JP2020505771A5 - - Google Patents
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- Publication number
- JP2020505771A5 JP2020505771A5 JP2019539312A JP2019539312A JP2020505771A5 JP 2020505771 A5 JP2020505771 A5 JP 2020505771A5 JP 2019539312 A JP2019539312 A JP 2019539312A JP 2019539312 A JP2019539312 A JP 2019539312A JP 2020505771 A5 JP2020505771 A5 JP 2020505771A5
- Authority
- JP
- Japan
- Prior art keywords
- conductor layer
- power module
- pipe
- layer
- module according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004020 conductor Substances 0.000 claims description 19
- 238000007747 plating Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000000463 material Substances 0.000 claims 10
- 238000000034 method Methods 0.000 claims 5
- 238000002161 passivation Methods 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP17173262.1A EP3410478A1 (en) | 2017-05-29 | 2017-05-29 | Power module and method for manufacturing the power module |
| EP17173262.1 | 2017-05-29 | ||
| PCT/JP2018/018023 WO2018221149A1 (en) | 2017-05-29 | 2018-05-01 | Power module and method for manufacturing the power module |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020505771A JP2020505771A (ja) | 2020-02-20 |
| JP2020505771A5 true JP2020505771A5 (cg-RX-API-DMAC7.html) | 2020-04-02 |
| JP6872291B2 JP6872291B2 (ja) | 2021-05-19 |
Family
ID=58800718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019539312A Expired - Fee Related JP6872291B2 (ja) | 2017-05-29 | 2018-05-01 | パワーモジュール及びパワーモジュールを製造する方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11121059B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP3410478A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6872291B2 (cg-RX-API-DMAC7.html) |
| CN (1) | CN110663112A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2018221149A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11967899B2 (en) | 2020-05-22 | 2024-04-23 | Marel Power Solutions | Fluid cooled inverter |
| US11849539B2 (en) * | 2020-08-13 | 2023-12-19 | Toyota Motor Engineering & Manufacturing North America, Inc. | Embedded cooling systems utilizing heat pipes |
| CN118370008A (zh) | 2021-09-15 | 2024-07-19 | 马雷尔动力解决方案股份有限公司 | 风冷式功率转换器 |
| US12193202B2 (en) | 2021-09-15 | 2025-01-07 | Marel Power Solutions, Inc. | Air cooled compact power systems |
| JP2024080085A (ja) * | 2022-12-01 | 2024-06-13 | ナブテスコ株式会社 | 部品内蔵型回路基板および部品内蔵型回路基板の製造方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05235492A (ja) * | 1992-02-26 | 1993-09-10 | Hitachi Ltd | 配線基板 |
| JP4140100B2 (ja) * | 1998-10-29 | 2008-08-27 | ソニー株式会社 | ヒートパイプ内蔵プリント配線基板 |
| FR2786656B1 (fr) * | 1998-11-27 | 2001-01-26 | Alstom Technology | Composant electronique de puissance comportant des moyens de refroidissement |
| SE522799C2 (sv) * | 2000-02-23 | 2004-03-09 | Teracom Ab | Anordning för borttransport av värme från uppvärmda element samt ett förfarande för tillverkning av anordningen |
| US6292366B1 (en) * | 2000-06-26 | 2001-09-18 | Intel Corporation | Printed circuit board with embedded integrated circuit |
| US20040229391A1 (en) * | 2003-04-25 | 2004-11-18 | Kazuyuki Ohya | LED lamp manufacturing process |
| JP4350606B2 (ja) * | 2004-07-23 | 2009-10-21 | シャープ株式会社 | プリント配線板の製造方法 |
| KR20050117482A (ko) * | 2005-06-29 | 2005-12-14 | 주식회사 써모랩 | 냉각장치가 내장된 인쇄회로기판 및 그의 제작방법 |
| US20090165302A1 (en) * | 2007-12-31 | 2009-07-02 | Slaton David S | Method of forming a heatsink |
| JP2009290021A (ja) * | 2008-05-29 | 2009-12-10 | Toshiba Corp | 部品内蔵プリント配線板、同配線板の製造方法および電子機器 |
| DE102008040906A1 (de) * | 2008-07-31 | 2010-02-04 | Robert Bosch Gmbh | Leiterplatine mit elektronischem Bauelement |
| CN103635012A (zh) * | 2012-08-21 | 2014-03-12 | 三星电机株式会社 | 印刷电路板以及用于制造该印刷电路板的方法 |
| EP3088829B1 (en) * | 2013-12-24 | 2020-04-08 | Furukawa Electric Co., Ltd. | Heat receiving structure and heat sink |
| JP6398405B2 (ja) * | 2014-07-15 | 2018-10-03 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
| US9567204B2 (en) * | 2014-08-29 | 2017-02-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Microelectrochemical systems (MEMS) device having a seal layer arranged over or lining a hole in fluid communication with a cavity of the MEMS device |
| WO2016071324A1 (en) * | 2014-11-03 | 2016-05-12 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Hermetically sealed heat pipe structure synthesized with support structure and method for producing it |
| KR102546379B1 (ko) * | 2015-10-22 | 2023-06-21 | 에이지씨 가부시키가이샤 | 배선 기판의 제조 방법 |
-
2017
- 2017-05-29 EP EP17173262.1A patent/EP3410478A1/en not_active Withdrawn
-
2018
- 2018-05-01 CN CN201880031155.8A patent/CN110663112A/zh not_active Withdrawn
- 2018-05-01 WO PCT/JP2018/018023 patent/WO2018221149A1/en not_active Ceased
- 2018-05-01 JP JP2019539312A patent/JP6872291B2/ja not_active Expired - Fee Related
- 2018-05-01 US US16/604,024 patent/US11121059B2/en not_active Expired - Fee Related