JP2020529940A5 - - Google Patents

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Publication number
JP2020529940A5
JP2020529940A5 JP2020507075A JP2020507075A JP2020529940A5 JP 2020529940 A5 JP2020529940 A5 JP 2020529940A5 JP 2020507075 A JP2020507075 A JP 2020507075A JP 2020507075 A JP2020507075 A JP 2020507075A JP 2020529940 A5 JP2020529940 A5 JP 2020529940A5
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JP
Japan
Prior art keywords
printing system
imaging surface
station
polymer
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020507075A
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English (en)
Japanese (ja)
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JP2020529940A (ja
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Publication date
Priority claimed from GBGB1712726.7A external-priority patent/GB201712726D0/en
Application filed filed Critical
Publication of JP2020529940A publication Critical patent/JP2020529940A/ja
Publication of JP2020529940A5 publication Critical patent/JP2020529940A5/ja
Priority to JP2022148364A priority Critical patent/JP2022188090A/ja
Pending legal-status Critical Current

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JP2020507075A 2017-08-08 2018-08-08 印刷システム及びその書込みモジュール Pending JP2020529940A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022148364A JP2022188090A (ja) 2017-08-08 2022-09-16 印刷システム及びその書込みモジュール

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1712726.7 2017-08-08
GBGB1712726.7A GB201712726D0 (en) 2017-08-08 2017-08-08 Electric current and heat mitigation in a printing machine writing module
PCT/IB2018/055971 WO2019030694A1 (en) 2017-08-08 2018-08-08 PRINTING SYSTEM AND WRITING MODULE

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022148364A Division JP2022188090A (ja) 2017-08-08 2022-09-16 印刷システム及びその書込みモジュール

Publications (2)

Publication Number Publication Date
JP2020529940A JP2020529940A (ja) 2020-10-15
JP2020529940A5 true JP2020529940A5 (https=) 2021-08-19

Family

ID=59894977

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020507075A Pending JP2020529940A (ja) 2017-08-08 2018-08-08 印刷システム及びその書込みモジュール
JP2022148364A Pending JP2022188090A (ja) 2017-08-08 2022-09-16 印刷システム及びその書込みモジュール

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022148364A Pending JP2022188090A (ja) 2017-08-08 2022-09-16 印刷システム及びその書込みモジュール

Country Status (7)

Country Link
US (1) US11865782B2 (https=)
EP (1) EP3665015B1 (https=)
JP (2) JP2020529940A (https=)
CN (1) CN110997330B (https=)
ES (1) ES2902045T3 (https=)
GB (1) GB201712726D0 (https=)
WO (1) WO2019030694A1 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3842864B1 (en) * 2019-12-23 2022-08-03 Cubicure GmbH Systems and methods for lithography-based additive manufacturing three-dimensional (3d) structures
CN112531461A (zh) * 2020-12-30 2021-03-19 江西铭德半导体科技有限公司 一种可控横向光场的多结型半导体激光器及其制造方法
JP7475501B2 (ja) * 2021-01-20 2024-04-26 ソニーグループ株式会社 面発光レーザ、電子機器及び面発光レーザの製造方法
FR3124030A1 (fr) * 2021-06-09 2022-12-16 Sidel Participations Emetteur laser pour station de chauffage
CN113591300B (zh) * 2021-07-29 2024-03-15 深圳市创想三维科技股份有限公司 3d打印文件的生成方法、装置、计算机设备和存储介质
US11827037B2 (en) * 2021-08-23 2023-11-28 Xerox Corporation Semiconductor array imager for printing systems
US11984701B2 (en) * 2021-08-23 2024-05-14 Xerox Corporation System for electronically controlling and driving independently addressable semiconductor lasers
US12366815B2 (en) * 2021-08-23 2025-07-22 Xerox Corporation Focusing optics for use with semiconductor lasers for imaging applications
US12562552B2 (en) * 2021-08-23 2026-02-24 Genesee Valley Innovations, LLC Independently-addressable high power surface-emitting laser array with tight-pitch packing
US20230054034A1 (en) * 2021-08-23 2023-02-23 Palo Alto Research Center Incorporated 3d package for semiconductor thermal management
TWI785780B (zh) 2021-09-06 2022-12-01 虹光精密工業股份有限公司 發光晶片打件偏差之調節方法及列印頭
CN113733546A (zh) * 2021-09-13 2021-12-03 数造科技(湖南)有限公司 一种3d发光字打印的自动化一体成型设备及方法
CN116277938A (zh) * 2023-02-09 2023-06-23 京东方科技集团股份有限公司 一种光固化3d打印机及打印方法
FR3149229B1 (fr) * 2023-05-31 2025-04-25 Sidel Participations Unité de traitement thermique de préformes comprenant des éléments de chauffage connectés en série
GB2633405A (en) * 2023-09-11 2025-03-12 Landa Labs 2012 Ltd Method an apparatus for 3D printing
WO2025057054A1 (en) 2023-09-11 2025-03-20 Landa Labs (2012) Ltd Method and apparatus for 3d printing
JP2025173883A (ja) * 2024-05-15 2025-11-28 キヤノン株式会社 発光装置及び測距装置

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61118273A (ja) 1984-11-15 1986-06-05 Erumu:Kk レ−ザ−式インクジエツトプリンタ
US5600363A (en) 1988-12-28 1997-02-04 Kyocera Corporation Image forming apparatus having driving means at each end of array and power feeding substrate outside head housing
JPH03114341U (https=) * 1990-03-12 1991-11-25
US5572540A (en) * 1992-08-11 1996-11-05 University Of New Mexico Two-dimensional opto-electronic switching arrays
AUPO799197A0 (en) 1997-07-15 1997-08-07 Silverbrook Research Pty Ltd Image processing method and apparatus (ART01)
FR2761537B1 (fr) 1997-04-01 1999-06-11 Thomson Csf Laser comprenant un empilement de diodes laser epitaxiees compris entre deux miroirs de bragg
US6493371B1 (en) * 1998-04-14 2002-12-10 Bandwidth9, Inc. Vertical cavity apparatus with tunnel junction
US6487230B1 (en) * 1998-04-14 2002-11-26 Bandwidth 9, Inc Vertical cavity apparatus with tunnel junction
US6635861B1 (en) * 1998-10-22 2003-10-21 Wavefront Research, Inc. Relaxed tolerance optical interconnect system having a GRIN rod lens
US20030057363A1 (en) * 2000-12-26 2003-03-27 Anderson Gene R. Optical power control system
US6863444B2 (en) * 2000-12-26 2005-03-08 Emcore Corporation Housing and mounting structure
US6799902B2 (en) * 2000-12-26 2004-10-05 Emcore Corporation Optoelectronic mounting structure
GB0121308D0 (en) * 2001-09-03 2001-10-24 Thomas Swan & Company Ltd Optical processing
JP2003080761A (ja) * 2001-09-12 2003-03-19 Fuji Xerox Co Ltd 画像形成方法及び装置
US7002613B2 (en) * 2002-09-06 2006-02-21 Heidelberger Druckmaschinen Ag Method for printing an image on a printing substrate and device for inputting energy to a printing-ink carrier
JP2004122512A (ja) * 2002-10-01 2004-04-22 Sanyo Electric Co Ltd プリントヘッド
US6771680B2 (en) * 2002-10-22 2004-08-03 Agilent Technologies, Inc Electrically-pumped, multiple active region vertical-cavity surface-emitting laser (VCSEL)
US7796885B2 (en) * 2002-11-05 2010-09-14 Lightfleet Corporation Distribution optical elements and compound collecting lenses for broadcast optical interconnect
US6936486B2 (en) 2002-11-19 2005-08-30 Jdsu Uniphase Corporation Low voltage multi-junction vertical cavity surface emitting laser
JP5017804B2 (ja) 2005-06-15 2012-09-05 富士ゼロックス株式会社 トンネル接合型面発光半導体レーザ装置およびその製造方法
WO2007010184A1 (en) * 2005-07-15 2007-01-25 Xyratex Technology Limited Optical printed circuit board and manufacturing method
DE102006010728A1 (de) * 2005-12-05 2007-06-06 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Laservorrichtung
JP4884810B2 (ja) * 2006-03-17 2012-02-29 古河電気工業株式会社 半導体発光素子及びその製造方法
JP4697077B2 (ja) * 2006-07-12 2011-06-08 日立電線株式会社 光モジュール
JP5144243B2 (ja) * 2006-12-28 2013-02-13 富士フイルム株式会社 画像形成方法及び画像形成装置
US8535474B2 (en) * 2007-08-06 2013-09-17 Kao Corporation Liquid applicator
DE602007011610D1 (de) * 2007-09-14 2011-02-10 Punch Graphix Int Nv Lichtemittierendes Array zum Drucken oder Kopieren
JP2009260205A (ja) * 2008-03-17 2009-11-05 Ricoh Co Ltd 光源装置、光走査装置及び画像形成装置
DE102008030818B4 (de) * 2008-06-30 2022-03-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Oberflächenemittierender Halbleiterlaser mit mehreren aktiven Zonen
WO2010130051A1 (en) 2009-05-14 2010-11-18 4233999 Canada, Inc. System for and method of providing high resolution images using monolithic arrays of light emitting diodes
US9160450B2 (en) * 2011-09-23 2015-10-13 Te Connectivity Nederland B.V. Multi-channel transceiver
JP2013165188A (ja) 2012-02-10 2013-08-22 Oki Data Corp 半導体発光装置、光源装置、画像形成装置及び画像表示装置
CN104661825A (zh) * 2012-06-15 2015-05-27 海德堡印刷机械股份公司 用于将印刷液体间接施加到承印材料上的方法
US9573360B2 (en) * 2013-09-09 2017-02-21 Xerox Corporation Thermally conductive aqueous transfix blanket
ES2799123T3 (es) * 2013-12-17 2020-12-14 Eos Gmbh Electro Optical Systems Sistema de impresión láser
CN106457298A (zh) * 2014-05-17 2017-02-22 善持乐株式会社 热熔粘接剂的辊转印涂敷方法以及涂敷装置
US20160072258A1 (en) 2014-09-10 2016-03-10 Princeton Optronics Inc. High Resolution Structured Light Source
JP2016078238A (ja) 2014-10-09 2016-05-16 株式会社リコー プリントヘッド及び画像形成装置
MX372575B (es) * 2015-05-27 2020-04-16 Landa Labs 2012 Ltd Metodo y aparato de impresion para el recubrimiento de regiones seleccionadas de un sustrato con una pelicula
GB201509080D0 (en) * 2015-05-27 2015-07-08 Landa Labs 2012 Ltd Coating apparatus
PT3302985T (pt) * 2015-05-27 2021-01-13 Landa Labs 2012 Ltd Dispositivo de formação de imagens
CN110023092B (zh) * 2016-11-30 2021-08-20 兰达实验室(2012)有限公司 热转印打印的改进
US11125664B2 (en) 2017-12-04 2021-09-21 Montana Instruments Corporation Analytical instruments, methods, and components
US10509128B1 (en) * 2019-04-12 2019-12-17 K Laser Technology, Inc. Programmable pattern optical projector for depth detection

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