JP2020523755A5 - - Google Patents

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Publication number
JP2020523755A5
JP2020523755A5 JP2019568406A JP2019568406A JP2020523755A5 JP 2020523755 A5 JP2020523755 A5 JP 2020523755A5 JP 2019568406 A JP2019568406 A JP 2019568406A JP 2019568406 A JP2019568406 A JP 2019568406A JP 2020523755 A5 JP2020523755 A5 JP 2020523755A5
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JP
Japan
Prior art keywords
wire
substrate
main surface
surface area
layer
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JP2019568406A
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English (en)
Japanese (ja)
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JP2020523755A (ja
JP7190453B2 (ja
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Priority claimed from PCT/IB2018/054105 external-priority patent/WO2018229609A1/en
Publication of JP2020523755A publication Critical patent/JP2020523755A/ja
Publication of JP2020523755A5 publication Critical patent/JP2020523755A5/ja
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Publication of JP7190453B2 publication Critical patent/JP7190453B2/ja
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JP2019568406A 2017-06-12 2018-06-07 伸縮性導体 Active JP7190453B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762518519P 2017-06-12 2017-06-12
US62/518,519 2017-06-12
US201762610536P 2017-12-27 2017-12-27
US62/610,536 2017-12-27
PCT/IB2018/054105 WO2018229609A1 (en) 2017-06-12 2018-06-07 Stretchable conductors

Publications (3)

Publication Number Publication Date
JP2020523755A JP2020523755A (ja) 2020-08-06
JP2020523755A5 true JP2020523755A5 (enExample) 2021-07-26
JP7190453B2 JP7190453B2 (ja) 2022-12-15

Family

ID=64659091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019568406A Active JP7190453B2 (ja) 2017-06-12 2018-06-07 伸縮性導体

Country Status (5)

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US (2) US10854355B2 (enExample)
EP (1) EP3639281A4 (enExample)
JP (1) JP7190453B2 (enExample)
CN (1) CN110753976B (enExample)
WO (1) WO2018229609A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018105653A1 (de) * 2018-03-12 2019-09-12 Osram Opto Semiconductors Gmbh Verfahren zur herstellung einer anordung, anordnung und array
US10999925B2 (en) * 2018-09-19 2021-05-04 Ii-Vi Delaware, Inc. Stretchable conductor circuit
WO2020259786A1 (en) * 2019-06-26 2020-12-30 Coloplast A/S A device for connecting to a base plate and/or a sensor patch for an ostomy appliance
CN111403080A (zh) 2020-03-24 2020-07-10 东莞讯滔电子有限公司 电缆及其制造方法
DE102020207783A1 (de) 2020-06-23 2021-12-23 Tesa Se Leitfähiger doppelseitiger Haftklebestreifen
HRP20221403T1 (hr) * 2020-07-01 2023-01-06 Nanoleq Ag Spojni sklop
JP2023150966A (ja) * 2022-03-31 2023-10-16 株式会社プロテリアル 伸縮フラットケーブル
WO2025095037A1 (ja) * 2023-10-31 2025-05-08 Tdk株式会社 樹脂配線基板および伸縮性デバイス
CN118898953A (zh) * 2024-07-17 2024-11-05 天马新型显示技术研究院(厦门)有限公司 一种基板及其制备方法和显示面板、显示装置

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US562A (en) 1838-01-09 Scale beam and weight
US4520A (en) 1846-05-16 Cooking-stove
US3324014A (en) * 1962-12-03 1967-06-06 United Carr Inc Method for making flush metallic patterns
DE1593791A1 (de) 1966-05-04 1970-10-01 Ciba Geigy Latente Haerter und stabile hitzegehaertete Epoxydmassen
JPS55154010A (en) * 1979-05-21 1980-12-01 Yutaka Fukuda Elongation responsive electric cord
JPS6038809B2 (ja) * 1979-11-20 1985-09-03 信越ポリマ−株式会社 異方導電性を有するエラスチツク構造体の製造方法
JPS6072917A (ja) 1983-09-30 1985-04-25 Ajinomoto Co Inc エポキシ樹脂用潜在性硬化剤
EP0193068A1 (en) 1985-02-18 1986-09-03 Asahi Kasei Kogyo Kabushiki Kaisha One liquid type epoxy resin composition
IE891601L (en) 1989-05-18 1990-11-18 Loctite Ireland Ltd Latent hardeners for epoxy resin compositions
EP0594133B1 (en) 1992-10-22 1998-05-06 Ajinomoto Co., Inc. Polythiol epoxy resin composition with extended working life
CA2318790C (en) 1998-02-18 2004-03-30 Minnesota Mining And Manufacturing Company Optical film
US6322236B1 (en) 1999-02-09 2001-11-27 3M Innovative Properties Company Optical film with defect-reducing surface and method for making same
US7491892B2 (en) * 2003-03-28 2009-02-17 Princeton University Stretchable and elastic interconnects
US7265298B2 (en) * 2003-05-30 2007-09-04 The Regents Of The University Of California Serpentine and corduroy circuits to enhance the stretchability of a stretchable electronic device
US7388166B2 (en) * 2003-06-24 2008-06-17 Koninklijke Philips Electronics N.V. Stretchable fabric switch
JP4672012B2 (ja) 2004-06-18 2011-04-20 テクストロニクス， インク． 孔空けされた機能性織物構造
GB2431045B (en) * 2005-09-09 2008-02-13 Eleksen Ltd Electrical conductor element
US7328638B2 (en) 2005-12-27 2008-02-12 3M Innovative Properties Company Cutting tool using interrupted cut fast tool servo
US20090166877A1 (en) 2006-04-18 2009-07-02 Koninklijke Philips Electronics N.V. electro-optic device and a method for producing the same
TWI654770B (zh) * 2006-09-06 2019-03-21 美國伊利諾大學理事會 二維可延伸且可撓曲設備及其製造方法
US8207473B2 (en) * 2008-06-24 2012-06-26 Imec Method for manufacturing a stretchable electronic device
KR101048356B1 (ko) 2009-06-08 2011-07-14 서울대학교산학협력단 잡아 늘일 수 있는 전자소자들의 금속 연결 구조 및 그 제조방법
CN201765868U (zh) * 2010-07-12 2011-03-16 吴林权 弹性导线
US8636551B2 (en) 2011-01-07 2014-01-28 Hypertronics Corporation Electrical contact with embedded wiring
ES2618728T3 (es) * 2012-01-30 2017-06-22 Sensoria Inc. Sensores, interfaces y sistemas de sensores para la recolección de data y la integración del monitoreo remoto de condiciones cercanas o sobre las superficies del cuerpo
US9247637B2 (en) * 2012-06-11 2016-01-26 Mc10, Inc. Strain relief structures for stretchable interconnects
KR20140049314A (ko) * 2012-10-17 2014-04-25 한국전자통신연구원 신축성 전자 디바이스 및 그의 제조방법
KR20150125946A (ko) * 2013-02-06 2015-11-10 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 인장성의 전자장치에 대한 자기 유사형 및 프랙탈 설계
US9706647B2 (en) * 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
US10391683B2 (en) * 2015-05-31 2019-08-27 Purdue Research Foundation Method to genberate an ultra-stretchable electrical and heat conductive arrangement
JP6491556B2 (ja) * 2015-07-09 2019-03-27 日東電工株式会社 配線回路基板
US20170053873A1 (en) 2015-08-19 2017-02-23 Huilong Zhu Flexible integrated circuit devices and methods for manufacturing the same
KR20170036221A (ko) * 2015-09-24 2017-04-03 성균관대학교산학협력단 전기 저항 변화가 최소화된 신장성 전기 전도체 및 이의 제조 방법
US9832863B2 (en) 2015-09-25 2017-11-28 Intel Corporation Method of fabricating a stretchable computing device
TWM518392U (zh) 2015-11-13 2016-03-01 Kings Metal Fiber Technologies 膠線結構
TWM516858U (zh) * 2015-11-19 2016-02-11 Kings Metal Fiber Technologies 膠線改良結構
CN206040253U (zh) * 2016-08-31 2017-03-22 江苏火凤凰线缆系统技术股份有限公司 一种机器人手臂用伸缩信号线缆

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