JP2020507204A - 集積回路においてインダクタおよびパターングランドシールドを実装するための回路および方法 - Google Patents
集積回路においてインダクタおよびパターングランドシールドを実装するための回路および方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 201
- 239000002184 metal Substances 0.000 claims abstract description 201
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 238000002955 isolation Methods 0.000 claims description 13
- 238000000926 separation method Methods 0.000 claims description 10
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 230000002457 bidirectional effect Effects 0.000 claims description 2
- 239000011295 pitch Substances 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 4
- 230000003071 parasitic effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000004040 coloring Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- -1 metal layers M0-M4 Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910021654 trace metal Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5225—Shielding layers formed together with wiring layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5226—Via connections in a multilevel interconnection structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/10—Inductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/08—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance
- H03B5/12—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance active element in amplifier being semiconductor device
- H03B5/1206—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance active element in amplifier being semiconductor device using multiple transistors for amplification
- H03B5/1212—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance active element in amplifier being semiconductor device using multiple transistors for amplification the amplifier comprising a pair of transistors, wherein an output terminal of each being connected to an input terminal of the other, e.g. a cross coupled pair
- H03B5/1215—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance active element in amplifier being semiconductor device using multiple transistors for amplification the amplifier comprising a pair of transistors, wherein an output terminal of each being connected to an input terminal of the other, e.g. a cross coupled pair the current source or degeneration circuit being in common to both transistors of the pair, e.g. a cross-coupled long-tailed pair
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B2201/00—Aspects of oscillators relating to varying the frequency of the oscillations
- H03B2201/02—Varying the frequency of the oscillations by electronic means
- H03B2201/0208—Varying the frequency of the oscillations by electronic means the means being an element with a variable capacitance, e.g. capacitance diode
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- Semiconductor Integrated Circuits (AREA)
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Abstract
Description
本発明は、一般に集積回路デバイスに関し、特に、集積回路においてインダクタおよびパターングランドシールドを実装するための回路および方法に関する。
インダクタは、多くの電子デバイスの重要な要素である。インダクタはまた、集積回路の発振器内等、集積回路において実装され得る。しかし、集積回路の密度が増加し続けるにつれて、ノイズは、集積回路の特定の回路に影響し得る。インダクタは、ノイズによって影響され得る集積回路の1つの要素であり得、集積回路の品質ファクタ、またはQファクタを改善するためにシールディングを要し得る。
集積回路デバイスが説明される。集積回路デバイスは、基板と、複数の金属配線相互接続層と、複数の金属配線相互接続層のうちの少なくとも1つの金属層において形成されたインダクタと、複数の金属配線相互接続層と基板との間の下部金属層とを含む。パターングランドシールドは、下部金属層に形成される。
任意に、集積回路デバイスは、パターングランドシールドの上方に延在し、インダクタを取り囲む分離壁をさらに含み得る。
任意に、複数の金属配線相互接続層は、一方向金属層を含み得る。
任意に、インダクタは、二方向金属層を含む複数の金属層において形成され得る。
任意に、集積回路デバイスのトランジスタは、10ナノメートル以下のゲート幅を有し得、下部金属層は、約20ナノメートルのトレース幅を有する金属トレースを有し得る。
集積回路デバイスの実装方法もまた説明される。方法は、複数の金属配線相互接続層を提供することと、複数の金属配線相互接続層のうちの少なくとも1つの金属層においてインダクタを形成することと、複数の金属配線相互接続層と基板との間の下部金属層においてパターングランドシールドを形成することとを備える。
本明細書は、新規と考えられる本発明の1つまたは複数の実装形態の特徴を規定する請求項を含むが、回路および方法は、図面と併せた説明の考察からよりよく理解されると考えられる。様々な回路および方法が開示されるが、これらの回路および方法は、様々な形態で具体化することができる本発明の構成の単なる例示であることを理解されたい。したがって、本明細書内に開示される特定の構造上および機能上の詳細は、限定として解釈されるべきではなく、単に請求項の根拠としておよび当業者に本発明の構成を事実上任意の適切な詳細な構造において様々に用いることを教示するための代表的な根拠として解釈されるべきである。さらに、本明細書で使用される用語および語句は、限定することを意図するものではなく、むしろ回路および方法の理解可能な説明を提供することを意図している。
Claims (15)
- 集積回路デバイスであって、
基板と、
複数の金属配線相互接続層と、
前記複数の金属配線相互接続層のうちの少なくとも1つの金属層において形成されたインダクタと、
前記複数の金属配線相互接続層と前記基板との間の下部金属層を備え、
パターングランドシールドは、前記下部金属層に形成される、集積回路デバイス。 - 前記パターングランドシールドは、前記下部金属層と前記基板との間のコンタクト要素を用いて前記基板に結合される、請求項1に記載の集積回路デバイス。
- 前記コンタクト要素は、前記基板上に形成された拡散コンタクト要素を備える、請求項2に記載の集積回路デバイス。
- 前記パターングランドシールドの上方に延在し、前記インダクタを取り囲む分離壁をさらに備える、請求項1〜請求項3のいずれか1項に記載の集積回路デバイス。
- 前記パターングランドシールドは、M0層またはM1層のいずれかにおいて形成される、請求項1〜請求項4のいずれか1項に記載の集積回路デバイス。
- 前記分離壁は、前記インダクタのための電流帰路を備える、請求項4に記載の集積回路デバイス。
- 前記複数の金属配線相互接続層は、一方向金属層を備え、前記下部金属層は、一方向金属層を備える、請求項1〜請求項6のいずれか1項に記載の集積回路デバイス。
- 前記インダクタは、二方向金属層を備える複数の金属層において形成される、請求項1〜請求項7のいずれか1項に記載の集積回路デバイス。
- 集積回路デバイスであって、
基板と、
複数の金属配線相互接続層と、
前記複数の金属配線相互接続層のうちの少なくとも1つの金属層において形成されたインダクタと、
パターングランドシールドの上方に延在し、前記インダクタを取り囲む分離壁とを備え、
前記パターングランドシールドは、前記複数の金属配線相互接続層のうちの下部層において形成され、前記下部層は、一方向金属層であり、前記下部層の上方の前記複数の金属配線相互接続層のうちの層のトレースを使用して前記分離壁に接続される、集積回路デバイス。 - 前記パターングランドシールドは、前記複数の金属配線相互接続層のうちの前記層の前記トレースを用いて前記基板に結合される、請求項9に記載の集積回路デバイス。
- 前記分離壁は、前記基板へと延在する、請求項10に記載の集積回路デバイス。
- 前記インダクタは、前記複数の金属配線層のうちの上部金属層において形成される、請求項9〜請求項11のいずれか1項に記載の集積回路デバイス。
- 集積回路デバイスの実装方法であって、
複数の金属配線相互接続層を提供することと、
前記複数の金属配線相互接続層のうちの少なくとも1つの金属層でインダクタを形成することと、
前記複数の金属配線相互接続層と基板との間の下部金属層においてパターングランドシールドを形成することとを備える、方法。 - 前記パターングランドシールドを前記基板に前記下部金属層と前記基板との間のコンタクト要素を用いて結合することをさらに備える、請求項13に記載の方法。
- 前記パターングランドシールドの上方に延在し、前記インダクタを取り囲む分離壁を提供することと、前記分離壁を用いて前記インダクタのための電流帰路を提供することとをさらに備える、請求項13または請求項14に記載の方法。
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US15/397,612 US10217703B2 (en) | 2017-01-03 | 2017-01-03 | Circuits for and methods of implementing an inductor and a pattern ground shield in an integrated circuit |
US15/397,612 | 2017-01-03 | ||
PCT/US2017/064022 WO2018128733A1 (en) | 2017-01-03 | 2017-11-30 | Circuits for and methods of implementing an inductor and a pattern ground shield in an integrated circuit |
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JP2020507204A true JP2020507204A (ja) | 2020-03-05 |
JP7346297B2 JP7346297B2 (ja) | 2023-09-19 |
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US (1) | US10217703B2 (ja) |
EP (1) | EP3566247B1 (ja) |
JP (1) | JP7346297B2 (ja) |
KR (1) | KR102483040B1 (ja) |
CN (1) | CN110291629B (ja) |
WO (1) | WO2018128733A1 (ja) |
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CN109216316B (zh) * | 2017-07-03 | 2020-09-08 | 无锡华润上华科技有限公司 | 堆叠螺旋电感 |
US10692963B2 (en) * | 2018-01-30 | 2020-06-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for shielded inductive devices |
US11043470B2 (en) | 2019-11-25 | 2021-06-22 | Xilinx, Inc. | Inductor design in active 3D stacking technology |
US11011459B1 (en) * | 2020-02-06 | 2021-05-18 | Qualcomm Incorporated | Back-end-of-line (BEOL) on-chip sensor |
US11774682B2 (en) | 2020-06-09 | 2023-10-03 | Senko Advanced Components, Inc | Multiport assembly and associated components |
US20220254868A1 (en) * | 2021-02-09 | 2022-08-11 | Mediatek Inc. | Asymmetric 8-shaped inductor and corresponding switched capacitor array |
US20230069734A1 (en) * | 2021-08-31 | 2023-03-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method of fabricating the same |
TW202350060A (zh) * | 2022-05-31 | 2023-12-16 | 瑞昱半導體股份有限公司 | 屏蔽電路與半導體裝置 |
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- 2017-11-30 EP EP17830033.1A patent/EP3566247B1/en active Active
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Also Published As
Publication number | Publication date |
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CN110291629B (zh) | 2023-09-22 |
EP3566247B1 (en) | 2021-04-21 |
US10217703B2 (en) | 2019-02-26 |
CN110291629A (zh) | 2019-09-27 |
WO2018128733A1 (en) | 2018-07-12 |
KR20190099077A (ko) | 2019-08-23 |
EP3566247A1 (en) | 2019-11-13 |
US20180190584A1 (en) | 2018-07-05 |
KR102483040B1 (ko) | 2022-12-29 |
JP7346297B2 (ja) | 2023-09-19 |
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