JP2021055113A5 - - Google Patents
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- Publication number
- JP2021055113A5 JP2021055113A5 JP2020218278A JP2020218278A JP2021055113A5 JP 2021055113 A5 JP2021055113 A5 JP 2021055113A5 JP 2020218278 A JP2020218278 A JP 2020218278A JP 2020218278 A JP2020218278 A JP 2020218278A JP 2021055113 A5 JP2021055113 A5 JP 2021055113A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- electronic component
- electromagnetic wave
- wave shielding
- resins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims 12
- 239000011347 resin Substances 0.000 claims 12
- 239000000945 filler Substances 0.000 claims 7
- 239000000565 sealant Substances 0.000 claims 3
- 238000005538 encapsulation Methods 0.000 claims 2
- 229920005992 thermoplastic resin Polymers 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- 239000004641 Diallyl-phthalate Substances 0.000 claims 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 claims 1
- 239000011231 conductive filler Substances 0.000 claims 1
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 229920000515 polycarbonate Polymers 0.000 claims 1
- 239000004417 polycarbonate Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920001225 polyester resin Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000009719 polyimide resin Substances 0.000 claims 1
- 229920005672 polyolefin resin Polymers 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
- 229920002635 polyurethane Polymers 0.000 claims 1
- 239000011342 resin composition Substances 0.000 claims 1
- 229920006337 unsaturated polyester resin Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020218278A JP7371613B2 (ja) | 2019-05-30 | 2020-12-28 | 電子部品の封止体 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019101328A JP7236326B2 (ja) | 2019-05-30 | 2019-05-30 | 電子部品の封止体、及び電子部品の封止体の製造方法 |
| JP2020218278A JP7371613B2 (ja) | 2019-05-30 | 2020-12-28 | 電子部品の封止体 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019101328A Division JP7236326B2 (ja) | 2019-05-30 | 2019-05-30 | 電子部品の封止体、及び電子部品の封止体の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021055113A JP2021055113A (ja) | 2021-04-08 |
| JP2021055113A5 true JP2021055113A5 (enrdf_load_stackoverflow) | 2022-05-13 |
| JP7371613B2 JP7371613B2 (ja) | 2023-10-31 |
Family
ID=88509956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020218278A Active JP7371613B2 (ja) | 2019-05-30 | 2020-12-28 | 電子部品の封止体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7371613B2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119213882A (zh) | 2022-10-26 | 2024-12-27 | Ｊｘ金属株式会社 | 金属树脂复合电磁波屏蔽材料 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001237352A (ja) * | 2000-02-25 | 2001-08-31 | Sony Corp | 半導体パッケージ、発熱部品及びその放熱構造 |
| JP2002324877A (ja) * | 2001-04-25 | 2002-11-08 | Mitsui Chemicals Inc | 半導体素子 |
| JP3916889B2 (ja) * | 2001-06-08 | 2007-05-23 | ソニー株式会社 | 半導体封止用樹脂組成物およびそれを用いた半導体装置 |
| JP4651004B2 (ja) * | 2004-12-07 | 2011-03-16 | 戸田工業株式会社 | 球状焼結フェライト粒子およびそれを用いた半導体封止用樹脂組成物ならびにそれを用いて得られる半導体装置 |
| JP2007287937A (ja) * | 2006-04-17 | 2007-11-01 | Kyocera Chemical Corp | 樹脂封止型半導体装置及びその製造方法 |
-
2020
- 2020-12-28 JP JP2020218278A patent/JP7371613B2/ja active Active
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