JP2021027357A - ヒートシンク - Google Patents
ヒートシンク Download PDFInfo
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- JP2021027357A JP2021027357A JP2020129606A JP2020129606A JP2021027357A JP 2021027357 A JP2021027357 A JP 2021027357A JP 2020129606 A JP2020129606 A JP 2020129606A JP 2020129606 A JP2020129606 A JP 2020129606A JP 2021027357 A JP2021027357 A JP 2021027357A
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- heat
- hole
- resistant wire
- heat sink
- holes
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- 239000007769 metal material Substances 0.000 claims abstract description 30
- 239000012530 fluid Substances 0.000 claims abstract description 28
- 238000005491 wire drawing Methods 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 238000005266 casting Methods 0.000 claims description 17
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 238000005452 bending Methods 0.000 claims description 7
- 230000014759 maintenance of location Effects 0.000 claims description 4
- 238000001816 cooling Methods 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 description 26
- 240000002853 Nelumbo nucifera Species 0.000 description 15
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 15
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 239000012768 molten material Substances 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 238000005553 drilling Methods 0.000 description 9
- 239000003507 refrigerant Substances 0.000 description 9
- 238000010894 electron beam technology Methods 0.000 description 7
- 239000006082 mold release agent Substances 0.000 description 7
- 238000000605 extraction Methods 0.000 description 6
- 239000011148 porous material Substances 0.000 description 6
- 238000003754 machining Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000011343 solid material Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 229910052582 BN Inorganic materials 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910003472 fullerene Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C9/00—Moulds or cores; Moulding processes
- B22C9/10—Cores; Manufacture or installation of cores
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D25/00—Special casting characterised by the nature of the product
- B22D25/02—Special casting characterised by the nature of the product by its peculiarity of shape; of works of art
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/08—Alloys with open or closed pores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
(1) 金属材料の鋳造品からなり、外面に単又は複数の貫通した耐熱線引き抜き孔が開口しており、該耐熱線引き抜き孔内を流通する流体中に熱を放熱することを特徴とするヒートシンク。
(7) 前記耐熱線引き抜き孔の孔径(直径)が、100μm〜20mm、好ましくは200μm〜10mm、より好ましくは300μm〜5mmである、(1)〜(6)の何れかに記載のヒートシンク。
(8) 前記耐熱線引き抜き孔の孔の長さが、1mm〜2000mm、好ましくは5mm〜1000mm、より好ましくは10mm〜300mmである、(1)〜(7)の何れか1に記載のヒートシンク。
(9) 前記耐熱線引き抜き孔のアスペクト比が、0.05〜20000、好ましくは1〜1000、より好ましくは3〜300である、(1)〜(8)の何れかに記載のヒートシンク。
(12) 遅くとも溶融した金属材料を供給する前に、あらかじめ前記耐熱線の表面に離型剤を被覆してなる、(11)記載の製造方法。
(14) 前記凝固させ、脱型した後、当該金属材料の鋳造品から前記耐熱線を引き抜くことで、単又は複数の耐熱線引き抜き孔が表面に開口した金属材料の鋳造品を得る、(11)〜(13)の何れかに記載の有孔鋳造品の製造方法。
2 耐熱線
2a 端部
3 鋳型
4 鋳造物
4b 側面
5 治具
6 治具
7 ヒーター
8 冷却対象物
9 離型剤の層
10 引き抜き孔
11 孔部
12 溶融材料
13 閉塞部材
14 流体溜め空間
30 プレート型
31 外側型
9 固体材料
Claims (5)
- 金属材料の鋳造品からなり、外面に単又は複数の貫通した耐熱線引き抜き孔が開口しており、該耐熱線引き抜き孔内を流通する流体中に熱を放熱することを特徴とするヒートシンク。
- 前記耐熱線引き抜き孔が、前記鋳造品の鋳型内に設けられて凝固する金属材料に端部が外面に露出した状態に埋め込まれる単又は複数の耐熱線の引き抜き孔である、請求項1記載のヒートシンク。
- 前記耐熱線が、表面に離型剤が被覆されたものである、請求項2記載のヒートシンク。
- 前記耐熱線が、所定の保形性並びに屈曲変形可能性を備えた金属細線である、請求項2又は3記載のヒートシンク。
- 前記鋳造品に前記引き抜き孔の断面積よりも大きな断面積の有底の孔部が設けられ、
前記耐熱線引き抜き孔が、前記鋳造品の外面の開口部から前記孔部の内周面の開口部にいたる貫通孔であって、前記孔部内の空間と鋳造品外部空間を連通する孔である請求項1〜4の何れか1項に記載のヒートシンク。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019140246 | 2019-07-30 | ||
JP2019140246 | 2019-07-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021027357A true JP2021027357A (ja) | 2021-02-22 |
JP7165361B2 JP7165361B2 (ja) | 2022-11-04 |
Family
ID=74228245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2020129606A Active JP7165361B2 (ja) | 2019-07-30 | 2020-07-30 | ヒートシンク |
Country Status (2)
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JP (1) | JP7165361B2 (ja) |
WO (1) | WO2021020529A1 (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62168657A (ja) * | 1986-01-20 | 1987-07-24 | Toyoda Autom Loom Works Ltd | 鋳造方法 |
US20030173720A1 (en) * | 2002-03-12 | 2003-09-18 | Massachusetts Institute Of Technology | Methods for forming articles having very small channels therethrough, and such articles, and methods of using such articles |
JP4217865B2 (ja) * | 1999-07-09 | 2009-02-04 | 英雄 中嶋 | 多孔質金属体の製造方法 |
WO2014050892A1 (ja) * | 2012-09-25 | 2014-04-03 | 学校法人常翔学園 | 有孔鋳造品及びその製造方法 |
JP2018073869A (ja) * | 2016-10-24 | 2018-05-10 | 株式会社ロータス・サーマル・ソリューション | ヒートシンク、該ヒートシンクを備えた冷却装置及び該ヒートシンクの製造方法、並びに冷却対象物の冷却方法 |
JP2018179412A (ja) * | 2017-04-13 | 2018-11-15 | 株式会社ロータス・サーマル・ソリューション | 熱交換器 |
-
2020
- 2020-07-30 JP JP2020129606A patent/JP7165361B2/ja active Active
- 2020-07-30 WO PCT/JP2020/029317 patent/WO2021020529A1/ja active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62168657A (ja) * | 1986-01-20 | 1987-07-24 | Toyoda Autom Loom Works Ltd | 鋳造方法 |
JP4217865B2 (ja) * | 1999-07-09 | 2009-02-04 | 英雄 中嶋 | 多孔質金属体の製造方法 |
US20030173720A1 (en) * | 2002-03-12 | 2003-09-18 | Massachusetts Institute Of Technology | Methods for forming articles having very small channels therethrough, and such articles, and methods of using such articles |
WO2014050892A1 (ja) * | 2012-09-25 | 2014-04-03 | 学校法人常翔学園 | 有孔鋳造品及びその製造方法 |
JP2018073869A (ja) * | 2016-10-24 | 2018-05-10 | 株式会社ロータス・サーマル・ソリューション | ヒートシンク、該ヒートシンクを備えた冷却装置及び該ヒートシンクの製造方法、並びに冷却対象物の冷却方法 |
JP2018179412A (ja) * | 2017-04-13 | 2018-11-15 | 株式会社ロータス・サーマル・ソリューション | 熱交換器 |
Also Published As
Publication number | Publication date |
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WO2021020529A1 (ja) | 2021-02-04 |
JP7165361B2 (ja) | 2022-11-04 |
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