JP2020200481A5 - - Google Patents

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Publication number
JP2020200481A5
JP2020200481A5 JP2020155506A JP2020155506A JP2020200481A5 JP 2020200481 A5 JP2020200481 A5 JP 2020200481A5 JP 2020155506 A JP2020155506 A JP 2020155506A JP 2020155506 A JP2020155506 A JP 2020155506A JP 2020200481 A5 JP2020200481 A5 JP 2020200481A5
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JP
Japan
Prior art keywords
pressure
sensitive adhesive
adhesive layer
electrolyte
adherend
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Pending
Application number
JP2020155506A
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English (en)
Japanese (ja)
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JP2020200481A (ja
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Priority to JP2020155506A priority Critical patent/JP2020200481A/ja
Priority claimed from JP2020155506A external-priority patent/JP2020200481A/ja
Publication of JP2020200481A publication Critical patent/JP2020200481A/ja
Publication of JP2020200481A5 publication Critical patent/JP2020200481A5/ja
Pending legal-status Critical Current

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JP2020155506A 2020-09-16 2020-09-16 被着体の接合・分離方法 Pending JP2020200481A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020155506A JP2020200481A (ja) 2020-09-16 2020-09-16 被着体の接合・分離方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020155506A JP2020200481A (ja) 2020-09-16 2020-09-16 被着体の接合・分離方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2015228951A Division JP6767104B2 (ja) 2015-11-24 2015-11-24 被着体の接合・分離方法

Publications (2)

Publication Number Publication Date
JP2020200481A JP2020200481A (ja) 2020-12-17
JP2020200481A5 true JP2020200481A5 (https=) 2021-02-04

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ID=73741835

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JP2020155506A Pending JP2020200481A (ja) 2020-09-16 2020-09-16 被着体の接合・分離方法

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JP (1) JP2020200481A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7717650B2 (ja) 2022-03-18 2025-08-04 株式会社東芝 物体の接着・剥離方法、及び物体接着剥離装置
CN119351032B (zh) * 2024-10-18 2025-11-07 韦尔通科技股份有限公司 一种可电拆卸单组分聚氨酯热熔胶及其制备方法和应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7332218B1 (en) * 1999-07-14 2008-02-19 Eic Laboratories, Inc. Electrically disbonding materials
JP4139851B2 (ja) * 2005-08-09 2008-08-27 横浜ゴム株式会社 通電剥離用組成物を用いた接着剤、通電剥離性多層接着剤
JP5210078B2 (ja) * 2008-07-31 2013-06-12 ビッグテクノス株式会社 電気剥離性粘着剤組成物、電気剥離性粘着製品及びその剥離方法
JP5296446B2 (ja) * 2008-07-31 2013-09-25 ビッグテクノス株式会社 電気剥離性粘着剤組成物、電気剥離性粘着製品及びその剥離方法

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