JP2020181860A - Board conveyance system and board conveyance method - Google Patents

Abstract

To provide a board conveyance method for circumventing positional deviation of a board from a tray, due to residual air between a board and the tray, when a processing chamber is decompressed.SOLUTION: A board conveyance method includes a step of preparing a tray having multiple open holes, and a conveyance arm having multiple projection pins at the positions corresponding to respective open holes of the tray, a placement step of placing the board on the tray, a support step of supporting the board and the tray by means of the conveyance arm by approaching the conveyance arm and the tray placed above the arm so that each projection pin penetrates a corresponding open hole and supports the board, a conveyance step of conveying the board and the tray, supported by the conveyance arm, to the chamber, and a separation step of separating the conveyance arm and the tray so that the projection pins are separated from the board, and the tray supports the board for placing the tray at a prescribed position in the chamber.SELECTED DRAWING: Figure 1

Description

The present invention relates to a substrate transfer system and a substrate transfer method, and relates to a substrate transfer system and a substrate transfer method for transporting a semiconductor substrate in a semiconductor element manufacturing process.

In recent years, mobile communication devices such as mobile phones have used SiP (system in package) modules in which a plurality of high-performance semiconductor elements (semiconductor chips) are sealed in one package. Such semiconductor elements are required to be thin, and for example, a thin finish grinding technique that realizes a semiconductor substrate (semiconductor wafer) having a thickness of 100 μm or less with good yield is attracting attention.

However, as the thickness of the semiconductor substrate becomes thinner, the rigidity of the substrate becomes lower. For example, the semiconductor substrate having low rigidity is directly conveyed by the transfer robot arm between the loader for storing the semiconductor substrate and the processing chamber for plasma processing. This is difficult, and in general, loading and unloading into and out of the processing chamber is realized by transporting a tray on which a semiconductor substrate is placed by a robot arm.

Specifically, a back grinding technique has been proposed in which only the inner surface of the back surface is polished while leaving a small amount of the outer edge of the back surface of the semiconductor substrate. For example, a semiconductor is formed by thickening only the outer edge of the back surface having a width of 3 mm in the radial direction. TAIKO (registered trademark) semiconductor substrates that give rigidity to the substrate and prevent cracking and chipping due to warpage have been put into practical use. In the present application, such a thinned semiconductor substrate is also simply referred to as a "thinned substrate".

For example, Patent Document 1 describes a processing method capable of preventing the semiconductor substrate from warping and peeling off the protective tape without adhesive residue when the TAIKO (registered trademark) semiconductor substrate is subjected to the sputtering treatment.

Specifically, the treatment method described in Patent Document 1 contains a base material and a curable pressure-sensitive adhesive on the unground side surface of a thin-walled substrate in which only the inner region is ground while leaving the outer edge portion. A tape pasting step of sticking a wafer protective tape having a mold adhesive layer, a tape curing step of stimulating the wafer protective tape to cure the wafer protective tape, and a sputtering process on a thinned substrate to which the wafer protective tape is stuck. It has a sputtering step of performing the above-mentioned process and a tape peeling step of peeling the wafer protective tape from the thinned substrate after the sputtering process.

On the other hand, since the inner portion (central portion) of the back surface of such a thinned semiconductor substrate is recessed from the outer edge portion of the back surface, it is described in Patent Document 1 when it is placed on the tray with the outer edge portion of the back surface facing downward. Besides the problem (prevention of warpage and adhesive residue), there is another problem to be solved.

That is, the thinned substrate has a closed space formed between a thick outer edge, a thin inner back surface, and a tray surface, and this space is usually filled with air under atmospheric pressure. However, when the processing chamber containing the tray on which the thinned substrate is placed is depressurized (evacuated) for plasma processing from the atmospheric pressure environment, the air filled in the closed space is thinned. The thinned substrate may be lifted (jumped up) from the tray by vigorously flowing out from the outer edge of the substrate. At this time, the thinned substrate does not always land at a predetermined position in the original tray under atmospheric pressure, and often deviates from the predetermined position and lands (misalignment occurs).

Until now, in order to prevent such misalignment, the operator generally fixed the substrate to the tray using a jig such as a leaf spring, but the production efficiency is reduced (the work man-hours are increased) and the processing is performed. The presence of jigs in the chamber could also result in non-uniformity (eg, non-uniform plasma etching) in the plasma treatment of the substrate.

JP-A-2018-147990

Therefore, an aspect of the present invention prevents the air remaining between the substrate and the tray from flowing out from the outer edge of the thinned substrate when the processing chamber into which the thinned substrate is carried is depressurized (vacuum). The purpose of this is to avoid misalignment of the substrate placed on the tray and improve the stability of substrate transfer.

A first aspect of the present invention relates to a substrate transport method, wherein the substrate transport method has a tray having a plurality of through holes and a transport arm having a plurality of protruding pins at positions corresponding to the through holes of the tray. The step of preparing the above, the step of placing the substrate on the tray, and the transfer arm and the upper part of the arm so that each of the protruding pins penetrates the corresponding through hole to support the substrate. A support step of bringing the arranged trays close to each other to support the substrate and the tray with the transport arm, a transport step of transporting the substrate and the tray supported by the transport arm to the chamber, and the tray. A separation step is provided in which the protruding pin is separated from the substrate and the tray separates the transport arm and the tray so that the tray supports the substrate in order to place the tray in a predetermined position in the chamber.

A second aspect of the present invention relates to a substrate transfer system, wherein the substrate transfer system includes a tray having a plurality of through holes, a substrate storage unit for storing the tray on which the substrate is placed, and the said tray. A transport unit having a transport arm having a plurality of protruding pins at positions corresponding to the through holes and a chamber capable of depressurizing are provided, and the transport portion penetrates the through holes to which the protruding pins correspond. The transfer arm and the tray arranged above the arm are brought close to each other so as to support the substrate, the substrate and the tray are supported by the transfer arm, and the tray is transferred from the substrate storage portion to the chamber. In order to transport and place the tray in a predetermined position in the chamber, the protruding pin is separated from the substrate, and the transport arm and the tray are separated so that the tray supports the substrate.

According to the aspect of the present invention, it is possible to suppress the misalignment of the substrate placed on the tray and improve the stability of substrate transport.

(A) and (d) are cross-sectional views and plan views of a thin-walled substrate, and (b) and (e) are cross-sectional views and plan views of trays constituting the substrate transfer system according to the embodiment of the present invention. (C) and (f) are a cross-sectional view and a plan view of a transfer arm constituting the substrate transfer system according to the embodiment of the present invention. (A) is a cross-sectional view showing a state in which the thinned substrate is placed on the tray, and (b) is a cross-sectional view showing the thinned substrate mounted on the tray and the rising transport arm. Yes, (c) is a cross-sectional view showing a state in which the outer edge portion of the thinned substrate is supported by the transport arm, and (d) is a cross-sectional view in which the thinned substrate is placed on the tray again with the transport arm lowered. It is sectional drawing which shows the state. (A) to (k) are conceptual diagrams showing each step of the substrate transfer method according to the embodiment of the present invention, and show the positions of the thinned substrate, the tray, and the transfer arm, and the pressure state of the processing chamber. ..

An embodiment of the substrate transfer system and the substrate transfer method according to the present invention will be described below with reference to the accompanying drawings. In the description of the embodiments, terms indicating directions (for example, "horizontal", "up and down", "left and right", etc.) are appropriately used for ease of understanding, but these terms are used to describe the directions in the drawings. It does not limit the present invention. In each drawing, in order to clarify the shape or characteristics of each component of the substrate transfer system, these dimensions are shown as relative ones and are not necessarily represented by the same scale ratio. Further, in each drawing, the same components are shown by using the same reference numerals.

[Configuration of board transfer system]
1 (a) to 1 (f) are schematic views showing an embodiment of the substrate transfer system 1 according to the present invention. Specifically, FIGS. 1 (a) and 1 (d) are cross-sectional views and plan views of the thinned substrate 10, and FIGS. 1 (b) and 1 (e) are the embodiments of the present invention. FIG. 1 (c) and FIG. 1 (f) are cross-sectional views and plan views of the tray 20 constituting the substrate transfer system 1, and FIGS. 1 (c) and 1 (f) show the transfer arm 30 constituting the substrate transfer system 1 according to the embodiment of the present invention. It is a sectional view and a plan view.

In order to make the present invention easier to understand, the thinned substrate 10 is a semiconductor substrate that imparts rigidity to the substrate and prevents cracks and chips due to warpage by, for example, thickening only the outer back edge portion 12 having a width of 3 mm in the radial direction. However, the present invention is not limited to this, and the entire semiconductor substrate including the outer edge portion may be thinned. Further, the thinned substrate may be a substrate made of an arbitrary semiconductor (Si, SiC, GaN), or may be a substrate made of a material other than the semiconductor such as glass epoxy resin.

The substrate transfer system 1 generally includes a substrate storage unit for storing a tray 20 on which a thinning substrate 10 is placed, a processing chamber 40 capable of depressurizing using a vacuum pump (both not shown), and a thinning substrate 10. The tray 20 on which the tray 20 is placed is carried from the substrate storage unit into the processing chamber 40, and is provided with a transport unit (not shown) which is carried out from the processing chamber 40 to another substrate storage unit. That is, the transfer unit includes a transfer arm 30, and the transfer arm 30 is configured to support the thinned substrate 10 and / or the tray 20 and carry it into the processing chamber 40 and carry it out from the processing chamber 40.

The thinned substrate 10 has an arbitrary diameter such as 4 inches, 5 inches, 6 inches, or 8 inches, and has a back surface outer edge portion 12 that imparts rigidity to the thinned substrate 10 to prevent cracking or chipping due to warpage. (FIG. 1A), the back surface outer edge portion 12 has a width of, for example, about 3 mm in the radial direction. The back surface outer edge portion 12 of the thinned substrate 10 projects downward in the drawing, and a central recess 14 is formed inside the thinned substrate 10. That is, the thinned substrate 10 has a closed space formed between the thick back surface outer edge portion 12, the thin central recess 14, and the surface of the tray 20.

The tray 20 has a substantially circular planar shape (FIG. 1 (e)) and has a surface outer peripheral portion 22 projecting upward (FIG. 1 (b)). The inner diameter of the front outer peripheral portion 22 of the tray 20 is larger than the outer diameter of the back surface outer edge portion 12 of the thinned substrate 10, and when the tray 20 and the thinned substrate 10 are arranged concentrically, the back surface outer edge portion of the thinned substrate 10 An annular gap of, for example, about 1 mm to 2 mm may be formed between the 12 and the outer peripheral portion 22 of the surface of the tray 20. The inner diameter of the outer peripheral portion 22 of the surface of the tray 20 is preferably set to be larger than the maximum dimension in consideration of the tolerance of the outer diameter of the thinned substrate 10. As a result, even if the outer diameter of the thinned substrate 10 varies, the thinned substrate 10 can be reliably placed on the tray 20.

When the thinned substrate 10 includes the back surface outer edge portion 12, the inner diameter of the front surface outer peripheral portion 22 of the tray 20 is set so that the difference from the outer diameter of the thinned substrate 10 is smaller than the radial width of the back surface outer edge portion 12. It is preferable to be done. As a result, even if the thinned substrate 10 placed on the tray 20 is displaced in the tray 20, the protruding pin 34 can be brought into contact with the back surface outer edge portion 12 of the thinned substrate 10, and the protruding pin 34 is thin. It is possible to prevent the thinned substrate 10 from being damaged by contacting the central recess 14.

Further, it is preferable that the height of the outer peripheral portion 22 of the surface of the tray 20 on the inner diameter side is larger than the difference between the height of the protruding pin 34 and the thickness inside the outer peripheral portion 22 of the surface of the tray 20. As a result, in a state where the thinned substrate 10 is supported by the protruding pins 34 and separated from the tray 20, for example, even if some lateral force is applied to the thinned substrate 10 during transportation, the outer peripheral portion of the surface 22 can prevent the thinned substrate from popping out of the tray 20.

Further, as shown in the figure, the tray 20 according to the present embodiment has a plurality of through holes 24 at positions corresponding to the back surface outer edge portion 12 of the thinned substrate 10. FIG. 1D shows a region (position) on the back surface outer edge portion 12 of the thinned substrate 10 corresponding to the through hole 24 of the tray 20 by a broken line small circle 24'. The tray 20 preferably has four through holes 24 as shown in the figure, but is not limited to this, and may have five or more through holes 24.

As shown in FIGS. 1 (a) to 1 (f), the transport arm 30 according to the present embodiment has a plurality of protrusions at positions corresponding to the back surface outer edge portion 12 of the thinned substrate 10 and the through hole 24 of the tray 20. It has a pin 34. Each protruding pin 34 has a substantially cylindrical shape, and its outer diameter is smaller than the inner diameter of the through hole 24 of the tray 20, has the same length, and is configured to be larger than the thickness of the tray 20. That is, when the transport arm 30 moves up and down (moves up and down) with respect to the tray 20 on which the thinning substrate 10 is placed, the protruding pin 34 freely penetrates (inserts) the through hole 24 of the tray 20 and the thinning substrate While maintaining the horizontal state of 10, the back surface outer edge portion 12 can be pushed up (the thinned substrate 10 is separated from the tray 20) to support the thinned substrate 10.

[Board transfer method]
2 (a) to 2 (d) are schematic cross-sectional views showing an embodiment of the substrate transport method according to the present invention. Specifically, FIG. 2A is a cross-sectional view showing a state in which the thinned substrate 10 is mounted on the tray 20, and FIG. 2B is a cross-sectional view showing the thinned substrate 10 mounted on the tray 20. , And a cross-sectional view showing the ascending transport arm 30, FIG. 2C is a cross-sectional view showing a state in which the back surface outer edge portion 12 of the thinned substrate 10 is supported by the transport arm 30. 2 (d) is a cross-sectional view showing a state in which the transport arm 30 is lowered and the thinned substrate 10 is placed on the tray 20 again.

A plurality of trays 20 on which the thinned substrate 10 is placed are stored in the substrate storage portion (FIG. 2A). The transfer unit can move the transfer arm 30 from the substrate storage unit to the processing chamber 40 (or load lock chamber 42). In addition, the transport unit can arrange the transport arm 30 directly below the tray 20 so that each protruding pin 34 is accurately aligned with the corresponding through hole 24 of the tray 20 (FIG. 2B). Further, in the transport unit, by moving the transport arm 30 upward, each protruding pin 34 penetrates each through hole 24 of the tray 20, and while maintaining the horizontal state of the thinned substrate 10, the thinned substrate 10 The back surface outer edge portion 12 can be pushed up to separate the thinned substrate 10 from the tray 20 (FIG. 2 (c)). At this time, the tray 20 is supported by the upper surface 36 of the transport arm 30. Further, the transport unit moves the transport arm 30 downward to retract each of the protruding pins 34 from the through holes 24, and as in FIG. 2B, brings the thinned substrate 10 into contact with the tray 20 to support it. (Fig. 2 (d)).

That is, the transport arm 30 can horizontally support the thinned substrate 10 with the protruding pin 34 while supporting the tray 20 on its upper surface 36 (FIG. 2 (c)), and the transport unit is in this state. 30 may be transported from the substrate storage portion to the load lock chamber 42 (also referred to as “spare chamber”).

3A to 3K show a series of transfer arms 30 and a vacuum from carrying the tray 20 on which the thinned substrate 10 is placed into the load lock chamber 42 to plasma processing in the processing chamber 40. It is a conceptual diagram which shows the operation (decompression state) of a pump. In the figure, the thinned substrate 10 is shown by a small circle, the tray 20 is shown by a great circle, and the transport arm 30 is shown by a U shape. Further, in the drawing, the transfer arm 30 is moved upward to indicate the thinned substrate 10 in the pushed-up state by the letter U, and the transfer arm 30 is moved downward and is supported by the tray 20 at the lower position. The thinned substrate 10 in the state of being formed is indicated by the alphabet letter D.

Further, in the figure, a load lock chamber 42 having a first gate valve 44 (left side) and a second gate valve 46 (right side) that can be opened and closed is shown, and the processing chamber 40 is a load lock chamber 42 via the second gate valve 46. It can be opened and closed. The first gate valve 44 and the second gate valve 46 can be opened and closed independently by using an actuator (not shown). Further, the load lock chamber 42 and the processing chamber 40 can be independently depressurized by using a vacuum pump (not shown).

FIG. 3A shows a state (D) in which the thinned substrate 10 is supported by the tray 20 and is arranged in the substrate storage portion. At this time, the tray 20 and the thinned substrate 10 are outside the load lock chamber 42 and are under atmospheric pressure, the first gate valve 44 and the second gate valve 46 are in the closed position, and the load lock chamber 42 and The processing chamber 40 is in a vacuum state.

The first gate valve 44 moves to the open position and opens the load lock chamber 42 to the atmospheric pressure state (FIG. 3 (b)). At this time, the thinned substrate 10 remains in the state (D) supported by the tray 20, and a closed space is formed between the thinned substrate 10 and the surface of the tray 20 to be filled with air.

Next, the transport unit moves the transport arm 30 below the tray 20. At this time, the thinned substrate 10 remains in the state (D) supported by the tray 20. Next, in the transport unit, the transport arm 30 is moved upward, and each protruding pin 34 penetrates each through hole 24 of the tray 20, and while maintaining the horizontal state of the thinned substrate 10, the back surface outer edge portion 12 Is pushed up to separate the thinned substrate 10 from the tray 20 (U) (FIG. 3 (c)). As a result, as described with reference to FIG. 2C, the closed space between the thinned substrate 10 and the surface of the tray 20 is eliminated.

The transport unit carries the tray 20 and the thinned substrate 10 into the load lock chamber 42 in the atmospheric pressure state by using the transport arm 30 (U) with the thinned substrate 10 separated from the tray 20 (FIG. FIG. 3 (d)).

Then, the first gate valve 44 moves to the closed position (FIG. 3 (e)), the vacuum pump operates, and the load lock chamber 42 is depressurized (FIG. 3 (f)). At this time, the thinned substrate 10 is separated from the tray 20 (U), and the closed space between the thinned substrate 10 and the surface of the tray 20 is eliminated. Therefore, as described in the column of the prior art. The thinned substrate 10 does not float from the tray 20 due to the air filled in the closed space during depressurization, and does not deviate from the predetermined position and land (misalignment occurs). Therefore, according to the present embodiment, the position of the substrate is displaced without preparing a tray provided with a jig for fixing the substrate or by the operator using the jig to fix the thinned substrate 10 to the tray 20. Can be suppressed and the stability of substrate transfer can be improved.

Next, the transport unit rotates the transport arm 30 that supports the tray 20 by 180 degrees in a horizontal plane. Further, the second gate valve 46 moves to the open position while the first gate valve 44 maintains the closed position (FIG. 3 (g)). At this time, both the load lock chamber 42 and the processing chamber 40 are depressurized and are in a vacuum state.

The transport unit uses the transport arm 30 to carry the thinned substrate 10 and the tray 20 into the processing chamber 40 (FIG. 3 (h)), and also to an elevating mechanism (not shown) provided in the processing chamber 40. After delivering the tray 20, the vehicle returns to the load lock chamber 42 (FIG. 3 (i)), and the transport arm 30 is lowered as shown in FIG. 2 (d) to separate the tray 20 from the tray 20. At this time, as described with reference to FIG. 2 (d), the thinned substrate 10 is in a state (D) supported by the tray 20 (FIG. 3 (j)), and the surfaces of the thinned substrate 10 and the tray 20 are formed. A closed space is formed again, but since the processing chamber 40 is already maintained in a vacuum state, the pressure in the closed space will not be higher than the pressure in the processing chamber 40, and the closed space will be formed. The position shift of the thinned substrate 10 does not occur due to the retained air.

Finally, a process gas is introduced into the processing chamber 40, and a high-frequency voltage is applied to turn the process gas into plasma and perform plasma treatment on the surface of the thinned substrate 10 (FIG. 3 (k)).

As described above, the transport section is arranged above the transport arm 30 and the transport arm 30 so that each protruding pin 34 of the transport arm 30 penetrates the corresponding through hole 24 to support the thinned substrate 10. The thinned substrate 10 and the tray 20 are supported by the transport arm 30 in close proximity to the tray 20, the tray 20 is transported from the substrate storage portion to the processing chamber 40, and the tray 20 is placed at a predetermined position in the processing chamber 40. Therefore, the protruding pin 34 is separated from the thinning substrate 10, and the transport arm 30 and the tray 20 are separated so that the tray 20 supports the thinning substrate 10.
Therefore, according to the present embodiment, when the load lock chamber 42 is depressurized, the thinned substrate 10 is lifted from the tray 20 by the air filled in the closed space formed between the thinned substrate 10 and the tray 20, and the tray It is possible to avoid the misalignment of 20 and improve the stability of substrate transfer and improve the processing accuracy of plasma processing on the substrate.

The thinned substrate 10 subjected to the plasma treatment may be stored in the substrate storage unit by performing a series of operations shown in FIGS. 3 (a) to 3 (k) in the reverse order.

In the above description, the transport unit transports the transport arm 30 in the state shown in FIG. 2C from the substrate storage portion to the load lock chamber 42, but the processing chamber 40 also has the function of the load lock chamber 42. It may be a thing. In this case, the transport unit performs the operations of FIGS. 3 (a) to 3 (f) in the above series of operations, and then performs the plasma treatment of FIG. 3 (k), and similarly, the operations of FIGS. The operation of (f) may be performed in the reverse order, and the plasma-treated thin-walled substrate 10 may be sequentially stored in another substrate storage unit.

Further, as described above, the substrate mounted on the tray 20 is not limited to the thinned substrate, and a closed space is formed between the tray 20 and the substrate, and when the pressure is reduced, the substrate is formed by the air remaining in the closed space. A substrate having an arbitrary shape may be used as long as it can be lifted from the tray 20 and misaligned.

The present invention can be used in a substrate transport system and a substrate transport method for transporting a semiconductor substrate in a semiconductor element manufacturing process.

1 ... Substrate transfer system 10 ... Substrate (thinned substrate)
12 ... Back surface outer edge 14 ... Central recess 20 ... Tray 22 ... Front surface outer circumference 24 ... Through hole 30 ... Conveyor arm 34 ... Protruding pin 36 ... Top surface 40 ... Processing chamber 42 ... Load lock chamber (spare chamber)
44 ... 1st gate valve 46 ... 2nd gate valve

Claims (7)

A step of preparing a tray having a plurality of through holes and a transfer arm having a plurality of protruding pins at positions corresponding to the respective through holes of the tray.
The mounting process of mounting the substrate on the tray and
The transfer arm and the tray arranged above the transfer arm are brought close to each other so that each of the protruding pins penetrates the corresponding through hole to support the substrate, and the substrate and the tray are brought together by the transfer arm. Supporting process to support and
A transfer step of transferring the substrate and the tray supported by the transfer arm to the chamber, and
A separation step of separating the transport arm and the tray so that the tray separates from the substrate so that the tray supports the substrate in order to place the tray in a predetermined position in the chamber. Substrate transfer method provided with. The substrate has an outer edge portion and a recess provided inside the outer edge portion on a surface on the side on which the tray is placed.
In the support step, the transport arm is brought closer to the tray so that each of the protruding pins penetrates the corresponding through hole and supports the outer edge portion of the substrate.
In the separation step, the transport arm is separated from the tray so that the protruding pin is separated from the outer edge portion of the substrate and the tray supports the substrate.
The substrate transport method according to claim 1. The chamber includes a spare chamber and a processing chamber.
The transfer process is
The tray is transported to the spare chamber under atmospheric pressure,
The spare chamber is decompressed and
The tray is transported from the spare chamber to the processing chamber in a decompressed state.
The substrate transport method according to claim 1 or 2. A tray with multiple through holes and
A board storage unit that stores the tray on which the board is placed, and
A transport unit provided with a transport arm having a plurality of protruding pins at positions corresponding to the respective through holes of the tray, and a transport unit.
With a decompressable chamber,
The transport unit
The transfer arm and the tray arranged above the transfer arm are brought close to each other so that each of the protruding pins penetrates the corresponding through hole to support the substrate, and the substrate and the tray are moved by the transfer arm. Support,
The tray is conveyed from the substrate storage to the chamber,
In order to place the tray in a predetermined position in the chamber, the protruding pin is separated from the substrate, and the transport arm and the tray are separated so that the tray supports the substrate.
Board transfer system. The substrate has an outer edge portion and a recess provided inside the outer edge portion on a surface on the side on which the tray is placed.
The transport unit
The transport arm is brought closer to the tray so that each of the protruding pins penetrates the corresponding through hole and supports the outer edge portion of the substrate.
The transport arm is separated from the tray so that the protruding pin is separated from the outer edge portion of the substrate and the tray supports the outer edge portion of the substrate.
The substrate transfer system according to claim 4. The chamber includes a spare chamber and a processing chamber.
The transport unit transports the tray to the spare chamber in the atmospheric pressure state, and after the spare chamber is decompressed, transports the tray from the spare chamber to the processing chamber in the depressurized state.
The substrate transfer system according to claim 4 or 5. The outer diameter of the protruding pin is smaller than the inner diameter of the through hole, and the length of the protruding pin is larger than the thickness of the tray.
The substrate transfer system according to any one of claims 4 to 6.

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