JP2020186824A - ヒートシンク - Google Patents
ヒートシンク Download PDFInfo
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- JP2020186824A JP2020186824A JP2019089695A JP2019089695A JP2020186824A JP 2020186824 A JP2020186824 A JP 2020186824A JP 2019089695 A JP2019089695 A JP 2019089695A JP 2019089695 A JP2019089695 A JP 2019089695A JP 2020186824 A JP2020186824 A JP 2020186824A
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- 230000005855 radiation Effects 0.000 claims abstract description 52
- 239000012530 fluid Substances 0.000 claims abstract description 49
- 238000010438 heat treatment Methods 0.000 claims description 47
- 230000017525 heat dissipation Effects 0.000 claims description 35
- 238000009434 installation Methods 0.000 abstract description 36
- 238000009413 insulation Methods 0.000 abstract description 3
- 230000032258 transport Effects 0.000 description 156
- 239000012071 phase Substances 0.000 description 33
- 238000001816 cooling Methods 0.000 description 22
- 239000007791 liquid phase Substances 0.000 description 22
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003575 carbonaceous material Substances 0.000 description 2
- -1 copper Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
[1]発熱体と熱的に接続される受熱部を有する熱輸送部材と、該熱輸送部材の放熱部にて熱的に接続された、複数の放熱フィンが配置された放熱フィン群と、を備え、
前記熱輸送部材が、前記受熱部から前記放熱部まで連通し、且つ作動流体が封入された一体である内部空間を有し、
前記放熱部の前記熱輸送部材の熱輸送方向に対して直交方向の内部空間の断面積が、前記受熱部と前記放熱部の間の断熱部の前記断面積よりも大きいヒートシンク。
[2]前記発熱体と熱的に接続される前記受熱部を有する熱輸送部材と、該熱輸送部材の放熱部にて接続された管体と、該管体と熱的に接続された、前記複数の放熱フィンが配置された放熱フィン群と、を備え、
前記熱輸送部材が、前記受熱部から前記管体との接続部まで連通し、且つ前記作動流体が封入された一体である内部空間を有し、前記熱輸送部材の内部空間が、前記管体の内部空間と連通し、
前記放熱部の前記断面積が、前記断熱部の前記断面積よりも大きい[1]に記載のヒートシンク。
[3]前記受熱部の前記断面積が、前記断熱部の前記断面積と同じである[1]または[2]に記載のヒートシンク。
[4]前記受熱部の前記断面積が、前記断熱部の前記断面積よりも大きい[1]または[2]に記載のヒートシンク。
[5]前記管体が、前記放熱フィンの配置方向に沿って延在している[2]に記載のヒートシンク。
[6]前記管体の延在方向が、前記熱輸送部材の熱輸送方向と平行ではない[2]に記載のヒートシンク。
[7]前記熱輸送部材の少なくとも一面が、平面形状である[1]乃至[6]のいずれか1つに記載のヒートシンク。
[8]前記熱輸送部材が、熱輸送方向に対して直交方向の段差部を有する[1]乃至[7]のいずれか1つに記載のヒートシンク。
10 熱輸送部材
20 放熱フィン群
21 放熱フィン
31 管体
41 受熱部
42 放熱部
43 断熱部
Claims (8)
- 発熱体と熱的に接続される受熱部を有する熱輸送部材と、該熱輸送部材の放熱部にて熱的に接続された、複数の放熱フィンが配置された放熱フィン群と、を備え、
前記熱輸送部材が、前記受熱部から前記放熱部まで連通し、且つ作動流体が封入された一体である内部空間を有し、
前記放熱部の前記熱輸送部材の熱輸送方向に対して直交方向の内部空間の断面積が、前記受熱部と前記放熱部の間の断熱部の前記断面積よりも大きいヒートシンク。 - 前記発熱体と熱的に接続される前記受熱部を有する熱輸送部材と、該熱輸送部材の放熱部にて接続された管体と、該管体と熱的に接続された、前記複数の放熱フィンが配置された放熱フィン群と、を備え、
前記熱輸送部材が、前記受熱部から前記管体との接続部まで連通し、且つ前記作動流体が封入された一体である内部空間を有し、前記熱輸送部材の内部空間が、前記管体の内部空間と連通し、
前記放熱部の前記断面積が、前記断熱部の前記断面積よりも大きい請求項1に記載のヒートシンク。 - 前記受熱部の前記断面積が、前記断熱部の前記断面積と同じである請求項1または2に記載のヒートシンク。
- 前記受熱部の前記断面積が、前記断熱部の前記断面積よりも大きい請求項1または2に記載のヒートシンク。
- 前記管体が、前記放熱フィンの配置方向に沿って延在している請求項2に記載のヒートシンク。
- 前記管体の延在方向が、前記熱輸送部材の熱輸送方向と平行ではない請求項2に記載のヒートシンク。
- 前記熱輸送部材の少なくとも一面が、平面形状である請求項1乃至6のいずれか1項に記載のヒートシンク。
- 前記熱輸送部材が、熱輸送方向に対して直交方向の段差部を有する請求項1乃至7のいずれか1項に記載のヒートシンク。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019089695A JP6697112B1 (ja) | 2019-05-10 | 2019-05-10 | ヒートシンク |
PCT/JP2020/016356 WO2020230499A1 (ja) | 2019-05-10 | 2020-04-14 | ヒートシンク |
EP20775154.6A EP3764395A4 (en) | 2019-05-10 | 2020-04-14 | HEATSINK |
CN202010388323.8A CN111918521B (zh) | 2019-05-10 | 2020-05-09 | 散热器 |
CN202020762840.2U CN212544353U (zh) | 2019-05-10 | 2020-05-09 | 散热器 |
TW109115551A TWI741592B (zh) | 2019-05-10 | 2020-05-11 | 散熱裝置 |
US17/027,182 US11246239B2 (en) | 2019-05-10 | 2020-09-21 | Heatsink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019089695A JP6697112B1 (ja) | 2019-05-10 | 2019-05-10 | ヒートシンク |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6697112B1 JP6697112B1 (ja) | 2020-05-20 |
JP2020186824A true JP2020186824A (ja) | 2020-11-19 |
Family
ID=70682419
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2019089695A Active JP6697112B1 (ja) | 2019-05-10 | 2019-05-10 | ヒートシンク |
Country Status (6)
Country | Link |
---|---|
US (1) | US11246239B2 (ja) |
EP (1) | EP3764395A4 (ja) |
JP (1) | JP6697112B1 (ja) |
CN (2) | CN212544353U (ja) |
TW (1) | TWI741592B (ja) |
WO (1) | WO2020230499A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023022211A1 (ja) * | 2021-08-20 | 2023-02-23 | 古河電気工業株式会社 | ヒートシンク |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6828085B2 (ja) * | 2019-05-09 | 2021-02-10 | レノボ・シンガポール・プライベート・リミテッド | 熱輸送装置および電子機器 |
USD953280S1 (en) * | 2020-01-17 | 2022-05-31 | Furukawa Electric Co., Ltd | Heat sink |
WO2023276940A1 (ja) * | 2021-06-30 | 2023-01-05 | 日本軽金属株式会社 | 熱デバイス冷却用ヒートシンク |
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JPS5117058A (ja) * | 1974-08-01 | 1976-02-10 | Kogyo Gijutsuin | |
JPS63104863U (ja) * | 1986-12-24 | 1988-07-07 | ||
JPH04225791A (ja) * | 1990-12-27 | 1992-08-14 | Furukawa Electric Co Ltd:The | ヒートパイプ式放熱器およびその製造方法 |
JP2000261175A (ja) * | 1999-03-10 | 2000-09-22 | Fujikura Ltd | 電子機器の冷却装置 |
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2019
- 2019-05-10 JP JP2019089695A patent/JP6697112B1/ja active Active
-
2020
- 2020-04-14 WO PCT/JP2020/016356 patent/WO2020230499A1/ja unknown
- 2020-04-14 EP EP20775154.6A patent/EP3764395A4/en not_active Withdrawn
- 2020-05-09 CN CN202020762840.2U patent/CN212544353U/zh active Active
- 2020-05-09 CN CN202010388323.8A patent/CN111918521B/zh active Active
- 2020-05-11 TW TW109115551A patent/TWI741592B/zh active
- 2020-09-21 US US17/027,182 patent/US11246239B2/en active Active
Patent Citations (13)
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JPS5117058A (ja) * | 1974-08-01 | 1976-02-10 | Kogyo Gijutsuin | |
JPS63104863U (ja) * | 1986-12-24 | 1988-07-07 | ||
JPH04225791A (ja) * | 1990-12-27 | 1992-08-14 | Furukawa Electric Co Ltd:The | ヒートパイプ式放熱器およびその製造方法 |
JP2000261175A (ja) * | 1999-03-10 | 2000-09-22 | Fujikura Ltd | 電子機器の冷却装置 |
JP2004125381A (ja) * | 2002-08-02 | 2004-04-22 | Mitsubishi Alum Co Ltd | ヒートパイプユニット及びヒートパイプ冷却器 |
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JP2018185110A (ja) * | 2017-04-26 | 2018-11-22 | 株式会社フジクラ | ヒートパイプ |
CN207146269U (zh) * | 2017-07-17 | 2018-03-27 | 海蓝星光学科技(东莞)有限公司 | 一种led机动车前大灯专用导热管 |
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