JP2020515669A - 半導体基板上の残渣を除去するための洗浄組成物 - Google Patents
半導体基板上の残渣を除去するための洗浄組成物 Download PDFInfo
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- JP2020515669A JP2020515669A JP2019552549A JP2019552549A JP2020515669A JP 2020515669 A JP2020515669 A JP 2020515669A JP 2019552549 A JP2019552549 A JP 2019552549A JP 2019552549 A JP2019552549 A JP 2019552549A JP 2020515669 A JP2020515669 A JP 2020515669A
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- LUVHDTDFZLTVFM-UHFFFAOYSA-M tetramethylazanium;chlorate Chemical compound [O-]Cl(=O)=O.C[N+](C)(C)C LUVHDTDFZLTVFM-UHFFFAOYSA-M 0.000 description 1
- FDXKBUSUNHRUIZ-UHFFFAOYSA-M tetramethylazanium;chlorite Chemical compound [O-]Cl=O.C[N+](C)(C)C FDXKBUSUNHRUIZ-UHFFFAOYSA-M 0.000 description 1
- ZRVXFJFFJZFRLQ-UHFFFAOYSA-M tetramethylazanium;iodate Chemical compound [O-]I(=O)=O.C[N+](C)(C)C ZRVXFJFFJZFRLQ-UHFFFAOYSA-M 0.000 description 1
- ZCWKIFAQRXNZCH-UHFFFAOYSA-M tetramethylazanium;perchlorate Chemical compound C[N+](C)(C)C.[O-]Cl(=O)(=O)=O ZCWKIFAQRXNZCH-UHFFFAOYSA-M 0.000 description 1
- HLQAWDQQEJSALG-UHFFFAOYSA-M tetramethylazanium;periodate Chemical compound C[N+](C)(C)C.[O-]I(=O)(=O)=O HLQAWDQQEJSALG-UHFFFAOYSA-M 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
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- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0042—Reducing agents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/044—Hydroxides or bases
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/046—Salts
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/12—Water-insoluble compounds
- C11D3/1213—Oxides or hydroxides, e.g. Al2O3, TiO2, CaO or Ca(OH)2
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2006—Monohydric alcohols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2041—Dihydric alcohols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D3/2003—Alcohols; Phenols
- C11D3/2041—Dihydric alcohols
- C11D3/2048—Dihydric alcohols branched
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/28—Heterocyclic compounds containing nitrogen in the ring
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D3/16—Organic compounds
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- C11D3/33—Amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D3/16—Organic compounds
- C11D3/34—Organic compounds containing sulfur
- C11D3/3409—Alkyl -, alkenyl -, cycloalkyl - or terpene sulfates or sulfonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D3/16—Organic compounds
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- C11D3/3427—Organic compounds containing sulfur containing thiol, mercapto or sulfide groups, e.g. thioethers or mercaptales
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D3/34—Organic compounds containing sulfur
- C11D3/349—Organic compounds containing sulfur additionally containing nitrogen atoms, e.g. nitro, nitroso, amino, imino, nitrilo, nitrile groups containing compounds or their derivatives or thio urea
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/06—Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/10—Salts
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D7/02—Inorganic compounds
- C11D7/20—Water-insoluble oxides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D7/22—Organic compounds
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- C11D7/3281—Heterocyclic compounds
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
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- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
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- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
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Abstract
Description
本出願は2017年3月24日に出願された米国仮出願第62/475,947号の優先権を主張するものであり、その全体が参照により本明細書に組み込まれる。
1)少なくとも1種類のレドックス剤と、
2)少なくとも1種類の水溶性有機溶媒と、
3)少なくとも1種類の金属含有添加剤と、
4)少なくとも1種類の環状アミンと、
5) 水と、
を含む、洗浄組成物に関する。
(A)ポストエッチ残渣及び/又はポストアッシュ残渣を含む半導体基板を提供する工程;
(B)前記半導体基板を、本明細書に記載の洗浄組成物と接触させる工程;
(C)前記半導体基板を、適切なリンス溶媒でリンスする工程;並びに
(D)所望により、前記リンス溶媒を除去し前記半導体基板の品質(integrity)を損なわない何らかの手段によって、前記半導体基板を乾燥させる工程、
を含んでいてもよい。
1)少なくとも1種類のレドックス剤と、
2)少なくとも1種類の水溶性有機溶媒(例えば、水溶性アルコール類、水溶性ケトン類、水溶性エステル類、水溶性スルホン類、及び水溶性エーテル類からなる群より選択される水溶性有機溶媒)と、
3)少なくとも1種類の金属含有添加剤と、
4)少なくとも1種類の環状アミンと、
5) 水と、
を含む、非腐食性洗浄組成物に関する。
(A)ポストエッチ残渣及び/又はポストアッシュ残渣を含む半導体基板を提供する工程;
(B)前記半導体基板を、本明細書に記載の洗浄組成物と接触させる工程;
(C)前記半導体基板を、適切なリンス溶媒でリンスする工程;並びに
(D)所望により、前記リンス溶媒を除去し前記半導体基板の品質を損なわない何らかの手段によって、前記半導体基板を乾燥させる工程、
を含む。
ある実施形態では、前記洗浄方法は、上述の方法により得られた前記半導体基板から半導体デバイス(例えば、半導体チップなどの集積回路デバイス)を形成することをさらに含む。
調合物ブレンド
本開示の組成物を、有機溶媒及び超純粋脱イオン水(DIW)と撹拌しながら混合することにより調製した。均一な溶液が得られた後、残りの成分を添加した。用いた成分はすべて、市販されている高純度のものであった。
ビーカー試験による洗浄評価
Co/TiN/Ti/TiOx/ILDの多層基板を用いて、基板のPER(ポストエッチ残渣)を上述の洗浄組成物により洗浄した。
ビーカー試験との材料相溶性評価
シリコン基板(すなわち、シリコンウェハ)上のブランケットCo、シリコン基板上のTiOx、シリコン基板上のTiN、シリコン基板上のAlOx、及び/又はシリコン基板上のW合金をさいの目に切り、材料相溶性試験用のおよそ1インチ×1インチの正方形試験クーポンにした。まず、試験クーポンについて、金属膜(Co)の場合は4点プローブ、CDE Resmap 273により、又は誘電体膜(TiOx、TiN、及びAlOx)の場合はWoollam M−2000Xを用いたエリプソメトリにより、厚み又はシート抵抗を測定した。次に、試験クーポンを長さ4インチのプラスチックロッキングピンセットにセットし、クーポンのCo、W合金、TiOx、TiN、又はAlOx層を有する側が撹拌子側になるようにして、一般手順2の洗浄手順に記載の通りに10分間処理した。
洗浄調合物FE−1〜FE−6(これらの全ては硫黄含有添加剤及び金属含有添加剤を含む)を一般手順1に従って調製した。それらの組成を表1にまとめる。
露出しているコバルトとの洗浄剤の相溶性
調合物FE−1〜FE−6を、一般手順2に従いコバルト腐食抑制能力について、露出しているチタン層の下にコバルト層を含有するパターニングされたシリコン基板を使用して試験した。洗浄組成物による露出コバルトの損失(すなわち、洗浄組成物によって除去された露出コバルトの数)を測定し、表2に示す。
洗浄調合物FE−7〜FE−12(これらの全ては、硫黄含有添加剤及び金属含有添加剤を含有した)を、一般手順1によって調製した。それらの組成を表3に要約する。特に、調合物FE−7〜FE−12は、増加する量のDBUを含有した。
露出している金属又は誘電体との洗浄剤の相溶性
調合物FE−7〜FE−12を、一般手順2に従い材料相溶性について、露出しているコバルトを含有するパターニングされたシリコン基板を用いて試験した。調合物FE−7〜FE−9、FE−11、及びFE−12を、一般手順3に従い材料相溶性について、シリコン基板上のブランケットフィルムを用いて、65o℃、4分間で試験した。パターニングされたシリコン基板上の露出コバルトの、洗浄組成物による損失(すなわち、洗浄組成物によって除去された露出コバルトの数)を測定し、表4に示す。洗浄調合物によるシリコン基板上のブランケット膜としてのW合金、Co、AlOx、TiOx、及びTiNのエッチング速度(ER)(オングストローム/分)を表5に示す。
洗浄調合物FE−13〜FE−16(全てアミノ酸添加剤及び金属含有添加剤を含有する)を、一般手順1によって調製した。それらの組成を表6に要約する。具体的には、調合物FE−13〜FE−16は、メタンスルホン酸(MSA)の量を除いて、そしてその結果としてpHを除いて、実質的に同じ組成を有していた。
露出金属との洗浄剤の相溶性
調合物FE−13〜FE−16を、一般手順3に従い材料相溶性について、シリコン基板上のブランケットフィルムを用いて、65o℃、4分間で試験した。洗浄調合物によるW合金、Co、AlOx、TiOx、及びTiNのエッチング速度(ER)(オングストローム/分)を表7に示す。
洗浄調合物FE−17〜FE−18(これらの全ては、硫黄含有添加剤及び金属含有添加剤を含有する)を、一般手順1によって調製した。それらの組成を表8に要約する。
露出金属との洗浄剤の相溶性
調合物FE−17〜FE−18を、一般手順3に従いコバルト相溶性について、シリコン基板上のブランケットフィルムを用いて、65o℃、4分間で試験した。洗浄調合物によるCoのエッチング速度(ER)(オングストローム/分)を表9に示す。
Claims (33)
- 1)少なくとも1種類のレドックス剤;
2)少なくとも1種類の水溶性有機溶媒;
3)少なくとも1種類の金属含有添加剤;
4)少なくとも1種類の環状アミン;及び
5) 水
を含む、洗浄組成物。 - pHが約7〜約12である、請求項1に記載の組成物。
- 前記少なくとも1種類の環状アミンが式(I)の環状アミンを含む、請求項1に記載の組成物:
式中、
nは1、2、又は3であり;
mは1、2、又は3であり;
R1〜R10は、それぞれ独立に、H、C1〜C6アルキル基、又はアリール基であり;
Lは−O−、−S−、−N(Ra)−、又は−C(RaRb)−であり、ここでRa及びRbは、それぞれ独立に、H、C1〜C6アルキル基、又はアリール基であり;
R11はHであるか、又はRaと共に、R11が結合しているC原子とLとの間の第2の結合を形成する。 - 式(I)の環状アミンが、
である、請求項3に記載の組成物。 - 前記少なくとも1種類の環状アミンは、前記組成物の約0.1重量%〜約2重量%を占める、請求項1に記載の組成物。
- 前記少なくとも1種類のレドックス剤は、ヒドロキシルアミンを含む、請求項1に記載の組成物。
- 前記少なくとも1種類のレドックス剤は、前記組成物の約0.5重量%〜約20重量%を占める、請求項1に記載の組成物。
- 前記少なくとも1種類の水溶性有機溶媒は、2種類の有機溶媒を含む、請求項1に記載の組成物。
- 前記2種類の有機溶媒は、それぞれ独立に、アルキレングリコール類及びアルキレングリコールエーテル類からなる群より選択される、請求項8に記載の組成物。
- 前記少なくとも1種類の水溶性有機溶媒は、前記組成物の約60重量%〜約95重量%を占める、請求項1に記載の組成物。
- 前記少なくとも1種類の金属含有添加剤は、金属ハロゲン化物、金属水酸化物、金属ホウ化物、金属アルコキシド、金属酸化物、又は金属含有アンモニウム塩を含む、請求項1に記載の組成物。
- 前記少なくとも1種類の金属含有添加剤は、第2A族金属、第3B族金属、第4B族金属、第5B族金属、又はランタニド金属を含む、請求項1に記載の組成物。
- 前記少なくとも1種類の金属含有添加剤は、Ca、Ba、Ti、Hf、Sr、La、Ce、W、V、Nb、又はTaを含む、請求項12に記載の組成物。
- 前記少なくとも1種類の金属含有添加剤は、ホウ化タングステン、Ca(OH)2、BaCl2、SrCl2、LaCl3、CeCl3、(NH4)2TiF6、BaTiO3、Ti(OEt)4、Ti(OCH(CH3)2)4、HfO2、V2O5、Nb2O5、又はTaF3を含む、請求項1に記載の組成物。
- 前記少なくとも1種類の金属含有添加剤は、前記組成物の約0.001重量%〜約0.5重量%を占める、請求項1に記載の組成物。
- 前記水は、前記組成物の約5重量%〜約28重量%を占める、請求項1に記載の組成物。
- 前記少なくとも1種類の環状アミンとは異なるpH調整剤をさらに含む、請求項1に記載の組成物。
- 少なくとも1種類の洗浄添加剤をさらに含む、請求項1に記載の組成物。
- 前記少なくとも1種類の洗浄添加剤は、硫黄含有添加剤を含む、請求項18に記載の組成物。
- 前記硫黄含有添加剤は、チオール又はチオエーテルを含む、請求項19に記載の組成物。
- 前記硫黄含有添加剤は、3−アミノ−5−メルカプト−1H−1,2,4−トリアゾール、β−メルカプトエタノール、3−アミノ−5−メチルチオ−1H−1,2,4−トリアゾール、1−フェニル−1H−テトラゾール−5−チオール、4−メチル−4H−1,2,4−トリアゾール−3−チオール、2−ピリジンチオール、又は3−メルカプト−プロピオン酸を含む、請求項20に記載の組成物。
- 前記硫黄含有添加剤は、前記組成物の約0.01重量%〜約0.15重量%を占める、請求項19に記載の組成物。
- 前記少なくとも1種類の洗浄添加剤は、有機酸を含む、請求項18に記載の組成物。
- 前記有機酸は、カルボン酸又はスルホン酸を含む、請求項23に記載の組成物
- 前記少なくとも1種類の有機酸は、前記組成物の約0.1重量%〜約0.5重量%を占める、請求項23に記載の組成物。
- 前記少なくとも1種類の洗浄添加剤は、アミノ酸を含む、請求項18に記載の組成物。
- 前記アミノ酸はグリシンである、請求項26に記載の組成物。
- 前記アミノ酸は前記組成物の約0.01重量%〜約0.15重量%を占める、請求項26に記載の組成物。
- ポストエッチ残渣又はポストアッシュ残渣を含む半導体基板を、請求項1〜請求項28のいずれか一項に記載の洗浄組成物と接触させることを含む、方法。
- 前記半導体基板は、Cu、Co、W、AlOx、AlN、AlOxNy、Ti、TiN、Ta、TaN、TiOx、ZrOx、HfOx、及びTaOxからなる群より選択される材料を含む層をさらに有する、請求項29に記載の方法。
- 前記接触工程の後に、前記半導体基板をリンス溶媒でリンスすることをさらに含む、請求項29に記載の方法。
- 前記リンス工程の後に、前記半導体基板を乾燥させることをさらに含む、請求項31に記載の方法。
- 前記半導体基板から半導体デバイスを形成することをさらに含む、請求項29に記載の方法。
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US20230402276A1 (en) * | 2022-06-13 | 2023-12-14 | Tokyo Electron Limited | Methods For Selective Removal Of Surface Oxides On Metal Films |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007526523A (ja) * | 2004-03-03 | 2007-09-13 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 基板上に付着したフォトレジスト及び/又は犠牲反射防止材料のエッチング後除去のための組成物並びにプロセス |
JP2009260249A (ja) * | 2008-03-19 | 2009-11-05 | Fujifilm Corp | 半導体デバイス用洗浄液、および洗浄方法 |
JP2010163608A (ja) * | 2008-12-18 | 2010-07-29 | Sanyo Chem Ind Ltd | 電子材料用洗浄剤 |
KR20140006661A (ko) * | 2012-07-06 | 2014-01-16 | 동우 화인켐 주식회사 | 세정제 조성물 및 이를 이용한 세정방법 |
JP2016025358A (ja) * | 2014-07-24 | 2016-02-08 | エア プロダクツ アンド ケミカルズ インコーポレイテッドAir Products And Chemicals Incorporated | 窒化チタンハードマスク及びエッチ残留物除去 |
JP2016090753A (ja) * | 2014-10-31 | 2016-05-23 | 東京応化工業株式会社 | リソグラフィー用洗浄液、及び基板の洗浄方法 |
JP2017504190A (ja) * | 2013-12-06 | 2017-02-02 | フジフイルム エレクトロニック マテリアルズ ユー.エス.エー., インコーポレイテッド | 表面上の残渣を除去するための洗浄用製剤 |
WO2017099211A1 (ja) * | 2015-12-11 | 2017-06-15 | 富士フイルム株式会社 | 洗浄液、基板洗浄方法、及び、半導体デバイスの製造方法 |
JP2019537640A (ja) * | 2016-10-06 | 2019-12-26 | フジフイルム エレクトロニック マテリアルズ ユー.エス.エー., インコーポレイテッド | 半導体基板の残渣を除去するための洗浄用調合物 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6110881A (en) | 1990-11-05 | 2000-08-29 | Ekc Technology, Inc. | Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials |
JP2731730B2 (ja) | 1993-12-22 | 1998-03-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | フォトレジストの除去方法 |
US20040134873A1 (en) | 1996-07-25 | 2004-07-15 | Li Yao | Abrasive-free chemical mechanical polishing composition and polishing process containing same |
US6033993A (en) | 1997-09-23 | 2000-03-07 | Olin Microelectronic Chemicals, Inc. | Process for removing residues from a semiconductor substrate |
US6717019B2 (en) | 2002-01-30 | 2004-04-06 | Air Products And Chemicals, Inc. | Glycidyl ether-capped acetylenic diol ethoxylate surfactants |
CN1875325B (zh) | 2003-10-29 | 2011-01-26 | 马林克罗特贝克公司 | 含有金属卤化物腐蚀抑制剂的碱性后等离子体蚀刻/灰化残余物去除剂和光致抗蚀剂剥离组合物 |
US20100056410A1 (en) * | 2006-09-25 | 2010-03-04 | Advanced Technology Materials, Inc. | Compositions and methods for the removal of photoresist for a wafer rework application |
US20100105595A1 (en) | 2008-10-29 | 2010-04-29 | Wai Mun Lee | Composition comprising chelating agents containing amidoxime compounds |
US8361237B2 (en) * | 2008-12-17 | 2013-01-29 | Air Products And Chemicals, Inc. | Wet clean compositions for CoWP and porous dielectrics |
JP5508130B2 (ja) | 2010-05-14 | 2014-05-28 | 富士フイルム株式会社 | 洗浄組成物、半導体装置の製造方法及び洗浄方法 |
SG10201505535VA (en) * | 2010-07-16 | 2015-09-29 | Entegris Inc | Aqueous cleaner for the removal of post-etch residues |
KR101925272B1 (ko) * | 2011-03-21 | 2019-02-27 | 바스프 에스이 | 질소-무함유 수성 세정 조성물, 이의 제조 및 용도 |
US10920141B2 (en) * | 2013-06-06 | 2021-02-16 | Entegris, Inc. | Compositions and methods for selectively etching titanium nitride |
KR102256773B1 (ko) * | 2013-11-08 | 2021-05-27 | 후지 필름 일렉트로닉 머트리얼즈 가부시키가이샤 | 반도체 기판용 세정제 및 반도체 기판 표면의 처리방법 |
CN107155367B (zh) * | 2014-06-30 | 2021-12-21 | 恩特格里斯公司 | 利用钨及钴兼容性移除蚀刻后残余物的含水及半含水清洁剂 |
US10073351B2 (en) * | 2014-12-23 | 2018-09-11 | Versum Materials Us, Llc | Semi-aqueous photoresist or semiconductor manufacturing residue stripping and cleaning composition with improved silicon passivation |
-
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Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007526523A (ja) * | 2004-03-03 | 2007-09-13 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 基板上に付着したフォトレジスト及び/又は犠牲反射防止材料のエッチング後除去のための組成物並びにプロセス |
JP2009260249A (ja) * | 2008-03-19 | 2009-11-05 | Fujifilm Corp | 半導体デバイス用洗浄液、および洗浄方法 |
JP2010163608A (ja) * | 2008-12-18 | 2010-07-29 | Sanyo Chem Ind Ltd | 電子材料用洗浄剤 |
KR20140006661A (ko) * | 2012-07-06 | 2014-01-16 | 동우 화인켐 주식회사 | 세정제 조성물 및 이를 이용한 세정방법 |
JP2017504190A (ja) * | 2013-12-06 | 2017-02-02 | フジフイルム エレクトロニック マテリアルズ ユー.エス.エー., インコーポレイテッド | 表面上の残渣を除去するための洗浄用製剤 |
JP2016025358A (ja) * | 2014-07-24 | 2016-02-08 | エア プロダクツ アンド ケミカルズ インコーポレイテッドAir Products And Chemicals Incorporated | 窒化チタンハードマスク及びエッチ残留物除去 |
JP2016090753A (ja) * | 2014-10-31 | 2016-05-23 | 東京応化工業株式会社 | リソグラフィー用洗浄液、及び基板の洗浄方法 |
WO2017099211A1 (ja) * | 2015-12-11 | 2017-06-15 | 富士フイルム株式会社 | 洗浄液、基板洗浄方法、及び、半導体デバイスの製造方法 |
JP2019537640A (ja) * | 2016-10-06 | 2019-12-26 | フジフイルム エレクトロニック マテリアルズ ユー.エス.エー., インコーポレイテッド | 半導体基板の残渣を除去するための洗浄用調合物 |
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CN110475845B (zh) | 2022-02-25 |
KR102490840B1 (ko) | 2023-01-20 |
IL269487A (en) | 2019-11-28 |
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SG11201908616PA (en) | 2019-10-30 |
WO2018175222A1 (en) | 2018-09-27 |
IL269487B (en) | 2022-09-01 |
KR20190128074A (ko) | 2019-11-14 |
US20180272386A1 (en) | 2018-09-27 |
US10702893B2 (en) | 2020-07-07 |
EP3601514A4 (en) | 2020-04-08 |
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