JP2021057534A5 - - Google Patents
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- Publication number
- JP2021057534A5 JP2021057534A5 JP2019181661A JP2019181661A JP2021057534A5 JP 2021057534 A5 JP2021057534 A5 JP 2021057534A5 JP 2019181661 A JP2019181661 A JP 2019181661A JP 2019181661 A JP2019181661 A JP 2019181661A JP 2021057534 A5 JP2021057534 A5 JP 2021057534A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor switching
- semiconductor device
- switching elements
- terminal
- detection unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 28
- 238000001514 detection method Methods 0.000 claims description 16
- 230000004913 activation Effects 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 2
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019181661A JP2021057534A (ja) | 2019-10-01 | 2019-10-01 | 半導体装置 |
| PCT/JP2020/032300 WO2021065259A1 (ja) | 2019-10-01 | 2020-08-27 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019181661A JP2021057534A (ja) | 2019-10-01 | 2019-10-01 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021057534A JP2021057534A (ja) | 2021-04-08 |
| JP2021057534A5 true JP2021057534A5 (de) | 2021-09-09 |
Family
ID=75271272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019181661A Pending JP2021057534A (ja) | 2019-10-01 | 2019-10-01 | 半導体装置 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2021057534A (de) |
| WO (1) | WO2021065259A1 (de) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011111097A1 (ja) * | 2010-03-10 | 2011-09-15 | 株式会社 日立製作所 | 電力変換装置 |
| JP5661052B2 (ja) * | 2012-01-18 | 2015-01-28 | 三菱電機株式会社 | パワー半導体モジュールおよびその製造方法 |
| JP6256419B2 (ja) * | 2015-06-24 | 2018-01-10 | 株式会社デンソー | 半導体チップおよびそれを用いた半導体モジュール |
| DE112017001729B4 (de) * | 2016-04-01 | 2022-11-03 | Mitsubishi Electric Corporation | Halbleitermodule |
| JP6439750B2 (ja) * | 2016-05-20 | 2018-12-19 | 株式会社デンソー | 半導体装置 |
| WO2018220721A1 (ja) * | 2017-05-30 | 2018-12-06 | 三菱電機株式会社 | 半導体パワーモジュール |
-
2019
- 2019-10-01 JP JP2019181661A patent/JP2021057534A/ja active Pending
-
2020
- 2020-08-27 WO PCT/JP2020/032300 patent/WO2021065259A1/ja active Application Filing
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