JP2020533807A5 - - Google Patents

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Publication number
JP2020533807A5
JP2020533807A5 JP2020515236A JP2020515236A JP2020533807A5 JP 2020533807 A5 JP2020533807 A5 JP 2020533807A5 JP 2020515236 A JP2020515236 A JP 2020515236A JP 2020515236 A JP2020515236 A JP 2020515236A JP 2020533807 A5 JP2020533807 A5 JP 2020533807A5
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JP
Japan
Prior art keywords
target material
target
radiation beam
additional layer
layer
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JP2020515236A
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English (en)
Japanese (ja)
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JP7360172B2 (ja
JP2020533807A (ja
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Priority claimed from GB1714802.4A external-priority patent/GB2566477A/en
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Publication of JP2020533807A5 publication Critical patent/JP2020533807A5/ja
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Publication of JP7360172B2 publication Critical patent/JP7360172B2/ja
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JP2020515236A 2017-09-14 2018-09-12 ターゲット材料を処理する方法 Active JP7360172B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1714802.4 2017-09-14
GB1714802.4A GB2566477A (en) 2017-09-14 2017-09-14 Method of processing a target material
PCT/EP2018/074649 WO2019053082A1 (en) 2017-09-14 2018-09-12 METHOD OF PROCESSING TARGET MATERIAL

Publications (3)

Publication Number Publication Date
JP2020533807A JP2020533807A (ja) 2020-11-19
JP2020533807A5 true JP2020533807A5 (enExample) 2021-09-16
JP7360172B2 JP7360172B2 (ja) 2023-10-12

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ID=60159472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020515236A Active JP7360172B2 (ja) 2017-09-14 2018-09-12 ターゲット材料を処理する方法

Country Status (8)

Country Link
US (1) US11107679B2 (enExample)
EP (1) EP3682463A1 (enExample)
JP (1) JP7360172B2 (enExample)
KR (1) KR102566382B1 (enExample)
CN (1) CN111095482B (enExample)
GB (1) GB2566477A (enExample)
TW (1) TWI801418B (enExample)
WO (1) WO2019053082A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7571073B2 (ja) * 2022-03-24 2024-10-22 株式会社Kokusai Electric 半導体装置の製造方法、基板処理方法、プログラム、及び基板処理装置
CN116532808A (zh) * 2023-05-17 2023-08-04 泰兰特激光技术(武汉)有限公司 一种局域改变无机非金属材料表面载流子浓度的方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI316736B (en) * 2003-05-02 2009-11-01 Au Optronics Corp Method of fabricating polysilicon film by excimer laser crystallization process
JP4769491B2 (ja) * 2004-06-04 2011-09-07 株式会社 液晶先端技術開発センター 結晶化方法、薄膜トランジスタの製造方法、薄膜トランジスタおよび表示装置
KR100646937B1 (ko) * 2005-08-22 2006-11-23 삼성에스디아이 주식회사 다결정 실리콘 박막트랜지스터 및 그 제조방법
TW200713460A (en) * 2005-09-22 2007-04-01 Adv Lcd Tech Dev Ct Co Ltd Phase modulation device, phase modulation device fabrication method, crystallization apparatus, and crystallization method
TWI280292B (en) * 2005-12-12 2007-05-01 Ind Tech Res Inst Method of fabricating a poly-silicon thin film
KR101375834B1 (ko) * 2007-11-20 2014-03-18 삼성전자주식회사 다결정 실리콘 박막 및 이를 적용하는 박막 트랜지스터의제조방법
EP2212913A4 (en) * 2007-11-21 2013-10-30 Univ Columbia SYSTEMS AND METHOD FOR PRODUCING EPITACTIC STRUCTURED THICK FILMS
WO2009068756A1 (fr) * 2007-11-28 2009-06-04 Commissariat A L'energie Atomique Procede de cristallisation
US8569155B2 (en) * 2008-02-29 2013-10-29 The Trustees Of Columbia University In The City Of New York Flash lamp annealing crystallization for large area thin films
JP5342898B2 (ja) * 2009-02-26 2013-11-13 三菱電機株式会社 逆スタガ構造の薄膜トランジスタ及びその製造方法
JP2011003666A (ja) * 2009-06-17 2011-01-06 Sony Corp 照射装置および半導体素子の製造方法
EP2833391A4 (en) * 2012-03-30 2015-04-22 Teijin Ltd SEMICONDUCTOR LAMINATE AND METHOD FOR THE PRODUCTION THEREOF, METHOD FOR THE PRODUCTION OF A SEMICONDUCTOR COMPONENT, SEMICONDUCTOR ELEMENT, DOTING COMPOSITION, DOPING INJECTION LAYER AND METHOD FOR FORMING A DOPED LAYER
CN104797980A (zh) * 2012-09-20 2015-07-22 英特斯特公司 照射装置及照射方法
JP2014090045A (ja) * 2012-10-30 2014-05-15 Sanken Electric Co Ltd イオン導入層の活性化方法、および、半導体装置の製造方法
TWI593024B (zh) * 2015-07-24 2017-07-21 友達光電股份有限公司 薄膜電晶體的製造方法
KR102781391B1 (ko) * 2015-09-09 2025-03-17 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들

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