CN110753976B - 可拉伸导体 - Google Patents

可拉伸导体 Download PDF

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Publication number
CN110753976B
CN110753976B CN201880038510.4A CN201880038510A CN110753976B CN 110753976 B CN110753976 B CN 110753976B CN 201880038510 A CN201880038510 A CN 201880038510A CN 110753976 B CN110753976 B CN 110753976B
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China
Prior art keywords
wire
layer
surface area
substrate
conductive
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Expired - Fee Related
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CN201880038510.4A
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English (en)
Chinese (zh)
Other versions
CN110753976A (zh
Inventor
安基特·马哈詹
詹姆斯·朱
撒格尔·A·沙
米哈伊尔·L·佩库罗夫斯基
维维克·克里斯南
凯文·T·雷迪
小克里斯托弗·B·瓦尔克
迈克尔·A·克罗普
卡拉·A·迈耶斯
特雷莎·M·格代尔
托马斯·J·梅茨勒
乔纳森·W·肯灵
罗杰·W·巴顿
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of CN110753976A publication Critical patent/CN110753976A/zh
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    • BPERFORMING OPERATIONS; TRANSPORTING
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
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    • B32B2605/00Vehicles
    • B32B2605/18Aircraft
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/08Flat or ribbon cables
    • H01B7/0846Parallel wires, fixed upon a support layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0133Elastomeric or compliant polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49162Manufacturing circuit on or in base by using wire as conductive path

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
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US11894164B2 (en) 2024-02-06
US20210280337A1 (en) 2021-09-09
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