode pattern or the peripheral extraction portion corresponding to

[0054] The thickness of the polyimide substrate is not limited and may be appropriately set depending on the application. The average thickness of the polyimide substrate is preferably from 10 to 200100, from the viewpoint of strength, pattern linearity, and the controllability of M0, and is from 1101 to 1001. It is more preferable, and it is particularly preferable that it is from 1001 to 60.

The average thickness of the polyimide substrate is measured by the following method.

Using a scanning electron microscope (3/ 1\/1), observe the cross section of the polyimide board in the thickness direction and measure the thickness of the polyimide board at 10 locations. The arithmetic average value of the measured values is taken as the average thickness of the polyimide substrate.

[0056] [Photosensitive transfer material]

In the method for producing a patterned substrate according to the present disclosure, the photosensitive transfer material is a temporary support, and a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50 ^° C. or higher, Have. In the method for producing a patterned substrate according to the present disclosure, by using the above-mentioned photosensitive transfer material, it is possible to suppress excessive diffusion of acid in the photosensitive resin composition layer after exposure, and thus the photosensitive resin composition Excessive acid decomposition reaction of the layer can be suppressed. Therefore, it is possible to suppress the decrease in the line width of the pattern due to the passage of time after the exposure.

Hereinafter, each constitution of the photosensitive transfer material will be described.

[0058] [Temporary support]

The photosensitive transfer material has a temporary support. The temporary support is a support that supports the photosensitive resin composition layer and can be peeled from the photosensitive resin composition layer.

[0059] The temporary support preferably has optical transparency from the viewpoint that the photosensitive resin composition layer can be exposed through the temporary support when the photosensitive resin composition layer is subjected to pattern exposure. Here, having light transmittance means that the transmittance of the dominant wavelength of the light used for pattern exposure is 50% or more, and the transmittance of the dominant wavelength of the light used for pattern exposure is From the viewpoint of improving exposure sensitivity, 60% or more is preferable. 〇 2020/174767 1 5 (: 171?2019/044334

, 70% or more is more preferable. As a method of measuring the transmittance, there is a method of measuring using a spectrophotometer (eg, 1\/1 0 0 3 6 "丨 6 3" manufactured by Otsuka Electronics Co., Ltd.).

[0060] Examples of the temporary support include a glass substrate, a resin film, and paper, and a resin film is particularly preferable from the viewpoint of strength and flexibility. Examples of the resin film include polyethylene terephthalate film, cellulose triacetate film, polystyrene film, polycarbonate film, and polyimide film. Among the above, a biaxially stretched polyethylene terephthalate film is particularly preferable as the temporary support.

[0061] The thickness of the temporary support is determined from the viewpoints of strength as a support, flexibility required for bonding with a circuit wiring formation substrate, light transmittance required in the first exposure step, and the like. It may be appropriately set according to the material. The average thickness of the temporary support is preferably from 5 to 200!, and more preferably from 10 |^ to 150 because of ease of handling and stability. The average thickness of the temporary support is measured by a method according to the method for measuring the average thickness of the polyimide substrate.

[0062] Preferable embodiments of the temporary support are described, for example, in paragraphs XX017 to 01718 of JP-A No. 2014_856543. The descriptions of the above documents are incorporated herein by reference.

[Photosensitive resin composition layer]

The photosensitive transfer material has a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50 ^° or higher. Since the photosensitive transfer material has a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50 ^° C. or higher, it is possible to suppress a decrease in the line width of the pattern with the passage of time after exposure. ..

[0064] In the photosensitive resin composition layer, materials other than the acid-decomposable resin having a glass transition temperature of 50 ^° or higher are not limited, and are used in known acid-decomposable photosensitive resin composition layers. Known materials can be used.

[0065] From the viewpoint of sensitivity and resolution, the photosensitive resin composition layer preferably contains an acid-decomposable resin and a photo-acid generator, and has an acid group protected by an acid-decomposable group. 〇2020/174767 16 卩(：171?2019/044334

It is more preferable to contain a polymer (hereinafter, also referred to as “polymer X”) containing a structural unit (hereinafter, also referred to as “structural unit”) to be used, and a photo-acid generator. That is, the photosensitive resin composition layer is preferably a chemically amplified photosensitive resin composition layer.

[0066] When the photosensitive resin composition layer contains a photoacid generator such as an onium salt or an oxime sulfonate compound described below, the acid generated in response to actinic radiation (actinic ray) is It acts as a catalyst for the deprotection of protected acid groups. Since the acid generated by the action of one photon contributes to a large number of deprotection reactions, the quantum yield exceeds 1, which is a large value, for example, to the power of 10. As a result, high sensitivity is obtained. On the other hand, when a quinonediazide compound is used as a photoacid generator that is sensitive to actinic rays, it produces a carboxy group by a sequential photochemical reaction, but its quantum yield is always 1 or less, which is applicable to the chemical amplification type. do not do.

[0067] (Acid-decomposable resin)

The photosensitive resin composition layer contains an acid-decomposable resin having a glass transition temperature of 50 ^° C. or higher. Since the photosensitive resin composition layer contains the acid-decomposable resin having a glass transition temperature of 50 ^° C. or higher, it is possible to suppress the reduction of the line width of the pattern due to the passage of time after exposure.

The acid-decomposable resin is not limited as long as it has a glass transition temperature of 50 ^° C. or higher and can be decomposed by the action of an acid. Here, the term “decomposition” is not limited to a reaction involving the breaking of a chemical bond, but includes a reaction involving the conversion of a chemical structure. The acid-decomposable resin changes its polarity due to the action with acid, so that, for example, the solubility in a developing solution described later increases.

From the viewpoint of sensitivity and resolution, the acid-decomposable resin is preferably a polymer (polymer X) containing a constitutional unit (constitutional unit) having an acid group protected by an acid-decomposable group.

[0070] An acid group protected by an acid-decomposable group is converted into an acid group through a deprotection reaction by the action of a catalytic amount of an acid substance such as an acid generated by exposure. With the above acid group, 〇2020/174767 17 卩(：171?2019/044334

It is possible to dissolve the photosensitive resin composition layer in the developing solution.

The polymer X is preferably an addition polymerization type polymer, and more preferably a polymer containing a structural unit derived from (meth)acrylic acid or its ester. The polymer X has a structural unit other than the structural unit derived from (meth)acrylic acid or its ester (for example, a structural unit derived from a styrene compound or a structural unit derived from a vinyl compound). Good.

[0072] Hereinafter, preferred embodiments of the structural unit will be described.

[0073] Building unit eight

The structural unit is a structural unit having an acid group protected by an acid-decomposable group.

[0074] In the present disclosure, the "acid group" means a proton-dissociable group in which <3 is 12 or less. Acidic

From the viewpoint of improving sensitivity, 3 is preferably 10 or less, and more preferably 6 or less. Further, <3 of the acid group is preferably 15 or more. The acid group is preferably a carboxy group or a phenolic hydroxyl group

[0075] The acid-decomposable group is not limited and known acid-decomposable groups can be used. Examples of the acid-labile group include groups that are relatively easily decomposed by an acid (for example, acetal-type protecting groups such as 1-alkoxyalkyl group, tetrahydropyranyl group, and tetrahydrofuranyl group), and groups that are relatively difficult to be decomposed by acid. (For example, 1 6 "

And other tertiary alkyloxycarbonyl groups (that is, carbonic acid ester type protecting groups).

[0076] Among the above, the acid-decomposable group is preferably a group having a structure protected in the form of acetal. From the viewpoint of sensitivity, the acid-decomposable group is preferably a group having a cyclic structure, more preferably a group having a tetrahydrofuran ring structure or a tetrahydropyran ring structure, and a group having a tetrahydrofuran ring structure. Is more preferably, and a tetrahydrofuranyl group is particularly preferable. In addition, the acid-decomposable group has a molecular weight of from the viewpoint of suppressing the variation in the line width of the conductive wiring when applied to the formation of the conductive pattern. 〇2020/174767 18 卩(：171?2019/044334

It is preferably an acid-decomposable group of 300 or less.

[0077] The constitutional unit is selected from the group consisting of a constitutional unit represented by the following formula 1, a constitutional unit represented by the formula 2, and a constitutional unit represented by the formula 3 from the viewpoint of sensitivity and resolution. Preferably, it is at least one type of structural unit.

[0078] [Chemical 1]

014

Formula 41

[0079] In Formula 1,

And [¾ ¹² each independently represent a hydrogen atom, an alkyl group, or an aryl group,

It is a reel base,

Represents an alkyl group, or an aryl group, and [¾ ^{1 1} or [¾ ¹ ^2,

¹³ may be linked to form a cyclic ether, and [ ¹⁴ is a hydrogen atom or a methyl group, X ¹ is a single bond or a divalent linking group,

Represents a displacing group, and! ! Represents an integer from 0 to 4.

In Eq. 2

And [¾ ²² each independently represent a hydrogen atom, an alkyl group, or an aryl group,

An aryl group, [¾ ²³ represents an alkyl group, or an aryl group, [and ¾ ²¹ or [¾ ² ^2, may form a cyclic ether linked and the [¾ ^23, [¾ ²⁴ is , Each independently, a hydroxy group, a halogen atom, an alkyl group, an alkoxy group, an alkenyl group, an aryl group, an aralkyl group, an alkoxycarbonyl group, a hydroxyalkyl group, an arylcarbonyl group, an aryloxycarbonyl group, or a cycloalkyl group. It represents a group and represents an integer of 0 to 3. 〇 2020/174767 19 卩 (：171?2019/044334

In Ekihachi 3,

Are each independently a hydrogen atom, an alkyl group, or an aryl group,

It is a reel base,

Or represents an aryl group,

And [ ^33] may be linked to form a cyclic ether, [ ³⁴ is a hydrogen atom or a methyl group, and X is a single bond or a divalent linking group.

[0080] Among the above, the structural unit is more preferably a structural unit represented by Formula 3. The constitutional unit represented by the formula 3 is a constitutional unit having a carboxy group protected by an acetal-type acid-decomposable group. When the polymer X contains the constitutional unit represented by the formula 3, the sensitivity during pattern formation is excellent and the resolution is further excellent.

[0081] In the formula 3, [when ³¹ or ³² is an alkyl group, the alkyl group has 1 to

It is preferably 10 alkyl groups. In the formula (8), when [ ³¹ or [ ³² is an aryl group, the aryl group is preferably a phenyl group. [¾ ³¹ and [¾ ³ ² are each hydrogen atom or an alkyl group of carbon number 1-4 are preferred.

In formula 83, [| ³³ represents an alkyl group or an aryl group, preferably an alkyl group having 1 to 10 carbon atoms, and more preferably an alkyl group having 1 to 6 carbon atoms.

Further, the alkyl group and aryl group in [ ³¹ to [ ^33] may have a substituent.

Good, [and ¾ ³¹ or [¾ ^32, it is good preferable to form a cyclic ether linked and the [¾ ^33. The number of ring members in the cyclic ether is not particularly limited, but is preferably 5 or 6, and more preferably 5.

[0083] X in the formula 8. Is preferably a single bond or an arylene group, and more preferably a single bond. X. The arylene group in may have a substituent.

[0084] In Formula 8,

Represents a hydrogen atom or a methyl group, and is preferably a hydrogen atom from the viewpoint that the glass transition temperature (polymer 9) of polymer X can be further lowered. 〇2020/174767 20 卩(：171?2019/044334

Good

[0085] with respect to the total amount of the structural units contained in the polymer X, the content of the constituent unit ^{3 4} is a hydrogen atom in Formula 3 is preferably two 0 mass% or more. In addition, in the structural unit,

The content (content: weight ratio), ^{1 3} 〇- nuclear magnetic resonance spectrum

It can be confirmed from the intensity ratio of the peak intensities calculated by the usual method from the measurement.

[0086] In addition, as a preferred embodiment of Formulas 8 1 to 3, there are:

Reference may be made to paragraphs 0 0 4 4 to 0 0 5 8 of No. 7 9 6 40.

[0087] In Formulas 1 to 3, the acid-decomposable group is preferably a group having a cyclic structure from the viewpoint of sensitivity, and more preferably a group having a tetrahydrofuran ring structure or a tetrahydropyran ring structure. A group having a tetrahydrofuran ring structure is more preferable, and a tetrahydrofuranyl group is particularly preferable.

[0088] The polymer X may contain one kind of constitutional unit alone, or may contain two or more kinds of constitutional unit eight.

[0089] The content of the structural unit in the polymer X is 1 with respect to the total mass of the polymer X.

It is preferably 0% by mass to 70% by mass, more preferably 15% by mass to 50% by mass, and particularly preferably 20% by mass to 40% by mass. Within the above range, the resolution is further improved.

When the polymer X contains two or more constitutional units, the content of the constitutional unit represents the total content of the two or more constitutional units.

The content of the repeating unit in the polymer X (content: weight ratio) can be confirmed by the intensity ratio of the peak intensity is calculated by a conventional method from ^{1 3} 0 _ IV measurement!.

[0090]-One structural unit having an acid group

The polymer X may contain a constitutional unit having an acid group (hereinafter, also referred to as “constitutional unit”). The structural unit M is an acid group not protected by an acid-decomposable group, 〇2020/174767 21 卩(：171?2019/044334

That is, it is a structural unit having an acid group having no protecting group. When the polymer X contains the structural unit, the sensitivity at the time of pattern formation becomes good, the polymer X easily dissolves in an alkaline developing solution in the developing step after pattern exposure, and the developing time can be shortened.

[0091] Examples of the acid group in the structural unit include a carboxy group, a sulfonamide group, a phosphonic acid group, a sulfo group, a phenolic hydroxyl group, and a sulfonylimide group. Among the above, the acid group is preferably a carboxy group or a phenolic hydroxyl group, and more preferably a carboxy group.

[0092] The polymer X may contain one kind of constitutional unit, or may contain two or more kinds of constitutional unit.

[0093] The content of the constitutional unit in the polymer X is preferably 0.01 mass% to 20 mass% with respect to the total mass of the polymer X, and 0.01 mass% to 1 It is more preferably 0% by mass, and particularly preferably 0.1% by mass to 5% by mass. Within the above range, the resolution becomes better.

When the polymer X contains two or more types of constitutional unit, the content of the above constitutional unit represents the total content of two or more types of constitutional unit.

Constituent unit Snake content in the polymer X (content: weight ratio) can be confirmed by the intensity ratio of the peak intensity is calculated by a conventional method from ^{1 3} 0 _ IV measurement!.

[0094] — Other building blocks

In the polymer X, in addition to the above-mentioned structural unit 8 and structural unit M, other structural units (hereinafter, also referred to as “structural unit (3)”) are effective in the method for producing a patterned substrate according to the present disclosure. It is preferable to include in the range which does not impair.

[0095] The monomer forming the structural unit 〇 is not limited, and examples thereof include a styrene compound, (meth)acrylic acid alkyl ester, (meth)acrylic acid cyclic alkyl ester, (meth)acrylic acid aryl ester, and Saturated dicarboxylic acid gestels, Bicyclo unsaturated compounds, Maleimide compounds, Unsaturated aromatic compounds, Conjugated gen compounds, Unsaturated monocarboxylic acids, Unsaturated dicarboxylic acids, 〇2020/174767 22 卩(：171?2019/044334

Examples thereof include unsaturated dicarboxylic acid anhydrides, unsaturated compounds having an aliphatic cyclic skeleton, and other unsaturated compounds.

[0096] By adjusting at least one of the type and content of the structural unit O, various characteristics of the polymer X can be adjusted. In particular, by including the structural unit (3, the glass transition temperature, acid value, and hydrophilicity or hydrophobicity of the polymer X can be easily adjusted.

As the structural unit 〇, for example, styrene, <<-methylstyrene, acetoxystyrene, methoxystyrene, ethoxystyrene, chlorostyrene, methyl vinyl benzoate, ethyl vinyl benzoate, (meth)methyl acrylate, ( (Meth)ethyl acrylate, (meth)acrylic acid 1·!-propyl, (meth)isopropyl acrylate, (meth)acrylic acid 1·!-butyl, (meth)acrylic acid 2-ethylhexyl, (meth)acrylic acid 2-hydroxyethyl, (meth)acrylic acid 2-hydroxypropyl, (meth)benzyl acrylate, (meth)cyclopentyl acrylate, (meth)cyclohexyl acrylate, (meth)isobornyl acrylate, acrylonitrile, or ethylene glycol mono A constituent unit formed by polymerizing acetoacetate mono(meth)acrylate may be mentioned. Further, as the structural unit 〇, a structural unit formed by polymerizing the compounds described in paragraphs 〇〇 21 to paragraph 0 024 of Japanese Patent Laid-Open No. 2 0 4 2 6 4 6 2 3 Can be mentioned.

From the viewpoint of resolution, it is preferable that the structural unit (3 includes a structural unit having a basic group.

Examples of the basic group include groups having a nitrogen atom. Examples of the group having a nitrogen atom include an aliphatic amino group, an aromatic amino group, and a nitrogen-containing heteroaromatic ring group, and an aliphatic amino group is preferable.

The aliphatic amino group may be any of a primary amino group, a secondary amino group, or a tertiary amino group, but from the viewpoint of resolution, a secondary amino group, or a tertiary amino group A primary amino group is preferred.

[0099] Examples of the monomer forming the structural unit having a basic group include, for example, 〇 2020/174767 23 卩 (：171?2019/044334

Phosphoric acid 1, 2, 2, 6, 6-pentamethyl-4-piperidyl, 2-(dimethylamino)ethyl methacrylate, acrylic acid 2, 2, 6, 6-tetramethyl

-4-Piperidyl, 2,2,6,6-Tetramethyl-4-piperidyl Methacrylate, 2,2,6,6-Tetramethyl-4-piperidyl Acrylate, 2-(Diethylamino)ethyl methacrylate, 2 Acrylate -(Dimethylamino) ethyl, acrylic acid 2-(diethylamino) ethyl, methacrylic acid 1\!-(3 -dimethylamino) propyl, acrylic acid 1\! _ (3 -dimethylamino)propyl, methacrylic acid 1\! -(3-Diethylamino)propyl, acrylic acid-(3-diethylamino)propyl, methacrylic acid 2-(diisopropylamino)ethyl, methacrylic acid 2-morpholinoethyl, acrylate 2-morpholinoethyl, 1\1 _ [3— (Dimethylamino)propyl] acrylic amide, 4-aminostyrene, 4-vinylpyridine, 2-vinylpyridine, 3-vinylpyridine, 1-vinylimidazole, 2-methyl-1-vinylimidazole, 1-allylimidazole, and 1 —Vinyl-1,2,4-triazole may be mentioned. Among these, 1,2,2,6,6-pentamethyl 4-piperidyl methacrylate is preferable.

[0100] Further, the structural unit (3 is preferably a structural unit having an aromatic ring or a structural unit having an aliphatic cyclic skeleton, from the viewpoint of improving the electrical characteristics of the photosensitive transfer material. Examples of the monomer that forms the unit include styrene, <<-methylstyrene, dicyclopentanyl (meth)acrylate, cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, and benzyl (meth)acrylate. ) Acrylate is mentioned, and cyclohexyl (meth)acrylate is preferable.

[0101] Further, the monomer forming the structural unit <3 is preferably a (meth)acrylic acid alkyl ester from the viewpoint of adhesion. Among the above, (meth)acrylic acid alkyl ester having an alkyl group having 4 to 12 carbon atoms is more preferable from the viewpoint of adhesion. Specifically, (meth)methyl acrylate, (meth)ethyl acrylate, (meth)propyl acrylate, (meth)acrylic acid 〇 2020/174767 24 卩 (：171?2019/044334

Examples thereof include 2-butylhexyl butyl, and 2-ethylhexyl (meth)acrylate.

[0102] The polymer X may contain one kind of constitutional unit <3, or may contain two or more kinds of constitutional unit ◯.

[0103] The content of the structural unit <3 is preferably 90% by mass or less, more preferably 85% by mass or less, particularly preferably 80% by mass or less, based on the total mass of the polymer X. The content of the structural unit ◯ is preferably 10% by mass or more, and more preferably 20% by mass or more. Within the above range, the resolution and the adhesiveness are further improved.

When the polymer X contains two or more kinds of constitutional units <3, the content of the constitutional units <3 represents two or more kinds of constitutional units (the total content of 3).

[0104] Hereinafter, preferred examples of the polymer X in the present disclosure will be given, but the present disclosure is not limited to the following examples. The ratio of the constituent units and the weight average molecular weight in the following exemplified compounds are appropriately selected to obtain preferable physical properties.

[0105]

〇 2020/174767 26 卩 (：171?2019/044334

[0106] _ Method for producing polymer X

The production method (synthesis method) of the polymer X is not limited. The polymer X is, for example, a monomer for forming the structural unit, and further, if necessary, in an organic solvent containing a monomer for forming the structural unit and a monomer for forming the structural unit 〇, initiating the polymerization. It can be synthesized by polymerizing with an agent. The polymer X can also be synthesized by a so-called polymer reaction.

[0107] In addition, the acid-decomposable resin (preferably the polymer X) is a (meth)acrylate compound having a linear alkyl group having 1 to 3 carbon atoms at the ester position from the viewpoint of resolution. A (meth)acrylate compound having a branched alkyl group of the number 1 to 3 at the ester position, a (meth)acrylate compound having a cyclic alkyl group having a carbon number of 4 to 20 at the ester position, and a compound having a carbon number of 4 to 20 It is preferable to include a structural unit derived from at least one (meth)acrylate compound selected from the group consisting of (meth)acrylate compounds having a cyclic ether group at the ester position.

[0108] Here, the term "ester position" used in the present disclosure will be described below. The expression “having eight in the ester position” means that eight is bonded to the bonding site (101) on the oxygen atom side of the ester bond (−0 (= 〇)-0 −), that is, “one 〇 (= 〇) 108” means that the structure is represented. For example, “having a straight-chain alkyl group having 1 to 3 carbon atoms at the ester position” means that a straight-chain alkyl group having 1 to 3 carbon atoms is bonded to the bond site on the oxygen atom side of the ester bond. Means that Further, when a straight-chain alkyl group having 1 to 3 carbon atoms is represented, "having a straight-chain alkyl group having 1 to 3 carbon atoms at the ester position" means "10 (= 〇) 10 It means having a structure represented by "1 X".

[0109] In the structural unit derived from the (meth)acrylate compound, the number of carbon atoms is 4 to 2

The cyclic alkyl group having 0 carbon atoms is preferably a cyclic alkyl group having 4 to 10 carbon atoms, more preferably a cyclic alkyl group having 5 to 8 carbon atoms, and particularly preferably a cyclohexyl group. .. 〇 2020/174767 27 卩 (：171?2019/044334

[0110] In the structural unit derived from the (meth)acrylate compound, the number of carbon atoms is 4 to 2

The cyclic ether group having 0 carbon atoms is preferably a cyclic ether group having 4 to 10 carbon atoms, more preferably a cyclic ether group having 5 to 8 carbon atoms, a tetrahydrofuranyl group, or a tetrahydropyranyl group. Is more preferable, and a tetrahydrofuranyl group is particularly preferable.

[01 11] The content of the structural unit derived from the (meth)acrylate compound is preferably 90% by mass or more, and more preferably 95% by mass or more, based on the total mass of the acid-decomposable resin. Is more preferable. The upper limit of the content of the constituent unit derived from the (meth)acrylate compound is not limited. The content of the structural unit derived from the (meth)acrylate compound may be appropriately set in the range of, for example, 100 mass% or less with respect to the total mass of the acid-decomposable resin.

[0112] The acid-decomposable resin (preferably the polymer X) contains a structural unit derived from at least one acrylic compound selected from the group consisting of acrylic acid, and an acrylate compound from the viewpoint of resolution. It is preferable.

[0113] The constituent unit derived from the acrylate compound is not limited, and examples thereof include constituent units derived from the various acrylate compounds described above.

[0114] The content of the structural unit derived from the acrylic compound is preferably 0% by mass to 40% by mass, and 0% by mass to 30% by mass with respect to the total mass of the acid-decomposable resin. It is more preferable that the amount is 5% by mass to 30% by mass.

[0115] Among the above, the acid-decomposable resin (preferably the polymer X) is a (meth)acrylate compound having a linear alkyl group having 1 to 3 carbon atoms at the ester position, and a branched chain having 1 to 3 carbon atoms. A (meth)acrylate compound having a cyclic alkyl group at the ester position, a (meth)acrylate compound having a cyclic alkyl group having 4 to 20 carbon atoms at the ester position, and a cyclic ether group having 4 to 20 carbon atoms Containing 90% by mass or more with respect to the total mass of the acid-decomposable resin, at least one structural unit derived from a (meth)acrylate compound selected from the group consisting of (meth)acrylate compounds in the ester position, And acrylic acid and acrylate compounds 〇 2020/174767 28 卩 (：171?2019/044334

It is preferable that the constituent unit derived from at least one acrylic compound selected from the group consisting of When the acid-decomposable resin contains the above structural units in a specific ratio, the resolution can be improved and the glass transition temperature of the acid-decomposable resin can be adjusted within a desired numerical range.

[0116] (Glass transition temperature)

The glass transition temperature of the acid-decomposable resin (preferably polymer X) is 50 ^° 〇 or higher, preferably 55° 〇 or higher, more preferably 60° 〇 or higher, and 70° 〇 or higher. Is more preferable, and it is particularly preferable that it is 80° or more. When the glass transition temperature of the acid-decomposable resin is 50 ^° 〇 or higher, the acid diffusion in the photosensitive resin composition layer can be suppressed after exposure to light, resulting in excessive acid decomposition of the photosensitive resin composition layer. The reaction can be suppressed. Therefore, it is possible to suppress the decrease in the line width of the pattern due to the passage of time after the exposure.

[0117] The glass transition temperature of the acid-decomposable resin is preferably 110 ^° C or less,

It is more preferably 100° or less, and even more preferably 90° or less. It is particularly preferable that it is 85° or less, and most preferably 80° or less. When the glass transition temperature of the acid-decomposable resin is 1100 ^° or less, the suitability for lamination can be improved under high temperature conditions.

[0118] Among the above, the glass transition temperature of the acid-decomposable resin is preferably from 50 ^° 〇 ~ 90 ^° 〇, more preferably from 55 ^° 〇_～90 ^° 〇, 55 ^° 〇_～85 ° O is more preferable, 60° O to 85° O is particularly preferable, and 60 ^° to 80 ^° O is most preferable. When the glass transition temperature of the decomposable resin is within the above numerical range, it is possible to suppress the decrease in the line width of the pattern due to the passage of time after exposure, and it is possible to improve the suitability for lamination under high temperature conditions.

[0119] The glass transition temperature of the acid-decomposable resin is measured by a method according to the method described in "3 <7 1 2 1 :1 987". As the glass transition temperature in the present disclosure, an extrapolated glass transition start temperature (hereinafter, also referred to as “Chapter 9”) is used.

When measuring the glass transition temperature, the expected glass transition temperature of the acid-decomposable resin 〇2020/174767 29 卩(：171?2019/044334

After maintaining the measuring device at a temperature about 50° below the temperature until it stabilizes, heat at a heating rate of 20°/min to a temperature about 30° above the temperature at which the glass transition ends Analysis (original) Curve or differential scanning calorific value (Draw the 030 curve. Extrapolation glass transition onset temperature (Diagram 9), that is, the glass transition temperature in the present disclosure is as follows. It is calculated as the temperature at the intersection of the straight line extending the side baseline to the high temperature side and the tangent line drawn at the point where the slope of the curve of the step transition of the glass transition becomes maximum.

[0120] In the present disclosure, as a method of adjusting the glass transition temperature of the acid-decomposable resin, for example, a method of adjusting the glass transition temperature using the equation (10) as a guideline can be mentioned. According to the formula, the glass transition temperature of the acid-decomposable resin can be calculated based on the glass transition temperature of the homopolymer of each constitutional unit constituting the desired acid-decomposable resin and the mass ratio of each constitutional unit. Can be adjusted.

[0121] Hereinafter, the formula will be described by taking a co-polymer including the first constitutional unit and the second constitutional unit as an example.

[0122] homopolymers sheets 9 1 Ding 9 of the first structural unit, the mass fraction of the first configuration unit in the copolymer 1, a homopolymer of sheets ₉ of the second structural unit and Ding ₉ 2, when the mass fraction of the second structural unit in the copolymer and \ ^ / 2, a copolymer of Ding 90 including first and configuration unit and a second constitutional unit (< : Kelvin) can be estimated according to the following formula.

○ Formula: 1 / Ding ₉ 0 = (\^/1 / Ding ₉ 1) 10 (\^/2/Ding ₉ 2) Using the above-mentioned formula, each structural unit that constitutes the copolymer It is possible to obtain a copolymer having a desired glass transition temperature by adjusting the type and mass fraction of.

[0123] It is also possible to adjust the glass transition temperature of the acid-decomposable resin by adjusting the weight average molecular weight of the acid-decomposable resin.

[0124] -Acid value_

The acid value of the acid-decomposable resin (preferably polymer X) is 0 9 <01 ^~ 1/9 ~ 50 1119

Is preferred,

〇 2020/174767 30 卩 (：171?2019/044334

More preferably, particularly preferably 0_Rei_19 <Rei_1 ^~ 1/9 ~ 1 0_Rei_19 <Rei_1 ^~ 1/9. When the acid value of the acid-decomposable resin is within the above numerical range, it is difficult for water to penetrate into the photosensitive resin composition layer, and therefore excessive hydrolysis reaction of the unexposed photosensitive resin composition layer can be suppressed. .. Therefore, it is possible to suppress a decrease in the line width of the pattern.

[0125] In the present disclosure, the acid value represents the mass of potassium hydroxide required to neutralize the acidic component per measurement sample 19. Specifically, the measurement sample was dissolved in tetrahydrofuran/water=9/1 (volume ratio) mixed solvent, and then obtained using a potentiometric titrator (for example, Ding_510, manufactured by Kyoto Electronics Manufacturing Co., Ltd.). The resulting solution at 25 ° 〇.

Neutralization Titrate. Using the inflection point of the titration 1 ^to 1 curves as the end point of titration, calculate the acid value by the following formula.

Formula: Eight = 56· 1 1 XV 3 X 0. 1 1 ^: /\«

Eight: Acid value (019 [< 〇 1 ^to 1/9)

V 3: Required for titration 〇 .01 01 〇丨

-Amount of sodium hydroxide used (011_)

Dry: 〇.

Potency of aqueous sodium hydroxide solution

%: Mass of measurement sample (9) (solid content conversion)

[0126] _ one molecular weight

The molecular weight of the acid-decomposable resin (preferably the polymer X) is preferably 60,000 or less in terms of polystyrene weight average molecular weight. When the weight average molecular weight of the acid-decomposable resin is 60,000 or less, the temperature range (for example, 150 ^° 〇) where the deterioration of the film quality of the polyimide substrate can be suppressed when the photosensitive transfer material is bonded to the polyimide substrate ^. The following) can be used for bonding. The weight average molecular weight of the acid-decomposable resin is preferably 2,000 to 60,000, more preferably 3,000 to 50,000. The ratio (dispersion degree) of the number average molecular weight and the weight average molecular weight of the polymer X is preferably 1.0 to 5.0, and more preferably 1.05 to 3.5. 〇2020/174767 31 卩(：171?2019/044334

[0127] In the present disclosure, the weight average molecular weight of the acid-decomposable resin is measured by GPC (gel permeation chromatography). As the measuring device, various commercially available devices can be used, and the contents of the device and the measuring technique are known to those skilled in the art.

In the measurement of the weight average molecular weight by gel permeation chromatography (GPC), HLC (registered trademark)-1820GPC (manufactured by Tosoh Corporation) is used as a measuring device. The columns are TS Kge I (registered trademark) Super H ZM— M (4.6 mm IDX 15 cm, manufactured by Tosoh Corporation), Super HZ 4000 (4.6 mm l DX l 5 cm, Tosoh Stock Association). Supper HZ 3000 (4.6 mm l DX l 5 cm, manufactured by Tosoh Corporation), and Super HZ 2000 (4.6 mm l DX l 5 cm, manufactured by Tosoh Corporation) Use those connected in series. Use THF (tetrahydrofuran) as the eluent.

As the measurement conditions, the sample concentration is 0.2% by mass, the flow rate is 0.35 mL/min, the sample injection amount is 10 ML, and the measurement temperature is 40 ^° C. A differential refractive index (R) detector is used as the detector.

The calibration curve is “standard sample TSK standard, polystyrene” manufactured by Tosoh Corporation: “F—40”, “F—20”, “F—4”, “F-1”, “A-5000”, “A” -2500" and "A-1 000" can be manufactured using either of the 7 samples.

[0128] (Content)

The photosensitive resin composition layer may contain one type of acid-decomposable resin alone,

It may contain two or more acid-decomposable resins. From the viewpoint of adhesion, the content of the acid-decomposable resin is preferably 50% by mass to 99.9% by mass, and 70% by mass to 98% by mass with respect to the total mass of the photosensitive resin composition layer. I like to have it.

[0129] (Other polymers)

The photosensitive resin composition layer contains an acid-decomposable resin and an acid protected by an acid-decomposable group. 〇 2020/174767 32 卩 (：171?2019/044334

It may contain a polymer not containing a constitutional unit having a group (hereinafter, also referred to as “other polymer”). In the present disclosure, the acid-decomposable resin and the other polymer are collectively referred to as “polymer component”. The compounds corresponding to the crosslinking agent, dispersant and surface active agent described later, even if they are polymer compounds, shall not be included in the polymer component.

[0130] Examples of other polymers include polyhydroxystyrene. Examples of commercially available polyhydroxystyrenes are 31\/1 8 1 000, 31\/1 8 2000, 31\/1 8 3000, 31\/1 8 1 440, 31\/1 8 1 7352 , 31\/1 Hachi 26259. and 3 IV! Hachi 3840 (above, manufactured by Sartomer),

11 001 3000,

110_

\ ARU FON 11 〇 3920, and Hachi II 〇 II 〇 1 3080 (hereinafter, manufactured by Toagosei Co., Ltd.), and ”门〇 “So 1690,” 〇门〇 “So I 678,

586 (above, manufactured by three Minahachi companies).

[0131] The photosensitive resin composition layer may contain one kind of another polymer alone, or may contain two or more kinds of other polymers.

[0132] When the photosensitive resin composition layer contains another polymer, the content of the other polymer is preferably 50% by mass or less based on the total mass of the polymer component, It is more preferably at most% by mass, particularly preferably at most 20% by mass.

[0133] When the photosensitive resin composition layer contains another polymer, the content of the polymer component is, from the viewpoint of adhesion, 50% by mass to 9% by mass with respect to the total mass of the photosensitive resin composition layer. It is preferably 9.9% by mass, more preferably 70% by mass to 98% by mass.

[0134] (Photoacid generator)

The photosensitive resin composition layer preferably contains a photoacid generator.

[0135] The photo-acid generator used in the present disclosure includes ultraviolet rays, deep ultraviolet rays, X-rays, electron beams, etc. 〇2020/174767 33 卩(：171?2019/044334

It is a compound capable of generating an acid when irradiated with an actinic ray. As the photo-acid generator, a wavelength of 300 n or more, preferably a wavelength of

Compounds that generate an acid by reacting to actinic rays of 450 n 〇! are preferable, but the chemical structure thereof is not limited. In addition, a photo-acid generator that is not directly sensitive to actinic light having a wavelength of 300 _n or more can be used by combining it with a sensitizer.

Any compound capable of reacting with the above-mentioned actinic rays and generating an acid can be preferably used in combination with the sensitizer.

As the photoacid generator, a photoacid generator that generates an acid of <3 is 4 or less is preferable, and a photoacid generator that generates an acid of <3 is 3 or less is more preferable,

A photo-acid generator that generates an acid of 2 or less is particularly preferable. The lower limit of <3 is not specified.

Is, for example, preferably not less than 10.0.

[0136] Examples of the photoacid generator include an ionic photoacid generator and a nonionic photoacid generator.

Examples of the ionic photoacid generator include onium salt compounds such as diaryliodonium salt compounds and triarylsulfonium salt compounds, and quaternary ammonium salt compounds. Among the above, onium salt compounds are preferable, and diaryl iodonium salts or triaryl sulfonium salt compounds are particularly preferable.

As the ionic photoacid generator, the ionic photoacid generator described in paragraphs 0 1 1 4 to 0 1 3 3 of JP-A No. 2 041-85 6 4 3 can also be preferably used. ..

[0138] Examples of the nonionic photoacid generator include trichloromethyl-3-triazine compounds, diazomethane compounds, imide sulfonate compounds, and oxime sulfonate compounds. Among the above, the oxime sulfonate compound is preferable from the viewpoints of sensitivity, resolution, and adhesion. Specific examples of trichloromethyl 3_ triazine compounds, diazomethane compounds, and imidsulfonate compounds are described in JP-A Nos. 2 0 1 1 -2 2 1 4 9 4 paragraphs 0 0 8 3 to 0 8 8 8. The compounds described can be exemplified. 〇 2020/174767 34 卩 (：171?2019/044334

[0139] As the oxime sulfonate compound, those described in paragraphs 〇 804 to 088 of International Publication No. 2018/179648 can be preferably used.

[0140] From the viewpoint of sensitivity and resolution, the photo-acid generator preferably contains at least one compound selected from the group consisting of an onium salt compound and an oxime sulfonate compound, and preferably contains an oxime sulfonate compound. More preferred.

In addition, examples of preferable photoacid generators include photoacid generators having the following structures.

[0141] [Chemical 3]

[0142] The photosensitive resin composition layer may contain one type of photoacid generator alone, or may contain two or more types of photoacid generator.

[0143] From the viewpoint of sensitivity and resolution, the content of the photo-acid generator in the photosensitive resin composition layer is from 0.1% by mass to 10% by mass with respect to the total mass of the photosensitive resin composition layer. Is preferable, and it is more preferable that the amount is from 0.5% by mass to 5% by mass.

[0144] (Other additives)

The photosensitive resin composition layer may contain other additives, if necessary.

[0145] As other additives, known additives may be used, and examples thereof include a plasticizer, a sensitizer, a heterocyclic compound, an alkoxysilane compound, a basic compound, an antisolent agent, and a surfactant. Can be mentioned.

[0146] Examples of the plasticizer, the sensitizer, the heterocyclic compound and the alkoxysilane compound are described in, for example, paragraphs 0 0 9 7 to 0 1 1 9 of International Publication No. 2018/17 9640. The mentioned plasticizers, sensitizers, heterocyclic compounds and alkoxysilane compounds are mentioned. 〇 2020/174767 35 卩 (：171?2019/044334

[0147] Further, the photosensitive resin composition layer may contain a solvent. When the photosensitive resin composition layer is formed from the photosensitive resin composition containing a solvent, the solvent may remain in the photosensitive resin composition layer.

[0148] The content of the solvent in the photosensitive resin composition layer is preferably 5% by mass or less, and more preferably 2% by mass or less, based on the total mass of the photosensitive resin composition layer. It is more preferably 1% by mass or less.

[0149] One basic compound

The photosensitive resin composition layer preferably contains a basic compound.

[0150] As the basic compound, any of the basic compounds used in the chemically amplified resist can be selected and used. Examples of the basic compound include aliphatic amines, aromatic amines, heterocyclic amines, quaternary ammonium hydroxides, and quaternary ammonium salts of carboxylic acids. Specific examples of the basic compound include compounds described in paragraphs 0 2 0 4 to 0 2 07 of JP 2 0 1 1 -2 2 1 4 9 4 JP, the contents of which are Incorporated herein.

[0151] Also, as the basic compound, 1\1-cyclohexyl-1\1'-[2-(4-morpholinyl)ethyl]thiourea (O IV! Ding II) can be preferably used. In addition, as a commercially available product of 1/1 / 11, it is manufactured by Toyo Kasei

Can be mentioned.

[0152] As the basic compound, a benzotriazole compound is preferable from the viewpoint of linearity of conductive wiring when applied to the formation of a conductive pattern.

The benzotriazole compound is not limited as long as it is a compound having a benzotriazole skeleton, and a known benzotriazole compound can be used.

Examples of the benzotriazole compound include 1, 2, 3, 3-benzotriazole, 1 — [1\1, 1\1 _ bis(2-ethylhexyl)aminomethyl]benzotriazole, 5-carboxybenzotriazole, 1 — ( Hydroxymethyl) _ 1 !! _ Benzotriazole, 1 — Acetyl 1 !! _ Benzotriazo 〇 2020/174767 36 卩 (：171?2019/044334, 1-aminobenzotriazole, 9 _ (1 1 ^to 1 _benzotriazol 1 -ylmethyl) 1 9 1 ^to 1-carbazole, 1 -chloro 1 1 ^to 1-benzotriazol, 1-(2-pyridinyl) benzotriazole, 1-hydroxybenzotriazole, 1-methylbenzotriazole, 1-ethylbenzotriazol, 1-(1'-hydroxyethyl)benzo Triazole, 1 — (2′-hydroxyethyl) benzotriazole, 1 — (1′-hydroxypropyl) benzotriazole, 1 — (2′-hydroxypropyl) benzotriazole, 1 _ (3'-Hydroxypropyl) benzotriazole, 4-hydroxy _ 1 1 ^to 1 _ benzotriazole, 5-methyl- 1 1 ^to 1 _ benzotriazole, methylbenzotriazole-5-carboxylate, ethylbenzotriazole 5-Carboxylate, 1 _ Butyl-benzotriazole-5-carboxylate, Cyclopentylethyl — Benzotriazole-5-carboxylate, 1 1 ^~ 1 _ Benzotriazole — 1 — Acetonitrile, 1 1 ^~ 1 — Benzotriazole 1 — Examples thereof include carboxy aldehyde, 2-methyl-2 1 ^to 1 _benzotriazole, and 2-ethyl 2 1 ^to 1 _benzotriazole.

[0153] The photosensitive resin composition layer may contain one kind of basic compound,

It may contain two or more basic compounds.

[0154] The content of the basic compound is 0.0 with respect to the total mass of the photosensitive resin composition layer.

It is preferably from 0.1% by mass to 5% by mass, more preferably from 0.05% by mass to 3% by mass.

[0155] _Surfactant I

The photosensitive resin composition layer preferably contains a surfactant from the viewpoint of thickness uniformity.

[0156] Examples of the surfactant include anionic surfactants, cationic surfactants, nonionic (nonionic) surfactants, and amphoteric surfactants. A preferred surfactant is a nonionic surfactant.

Examples of nonionic surfactants include polyoxyethylene higher surfactants. 〇 2020/174767 37 卩 (：171?2019/044334

Examples include rutile ether-based surfactants, polyoxyethylene higher alkylphenyl ether-based surfactants, polyoxyethylene glycol higher fatty acid ester-based surfactants, silicone-based surfactants, and fluorine-based surfactants. To be

[0157] As the surfactant, for example, the surfactants described in paragraphs 0120 to paragraph 0125 of International Publication No. 2018/179640 can be used. ..

[0158] As a commercially available product of the surfactant, for example, Megafac (registered trademark) -552 or -554 (above, manufactured by Kuchiki O Co., Ltd.) can be used.

[0159] In addition, paragraph 0 0 1 7 of Japanese Patent No. 45 0 2 7 8 4 and JP 2 0 0 9 _ 2

The surfactants described in paragraphs 0 0 6 0 to 0 0 7 1 of Japanese Patent Publication No. 37362 can also be used.

[0160] The photosensitive resin composition layer may contain one kind of surfactant alone, or may contain two or more kinds of surfactant.

[0161] The content of the surfactant is 0.00 relative to the total mass of the photosensitive resin composition layer.

It is preferably 1% by mass to 10% by mass, more preferably 0.01% by mass to 3% by mass.

[0162] In addition, the photosensitive resin composition layer in the present disclosure includes, as additives other than the above, metal oxide particles, antioxidants, dispersants, acid proliferating agents, development accelerators, conductive fibers, colorants, It may contain known additives such as a thermal radical polymerization initiator, a thermal acid generator, an ultraviolet absorber, a thickener, a crosslinking agent, and an organic or inorganic precipitation inhibitor.

Preferable embodiments of these components are described in paragraphs 〇165 to 81584 of JP-A No. 2 015 4-8 5 6 4 3 respectively, and the contents of this publication are incorporated in the present specification. Be done.

[0163] (Average Thickness of Photosensitive Resin Composition Layer)

The average thickness of the photosensitive resin composition layer is preferably 0.5 to 20. When the thickness of the photosensitive resin composition layer is 20 or less, the pattern is resolved. 〇 2020/174767 38 卩 (：171?2019/044334

The degree is more excellent, and is preferably 0.5 or more from the viewpoint of pattern linearity.The average thickness of the photosensitive resin composition layer is more preferably 0.8 to 15 and 1.0 to Particularly preferred is 100! The average thickness of the photosensitive resin composition layer is measured by a method according to the method for measuring the average thickness of the above polyimide substrate.

(Method for forming photosensitive resin composition layer)

The photosensitive resin composition layer can be formed by using a photosensitive resin composition containing a component used for forming the photosensitive resin composition layer and a solvent. It is also possible to prepare a composition by dissolving each component in a solvent in advance and then mixing the obtained solutions at a predetermined ratio. The composition prepared as described above may be filtered using, for example, a filter having a pore size of 0.2 to 30.

In the present disclosure, for example, the photosensitive resin composition layer according to the present disclosure can be formed by applying the photosensitive resin composition onto a temporary support or a protective film and drying.

The coating method is not limited, and includes slit coating, spin coating, force-ten coating, and ink jet coating.

In addition, the photosensitive resin composition layer may be formed on the intermediate layer or other layers described below formed on the temporary support or the protective film.

[0165] As the solvent, a known solvent can be used, and, for example, International Publication No. 20 18/1

It is possible to use the solvents described in paragraphs 0 0 9 2 to 0 9 9 4 of 796 0 4.

[0166] Further, the vapor pressure at 20 ° 〇 described in paragraph 0 0 1 4 of Japanese Patent Laid-Open No. 20 1 8 — 1 7 7 8 8 9 is 1

The following solvents can be preferably used.

As the solvent that can be used in the present disclosure, one type may be used alone, or two types may be used in combination. 〇 2020/174767 39 卩 (：171?2019/044334

[0167] The content of the solvent in the photosensitive resin composition is preferably 50 parts by mass to 1,900 parts by mass with respect to 100 parts by mass of the total solid content in the photosensitive resin composition. More preferably, it is 100 to 900 parts by mass.

[0168] [Intermediate layer]

The photosensitive transfer material according to the present disclosure preferably has an intermediate layer between the temporary support and the photosensitive resin composition layer.

[0169] (Polymer)

The intermediate layer preferably contains a polymer. As the polymer, water-soluble resin or alkali-soluble resin is preferable. When the polymer contained in the intermediate layer is a water-soluble resin, the water-soluble resin may further have alkali solubility. When the polymer contained in the intermediate layer is an alkali-soluble resin, the alkali-soluble resin may further have water solubility.

[0170] In the present disclosure, "water-soluble" means 1 ^to 17.0 of water at 22°C.

It means that the solubility in 9 is 0. 19 or more, and "alkali-soluble" means that the solubility in a 1% by mass aqueous solution of sodium carbonate ^at 22 ^{° is} 0.19 or more. Means there is.

[0171] In addition, the polymer has a solubility of 1 ^to 17.0 in water 109 at 22°

It is preferably 19 or more, more preferably 59 or more.

[0172] As the water-soluble resin, for example, cellulose resin, polyvinyl alcohol resin, polyvinylpyrrolidone resin, acrylic amide resin, (meth) acrylate resin, polyethylene oxide resin, gelatin, vinyl ether resin, polyamid Resin, and copolymers thereof. Among the above, the water-soluble resin is preferably a cellulose resin, and more preferably at least one resin selected from the group consisting of hydroxypropyl cellulose and hydroxypropylmethyl cellulose.

[0173] As the alkali-soluble resin, an alkali-soluble acrylic resin is preferable, and an acrylic resin having an acid group which may form a salt is more preferable.

[0174] The intermediate layer may contain one kind of polymer, or two or more kinds of polymers. 〇 2020/174767 40 卩 (：171?2019/044334

It may be contained.

[0175] From the viewpoint of adhesion, the content of the polymer is preferably 20% by mass to 100% by mass, and 50% by mass to 100% by mass with respect to the total mass of the intermediate layer. More preferably, it is mass %.

[0176] (1 ^to 1 sensitive dye)

The intermediate layer has a wavelength range during color development from the viewpoint of easy confirmation of the exposure pattern.

Or more, preferably contains 1 ^to 1 sensitive dye is more maximum absorption wavelength in the 1 ^to 1 changes.

Here, "the maximum absorption wavelength changes" means that a dye in a colored state is decolored, a dye in a decolored state is colored, and a dye in a colored state is in a coloring state of another hue. To any of the aspects that change to

[0177]! ^~ 1-sensitive dye, in terms of visibility, and more preferably by an acid generated from the photoacid generator is a potential dye is decolored.

[0178] The dye can be confirmed to be a 1 ^to 1 sensitive dye by the following method. Dye 〇.19 is mixed with ethanol and water (ethanol/water = 1/2 [mass ratio]) 1 Dissolve in 0 0 1_, 〇.

Add the hydrochloric acid aqueous solution of to adjust to 1 ^to 1 = 1. Titrate with 0.001 ○ 1 ○ 1 / 1_ (○ 0.01 1\1) sodium hydroxide solution, and check the color change and 1 ^to 1 when the color change appears. In addition, 1 ^~ 1 is 1 ^~ 1 meter (model number:

It is a value measured at 25 ° 〇 using Toa D-Keke Co., Ltd.).

[0179] The method for measuring the maximum absorption wavelength in the present disclosure is to measure the maximum absorption wavelength in an atmosphere of atmospheric air using a spectrophotometer: II V3100 (manufactured by Shimadzu Corporation) ^at 250 ^°. The transmission spectrum shall be measured in the range of n 〇 to 780!, and the wavelength at which the light intensity becomes minimum (maximum absorption wavelength) shall be measured.

[0180] Examples of dyes that are decolorized by exposure include leuco compounds, diphenylmethane dyes, oxazine dyes, xanthene dyes, iminonaphthoquinone dyes. 〇 2020/174767 41 卩 (：171?2019/044334

Dyes, azomethine dyes, and anthraquinone dyes.

[0181] Among the above, a leuco compound is preferable as the dye from the viewpoint of visibility.

Examples of leuco compounds include triarylmethane-based (eg, triphenylmethane-based), spiropyran-based, fluoran-based, diphenylmethane-based, mouth-daminelactam-based, indolylphthalide-based, leucoauramine-based leuco compounds. .. Of these, leuco compounds having a triarylmethane skeleton (that is, triarylmethane dyes) are preferable, and triphenylmethane dyes are more preferable.

From the viewpoint of visibility, the leuco compound is preferably a leuco compound having a lactone ring, a sultin ring, or a sultone ring, and having a lactone ring, a sultin ring, or a sultone ring opened or closed, and a sultone ring. However, it is more preferable that the sultone ring is a leuco compound that is closed and decolorized.

[0182] The dye is preferably a water-soluble compound for the purpose of preventing defects due to precipitation of the dye.

Further, the dye preferably has a solubility of 1 ^to 17.0 in water 109 at 22° of 19 or more, and more preferably 59 or more.

[0183] The intermediate layer may contain one type of dye alone, or may contain two or more types of dye.

[0184] From the viewpoint of visibility, the content of the dye is preferably 0.01 mass% to 10 mass%, and 0.5 mass% to 5 mass% with respect to the total mass of the intermediate layer. Is more preferable, and 1.0% by mass to 3.0% by mass is particularly preferable.

[0185] (Surfactant)

The intermediate layer preferably contains a surfactant from the viewpoint of thickness uniformity. As the surfactant, any of a surfactant having a fluorine atom, a surfactant having a silicon atom, and a surfactant having no fluorine atom and a silicon atom can be used. Among the above, the surfactant is a photosensitive resin composition. 〇2020/174767 42 卩(：171?2019/044334

From the viewpoints of suppressing the generation of streaks in the material layer and the intermediate layer, and from the viewpoint of adhesion, a surfactant having a fluorine atom is preferable, and a surfactant having a perfluoroalkyl group and a polyalkyleneoxy group is preferable. Is more preferable.

[0186] As the surfactant, any of anionic surfactants, cationic surfactants, nonionic (nonionic surfactants), and amphoteric surfactants can be used. A preferred surfactant is a nonionic surfactant.

[0187] From the viewpoint of suppressing the precipitation of the surfactant, the surfactant is preferably a surfactant having a solubility in water at 25 ^° C of 109 of 19 or more.

[0188] The intermediate layer may contain one kind of surfactant alone, or may contain two or more kinds of surfactant.

[0189] The content of the surfactant in the intermediate layer is from the viewpoint of suppressing streak generation in the photosensitive resin composition layer and the intermediate layer, and the adhesiveness, based on the total mass of the intermediate layer: 0.05 % To 2.0% by mass is preferable, and 0.1% by mass to...! .

It is more preferable that the content is ◯ mass%, and it is particularly preferable that the content is 0.2 mass% to 0.5 mass%.

[0190] (Inorganic filler)

The intermediate layer can contain an inorganic filler. Examples of the inorganic filler include silica particles, aluminum oxide particles, and zirconium oxide particles, and silica particles are more preferable. From the viewpoint of transparency, particles having a small particle size are preferable, and an inorganic filler having an average particle size of 100 n or less is more preferable. For example, if it is a commercially available product, Snowtex (registered trademark) is preferably used.

[0191] The volume fraction of the particles in the intermediate layer (volume ratio of particles in the intermediate layer) is 5% to 9% with respect to the total volume of the intermediate layer from the viewpoint of adhesion between the intermediate layer and the photosensitive layer. It is preferably 0%, more preferably 10% to 80%, particularly preferably 20% to 60%.

[0192] (! ^~ 1 modifier)

The intermediate layer can contain a !-conditioning agent. The middle layer contains !! 〇 2020/174767 43 卩 (：171?2019/044334

By having it, the coloring state or the decoloring state of the dye in the intermediate layer can be maintained more stably, and the adhesiveness between the photosensitive resin composition layer and the intermediate layer is further improved.

The [0193] 1 ^to 1 modifier, for example, sodium hydroxide, potassium hydroxide, hydroxide lithium, organic amines, and organic ammonium salts. ^1-1 modifier, from the viewpoint of water-soluble, is preferably sodium hydroxide. From the viewpoint of the adhesion between the photosensitive resin composition layer and the intermediate layer, the 1 ^to 1 adjusting agent is preferably an organic ammonium salt.

[0194] (Average thickness of intermediate layer)

The average thickness of the intermediate layer is preferably 0. 3 111 to 10 from the viewpoint of the adhesion between the photosensitive resin composition layer and the intermediate layer, and the pattern forming property, and 0. 3 0 1 to 5 is preferable. More preferably, 0.30! to 20! is particularly preferable.

Further, the average thickness of the intermediate layer is preferably thinner than the average thickness of the photosensitive resin composition layer.

The average thickness of the intermediate layer is measured according to the method for measuring the average thickness of the above-mentioned polyimide substrate.

[0195] The intermediate layer can have two or more layers.

When the intermediate layer has two or more layers, the average thickness of each layer is not limited as long as it is within the above range, but of the two or more layers in the intermediate layer, the layer closest to the photosensitive resin composition layer is The average thickness is preferably 0.3 to 10 from the viewpoint of the adhesion between the intermediate layer and the photosensitive resin composition layer, and the patterning property, and 0.3.

Is more preferable, and 0.30! to 20! is particularly preferable.

[0196] (Method of forming intermediate layer)

The intermediate layer can be formed by using an intermediate layer forming composition containing a component used for forming the intermediate layer and a water-soluble solvent. It is also possible to prepare a composition by dissolving each component in a solvent in advance and then mixing the obtained solutions at a predetermined ratio. The composition thus prepared may be filtered using a filter having a pore size of 3.0.

In the present disclosure, for example, the composition for forming an intermediate layer is applied to a temporary support and dried. 〇 2020/174767 44 卩 (：171?2019/044334

By drying, an intermediate layer can be formed on the temporary support. Examples of the coating method include slit coating, spin coating, pressure coating, and ink jet coating.

[0197] Examples of the water-soluble solvent include water and alcohols having 1 to 6 carbon atoms, and preferably include water. Examples of alcohols having 1 to 6 carbon atoms include methanol, ethanol,

_Propanol, Isopropanol,

Examples include butanol, 11-pentanol, and-hexanol. Among the above, at least one selected from the group consisting of methanol, ethanol, 11-propanol, and isopropanol is preferable.

[0198] [Protective film]

The photosensitive transfer material preferably has a protective film on the surface of the photosensitive transfer material opposite to the surface on which the temporary support is provided.

Examples of the protective film include a resin film and a paper, and a resin film is preferable from the viewpoint of strength and flexibility. Examples of the resin film include an ethylene film, a polypropylene film, a polyethylene terephthalate film, a cellulose triacetate film, a polystyrene film, and a polycarbonate film. Among the above, the protective film is preferably a polyethylene film, a polypropylene film, or a polyethylene terephthalate film.

[0199] The average thickness of the protective film is not limited, for example, 1

Is preferred. The average thickness of the protective film is measured according to the method for measuring the average thickness of the above polyimide substrate.

[0200] [Other layers]

The photosensitive transfer material may have a layer other than the above (hereinafter, also referred to as "other layer"). Examples of the other layer include a contrast enhancement layer, a thermoplastic resin layer, and the like.

Regarding the preferred embodiment of the contrast enhancement layer, see paragraph 0 1 3 4 of International Publication No. 2 0 1 8/1 7 9 6 4 0, a preferred embodiment of the thermoplastic resin layer. 〇 2020/174767 45 卩 (：171?2019/044334

For this, JP 0 1 4 8 5 6 4 3 JP, paragraphs 0 1 8 9 ~ paragraph 0 1 9 3 and, for a preferred embodiment of further layers, JP 2 0 1 4 8 5 6 4 There are descriptions in paragraphs 0 to 194 to 01996 of the No. 3 publication, and the contents of this publication are incorporated in this specification.

[0201] Here, referring to FIG. 1, an example of the layer structure of the photosensitive transfer material is schematically shown.

The photosensitive transfer material 100 shown in Fig. 1 comprises a temporary support 12 and a transfer layer 14 formed by laminating a photosensitive resin composition layer 14_1 and an intermediate layer 14_2, and a protective film. 1 and 6 are laminated in this order. The transfer layer 14 is a layer that is transferred (that is, laminated) on the polyimide substrate by undergoing the above-described bonding process.

[0202] [Method for producing photosensitive transfer material]

The method for producing the photosensitive transfer material is not limited, and a known production method, for example, a known method for forming each layer can be used.

[0203] As a method for producing the photosensitive transfer material, a method including a step of applying a photosensitive resin composition on a temporary support and drying it to form a photosensitive resin composition layer is preferably exemplified. When the photosensitive transfer material has an intermediate layer, the step of coating the intermediate layer-forming composition on a temporary support and drying the intermediate layer to form the intermediate layer, and the photosensitive resin composition on the intermediate layer. Preferred is a method including a step of coating and drying to form a photosensitive resin composition layer.

Further, the method for producing a photosensitive transfer material according to the present disclosure preferably further includes a step of providing a protective film on the photosensitive resin composition layer after the step of forming the photosensitive resin composition layer. ..

[0204] <Method of manufacturing circuit board>

The method of manufacturing a circuit board according to the present disclosure is not limited as long as it is a method of manufacturing a circuit board using a polyimide substrate having a conductive layer and applying the method of manufacturing a patterned substrate described above. A method of manufacturing a circuit board according to the present disclosure includes a step of manufacturing a patterned substrate by the method of manufacturing a patterned substrate (hereinafter, also referred to as a “substrate manufacturing step”), and the photosensitive resin in the patterned substrate. 〇 2020/174767 46 卩 (：171?2019/044334

A step of etching the conductive layer exposed in the region where the pattern of the composition layer is not formed (hereinafter, also referred to as "etching step"), and removing the pattern of the photosensitive resin composition layer. It is preferable that the steps (hereinafter, also referred to as “removing step”) and are in this order. Since the circuit board manufacturing method according to the present disclosure includes the above steps, it is possible to suppress a decrease in the line width of the circuit wiring due to the lapse of time after exposure, and it is excellent in the suitability for lamination under high temperature conditions.

[0205] As a preferred embodiment of the method for manufacturing a circuit board according to the present disclosure, after the removing step, the bonding step, the exposing step, the developing step, and the etching step described above are set as one set. As an example, there is a method of repeating the above set a plurality of times. By the above method, for example, two or more conductive patterns different from each other can be formed.

[0206] As a preferred embodiment of the method for manufacturing a circuit board according to the present disclosure, the etching step, the exposure step is performed on the pattern of the photosensitive resin composition layer before the removal step, Next, there may be mentioned a method of further performing the developing step. By the above method, for example, two or more different conductive patterns can be formed.

[0207] In addition, the polyimide substrate can be reused (rework). When the photosensitive resin composition layer is exposed to actinic rays, for example, the solubility of the exposed areas is increased by using, for example, a photosensitizer that generates acid upon irradiation with the active rays. If neither the unexposed portion nor the unexposed portion is cured and the obtained pattern shape is defective, the substrate can be reused (reworked) by exposing the entire surface.

[0208] As an embodiment of the method for manufacturing a circuit board according to the present disclosure, there is a method disclosed in International Publication No.

No. 6/190,405 can be consulted, the contents of which are incorporated herein.

[0209] [Substrate manufacturing process]

The method for manufacturing a circuit board according to the present disclosure preferably has a step of manufacturing a patterned board by the method for manufacturing a patterned board. In the above process, the polyimide substrate included in the patterned substrate has a conductive layer, 〇 2020/174767 47 卩 (：171?2019/044334

It is preferable to have a conductive layer on at least one surface. The embodiment of the method for producing a patterned substrate and each material used in the above method is as described in the above section “Method for producing a substrate with a pattern”, and the preferred embodiments are also the same.

[0210] [Etching process]

The method for producing a circuit board according to the present disclosure preferably has a step of etching the conductive layer exposed in a region where the pattern of the photosensitive resin composition layer is not formed in the /<<turned substrate.

[021 1] In the etching step, the pattern of the photosensitive resin composition layer (that is, the resin pattern) formed by the developing process is used as an etching resist to perform the etching treatment of the conductive layer. ..

[0212] The method of etching treatment is not limited and known methods can be applied.

Examples of the etching method include, for example, the method described in paragraphs 〇〇 48 to paragraph 0 0 5 4 of JP-A No. 2010-1515 2155, and known plasma etching. The dry etching method may be used.

[0213] As a method of the etching treatment, for example, a generally used wet etching method of immersing in an etching liquid can be mentioned. As the etching solution used for wet etching, an acidic type or alkaline type etching solution may be appropriately selected according to the object of etching.

Examples of the acidic type etching solution include an aqueous solution containing only an acidic component such as hydrochloric acid, sulfuric acid, hydrofluoric acid and phosphoric acid, and an acidic component and a salt such as ferric chloride, ammonium fluoride and potassium permanganate. A mixed aqueous solution is exemplified. As the acidic component, a component obtained by combining a plurality of acidic components may be used.

As the alkaline type etching solution, for example, an aqueous solution of an alkali component alone such as sodium hydroxide, potassium hydroxide, ammonia, an organic amine, a salt of an organic amine such as tetramethylammonium hydroxide, or an alkaline solution and an alkaline solution. Examples thereof include a mixed aqueous solution with a salt such as potassium manganate. Even if you use a combination of multiple alkaline components, 〇 2020/174 767 48 卩 (：171?2019/044334

Good.

[0214] The temperature of the etching solution is not limited, but it is preferably 45° or less. The resin pattern used as an etching mask (etching pattern) in the present disclosure preferably exhibits particularly excellent resistance to acidic and alkaline etching solutions in a temperature range of 45° or lower. Therefore, the photosensitive resin composition layer is prevented from peeling off during the etching process, and the portion where the photosensitive resin composition layer does not exist is selectively etched. After the etching process, in order to prevent contamination of the process line, a cleaning process of cleaning the etched substrate and a drying process of drying the cleaned substrate may be performed, if necessary.

[021 5] [Removal process]

The method for manufacturing a circuit board according to the present disclosure preferably has a step of removing the pattern of the photosensitive resin composition layer.

The removing step is not particularly limited and may be performed as necessary, but is preferably performed after the etching step.

The method of removing the remaining photosensitive resin composition layer is not particularly limited, but a method of removing it by a chemical treatment can be mentioned, and it is particularly preferable to use a removing solution.

As a method for removing the photosensitive resin composition layer, the photosensitive resin composition is preferably added to the removing solution under stirring at 30° to 80°, more preferably 50° to 80°. A method of immersing a substrate having layers and the like for 1 to 30 minutes can be mentioned.

[0216] Examples of the removing liquid include inorganic alkali components such as sodium hydroxide and potassium hydroxide, or primary amine compounds, secondary amine compounds, tertiary amine compounds, and quaternary ammonium salts. Examples of the removal solution include an organic alkaline component such as a compound dissolved in water, dimethylsulfoxide, 1\1_methylpyrrolidone, or a mixed solution thereof.

Alternatively, a removing solution may be used to remove the particles by a spray method, a shower method, a paddle method, or the like. 〇2020/174767 49 卩(：171?2019/044334

[0217] [Overall exposure process]

The method for manufacturing a circuit board according to the present disclosure includes a step of exposing the entire surface of the photosensitive resin composition layer between the etching step (etching step) and the removing step (removing step) (hereinafter, referred to as “ It is also referred to as "entire surface exposure step").

[0218] Further, the method for manufacturing a circuit board according to the present disclosure has a step of heating the whole surface-exposed photosensitive resin composition layer (hereinafter, also referred to as "heating step"), if necessary. May be. The whole surface exposure step and the heating step are preferably performed after the etching step and before the removing step.

[0219] After the etching process, by exposing the entire surface of the photosensitive resin composition layer used as the etching mask, the solubility in the removal liquid and the permeability of the removal liquid are improved, and the removal liquid is used for a long time. Also has excellent removability. Further, when the heating step is included, the heating step can further improve the reaction rate of the photo-acid generator and the reaction rate of the generated acid and the photosensitive resin, and as a result, the removal performance is improved.

[0220] The light source used for the exposure in the overall exposure step is not limited, and a known exposure light source can be used. From the viewpoint of removability, it is preferable to use a light source containing light having the same wavelength as that in the exposure step.

[0221] From the viewpoint of removability, the exposure amount in the whole surface exposure step is 5"/○ ² ~ 1,

It is particularly preferable that

[0222] From the viewpoint of removability, the exposure amount in the whole surface exposure step is preferably equal to or more than the exposure amount in the above exposure step, and more preferably more than the exposure amount in the above exposure step.

[0223] [Other processes]

The method for manufacturing a circuit board according to the present disclosure may include steps (hereinafter, also referred to as “other steps”) other than the above. Other steps include, for example: 〇 2020/174767 50 卩 (：171?2019/044334

However, the present invention is not limited to these steps.

Further, as an example of the exposure step, the development step, and other steps in the present disclosure, those described in paragraphs 0 0 3 5 to 0 0 5 1 of JP-A No. The method can be preferably used in the present disclosure.

[0224] (Protective film peeling process)

When the photosensitive transfer material has a protective film, the method for producing a circuit board according to the present disclosure preferably has a step of peeling the protective film of the photosensitive transfer material. The method for peeling off the protective film is not limited, and a known method can be applied.

[0225] (Process of reducing visible light reflectance)

The method for manufacturing a circuit board according to the present disclosure can include a step of reducing the visible light reflectance of part or all of the conductive layer on the polyimide board.

Examples of the treatment for reducing the visible light reflectance include oxidation treatment. For example, visible light reflectance can be reduced by blackening by converting copper into copper oxide by an oxidation treatment.

As for a preferable embodiment of the treatment for reducing the visible light reflectance, paragraphs 0 0 1 7 to 0 0 2 5 of JP-A 2 0 1 4-1 5 0 1 1 8 gazette, and JP 2 0 1 3 1 -Paragraph 0 0 4 1, Paragraph 0 0 4 2, Paragraph 0 0 4 8 and Paragraph 0 0 58 of Publication No. 2 0 6 3 15 are described, and the contents of this publication are incorporated into this specification. ..

(Step of Forming Insulating Film, and Step of Forming New Conductive Layer on Insulating Film) A method for manufacturing a circuit board according to the present disclosure is provided on a conductive pattern formed on a polyimide substrate. It is also preferable to have a step of forming an insulating film and a step of forming a new conductive layer on the insulating film.

With the above structure, a new conductive layer can be formed while being insulated from the conductive pattern previously formed.

The step of forming the insulating film is not limited, and a known method of forming a permanent film can be used. In addition, using a photosensitive material with insulating properties, photolithography 〇 2020/174767 51 卩 (：171?2019/044334

An insulating film having a desired pattern may be formed by roughing.

The step of forming a new conductive layer on the insulating film is not limited, and a new conductive layer having a desired pattern may be formed by photolithography using a photosensitive material having conductivity. ..

[0227] A method for manufacturing a circuit board according to the present disclosure uses a polyimide substrate having a plurality of conductive layers on both surfaces, and sequentially applies the conductive layers formed on both surfaces of the polyimide substrate. Alternatively, it is also preferable to form a circuit at the same time. The above configuration, it is the child form ^_ square of the ^_ conductive pattern on the surface, and the second conductive pattern touch panel circuit wiring formed of the other surface of the polyimide substrate. Further, it is also preferable to form the touch panel circuit wiring having the above-described configuration on both surfaces of the polyimide substrate by means of a hole-to-roll method.

The circuit board manufactured by the circuit board manufacturing method according to the present disclosure can be applied to various devices. An example of a device provided with a circuit board manufactured by the method for manufacturing a circuit board according to the present disclosure is an input device, which is preferably a touch panel, and more preferably a capacitive touch panel. Yes. Further, the input device can be applied to a display device such as an organic display device, a liquid crystal display device, or the like.

[0229] <Method for manufacturing touch panel>

One embodiment of the touch panel manufacturing method according to the present disclosure includes the circuit board manufacturing method.

[0230] Another embodiment of the touch panel manufacturing method according to the present disclosure has a step of preparing a circuit board manufactured by the circuit board manufacturing method. In the above embodiment, the touch panel is manufactured using the circuit board manufactured by the circuit board according to the present disclosure.

[0231] In each of the above-described embodiments, the embodiment of the method for manufacturing a circuit board is as described in the above section "Method for manufacturing a circuit board", and the preferred embodiment is also the same.

[0232] Regarding the method for manufacturing the touch panel according to the present disclosure, other than the above-mentioned matters, a public 〇2020/174767 52 卩(：171?2019/044334

The manufacturing method of the touch panel can be referred to.

Further, the touch panel manufacturing method according to the present disclosure may have any process (other process) other than the above matters.

[0233] An example of a mask pattern used in the touch panel manufacturing method according to the present disclosure is shown in Figs.

In the pattern shown in FIG. 2 and the pattern shown in FIG. 3, SL and G are non-image areas (light-shielding areas), and DL is a virtual frame for alignment. In the method for manufacturing a touch panel according to the present disclosure, for example, by exposing the photosensitive resin composition layer through a mask having a pattern shown in FIG. 2, circuit wiring having a pattern corresponding to SL and G is formed. Touch panel can be manufactured. Specifically, it can be prepared by the method described in FIG. 1 of WO2016/0 1 90405. In an example of the manufactured touch panel, G is a portion where a transparent electrode (touch panel electrode) is formed, and S L is a portion where the wiring of the peripheral extraction portion is formed.

The touch panel according to the present disclosure is a touch panel that includes at least a circuit board manufactured by the method for manufacturing a circuit board according to the present disclosure. Further, the touch panel according to the present disclosure preferably has at least a transparent substrate, an electrode, and an insulating layer or a protective layer.

The detection method in the touch panel according to the present disclosure may be any known method such as a resistance film method, a capacitance method, an ultrasonic method, an electromagnetic induction method, and an optical method. Among the above, the capacitance method is preferable.

As the touch panel type, there are so-called in-cell type (for example, those shown in FIGS. 5, 6, 7, and 8 of Japanese Patent Publication No. 201 2 -5 1 705 1), so-called on-cell type (for example, JP No. 201 3-1 681 25 shown in FIG. 19 of JP, JP-A No. 201-89 102 shown in FIG. 1 and FIG. 5),

0 GS (One Glass Solution) type, TO L (Touch-on-Lens) type (for example, the one shown in FIG. 2 of JP-A-2013-54727), and other configurations (for example, JP 201 3 _ 1 6487 1 Publication 〇 2020/174767 53 卩 (: 171?2019/044334

Of FIG. 6), various out-cell types (so-called 0 0, 0 1.02, ◦, 0 2, 0 1, 0 1, etc.) and the like.

[0235] <Laminate>

The laminate according to the present disclosure has a polyimide substrate and a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50 ^° C. or higher. Since the laminate according to the present disclosure has the above-mentioned configuration, when the laminate according to the present disclosure is exposed, it is possible to suppress excessive diffusion of an acid in the photosensitive resin composition layer after exposure. The excessive acid decomposition reaction of the material layer can be suppressed. Therefore, it is possible to suppress the decrease in the line width of the pattern due to the passage of time after the exposure.

[0236] In the laminate according to the present disclosure, the embodiments of the polyimide substrate and the photosensitive resin composition layer are as described in the above "Method for producing a patterned substrate", and the preferred embodiments are also the same. is there.

[0237] In the laminate according to the present disclosure, the photosensitive resin composition layer is preferably a layer formed by transfer. The layer formed by transfer can be formed by a method using a photosensitive transfer material described later (that is, a method of bonding the photosensitive transfer material and a polyimide substrate).

[0238] In addition, when the polyimide substrate has conductivity, the laminate according to the present disclosure includes a polyimide substrate, a conductive layer, and an acid-decomposable resin having a glass transition temperature of 50 ^° C or higher. It is preferable to have a photosensitive resin composition layer to be contained in this order.

[0239] The method for producing a laminated body according to the present disclosure is not limited, and examples thereof include a method for producing a laminated body by the "bonding step" described in the above "Method for producing a substrate with a pattern". .. That is, the above-mentioned photosensitive resin composition in a photosensitive transfer material, comprising: a temporary support; and a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature (Cho 9) of 50° or more. The layered product according to the present disclosure can be manufactured by bringing the layer and the polyimide substrate into contact with each other and bonding the photosensitive transfer material and the polyimide substrate together. Further, the laminate according to the present disclosure may be manufactured by applying the above-mentioned photosensitive resin composition onto a polyimide substrate. \\0 2020/174 767 54 ?(: 17 2019/044334

Example

[0240] Hereinafter, the present disclosure will be described in detail with reference to Examples, but the present disclosure is not limited thereto. Unless otherwise specified, "part" and "%" are based on mass.

[0241] <Abbreviation>

The following abbreviations used in the examples refer to the compounds below, respectively.

-"1\/1 Hatcho 1 ^to 1": 2-Tetrahydrofuranyl methacrylate (synthetic product, a methacrylate compound having a cyclic ether group at the ester position)

-"Ding 1 ^~ 1 1 ^~ 1 3": 4-(2-tetrahydrofuranyloxy) styrene (synthetic product)

-"Haccho 1 ^to 1": 2-Tetrahydrofuranyl acrylate (synthetic product, acrylate compound having cyclic ether group at ester position)

-"!\/!": Methacrylic acid (manufactured by Tokyo Chemical Industry Co., Ltd.)

-"1\/1 1\/1": Methyl methacrylate (manufactured by Tokyo Chemical Industry Co., Ltd., a methacrylate compound having a linear alkyl group at the ester position)

-"○ 1 ^~ 1 1\/1": Cyclohexyl methacrylate (manufactured by Tokyo Chemical Industry Co., Ltd., a methacrylate compound having a cyclic alkyl group at the ester position)

-"Mi": Ethyl acrylate (manufactured by Tokyo Chemical Industry Co., Ltd., an acrylate compound having a linear alkyl group at the ester position)

-"Mi 1 ^~ 1 1\/1": 2-ethylhexyl methacrylate (manufactured by Tokyo Chemical Industry Co., Ltd., a methacrylate compound having a branched alkyl group at the ester position)

-

: Methacrylic acid 1, 2, 2, 2, 6, 6-pentamethyl-4-piperidyl (Ltd.

-"1\/1 Sumi 1 ^~ 10": 4—Methoxyphenol (manufactured by Tokyo Chemical Industry Co., Ltd.)

-"-6 01": 2, 2, -azobis (2-methylpropionic acid) dimethyl (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.)

[0242] <1 \ / 1 synthesis of Hatcho 1 ^to 1>

Methacrylic acid (86.1 parts by mass, 1.0 molar equivalent) in 3 flasks, and 〇 2020/174767 55 卩 (：171?2019/044334

And hexane (86.1 parts by mass) were added and the mixture was cooled to 20 ^° . After adding camphor sulfonic acid (○0.00070 parts by mass, 〇.03 mmol equivalent) and 2-dihydrofuran (70.1 parts by mass, 1.0 molar equivalent) to the above three roflasco, 20°C was added. It was stirred for 1.5 hours in the temperature range of ±2°. Next, the liquid temperature was raised to 35° and then stirred for 2 hours. Kyoward 200 and Kyoward 1 000 (both manufactured by Kyowa Chemical Industry Co., Ltd.) were laid in this order in this order, and the reaction solution was filtered to obtain a filtrate. To the obtained filtrate, add 1\/1 and 1 ^to 1 (3 (4-methoxyphenol (manufactured by Tokyo Chemical Industry Co., Ltd.), 0.001 2 parts by mass), and concentrate at 40 ^° under reduced pressure. Thus, 2-tetrahydrofuranyl methacrylate (1\/1 8chome 1 ^to 1, tetrahydro-2!!-furan-2-yl methacrylate) 1 56.2 parts by mass was obtained as a colorless oil (yield 98.0% ).

[0243] <Synthesis of Ding 1 ^to 1 1 ^to 13,>

4-Hydroxystyrene (10.2 0.2 parts by mass, 1.0 mol equivalent) and hexane (10.2 parts by mass) were added to the three flasks and cooled to 20 ^° . After adding camphorsulfonic acid (○0.00070 parts by mass, 0.03 mmol equivalent) and 2-dihydrofuran (70.1 parts by mass, 1.0 molar equivalent) to the above three flasks at 80 ^° The temperature was raised to 0 and stirred for 5 hours. Kyoward 200 and Kyoward 1 000 (both manufactured by Kyowa Chemical Industry Co., Ltd.) were spread in this order in this order, and the reaction solution was filtered to obtain a filtrate. To the obtained filtrate, 1\/! 1 ^to 1 〇 (10.001 9 parts by mass) was added, and the mixture was concentrated under reduced pressure at 40° 〇 ^to give 4-(2-tetrahydrofuranyloxy)styrene. (1 ^to 11 ^to 13, 4-(2-tetrahydrofuranyloxy)styrene) 1 85.0 parts by mass was obtained as a colorless oil (yield 97.3%).

[0244] <Synthesis of Hatcho 1 ^to 1>

Acrylic acid (72.1 parts by mass, ...!.0 molar equivalent) and hexane (72.1 parts by mass) were added to the three flasks and cooled to 20°. Camphor sulfonic acid (○0.00070 parts by mass, 〇0.03 mmol equivalent) in the above three flasks

, And 2-dihydrofuran (77.9 parts by mass, ...!.0 molar equivalent) were added dropwise. 〇2020/174767 56 卩(：171?2019/044334

After that, the mixture was stirred for 1.5 hours in the temperature range of 20°±2°°. Next, the liquid temperature was raised to 35° and stirred for 2 hours. Kyoward 200 and Kyoward 1 000 (both manufactured by Kyowa Chemical Industry Co., Ltd.) were spread in this order in this order, and the reaction liquid was filtered to obtain a filtrate. To the obtained filtrate, 1\/1M 1 ^to 10 (0.001 2 parts by mass) was added, followed by concentration under reduced pressure at 40° 〇 to obtain 2-tetrahydrofuranyl acrylate (8 ^to 1 1, tetrahydro-acrylic acid 21 ^~ 1-furan_2-yl) 14.8 mass parts was obtained as a colorless oil (yield 99.0%

[0245] <Polymer

Synthesis>

Propyl acetate (75.0 parts by mass, manufactured by Showa Denko KK) was placed in the three flasks and heated to 90° under a nitrogen atmosphere. 1\/1 Hatcho 1 ^~ 1 (40 parts by mass), 1\/11\/1/8 (15 parts by mass), 〇1 ^~ 11\/1/8 (15 parts by mass), Minpachi (30 parts by mass) )

, -601 (4.0 parts by mass), and propyl acetate (75.0 parts by mass) are added to the solution in the above three flasks maintained in the temperature range of 90° 〇 ± 2° 〇 for 2 hours. It dripped over. 90 after the dropping. A solution containing polymer _ 1 (solid content concentration 4.0%) was obtained by stirring for 2 hours within the temperature range of ±2°.

Polymer 2 to polymer were prepared in the same manner as polymer 8_1, except that the type and amount of monomer used were changed according to Table 1 below.

A solution containing 11 was obtained. The solid content concentration in the solution was 40.0% by mass.

[0247] [Table 1]

〇 2020/174 767 57 卩 (：171?2019/044334

[0248] In Table 1, "monomer" means a monomer forming a constituent unit having an acid group protected by an acid-decomposable group. In Table 1, "monomer" means a monomer forming a structural unit other than a structural unit having an acid group protected by an acid-decomposable group. In Table 1, "one" means that the corresponding monomer was not used. In addition, the glass transition temperature (Table 9), acid value, and weight average molecular weight listed in Table 1

Was measured by the method described above.

[0249] <Examples 1 to 12 and Comparative Examples 1 to 2>

[Preparation of photosensitive transfer material]

A solution containing each polymer (_ 1 to _ 11), a photo-acid generator, a basic compound, and a surfactant were weighed so as to have a solid content mass ratio shown in Table 2 below, and then the above-mentioned components And propyl acetate were dissolved and mixed to obtain a mixed solution having a solid content concentration of 10% by mass. A photosensitive resin composition (composition for photosensitive transfer material) was obtained by filtering the mixed solution through a filter made of polytetrafluoroethylene having a diameter of 0.2. The photosensitive resin composition was applied as a temporary support onto a polyethylene terephthalate film having a thickness of 30 using a slit-shaped nozzle so that the dry film thickness was 4.0. Then, a photosensitive resin composition layer was formed on the temporary support by passing through a drying zone having an average temperature of 85° for 50 seconds. Finally, a polyethylene film (made by Tredegar,

By pressure-bonding onto the photosensitive resin composition layer, the photosensitive transfer materials of Examples 1 to 12 and Comparative Examples 1 and 2 were produced.

[0250] [Fabrication of substrate]

On each substrate listed in Table 2 below, the thickness is

A substrate with a copper layer was produced by stacking the layers.

[0251] [Sensitivity (exposure sensitivity) evaluation]

Each of the prepared photosensitive transfer materials had a mouth temperature of 1300 ^° (:, linear pressure ◯.

And was laminated on a substrate with a copper layer under a lamination condition of linear velocity of 3.0! A line-and-space pattern with a line width of 20 (0 lithography ratio = 1:1) without peeling off the temporary support. A photosensitive resin composition using an ultra-high pressure mercury lamp through a mask. 〇 2020/174767 58 卩 (：171?2019/044334

After exposing the layer, the temporary support was peeled off and developed after standing for 1 hour. Development is 2

Shower development was carried out for 40 seconds using a 0.9% sodium carbonate aqueous solution at 2 ^° . When a line-and-space pattern with a line width of 20 was formed by the above method, the residue in the space of 20 was observed using a scanning electron microscope (3M IV!) to completely eliminate the residue. The amount was calculated. The above-mentioned exposure amount was defined as the following evaluation (resolution evaluation, exposure amount applied by pattern width change rate).

[0252] [Evaluation]

(Lamination suitability (mouth-to-roll method))

After peeling off the protective film from each of the prepared photosensitive transfer materials, the mouth temperature 1

30 ° 0, linear pressure 〇.

The photosensitive transfer material was laminated on the substrate with the copper layer by the roll-to-roll method under the laminating condition of linear velocity (conveyance speed) of 3.0! A 500-square square test piece was cut out from the mouth after bonding, and the state of adhesion between the photosensitive resin composition and the copper layer was visually confirmed. The ratio (%) of the area where the photosensitive resin composition layer adheres to the copper layer without bubbles and floating in the test piece was calculated by the following formula, and according to the following criteria, the suitability for lamination under high temperature and high speed conditions Was evaluated. Table 2 shows the evaluation results. It can be said that the larger the adhesion area (%) of the photosensitive resin composition layer, the more excellent the suitability for lamination under high temperature and high speed conditions. Formula: Area (%) = [(Adhesive area of photosensitive resin composition layer) / (Area of test piece) 1 X 1 0 0

[0253] One standard

The area (%) is 95% or more, and the photosensitive resin composition layer is not cracked: 5

Area (%) is 95% or more, but there are cracks in the photosensitive resin composition layer: 4

Area (%) is 85% or more and less than 95%: 3

Area (%) is less than 85%: 2

[0254] (Resolution)

Each of the prepared photosensitive transfer materials had a mouth temperature of 1300 ^° (:, linear pressure ◯. 〇2020/174767 59 卩(：171?2019/044334

And was laminated on a substrate with a copper layer under a lamination condition of linear velocity of 3.0! A line-and-space pattern with a line width of 3 to 20 without peeling off the temporary support (〇 Li-iso ratio = 1:1) Using a high-pressure mercury lamp through a mask, a photosensitive resin composition layer Was exposed with the exposure amount obtained by the above-mentioned sensitivity evaluation, and after standing for 3 hours, the temporary support was peeled off and developed. The development was carried out by a shower development for 40 seconds using a 1.0% aqueous sodium carbonate solution ^at 220 ^° . Of the line and space patterns obtained in this way, the pattern with the smallest line width was used as the ultimate resolution. Moreover, when deciding the ultimate resolution, the pattern was observed using a scanning electron microscope (3×1\/○), and if the side wall of the pattern was significantly roughened, it was determined that the pattern could not be resolved. Based on the obtained ultimate resolution, the resolution was evaluated according to the following criteria: The evaluation results are shown in Table 2. The smaller the ultimate resolution, the better the resolution even when left after exposure. It can be said that an excellent pattern can be obtained.

[0255] One standard one

Reachable resolution is less than 6: 5

The ultimate resolution is less than 8 and more than 60!: 4.5

The ultimate resolution is less than 10 and is 8 or more: 4

The ultimate resolution is less than 15 and greater than or equal to 10: 3

The ultimate resolution is less than 200! and 15 or more: 2

The ultimate resolution is 20 or more: 1

[0256] (Pattern width change rate)

And was laminated on a substrate with a copper layer under a lamination condition of linear velocity of 3.0! Line-and-space pattern with a line width of 6 without peeling the temporary support (0 litho ratio 1:1) Through the mask, the photosensitive resin composition layer was exposed with the exposure amount obtained by the sensitivity evaluation using an ultra-high pressure mercury lamp. After the exposure, it was left for 3 hours, and allowed to stand for 24 hours, and then the temporary support was peeled off and developed. The development was carried out by using a 1.0% sodium carbonate aqueous solution at 22 ^° and shower development for 40 seconds. Got this way 〇2020/174767 60 卩(：171?2019/044334

A substrate with a line and space pattern was obtained. The pattern width after 3 hours and the pattern width after 24 hours in 6 patterns (resin pattern) on the substrate were obtained. The change rate of the pattern width after 24 hours with respect to the pattern width after 3 hours was obtained according to the following formula. Based on the obtained change rate of the pattern width, the change rate of the pattern width was evaluated according to the following criteria. Table 2 shows the evaluation results. It can be said that the smaller the value of the rate of change is, the more the decrease in line width due to the passage of time after exposure is suppressed, and that the performance is stable.

Formula: Pattern width change rate (%) = {[2 4 hours later pattern width ()] / [3 hours later pattern width () ]} X I 0 0

[0257] One standard one

Less than 2%: 3

Less than 5%, 2% or more: 2

5% or more: 1

[0258] (Copper wire width change rate)

And was laminated on a substrate with a copper layer under a lamination condition of linear velocity of 3.0! Exposure of the photosensitive resin composition layer obtained by sensitivity evaluation using a super high pressure mercury lamp through a line and space pattern with a line width of 6 (0 lithographic ratio 1:1) without peeling off the temporary support. After exposure for 3 hours, the film was allowed to stand for 3 hours and then for 24 hours, and then the temporary support was peeled off and developed. The development was carried out by shower development using a 1.0% sodium carbonate aqueous solution ^at 220 ^° C for 40 seconds. The line-and-space pattern obtained in this way was obtained. Next, the copper layer was etched using a copper etching solution (Kanryo Kagaku Co., Ltd., Oley 02) to obtain a substrate drawn with copper (solid line portion 3!_). The copper line width after 3 hours and the copper line width after 24 hours in the 6 patterns (copper pattern) on the above substrate were obtained, respectively. The rate of change of the copper line width after 24 hours with respect to the copper line width after 3 hours was calculated according to the following formula. Based on the obtained rate of change of the copper line width, the rate of change of the copper line width was evaluated according to the following criteria. Table 2 shows the evaluation results. The smaller the rate of change value, the more 〇 2020/174767 61 卩(：171?2019/044334

It can be said that the decrease in the line width due to the passage of time after light is suppressed, indicating that the performance is stable.

Formula: Copper wire width change rate (%) = {[Copper wire width after 24 hours ()] / [Copper wire width after 3 hours ()]} X 1 0 0

[0259] One standard one

Less than 5%: 3

Less than 10%, more than 5%: 2

10% or more: 1

[0260] [Display characteristics (luminance)]

Luminance was evaluated as one index of display characteristics.

On various polyimide substrates and polyethylene terephthalate substrate, a second conductive layer, indium tin oxide (chome), layer (thickness 150 m) is formed by sputtering. and, then, by forming a copper layer (thickness 2 0 0 _n m) in a vacuum vapor deposition method as the conductive layer of the first layer on the丨Ding 〇 layer, to prepare a board.

Each of the prepared photosensitive transfer materials was bonded onto the copper layer (linear pressure ◯.

, Linear velocity of 3.0/min, mouth temperature of 130 ^° 〇). Contact pattern exposure was performed using a photomask provided with the pattern shown in FIG. 2 in which the conductive layer pads were connected in one direction without peeling off the temporary support.

In the pattern shown in Fig. 2, the solid line part 3!_ and the gray part o are light-shielding parts, and the dotted line part !_ is a virtual alignment alignment frame.

After that, the temporary support was peeled off, developed and washed with water to obtain the pattern shown in FIG. Then, after etching the copper layer using a copper etching solution (Kanto Kagaku Co., Ltd. 0 Lee 02), use a copper etching solution (Kanto Kagaku Co., Ltd. 012) to obtain a copper layer. By etching, a substrate was obtained in which both copper (solid line 3!_) and sushi (gray part) were drawn in the pattern shown in Fig. 2.

Next, in alignment, pattern exposure was performed using a photomask with the opening of the pattern shown in FIG. 3, and development and washing were performed. 〇2020/174767 62 卩(：171?2019/044334

In the pattern shown in FIG. 3, the gray area ◦ is a light-shielding area and the dotted line area 0!_ is a virtual illustration of the alignment frame.

After that, the copper layer was etched by using LY 02, and the remaining photosensitive resin composition layer was peeled off by using a stripping solution (Kanto Kagaku Co., Ltd. <1301) to obtain a circuit board. ..

The resulting circuit board was irradiated with a fluorescent lamp from the back side (the wavelength range _{3 8 0~ 7 8 0 n m} ), transmitted light intensity luminance meter -!!! 3 _ 1 0 0 (IV丨\ 1 〇!_Ding Co., Ltd.).

With respect to the light intensity when the circuit board is not sandwiched (that is, the intensity of the light emitted from the fluorescent lamp), the light intensity when the circuit board is sandwiched (that is, the intensity of the light transmitted through the circuit board), The brightness retention rate was calculated according to the following formula. Based on the obtained luminance retention rate, the display characteristics were evaluated according to the following criteria. Table 2 shows the evaluation results. The larger the value of the luminance maintenance factor, the better the display characteristics of the display device when the obtained circuit board is provided in the display device.

Formula: Brightness maintenance ratio (%) = [Light intensity/Light intensity 8] X 1 0 0

[0261] One standard one

60% or more: 2

60% or less: 1

[0262] [Table 2]

[0263] The following abbreviations used in Table 2 represent the following materials, respectively:

[0264] <Photoacid generator> 〇 2020/174767 63 卩 (：171?2019/044334

-"Mi_1": a compound having the structure shown below (synthesized according to the method described in paragraph 0 2 2 7 of JP-A No. 20 1 3-4 7 7 6 5)

[0265] [Chemical 4]

[0266] "Mi_2": a compound having the structure shown below (trade name: 8

1 0 3, manufactured by Mihachi 3)

[0267] [Chemical 5]

[0268] <Surfactant>

"○ _ 1": Compound having the structure shown below

[0269] [Chemical 6]

Appreciation and rinsing mass study

Number: 1 〇

[0270] <Basic compound>

-"0-1": A compound having the structure shown below (〇1\/1c II)

[0271] \¥02020/174767 ¢4 ?€1/^2019/044334

[Chemical 7]

0^110

[0272] <Substrate>

-"Polyimide 1": Ding IV!M 0 (registered trademark) T V p e X (manufactured by A.S.T Co., Ltd., haze 0.4%, total light transmittance 90%, thickness 50)

-"Polyimide 2": Dye [¾1\/1 Md. 0 Ding Seo 63 (A.S.T. Co., Ltd., haze 3.0%, total light transmittance 88%, thickness 25)

-"Polyimide 3": Kapton (registered trademark) 1 001 ^~ 1 (manufactured by Toray DuPont Co., Ltd., total light transmittance of 85% or less, thickness 25)

-"Polyethylene terephthalate": Lumirror (registered trademark) 1 60360 (Toray Industries, Inc., haze 0.4%, total light transmittance 90%, thickness 16^^)

[0273] From Table 2, it was found that Examples 1 to 12 had a smaller change rate of the pattern width and the copper line width than Comparative Examples 1 to 2 and were excellent in laminate suitability under high temperature and high speed conditions. .. Further, it was found that Examples 1 to 10 using Polyimide 1 having a small haze and a high total light transmittance have excellent display characteristics as compared with Examples 11 to 12.

[0274] 201 Japanese patent application filed on February 28, 2011 201 9—03642

The disclosure of No. 9 is incorporated herein by reference in its entirety. All documents, patent applications, and technical standards mentioned herein are to the same extent as if each individual document, patent application, and technical standard were specifically and individually stated to be incorporated by reference. Incorporated herein by reference.

Claims

\¥0 2020/174767 65 ?(: 17 2019/044334 Claims

[Claim 1] The photosensitive resin composition layer in a photosensitive transfer material, comprising: a temporary support; and a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50 ^° or higher. And a polyimide substrate in contact with each other to bond the photosensitive transfer material and the polyimide substrate to each other.

[Claim 2] The glass transition temperature of the acid-decomposable resin is 50° to 90°°, and the heating temperature is 120° C. in the step of bonding the photosensitive transfer material and the polyimide substrate. ^The method for producing a patterned substrate according to claim 1, wherein the substrate is at a temperature of 0 ^° to 150 ^° and the transfer speed is 2.5/min to 5.0°!/min.

[Claim 3] The glass transition temperature of the acid-decomposable resin is 55° to 90°

The method for manufacturing a patterned substrate according to claim 1 or claim 2.

[Claim 4] The acid value of the acid-decomposable resin is

9. The method for producing a patterned substrate according to claim 1, wherein the method is 9.

[Claim 5] The acid-decomposable resin has a (meth)acrylate compound having a linear alkyl group having 1 to 3 carbon atoms at an ester position, and a branched alkyl group having 1 to 3 carbon atoms at an ester position (Meth) acrylate compound, which has a C4-C20 cyclic alkyl group at the ester position, and (meth) acrylate compound, and which has a C4-C20 cyclic ether group at the ester position (meth) acrylate compound From the group consisting of at least one (meth)acrylate compound-derived structural unit selected from the group of 90% by mass or more based on the total mass of the acid-decomposable resin, and comprising acrylic acid and an acrylate compound. The butter according to any one of claims 1 to 4, containing 0% by mass to 30% by mass with respect to the total mass of the acid-decomposable resin, the constituent unit derived from at least one selected acrylic compound. Manufacturing method of printed circuit board. 〇2020/174767 66 卩(：171?2019/044334

[Claim 6] The method for producing a patterned substrate according to any one of claims 1 to 5, wherein the haze of the polyimide substrate is 0.5% or less.

7. The method for manufacturing a patterned substrate according to claim 1, wherein the polyimide substrate has a total light transmittance of 85% or more.

[Claim 8] a step of pattern-exposing the photosensitive resin composition layer after the step of laminating,

Developing the pattern-exposed photosensitive resin composition layer to form a pattern of the photosensitive resin composition layer,

The method for manufacturing a patterned substrate according to claim 1, further comprising:

[Claim 9] The method for producing a patterned substrate according to any one of claims 1 to 8, wherein the polyimide substrate has a conductive layer.

[Claim 10] A step of producing a patterned substrate by the method for producing a patterned substrate according to claim 9,

A step of etching the conductive layer exposed in a region of the patterned substrate where the pattern of the photosensitive resin composition layer is not formed,

A step of removing the pattern of the photosensitive resin composition layer,

A method for manufacturing a circuit board having, in this order.

[Claim 11] The method for producing a circuit board according to claim 10, comprising a step of exposing the entire surface of the photosensitive resin composition layer between the etching step and the removing step.

12. The method for producing a circuit board according to claim 10 or 11, wherein the conductive layer is a copper layer or a silver layer.

[Claim 13] A method for manufacturing a touch panel, including the method for manufacturing the circuit board according to any one of claims 10 to 12.

[Claim 14] A touch panel having a step of preparing a circuit board manufactured by the method for manufacturing a circuit board according to any one of claims 10 to 12. 〇 2020/174767 67 卩 (: 171?2019/044334

Production method.

15. A laminate comprising a polyimide substrate and a photosensitive resin composition layer containing an acid-decomposable resin having a glass transition temperature of 50 ^° C. or higher.