JP2021108369A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2021108369A5 JP2021108369A5 JP2020214380A JP2020214380A JP2021108369A5 JP 2021108369 A5 JP2021108369 A5 JP 2021108369A5 JP 2020214380 A JP2020214380 A JP 2020214380A JP 2020214380 A JP2020214380 A JP 2020214380A JP 2021108369 A5 JP2021108369 A5 JP 2021108369A5
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- plating
- resist
- external
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 description 58
- 238000007747 plating Methods 0.000 description 57
- 239000010410 layer Substances 0.000 description 47
- 238000004519 manufacturing process Methods 0.000 description 42
- 239000002585 base Substances 0.000 description 32
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 30
- 229910001128 Sn alloy Inorganic materials 0.000 description 29
- 238000005530 etching Methods 0.000 description 29
- 238000003475 lamination Methods 0.000 description 20
- 239000000463 material Substances 0.000 description 20
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 229910052759 nickel Inorganic materials 0.000 description 13
- 230000004907 flux Effects 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- 230000001681 protective effect Effects 0.000 description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 7
- 239000010970 precious metal Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Images
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019238868 | 2019-12-27 | ||
| JP2019238868 | 2019-12-27 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021108369A JP2021108369A (ja) | 2021-07-29 |
| JP2021108369A5 true JP2021108369A5 (enrdf_load_stackoverflow) | 2021-09-09 |
| JP7197967B2 JP7197967B2 (ja) | 2022-12-28 |
Family
ID=76967997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020214380A Active JP7197967B2 (ja) | 2019-12-27 | 2020-12-24 | リードフレーム構造の製造方法、並びに半導体装置の製造方法及び積層半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7197967B2 (enrdf_load_stackoverflow) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5646368A (en) * | 1995-11-30 | 1997-07-08 | International Business Machines Corporation | Printed circuit board with an integrated twisted pair conductor |
| JP4723776B2 (ja) * | 2001-09-28 | 2011-07-13 | 三洋電機株式会社 | 半導体装置の製造方法 |
| JP2003297996A (ja) * | 2002-03-29 | 2003-10-17 | Matsushita Electric Ind Co Ltd | リードフレームおよびそれを用いた樹脂封止型半導体装置 |
-
2020
- 2020-12-24 JP JP2020214380A patent/JP7197967B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4343158B2 (ja) | 半導体デバイスのパッケージ製造方法 | |
| TWI527175B (zh) | 半導體封裝件、基板及其製造方法 | |
| US7662672B2 (en) | Manufacturing process of leadframe-based BGA packages | |
| US9859197B2 (en) | Integrated circuit package fabrication | |
| US20080246132A1 (en) | Semiconductor device and method of manufacturing semiconductor device | |
| US7579676B2 (en) | Leadless leadframe implemented in a leadframe-based BGA package | |
| KR20080073735A (ko) | 상단 및 하단 노출 패키지 반도체 조립 장치 및 방법 | |
| US7923835B2 (en) | Package, electronic device, substrate having a separation region and a wiring layers, and method for manufacturing | |
| US6458627B1 (en) | Semiconductor chip package and method of fabricating same | |
| TW201436132A (zh) | 封裝基板、封裝基板製作方法及封裝結構 | |
| TW202329271A (zh) | 側邊可焊接無引線封裝 | |
| CN104282637B (zh) | 倒装芯片半导体封装结构 | |
| JP3870704B2 (ja) | 半導体装置 | |
| US9502337B2 (en) | Flip-chip on leadframe semiconductor packaging structure and fabrication method thereof | |
| US11302623B2 (en) | Electronic device | |
| US8193643B2 (en) | Semiconductor device and method for fabricating the same | |
| JP3939847B2 (ja) | 半導体装置の製造方法 | |
| JP3564311B2 (ja) | 柱状電極付き半導体ウエハの製造方法及び半導体装置の製造方法 | |
| JP2021108369A5 (enrdf_load_stackoverflow) | ||
| US10727171B2 (en) | Lead frame | |
| JP2009152408A (ja) | 半導体装置およびその製造方法 | |
| JP7154818B2 (ja) | 半導体装置および半導体装置の製造方法 | |
| JP7197967B2 (ja) | リードフレーム構造の製造方法、並びに半導体装置の製造方法及び積層半導体装置の製造方法 | |
| JP2017183571A (ja) | 半導体装置の製造方法 | |
| CN115346967B (zh) | 三维堆叠屏蔽结构和三维堆叠屏蔽方法 |