JP2021162666A5 - - Google Patents

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JP2021162666A5
JP2021162666A5 JP2020062554A JP2020062554A JP2021162666A5 JP 2021162666 A5 JP2021162666 A5 JP 2021162666A5 JP 2020062554 A JP2020062554 A JP 2020062554A JP 2020062554 A JP2020062554 A JP 2020062554A JP 2021162666 A5 JP2021162666 A5 JP 2021162666A5
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Prior art keywords
wiring electrode
photosensitive composition
positive photosensitive
opaque wiring
forming
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JP2020062554A
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JP2021162666A (en
JP7472601B2 (en
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Claims (7)

透明基板に不透明配線電極を形成する工程、
前記不透明配線電極形成面にポジ型感光性組成物を塗布する工程、
前記ポジ型感光性組成物を露光マスクを用いて当該ポジ型感光性組成物の塗布面側から露光する工程、
前記不透明配線電極をマスクとして前記ポジ型感光性組成物を前記塗布面とは反対の面側から露光する工程、
および、両面から露光された前記ポジ型感光性組成物を現像することにより、前記不透明配線電極上の所望の部位に遮光層を形成する工程を有する配線電極付き基板の製造方法。 forming an opaque wiring electrode on a transparent substrate;
applying a positive photosensitive composition to the surface on which the opaque wiring electrodes are formed;
A step of exposing the positive photosensitive composition from the coated surface side of the positive photosensitive composition using an exposure mask;
A step of exposing the positive photosensitive composition from the side opposite to the coating surface using the opaque wiring electrode as a mask;
and a method for producing a wiring electrode-attached substrate, comprising the step of forming a light shielding layer at a desired portion on the opaque wiring electrode by developing the positive photosensitive composition exposed from both sides. 前記不透明配線電極が第１の不透明配線電極であり、
前記第１の不透明配線電極上の所望の部位に遮光層を形成する工程の後に、
前記第１の不透明配線電極形成面に絶縁層を形成する工程、
前記絶縁層上に第２の不透明配線電極を形成する工程、
前記第２の不透明配線電極形成面に第２のポジ型感光性組成物を塗布する工程、
前記第２のポジ型感光性組成物を露光マスクを用いて当該第２のポジ型感光性組成物の塗布面側から露光する工程、
前記第２の不透明配線電極をマスクとして前記第２のポジ型感光性組成物を前記塗布面とは反対の面側から露光する工程、
および、両面から露光された前記第２のポジ型感光性組成物を現像することにより、前記第１の不透明配線電極および第２の不透明配線電極上の所望の部位に第２の遮光層を形成する工程を有する請求項１記載の配線電極付き基板の製造方法。 The opaque wiring electrode is a first opaque wiring electrode,
After the step of forming a light shielding layer at a desired portion on the first opaque wiring electrode,
forming an insulating layer on the surface on which the first opaque wiring electrode is formed;
forming a second opaque wiring electrode on the insulating layer;
applying a second positive photosensitive composition to the surface on which the second opaque wiring electrode is formed;
A step of exposing the second positive photosensitive composition from the coating surface side of the second positive photosensitive composition using an exposure mask;
A step of exposing the second positive photosensitive composition from the surface side opposite to the coating surface using the second opaque wiring electrode as a mask;
Then, by developing the second positive photosensitive composition exposed from both sides, a second light-shielding layer is formed on desired portions on the first opaque wiring electrode and the second opaque wiring electrode. 2. The method for manufacturing a substrate with wiring electrodes according to claim 1, further comprising the step of: 透明基板に第１の不透明配線電極を形成する工程、
前記第１の不透明配線電極上に絶縁層を形成する工程、
前記絶縁層上に第２の不透明配線電極を形成する工程、
前記第２の不透明配線電極形成面にポジ型感光性組成物を塗布する工程、
前記ポジ型感光性組成物を露光マスクを用いて当該ポジ型感光性組成物の塗布面側から露光する工程、
前記第１の不透明配線電極および第２の不透明配線電極をマスクとして前記ポジ型感光性組成物を前記塗布面とは反対の面側から露光する工程、
および、両面から露光された前記ポジ型感光性組成物を現像することにより、第１の不透明配線電極および第２の不透明配線電極上の所望の部位に遮光層を形成する工程を有する配線電極付き基板の製造方法。 forming a first opaque wiring electrode on a transparent substrate;
forming an insulating layer on the first opaque wiring electrode;
forming a second opaque wiring electrode on the insulating layer;
applying a positive photosensitive composition to the surface on which the second opaque wiring electrode is formed;
A step of exposing the positive photosensitive composition from the coated surface side of the positive photosensitive composition using an exposure mask;
A step of exposing the positive photosensitive composition from the side opposite to the coating surface using the first opaque wiring electrode and the second opaque wiring electrode as a mask;
and a step of forming a light shielding layer at a desired portion on the first opaque wiring electrode and the second opaque wiring electrode by developing the positive photosensitive composition exposed from both sides. Substrate manufacturing method. 透明基板に第１の不透明配線電極を形成する工程、
前記第１の不透明配線電極形成面に第１の絶縁層を形成する工程、
前記第１の絶縁層上に第２の不透明配線電極を形成する工程、
前記第２の不透明配線電極形成面に第２の絶縁層を形成する工程、
前記第２の絶縁層形成面にポジ型感光性組成物を塗布する工程、
前記ポジ型感光性組成物を露光マスクを用いて当該ポジ型感光性組成物の塗布面側から露光する工程、
前記第１の不透明配線電極および第２の不透明配線電極をマスクとして前記ポジ型感光性組成物を前記塗布面とは反対の面側から露光する工程、
および、両面から露光された前記ポジ型感光性組成物を現像することにより、前記第１の不透明配線電極および第２の不透明配線電極上の所望の部位に遮光層を形成する工程を有する配線電極付き基板の製造方法。 forming a first opaque wiring electrode on a transparent substrate;
forming a first insulating layer on the surface on which the first opaque wiring electrode is formed;
forming a second opaque wiring electrode on the first insulating layer;
forming a second insulating layer on the surface on which the second opaque wiring electrode is formed;
applying a positive photosensitive composition to the second insulating layer forming surface;
A step of exposing the positive photosensitive composition from the coated surface side of the positive photosensitive composition using an exposure mask;
A step of exposing the positive photosensitive composition from the side opposite to the coating surface using the first opaque wiring electrode and the second opaque wiring electrode as a mask;
and a wiring electrode having a step of forming a light shielding layer at a desired portion on the first opaque wiring electrode and the second opaque wiring electrode by developing the positive photosensitive composition exposed from both sides. manufacturing method of substrate with 前記不透明配線電極が端子部を含み、前記現像により端子部上のポジ型感光性組成物が除去される、請求項１～４のいずれか一項記載の配線電極付き基板の製造方法。 5. The method for producing a substrate with wiring electrodes according to claim 1, wherein the opaque wiring electrodes include terminal portions, and the positive photosensitive composition on the terminal portions is removed by the development. 前記ポジ型感光性組成物を塗布面とは反対の面側から露光する工程において、光源としてＬＥＤランプを用いる、請求項１～５のいずれか一項記載の配線電極付き基板の製造方法。 6. The method for producing a substrate with wiring electrodes according to claim 1, wherein an LED lamp is used as a light source in the step of exposing the positive photosensitive composition from the side opposite to the coated side. 前記不透明配線電極の波長３６５ｎｍにおける透過率が２０％以下である請求項１～６のいずれか一項記載の配線電極付き基板の製造方法。 7. The method for manufacturing a substrate with wiring electrodes according to claim 1, wherein the opaque wiring electrodes have a transmittance of 20% or less at a wavelength of 365 nm .
JP2020062554A 2020-03-31 2020-03-31 Method for manufacturing substrate with wiring electrodes Active JP7472601B2 (en)

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JP2020062554A JP7472601B2 (en) 2020-03-31 2020-03-31 Method for manufacturing substrate with wiring electrodes

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JP2021162666A JP2021162666A (en) 2021-10-11
JP2021162666A5 true JP2021162666A5 (en) 2022-08-18
JP7472601B2 JP7472601B2 (en) 2024-04-23

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Publication number Priority date Publication date Assignee Title
WO2024004318A1 (en) * 2022-06-27 2024-01-04 東レ株式会社 Method for manufacturing substrate with wiring electrode

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JP2001264811A (en) 2000-03-22 2001-09-26 Fujitsu Ltd Method of manufacturing liquid crystal display device and device for exposure
US11449180B2 (en) 2017-03-17 2022-09-20 Toray Industries, Inc. Method for manufacturing substrate equipped with wiring electrode, and substrate equipped with wiring electrode

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