JP2021141320A - 複数の層を熱的に接続するための方法、装置、及びアセンブリ - Google Patents
複数の層を熱的に接続するための方法、装置、及びアセンブリ Download PDFInfo
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Abstract
Description
本出願は、上記と同じ題名及び発明者を有する、2020年2月28日付けで出願された米国仮特許出願シリアル番号第62/983,133号明細書に基づく優先権を主張するものであり、この仮特許出願は、その全体が参照により本明細書に援用される。
Claims (22)
- 熱界面材料を、集積回路のダイの上に適用することであって、これにより前記熱界面材料が、前記ダイと回路アセンブリの上部層との間になり、前記ダイに対して適用された前記熱界面材料が、液体金属液滴と未硬化ポリマーとのエマルジョンを含む、適用することと、
前記回路アセンブリを圧縮することであって、それによって前記液体金属液滴を変形させることと、
前記熱界面材料を硬化させることであって、それによって硬化したアセンブリを形成することと、を含む、方法。 - 前記ダイが、プロセッサを備え、かつ前記上部層が、ヒートシンク、一体型ヒートスプレッダ、又はパッケージングを備える、請求項1に記載の方法。
- 前記硬化したアセンブリ内で前記ダイと前記上部層との間に形成される接合ライン距離が、150ミクロンを超えない、請求項1に記載の方法。
- 適用前の前記熱界面材料内の前記液体金属液滴の平均粒子サイズが、前記硬化したアセンブリ内で前記ダイと前記上部層との間に形成される接合ライン距離より大きい、請求項1に記載の方法。
- 堆積前の前記熱界面材料内の前記液体金属液滴の平均サイズが、1%〜100%の範囲内で前記硬化したアセンブリ内で前記ダイと前記上部層との間に形成される接合ライン距離より大きい、請求項1に記載の方法。
- 前記液体金属液滴が、ガリウム、ガリウム合金、インジウム、インジウム合金、スズ、スズ合金、水銀、水銀合金、又はこれらの組合せを含む、請求項1に記載の方法。
- 前記液体金属液滴が、少なくとも摂氏−19度〜摂氏30度の範囲内の温度において液相である、請求項1に記載の方法。
- 硬化後の前記熱界面材料が、30(°K*mm2)/Wを超えない熱抵抗値を備える、請求項1に記載の方法。
- 前記ポリマーが、熱硬化性ポリマーを含む、請求項1に記載の方法。
- 前記ポリマーが、熱可塑性ポリマーを含む、請求項1に記載の方法。
- 前記エマルジョンが、硬化前に、250,000cP未満の粘度を有する、請求項1に記載の方法。
- 前記液体金属液滴が、堆積前には概して球状であり、かつ前記液体金属液滴が、前記アセンブリの圧縮後には概して楕円形状である、請求項1に記載の方法。
- 請求項1に記載の方法によって製造された集積回路アセンブリ。
- ダイと、
上部層と、
前記ダイ層及び前記上部層と接触して配置された熱的界面材料であって、前記上の材料が、ポリマーと、前記ポリマー全体にわたって分散した液体金属液滴と、を含み、前記ダイと前記上部層との間に形成される接合ライン距離が、150ミクロンを超えないものである、熱的界面材料と、を備える、集積回路アセンブリ。 - 前記液体金属液滴が、ガリウム、ガリウム合金、インジウム、インジウム合金、スズ、スズ合金、水銀、水銀合金、又はこれらの組合せを含む、請求項14に記載の方法。
- 前記液体金属液滴が、少なくとも摂氏−19度〜摂氏30度の範囲内の温度において液相である、請求項14に記載のアセンブリ。
- 前記熱界面材料が、30(°K*mm2)/Wを超えない熱抵抗値を備える、請求項14に記載のアセンブリ。
- 前記ポリマーが、熱硬化性ポリマーを含む、請求項14に記載のアセンブリ。
- 前記ポリマーが、熱可塑性ポリマーを含む、請求項14に記載のアセンブリ。
- 前記液体金属液滴が、概して楕円形状である、請求項14に記載のアセンブリ。
- 熱界面材料を第1層上に適用することであって、これにより前記熱界面材料がアセンブリの第1層と第2層との間になり、前記熱界面材料が、液体金属液滴と未硬化ポリマーとのエマルジョンを含む、適用することと、
前記アセンブリを圧縮し、それによって前記液体金属液滴を変形させることと、
前記熱界面材料を硬化させ、それによって硬化したアセンブリを形成することであって、適用前の前記熱界面材料内の前記液体金属液滴の平均粒子サイズが、前記アセンブリ内で前記第1層と前記第2層との間に形成される接合ライン距離より大きい、方法。 - 前記液体金属液滴が、少なくとも摂氏−19度〜摂氏30度の範囲内の温度において液相である、請求項21に記載の方法。
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