JP2021132133A - 搬送トレー - Google Patents
搬送トレー Download PDFInfo
- Publication number
- JP2021132133A JP2021132133A JP2020026979A JP2020026979A JP2021132133A JP 2021132133 A JP2021132133 A JP 2021132133A JP 2020026979 A JP2020026979 A JP 2020026979A JP 2020026979 A JP2020026979 A JP 2020026979A JP 2021132133 A JP2021132133 A JP 2021132133A
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- Prior art keywords
- ingot
- wafer
- accommodating
- point
- transport tray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000012431 wafers Nutrition 0.000 claims description 100
- 230000004308 accommodation Effects 0.000 abstract description 5
- 230000032258 transport Effects 0.000 description 96
- 239000010410 layer Substances 0.000 description 15
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 7
- 229910010271 silicon carbide Inorganic materials 0.000 description 7
- 239000013078 crystal Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 230000000149 penetrating effect Effects 0.000 description 3
- 230000005484 gravity Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 238000000638 solvent extraction Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D19/00—Pallets or like platforms, with or without side walls, for supporting loads to be lifted or lowered
- B65D19/38—Details or accessories
- B65D19/44—Elements or devices for locating articles on platforms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D19/00—Pallets or like platforms, with or without side walls, for supporting loads to be lifted or lowered
- B65D19/0004—Rigid pallets without side walls
- B65D19/0006—Rigid pallets without side walls the load supporting surface being made of a single element
- B65D19/003—Rigid pallets without side walls the load supporting surface being made of a single element forming discontinuous or non-planar contact surfaces
- B65D19/0032—Rigid pallets without side walls the load supporting surface being made of a single element forming discontinuous or non-planar contact surfaces the base surface being made of a single element
- B65D19/0036—Rigid pallets without side walls the load supporting surface being made of a single element forming discontinuous or non-planar contact surfaces the base surface being made of a single element forming discontinuous or non-planar contact surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D19/00—Pallets or like platforms, with or without side walls, for supporting loads to be lifted or lowered
- B65D19/38—Details or accessories
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
上壁と、下壁と、該上壁と該下壁とを連結する一対の側壁と、該上壁と該下壁と該一対の側壁とで形成されるトンネルとを備えた筐体と、
該筐体の該上壁に形成されインゴットを収容するインゴット収容凹部と、
該筐体の該下壁に形成されウエーハを収容するウエーハ収容部と、を備え、
該インゴット収容凹部の底面から突出する力点と、該インゴット収容凹部の側面から突出する作用点と、該力点と該作用点との間に形成された支点とを有する梃子が配設され、
インゴットの自重によって該力点が作動して該作用点によってインゴットの側面を支持する搬送トレーを本発明は提供する。
上壁と、下壁と、該上壁と該下壁とを連結する一対の側壁と、該上壁と該下壁と該一対の側壁とで形成されるトンネルとを備えた筐体と、
該筐体の該上壁に形成されインゴットを収容するインゴット収容凹部と、
該筐体の該下壁に形成されウエーハを収容するウエーハ収容部と、を備え、
該インゴット収容凹部の底面から突出する力点と、該インゴット収容凹部の側面から突出する作用点と、該力点と該作用点との間に形成された支点とを有する梃子が配設され、
インゴットの自重によって該力点が作動して該作用点によってインゴットの側面を支持するので、インゴットを搬送している際に、インゴットを安定して保持することができ、インゴットの脱落を防止することができる。
4:筐体
6:インゴット収容凹部
6a:第一のインゴット収容凹部
6b:第二のインゴット収容凹部
8:ウエーハ収容部
8a:第一のウエーハ収容部
8b:第二のウエーハ収容部
10:上壁
12:下壁
14:側壁
16:トンネル
22:梃子
22a:梃子の第一の部分
22b:梃子の第二の部分
22c:梃子の第三の部分
22d:梃子の第四の部分
22e:梃子の第五の部分
22f:梃子の第六の部分
24:力点
24a:第一の力点
24b:第二の力点
26:作用点
26a:第一の作用点
26b:第二の作用点
28:支点
Claims (2)
- インゴットからウエーハを生成するウエーハ生成装置で使用される搬送トレーであって、
上壁と、下壁と、該上壁と該下壁とを連結する一対の側壁と、該上壁と該下壁と該一対の側壁とで形成されるトンネルとを備えた筐体と、
該筐体の該上壁に形成されインゴットを収容するインゴット収容凹部と、
該筐体の該下壁に形成されウエーハを収容するウエーハ収容部と、を備え、
該インゴット収容凹部の底面から突出する力点と、該インゴット収容凹部の側面から突出する作用点と、該力点と該作用点との間に形成された支点とを有する梃子が配設され、
インゴットの自重によって該力点が作動して該作用点によってインゴットの側面を支持する搬送トレー。 - 該インゴット収容凹部は、2以上の大きさのインゴットに対応した同心状の収容凹部を備え、該収容凹部にはインゴットの大きさに対応した梃子が配設されている請求項1記載の搬送トレー。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020026979A JP7461158B2 (ja) | 2020-02-20 | 2020-02-20 | 搬送トレー |
US17/168,349 US11521877B2 (en) | 2020-02-20 | 2021-02-05 | Carrier tray |
CN202110175580.8A CN113277200A (zh) | 2020-02-20 | 2021-02-09 | 搬送托盘 |
DE102021201607.3A DE102021201607A1 (de) | 2020-02-20 | 2021-02-19 | Trägerablage |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020026979A JP7461158B2 (ja) | 2020-02-20 | 2020-02-20 | 搬送トレー |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021132133A true JP2021132133A (ja) | 2021-09-09 |
JP7461158B2 JP7461158B2 (ja) | 2024-04-03 |
Family
ID=77176317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020026979A Active JP7461158B2 (ja) | 2020-02-20 | 2020-02-20 | 搬送トレー |
Country Status (4)
Country | Link |
---|---|
US (1) | US11521877B2 (ja) |
JP (1) | JP7461158B2 (ja) |
CN (1) | CN113277200A (ja) |
DE (1) | DE102021201607A1 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06181252A (ja) * | 1992-12-11 | 1994-06-28 | Ebara Corp | ウエハ支持装置 |
JP2006210378A (ja) * | 2005-01-25 | 2006-08-10 | Jel:Kk | 基板保持装置 |
JP2019106458A (ja) * | 2017-12-12 | 2019-06-27 | 株式会社ディスコ | ウエーハ生成装置および搬送トレー |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5026303A (en) * | 1988-03-10 | 1991-06-25 | Yamaichi Electric Manufacturing Co., Ltd. | Slotless type IC carrier |
US5971156A (en) * | 1997-09-05 | 1999-10-26 | Kinetrix, Inc. | Semiconductor chip tray with rolling contact retention mechanism |
JP2000094221A (ja) | 1998-09-24 | 2000-04-04 | Toyo Advanced Technologies Co Ltd | 放電式ワイヤソー |
US6938783B2 (en) * | 2000-07-26 | 2005-09-06 | Amerasia International Technology, Inc. | Carrier tape |
KR100486412B1 (ko) * | 2000-10-18 | 2005-05-03 | (주)테크윙 | 테스트 핸들러의 테스트 트레이 인서트 |
US6889841B2 (en) * | 2001-07-03 | 2005-05-10 | Johnstech International Corporation | Interface apparatus for reception and delivery of an integrated circuit package from one location to another |
US7395933B2 (en) * | 2005-06-14 | 2008-07-08 | Intel Corporation | Carrier to hold semiconductor device using opposed rollers |
KR100792487B1 (ko) * | 2006-08-22 | 2008-01-10 | (주)테크윙 | 테스트핸들러용 테스트트레이의 인서트 |
KR101024973B1 (ko) * | 2006-10-25 | 2011-03-25 | 주식회사 오킨스전자 | 디바이스 케리어 |
KR100999000B1 (ko) * | 2008-09-09 | 2010-12-09 | 주식회사 티에프이스트포스트 | 반도체 패키지 인서트 |
JP7164396B2 (ja) * | 2018-10-29 | 2022-11-01 | 株式会社ディスコ | ウエーハ生成装置 |
-
2020
- 2020-02-20 JP JP2020026979A patent/JP7461158B2/ja active Active
-
2021
- 2021-02-05 US US17/168,349 patent/US11521877B2/en active Active
- 2021-02-09 CN CN202110175580.8A patent/CN113277200A/zh active Pending
- 2021-02-19 DE DE102021201607.3A patent/DE102021201607A1/de active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06181252A (ja) * | 1992-12-11 | 1994-06-28 | Ebara Corp | ウエハ支持装置 |
JP2006210378A (ja) * | 2005-01-25 | 2006-08-10 | Jel:Kk | 基板保持装置 |
JP2019106458A (ja) * | 2017-12-12 | 2019-06-27 | 株式会社ディスコ | ウエーハ生成装置および搬送トレー |
Also Published As
Publication number | Publication date |
---|---|
CN113277200A (zh) | 2021-08-20 |
US11521877B2 (en) | 2022-12-06 |
DE102021201607A1 (de) | 2021-08-26 |
JP7461158B2 (ja) | 2024-04-03 |
US20210265186A1 (en) | 2021-08-26 |
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