JP2020148984A - Display sealant - Google Patents
Display sealant Download PDFInfo
- Publication number
- JP2020148984A JP2020148984A JP2019048019A JP2019048019A JP2020148984A JP 2020148984 A JP2020148984 A JP 2020148984A JP 2019048019 A JP2019048019 A JP 2019048019A JP 2019048019 A JP2019048019 A JP 2019048019A JP 2020148984 A JP2020148984 A JP 2020148984A
- Authority
- JP
- Japan
- Prior art keywords
- component
- display
- acrylate
- meth
- sealant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000565 sealant Substances 0.000 title claims abstract description 34
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 67
- 150000003077 polyols Chemical class 0.000 claims abstract description 17
- 229920005862 polyol Polymers 0.000 claims abstract description 16
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 13
- 150000001875 compounds Chemical class 0.000 claims abstract description 13
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 11
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 6
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 6
- 239000008393 encapsulating agent Substances 0.000 claims description 52
- 239000004973 liquid crystal related substance Substances 0.000 claims description 36
- -1 styrene olefin Chemical class 0.000 claims description 29
- 239000010419 fine particle Substances 0.000 claims description 25
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical group C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 claims description 9
- 239000012766 organic filler Substances 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- 239000003505 polymerization initiator Substances 0.000 claims description 6
- 239000007870 radical polymerization initiator Substances 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 abstract description 21
- 230000001070 adhesive effect Effects 0.000 abstract description 21
- 230000035699 permeability Effects 0.000 abstract description 17
- 239000003822 epoxy resin Substances 0.000 description 37
- 229920000647 polyepoxide Polymers 0.000 description 37
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 21
- 239000000758 substrate Substances 0.000 description 20
- 239000000047 product Substances 0.000 description 15
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 239000007983 Tris buffer Substances 0.000 description 11
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical class C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 11
- 239000010408 film Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 10
- 229920003986 novolac Polymers 0.000 description 10
- 239000011256 inorganic filler Substances 0.000 description 9
- 229910003475 inorganic filler Inorganic materials 0.000 description 9
- 239000003112 inhibitor Substances 0.000 description 8
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 8
- 210000004027 cell Anatomy 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 6
- 239000006087 Silane Coupling Agent Substances 0.000 description 6
- 238000000862 absorption spectrum Methods 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 230000001588 bifunctional effect Effects 0.000 description 6
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 6
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000012948 isocyanate Substances 0.000 description 6
- 150000002513 isocyanates Chemical class 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 239000005058 Isophorone diisocyanate Substances 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 150000001412 amines Chemical class 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 150000002009 diols Chemical class 0.000 description 5
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000010526 radical polymerization reaction Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000011109 contamination Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- CSFWPUWCSPOLJW-UHFFFAOYSA-N lawsone Chemical compound C1=CC=C2C(=O)C(O)=CC(=O)C2=C1 CSFWPUWCSPOLJW-UHFFFAOYSA-N 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000004945 silicone rubber Substances 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- MFEWNFVBWPABCX-UHFFFAOYSA-N 1,1,2,2-tetraphenylethane-1,2-diol Chemical compound C=1C=CC=CC=1C(C(O)(C=1C=CC=CC=1)C=1C=CC=CC=1)(O)C1=CC=CC=C1 MFEWNFVBWPABCX-UHFFFAOYSA-N 0.000 description 3
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 3
- QCBSYPYHCJMQGB-UHFFFAOYSA-N 2-ethyl-1,3,5-triazine Chemical compound CCC1=NC=NC=N1 QCBSYPYHCJMQGB-UHFFFAOYSA-N 0.000 description 3
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 3
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 3
- HIPPBUJQSIICJN-UHFFFAOYSA-N 3385-61-3 Chemical compound C12CC=CC2C2CC(O)C1C2 HIPPBUJQSIICJN-UHFFFAOYSA-N 0.000 description 3
- 229930192627 Naphthoquinone Natural products 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 239000012975 dibutyltin dilaurate Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 3
- 150000002460 imidazoles Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 150000002791 naphthoquinones Chemical class 0.000 description 3
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 3
- ZNGSVRYVWHOWLX-KHFUBBAMSA-N (1r,2s)-2-(methylamino)-1-phenylpropan-1-ol;hydrate Chemical compound O.CN[C@@H](C)[C@H](O)C1=CC=CC=C1.CN[C@@H](C)[C@H](O)C1=CC=CC=C1 ZNGSVRYVWHOWLX-KHFUBBAMSA-N 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 2
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 2
- OVJHMJJVXOJMBB-UHFFFAOYSA-N 2-(1,3-dioxo-3a,4,5,6,7,7a-hexahydroisoindol-2-yl)ethyl prop-2-enoate Chemical compound C1CCCC2C(=O)N(CCOC(=O)C=C)C(=O)C21 OVJHMJJVXOJMBB-UHFFFAOYSA-N 0.000 description 2
- AGXAFZNONAXBOS-UHFFFAOYSA-N 2-[[3-(oxiran-2-ylmethyl)phenyl]methyl]oxirane Chemical compound C=1C=CC(CC2OC2)=CC=1CC1CO1 AGXAFZNONAXBOS-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- PTJWCLYPVFJWMP-UHFFFAOYSA-N 2-[[3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)COCC(CO)(CO)CO PTJWCLYPVFJWMP-UHFFFAOYSA-N 0.000 description 2
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 description 2
- OBGBGHKYJAOXRR-UHFFFAOYSA-N 2-methoxy-1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C(OC)=CC(=O)C2=C1 OBGBGHKYJAOXRR-UHFFFAOYSA-N 0.000 description 2
- LAQYHRQFABOIFD-UHFFFAOYSA-N 2-methoxyhydroquinone Chemical compound COC1=CC(O)=CC=C1O LAQYHRQFABOIFD-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- RDFQSFOGKVZWKF-UHFFFAOYSA-N 3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O RDFQSFOGKVZWKF-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- MJVAVZPDRWSRRC-UHFFFAOYSA-N Menadione Chemical compound C1=CC=C2C(=O)C(C)=CC(=O)C2=C1 MJVAVZPDRWSRRC-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- RDCRVCNPGSYUCY-UHFFFAOYSA-N [4-(hydroxymethyl)-3-bicyclo[2.2.1]heptanyl]methanol Chemical compound C1CC2(CO)C(CO)CC1C2 RDCRVCNPGSYUCY-UHFFFAOYSA-N 0.000 description 2
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 229920000800 acrylic rubber Polymers 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000000378 calcium silicate Substances 0.000 description 2
- 229910052918 calcium silicate Inorganic materials 0.000 description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- ULDHMXUKGWMISQ-UHFFFAOYSA-N carvone Chemical compound CC(=C)C1CC=C(C)C(=O)C1 ULDHMXUKGWMISQ-UHFFFAOYSA-N 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 229910052570 clay Inorganic materials 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000011258 core-shell material Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- 229940042795 hydrazides for tuberculosis treatment Drugs 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 125000000018 nitroso group Chemical group N(=O)* 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 235000010292 orthophenyl phenol Nutrition 0.000 description 2
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- GJZFGDYLJLCGHT-UHFFFAOYSA-N 1,2-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(CC)C(CC)=CC=C3SC2=C1 GJZFGDYLJLCGHT-UHFFFAOYSA-N 0.000 description 1
- XSCLFFBWRKTMTE-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCCC(CN=C=O)C1 XSCLFFBWRKTMTE-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- ROFVGYAMRSGUSQ-UHFFFAOYSA-N 1-(2-bromoethyl)piperazine;hydrobromide Chemical compound Br.BrCCN1CCNCC1 ROFVGYAMRSGUSQ-UHFFFAOYSA-N 0.000 description 1
- XZKLXPPYISZJCV-UHFFFAOYSA-N 1-benzyl-2-phenylimidazole Chemical compound C1=CN=C(C=2C=CC=CC=2)N1CC1=CC=CC=C1 XZKLXPPYISZJCV-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- ICLCCFKUSALICQ-UHFFFAOYSA-N 1-isocyanato-4-(4-isocyanato-3-methylphenyl)-2-methylbenzene Chemical compound C1=C(N=C=O)C(C)=CC(C=2C=C(C)C(N=C=O)=CC=2)=C1 ICLCCFKUSALICQ-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- VUZNLSBZRVZGIK-UHFFFAOYSA-N 2,2,6,6-Tetramethyl-1-piperidinol Chemical group CC1(C)CCCC(C)(C)N1O VUZNLSBZRVZGIK-UHFFFAOYSA-N 0.000 description 1
- BGCSUUSPRCDKBQ-UHFFFAOYSA-N 2,4,8,10-tetraoxaspiro[5.5]undecane Chemical compound C1OCOCC21COCOC2 BGCSUUSPRCDKBQ-UHFFFAOYSA-N 0.000 description 1
- OJRJDENLRJHEJO-UHFFFAOYSA-N 2,4-diethylpentane-1,5-diol Chemical compound CCC(CO)CC(CC)CO OJRJDENLRJHEJO-UHFFFAOYSA-N 0.000 description 1
- BVUXDWXKPROUDO-UHFFFAOYSA-N 2,6-di-tert-butyl-4-ethylphenol Chemical compound CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 BVUXDWXKPROUDO-UHFFFAOYSA-N 0.000 description 1
- SKHBJDDIGYYYMJ-UHFFFAOYSA-N 2,6-ditert-butyl-6-methylcyclohexa-1,3-dien-1-ol Chemical compound CC(C)(C)C1=C(O)C(C)(C(C)(C)C)CC=C1 SKHBJDDIGYYYMJ-UHFFFAOYSA-N 0.000 description 1
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical class OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- LGWROMGRXCZCLA-UHFFFAOYSA-N 2-hydroxybutanedihydrazide Chemical compound NNC(=O)CC(O)C(=O)NN LGWROMGRXCZCLA-UHFFFAOYSA-N 0.000 description 1
- QXSNXUCNBZLVFM-UHFFFAOYSA-N 2-methyl-1h-imidazole;1,3,5-triazinane-2,4,6-trione Chemical compound CC1=NC=CN1.O=C1NC(=O)NC(=O)N1 QXSNXUCNBZLVFM-UHFFFAOYSA-N 0.000 description 1
- SDQROPCSKIYYAV-UHFFFAOYSA-N 2-methyloctane-1,8-diol Chemical compound OCC(C)CCCCCCO SDQROPCSKIYYAV-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- RJIQELZAIWFNTQ-UHFFFAOYSA-N 2-phenyl-1h-imidazole;1,3,5-triazinane-2,4,6-trione Chemical compound O=C1NC(=O)NC(=O)N1.C1=CNC(C=2C=CC=CC=2)=N1 RJIQELZAIWFNTQ-UHFFFAOYSA-N 0.000 description 1
- WYKHFQKONWMWQM-UHFFFAOYSA-N 2-sulfanylidene-1h-pyridine-3-carboxylic acid Chemical compound OC(=O)C1=CC=CN=C1S WYKHFQKONWMWQM-UHFFFAOYSA-N 0.000 description 1
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- PFANXOISJYKQRP-UHFFFAOYSA-N 2-tert-butyl-4-[1-(5-tert-butyl-4-hydroxy-2-methylphenyl)butyl]-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(CCC)C1=CC(C(C)(C)C)=C(O)C=C1C PFANXOISJYKQRP-UHFFFAOYSA-N 0.000 description 1
- GPNYZBKIGXGYNU-UHFFFAOYSA-N 2-tert-butyl-6-[(3-tert-butyl-5-ethyl-2-hydroxyphenyl)methyl]-4-ethylphenol Chemical compound CC(C)(C)C1=CC(CC)=CC(CC=2C(=C(C=C(CC)C=2)C(C)(C)C)O)=C1O GPNYZBKIGXGYNU-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- KNTKCYKJRSMRMZ-UHFFFAOYSA-N 3-chloropropyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCl KNTKCYKJRSMRMZ-UHFFFAOYSA-N 0.000 description 1
- AMUBKBXGFDIMDJ-UHFFFAOYSA-N 3-heptyl-1,2-bis(9-isocyanatononyl)-4-pentylcyclohexane Chemical compound CCCCCCCC1C(CCCCC)CCC(CCCCCCCCCN=C=O)C1CCCCCCCCCN=C=O AMUBKBXGFDIMDJ-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- BOTGCZBEERTTDQ-UHFFFAOYSA-N 4-Methoxy-1-naphthol Chemical compound C1=CC=C2C(OC)=CC=C(O)C2=C1 BOTGCZBEERTTDQ-UHFFFAOYSA-N 0.000 description 1
- ALYNCZNDIQEVRV-PZFLKRBQSA-N 4-amino-3,5-ditritiobenzoic acid Chemical compound [3H]c1cc(cc([3H])c1N)C(O)=O ALYNCZNDIQEVRV-PZFLKRBQSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 1
- SFXHWRCRQNGVLJ-UHFFFAOYSA-N 4-methoxy-TEMPO Chemical group COC1CC(C)(C)N([O])C(C)(C)C1 SFXHWRCRQNGVLJ-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- QDZXJOMXPRWGFG-UHFFFAOYSA-N CCC1=NC=NC=N1.O=C1NC(=O)NC(=O)N1 Chemical compound CCC1=NC=NC=N1.O=C1NC(=O)NC(=O)N1 QDZXJOMXPRWGFG-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000005973 Carvone Substances 0.000 description 1
- 229920013683 Celanese Polymers 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- KZSNJWFQEVHDMF-BYPYZUCNSA-N L-valine Chemical compound CC(C)[C@H](N)C(O)=O KZSNJWFQEVHDMF-BYPYZUCNSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical group COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- XCOBLONWWXQEBS-KPKJPENVSA-N N,O-bis(trimethylsilyl)trifluoroacetamide Chemical compound C[Si](C)(C)O\C(C(F)(F)F)=N\[Si](C)(C)C XCOBLONWWXQEBS-KPKJPENVSA-N 0.000 description 1
- JMMSLMMJRMCXPW-UHFFFAOYSA-N OC.OC.C1CC2CCC1C2 Chemical compound OC.OC.C1CC2CCC1C2 JMMSLMMJRMCXPW-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 235000006732 Torreya nucifera Nutrition 0.000 description 1
- 244000111306 Torreya nucifera Species 0.000 description 1
- KZSNJWFQEVHDMF-UHFFFAOYSA-N Valine Natural products CC(C)C(N)C(O)=O KZSNJWFQEVHDMF-UHFFFAOYSA-N 0.000 description 1
- ZXZCZWDQDAADMX-UHFFFAOYSA-N [1-(hydroxymethyl)-2-adamantyl]methanol Chemical compound C1C(C2)CC3CC1C(CO)C2(CO)C3 ZXZCZWDQDAADMX-UHFFFAOYSA-N 0.000 description 1
- ZFDXZGUFUMAREO-UHFFFAOYSA-N [1-(hydroxymethyl)-2-phenylimidazol-4-yl]methanol Chemical compound OCC1=CN(CO)C(C=2C=CC=CC=2)=N1 ZFDXZGUFUMAREO-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- JFBZPFYRPYOZCQ-UHFFFAOYSA-N [Li].[Al] Chemical compound [Li].[Al] JFBZPFYRPYOZCQ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- OFLXLNCGODUUOT-UHFFFAOYSA-N acetohydrazide Chemical compound C\C(O)=N\N OFLXLNCGODUUOT-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- AZJUMRZVLRZXPD-UHFFFAOYSA-N adamantane methanol Chemical compound OC.OC.C1C(C2)CC3CC1CC2C3 AZJUMRZVLRZXPD-UHFFFAOYSA-N 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- QCTBMLYLENLHLA-UHFFFAOYSA-N aminomethylbenzoic acid Chemical compound NCC1=CC=C(C(O)=O)C=C1 QCTBMLYLENLHLA-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- GPBKPJXNAVXOJU-UHFFFAOYSA-N benzene-1,2,4-tricarbohydrazide Chemical compound NNC(=O)C1=CC=C(C(=O)NN)C(C(=O)NN)=C1 GPBKPJXNAVXOJU-UHFFFAOYSA-N 0.000 description 1
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 1
- ALHNLFMSAXZKRC-UHFFFAOYSA-N benzene-1,4-dicarbohydrazide Chemical compound NNC(=O)C1=CC=C(C(=O)NN)C=C1 ALHNLFMSAXZKRC-UHFFFAOYSA-N 0.000 description 1
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical class C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- UHVCSNKHFBQKBO-UHFFFAOYSA-N benzyl-ethenyl-[2-(3-trimethoxysilylpropylamino)ethyl]azanium;chloride Chemical compound Cl.CO[Si](OC)(OC)CCCNCCN(C=C)CC1=CC=CC=C1 UHVCSNKHFBQKBO-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 229930006711 bornane-2,3-dione Natural products 0.000 description 1
- HCOMFAYPHBFMKU-UHFFFAOYSA-N butanedihydrazide Chemical compound NNC(=O)CCC(=O)NN HCOMFAYPHBFMKU-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical group CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000004956 cell adhesive effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- FOAFCAUCIZMBJM-UHFFFAOYSA-N cyclohexane-1,1,2-tricarbohydrazide Chemical compound NNC(=O)C1CCCCC1(C(=O)NN)C(=O)NN FOAFCAUCIZMBJM-UHFFFAOYSA-N 0.000 description 1
- ZWLIYXJBOIDXLL-UHFFFAOYSA-N decanedihydrazide Chemical compound NNC(=O)CCCCCCCCC(=O)NN ZWLIYXJBOIDXLL-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- CEJLBZWIKQJOAT-UHFFFAOYSA-N dichloroisocyanuric acid Chemical compound ClN1C(=O)NC(=O)N(Cl)C1=O CEJLBZWIKQJOAT-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- KIQKWYUGPPFMBV-UHFFFAOYSA-N diisocyanatomethane Chemical compound O=C=NCN=C=O KIQKWYUGPPFMBV-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- MZRQZJOUYWKDNH-UHFFFAOYSA-N diphenylphosphoryl-(2,3,4-trimethylphenyl)methanone Chemical compound CC1=C(C)C(C)=CC=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MZRQZJOUYWKDNH-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- SWRGUMCEJHQWEE-UHFFFAOYSA-N ethanedihydrazide Chemical compound NNC(=O)C(=O)NN SWRGUMCEJHQWEE-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 1
- XZBIXDPGRMLSTC-UHFFFAOYSA-N formohydrazide Chemical compound NNC=O XZBIXDPGRMLSTC-UHFFFAOYSA-N 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N glutaric acid Chemical compound OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- LHGVFZTZFXWLCP-UHFFFAOYSA-N guaiacol Chemical class COC1=CC=CC=C1O LHGVFZTZFXWLCP-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- IFZUFHWISBKFJP-UHFFFAOYSA-N n'-[4-[dimethoxy(methyl)silyl]oxybutyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)OCCCCNCCN IFZUFHWISBKFJP-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- DAHPIMYBWVSMKQ-UHFFFAOYSA-N n-hydroxy-n-phenylnitrous amide Chemical compound O=NN(O)C1=CC=CC=C1 DAHPIMYBWVSMKQ-UHFFFAOYSA-N 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- DYUMLJSJISTVPV-UHFFFAOYSA-N phenyl propanoate Chemical compound CCC(=O)OC1=CC=CC=C1 DYUMLJSJISTVPV-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- DDOVHJODVHQLCS-UHFFFAOYSA-N pyridine-2,6-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=N1 DDOVHJODVHQLCS-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- DUIOPKIIICUYRZ-UHFFFAOYSA-N semicarbazide Chemical compound NNC(N)=O DUIOPKIIICUYRZ-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- NBOMNTLFRHMDEZ-UHFFFAOYSA-N thiosalicylic acid Chemical compound OC(=O)C1=CC=CC=C1S NBOMNTLFRHMDEZ-UHFFFAOYSA-N 0.000 description 1
- 229940103494 thiosalicylic acid Drugs 0.000 description 1
- JREYOWJEWZVAOR-UHFFFAOYSA-N triazanium;[3-methylbut-3-enoxy(oxido)phosphoryl] phosphate Chemical compound [NH4+].[NH4+].[NH4+].CC(=C)CCOP([O-])(=O)OP([O-])([O-])=O JREYOWJEWZVAOR-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- WTKVMIIQXATOJO-UHFFFAOYSA-N trimethyl-(1,1,2,2-tetraphenyl-2-trimethylsilyloxyethoxy)silane Chemical compound C=1C=CC=CC=1C(C(O[Si](C)(C)C)(C=1C=CC=CC=1)C=1C=CC=CC=1)(O[Si](C)(C)C)C1=CC=CC=C1 WTKVMIIQXATOJO-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 239000004474 valine Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3203—Polyhydroxy compounds
- C08G18/3212—Polyhydroxy compounds containing cycloaliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4236—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups
- C08G18/4238—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups derived from dicarboxylic acids and dialcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4266—Polycondensates having carboxylic or carbonic ester groups in the main chain prepared from hydroxycarboxylic acids and/or lactones
- C08G18/4269—Lactones
- C08G18/4277—Caprolactone and/or substituted caprolactone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
- C08G18/6633—Compounds of group C08G18/42
- C08G18/6637—Compounds of group C08G18/42 with compounds of group C08G18/32 or polyamines of C08G18/38
- C08G18/664—Compounds of group C08G18/42 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Sealing Material Composition (AREA)
- Liquid Crystal (AREA)
- Polyurethanes Or Polyureas (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
本発明は、フレキシブルディスプレイや湾曲形状のディスプレイにも適用できるディスプレイ用封止剤に関する。このディスプレイ用封止剤は、柔軟性と低透湿性を両立できるものである為、特にフレキシブルディスプレイや湾曲形状のディスプレイ用封止剤として有用である。
また、本発明のように柔軟性に富んだ封止剤は、被着体との接着強度に優れる為、高接着強度が要求される用途においても有用である。
The present invention relates to a display encapsulant that can also be applied to a flexible display or a curved display. Since this display encapsulant can achieve both flexibility and low moisture permeability, it is particularly useful as a sealant for flexible displays and curved displays.
Further, the highly flexible encapsulant as in the present invention is excellent in adhesive strength with an adherend, and is therefore useful in applications requiring high adhesive strength.
ディスプレイ用封止剤とは、例えば液晶ディスプレイ用シール剤、有機ＥＬディスプレイ用封止剤やタッチパネル用接着剤等を挙げることができる。これらの材料として共通していることは、優れた硬化性を有しながら、アウトガスが少なく、表示素子にダメージを与えないという特性が要求される点である。
また最近では、湾曲した形状のディスプレイや、フレキシブル性に富んだディスプレイが開発され製品化されている。こういったディスプレイに使用される基板は、従来のガラスのような剛直なものに代わって、プラスチックフィルムのような柔軟なものが使用されている（特許文献１）。
こういった背景から、ディスプレイ用封止剤には基板等のたわみに追従するような、すなわち硬化後においても柔軟であるという性質が要求されつつある。
Examples of the display sealant include a liquid crystal display sealant, an organic EL display sealant, a touch panel adhesive, and the like. What these materials have in common is that they are required to have excellent curability, low outgassing, and no damage to the display element.
Recently, curved displays and highly flexible displays have been developed and commercialized. As the substrate used for such a display, a flexible substrate such as a plastic film is used instead of a rigid substrate such as conventional glass (Patent Document 1).
Against this background, display encapsulants are required to have the property of following the deflection of a substrate or the like, that is, being flexible even after curing.
また、柔軟性に優れる封止剤は、接着強度においても有利である。例えば、衝撃による剥離や機材破壊を軽減することができる。この観点からも、封止剤に対する柔軟性付与という要求は高くなっている。 In addition, a sealing agent having excellent flexibility is also advantageous in terms of adhesive strength. For example, it is possible to reduce peeling and equipment destruction due to impact. From this point of view, there is an increasing demand for giving flexibility to the sealant.
一方、硬化物の柔軟性を高めるためには、硬化物の架橋密度を下げることが有効な手段である。しかし、架橋密度が下がると透湿性を悪化させるのが通常である。これはネットワークの緩い部分から水分が侵入する為であると考えられる。従って、低透湿性を担保する為には、架橋密度を下げずに柔軟性を高めるか、架橋密度は下げるが透湿性を悪化させないという、相反する特性の実現が必要となる。 On the other hand, in order to increase the flexibility of the cured product, it is an effective means to reduce the cross-linking density of the cured product. However, when the crosslink density decreases, the moisture permeability usually deteriorates. It is considered that this is because water invades from the loose part of the network. Therefore, in order to ensure low moisture permeability, it is necessary to realize contradictory characteristics such as increasing the flexibility without lowering the crosslink density or lowering the crosslink density but not deteriorating the moisture permeability.
従来、接着強度向上の観点から、柔軟性を有する表示素子用接着剤の開発は行われてきた（特許文献２）。しかし、上記の柔軟な基板に適応するための十分な性能を備えたものは未だ実現していない。 Conventionally, from the viewpoint of improving the adhesive strength, a flexible adhesive for a display element has been developed (Patent Document 2). However, one having sufficient performance for adapting to the above-mentioned flexible substrate has not yet been realized.
本発明は、フレキシブルディスプレイや湾曲形状のディスプレイにも適用できるディスプレイ用封止剤に関する。より詳細には、脂環構造を有するポリオールからなるウレタン（メタ）アクリレートを用いたディスプレイ用封止剤に関する。このディスプレイ用封止剤は、柔軟性と低透湿性を両立し、接着強度にも優れるものである為、ディスプレイ用封止剤として有用である。 The present invention relates to a display encapsulant that can also be applied to a flexible display or a curved display. More specifically, the present invention relates to a sealant for a display using a urethane (meth) acrylate composed of a polyol having an alicyclic structure. This display encapsulant is useful as a display encapsulant because it has both flexibility and low moisture permeability and is also excellent in adhesive strength.
本発明者らは、鋭意検討の結果、脂環構造を有するポリオールからなるウレタン（メタ）アクリレートを含有するディスプレイ用封止剤が柔軟性と低透湿性に非常に優れることを見出し、本発明に至ったものである。
なお、本明細書中、「（メタ）アクリレート」とは「アクリレート」及び／又は「メタクリレート」を意味する。
As a result of diligent studies, the present inventors have found that a display encapsulant containing a urethane (meth) acrylate composed of a polyol having an alicyclic structure is extremely excellent in flexibility and low moisture permeability. It has arrived.
In addition, in this specification, "(meth) acrylate" means "acrylate" and / or "methacrylate".
即ち本発明は、次の［１］〜［１２］に関するものである。
［１］
（ａ）脂環構造を有するポリオールと（ｂ）有機ポリイソシアネートと（ｃ）水酸基含有（メタ）アクリレートを反応して得られる（Ａ）ウレタン（メタ）アクリレートを含有するディスプレイ用封止剤。
［２］
前記成分（ａ）がトリシクロデカンジメタノール構造を有するポリオールである前項［１］に記載のディスプレイ用封止剤。
［３］
前記成分（Ａ）が、更に成分（ａ−１）として、成分（ａ）以外のポリオールを反応して得られるものである前項［１］又は［２］に記載のディスプレイ用封止剤。
［４］
更に、成分（Ｂ）硬化性化合物を含有する前項［１］乃至［３］のいずれか一項に記載のディスプレイ用封止剤。
［５］
前記成分（Ｂ）が、部分エポキシ（メタ）アクリレートである前項［４］に記載のディスプレイ用封止剤。
［６］
更に、成分（Ｃ）有機フィラーを含有する前項［１］乃至［５］のいずれか一項に記載のディスプレイ用封止剤。
［７］
前記成分（Ｃ）が、ウレタン微粒子、アクリル微粒子、スチレン微粒子、スチレンオレフィン微粒子、及びシリコーン微粒子からなる群より選択される１又は２以上の有機フィラーである前項［６］に記載のディスプレイ用封止剤。
［８］
更に、成分（Ｄ）熱硬化剤を含有する前項［１］乃至［７］のいずれか一項に記載のディスプレイ用封止剤。
［９］
更に、成分（Ｅ）光ラジカル重合開始剤を含有する前項［１］乃至［８］のいずれか一項に記載のディスプレイ用封止剤。
［１０］
更に、成分（Ｆ）熱ラジカル重合開始剤を含有する前項［１］乃至［９］のいずれか一項に記載のディスプレイ用封止剤。
［１１］
液晶滴下工法用液晶シール剤である、前項［１］乃至［１０］のいずれか一項に記載のディスプレイ用封止剤。
［１２］
前項［１１］に記載の液晶滴下工法用液晶シール剤によって封止された液晶ディスプレイ。
That is, the present invention relates to the following [1] to [12].
[1]
A display encapsulant containing (A) urethane (meth) acrylate obtained by reacting (a) a polyol having an alicyclic structure, (b) an organic polyisocyanate, and (c) a hydroxyl group-containing (meth) acrylate.
[2]
The display encapsulant according to the previous item [1], wherein the component (a) is a polyol having a tricyclodecanedimethanol structure.
[3]
The display encapsulant according to the preceding item [1] or [2], wherein the component (A) is further obtained by reacting a polyol other than the component (a) as the component (a-1).
[4]
The display encapsulant according to any one of the above items [1] to [3], which further contains the component (B) curable compound.
[5]
The display encapsulant according to the previous item [4], wherein the component (B) is a partial epoxy (meth) acrylate.
[6]
The display encapsulant according to any one of the above items [1] to [5], further containing the component (C) organic filler.
[7]
The display encapsulation according to the preceding item [6], wherein the component (C) is one or more organic fillers selected from the group consisting of urethane fine particles, acrylic fine particles, styrene fine particles, styrene olefin fine particles, and silicone fine particles. Agent.
[8]
The display encapsulant according to any one of the above items [1] to [7], further containing the component (D) thermosetting agent.
[9]
The display encapsulant according to any one of the above items [1] to [8], which further contains the component (E) photoradical polymerization initiator.
[10]
The display encapsulant according to any one of the above items [1] to [9], further containing the component (F) thermal radical polymerization initiator.
[11]
The sealant for a display according to any one of the above items [1] to [10], which is a liquid crystal sealant for a liquid crystal dropping method.
[12]
A liquid crystal display sealed with the liquid crystal sealant for the liquid crystal dropping method according to the previous item [11].
本発明のディスプレイ用封止剤は、柔軟性と低透湿性を両立し、接着強度にも優れるものである為、ディスプレイ用封止剤として有用である。 The display encapsulant of the present invention is useful as a display encapsulant because it has both flexibility and low moisture permeability and is also excellent in adhesive strength.
本発明のディスプレイ用封止剤は、（ａ）脂環構造を有するポリオールと（ｂ）有機ポリイソシアネートと（ｃ）水酸基含有（メタ）アクリレートからなる（Ａ）ウレタン（メタ）アクリレート（以下、単に「成分（Ａ）」ともいう。）を含有する。
成分（Ａ）はウレタン構造特有の柔軟な骨格を有し、さらに脂環構造を有するポリオールを用いることにより、硬化物が柔軟かつ低透湿性の特性を有し、ガラス基板だけでなく配向膜上においても高い接着強度を有する。
The display encapsulant of the present invention comprises (a) a polyol having an alicyclic structure, (b) an organic polyisocyanate, and (c) a hydroxyl group-containing (meth) acrylate (A) urethane (meth) acrylate (hereinafter, simply Also referred to as "component (A)").
The component (A) has a flexible skeleton peculiar to the urethane structure, and by using a polyol having an alicyclic structure, the cured product has the characteristics of being flexible and having low moisture permeability, and is not only on the glass substrate but also on the alignment film. Also has high adhesive strength.
柔軟性については、硬化物の弾性率を指標とすることができる。紫外線３０００ｍＪ／ｃｍ２（測定波長：３６５ｎｍ）照射後に１３０℃４０分の条件で硬化させた１００μｍの厚みの硬化物の弾性率としては２００〜３０００ＭＰａであることが好ましく、４００〜２０００ＭＰａであることが更に好ましく、６００〜１５００ＭＰａであることが特に好ましい。上記範囲のディスプレイ接着剤は、ディスプレイに掛かる応力に追従することができることから好ましいと言える。
低透湿性としては、３００μｍの厚みの硬化物において、透湿度が６０ｇ／ｍ２＊２４ｈ以下であることが好ましい。
For flexibility, the elastic modulus of the cured product can be used as an index. The elastic modulus of a cured product having a thickness of 100 μm cured under the conditions of 130 ° C. and 40 minutes after irradiation with ultraviolet rays of 3000 mJ / cm 2 (measurement wavelength: 365 nm) is preferably 200 to 3000 MPa, preferably 400 to 2000 MPa. It is more preferably 600 to 1500 MPa, and particularly preferably 600 to 1500 MPa. It can be said that the display adhesive in the above range is preferable because it can follow the stress applied to the display.
As for the low moisture permeability, it is preferable that the cured product having a thickness of 300 μm has a moisture permeability of 60 g / m 2 * 24 h or less.
成分（Ａ）は、（ａ）脂環構造を有するポリオールと（ｂ）有機ポリイソシアネートと（ｃ）水酸基含有（メタ）アクリレートを常法で合成することにより得ることができる。
前記成分（ａ）の水酸基１当量に対して、成分（ｂ）のイソシアネート基１．１〜２．０当量を反応させることが好ましく、１．３〜２．０当量を反応させることが特に好ましい。反応温度は、室温（２５℃）〜１００℃が好ましい。
成分（ａ）と成分（ｂ）との反応物中のイソシアネート基１当量あたり、成分（ｃ）中の水酸基０．９５〜１．１当量を反応させることが好ましい。反応温度は、室温（２５℃）〜１００℃が好ましい。
The component (A) can be obtained by synthesizing (a) a polyol having an alicyclic structure, (b) an organic polyisocyanate, and (c) a hydroxyl group-containing (meth) acrylate by a conventional method.
It is preferable to react 1.1 to 2.0 equivalents of the isocyanate group of the component (b) with 1 equivalent of the hydroxyl group of the component (a), and it is particularly preferable to react 1.3 to 2.0 equivalents. .. The reaction temperature is preferably room temperature (25 ° C.) to 100 ° C.
It is preferable to react 0.95-1.1 equivalents of the hydroxyl group in the component (c) per 1 equivalent of the isocyanate group in the reaction product of the component (a) and the component (b). The reaction temperature is preferably room temperature (25 ° C.) to 100 ° C.
成分（ａ）として脂環構造を有するポリオールとは、ポリオール構造内に脂環構造を有するものであれば特に制限されない。 The polyol having an alicyclic structure as the component (a) is not particularly limited as long as it has an alicyclic structure in the polyol structure.
成分（ａ）の具体例としては、例えば、シクロヘキサンジメタノール、ノルボルナンジメタノール、ノルボルネンジメタノール、トリシクロデカンジメタノール、ペンタシクロペンタデカンジメタノール、アダマンタンジメタノール、水添ビスフェノールＡ、水添ビスフェノールＦ、水添テルペンジフェノール及びこれらのＥＯ、ＰＯ、カプロラクトン変性物等が挙げられる。接着性を向上させる上で炭素数２０以下の脂環構造を使用することが好ましく、低透湿性と柔軟性のバランスからトリシクロデカンジメタノールを使用することが好ましい。トリシクロデカンジメタノールの市販品としては例えばセラニーズ社のＴＣＤアルコールＤＭ等が挙げられる。
また、ノルボルナンジメタノール、ノルボルネンジメタノール、トリシクロデカンジメタノール、アダマンタンジメタノール等の橋架け構造を有するジオールが、耐水性を向上させることから好ましい。
Specific examples of the component (a) include, for example, cyclohexanedimethanol, norbornanedimethanol, norbornanedimethanol, tricyclodecanedimethanol, pentacyclopentadecanemethanol, adamantandimethanol, hydrogenated bisphenol A, hydrogenated bisphenol F, and the like. Hydrogenated terpendiphenol and their EO, PO, caprolactone modified products and the like can be mentioned. It is preferable to use an alicyclic structure having 20 or less carbon atoms in order to improve the adhesiveness, and it is preferable to use tricyclodecanedimethanol from the viewpoint of the balance between low moisture permeability and flexibility. Examples of commercially available products of tricyclodecanedimethanol include TCD alcohol DM manufactured by Celanese.
Further, a diol having a bridging structure such as norbornane dimethanol, norbornene dimethanol, tricyclodecanedimethanol, and adamantane dimethanol is preferable because it improves water resistance.
本発明において、成分（ａ−１）として成分（ａ）以外のポリオールを使用することも好ましい実施態様である。成分（ａ−１）の具体例としては、例えば、水素化ポリブタジエンポリオール、エチレングリコール、ジエチレングリコール、トリエチレングリコール、プロピレングリコール、ジプロピレングリコール、トリプロピレングリコール、１，４−ブタンジオール、ネオペンチルグリコール、１，６−ヘキサンジオール、１，８−オクタンジオール、１，９−ノナンジオール、２−メチル−１，８−オクタンジオール、３−メチル−１，５−ペンタンジオール、２，４−ジエチル−１，５−ペンタンジオール、シクロヘキサン−１，４−ジメタノール、ポリエチレングリコール、ポリプロピレングリコール、ビスフェノールＡポリ（ｎ≒２〜２０）エトキシジオール、ビスフェノールＡポリ（ｎ≒２〜２０）プロポキシジオール等のジオール（ａ−１−１）、これらジオール（ａ−１−１）と二塩基酸又はその無水物（例えばコハク酸、アジピン酸、アゼライン酸、ダイマー酸、イソフタル酸、テレフタル酸、フタル酸あるいは、これらの無水物）との反応物であるポリエステルジオール（ａ−１−２）等を挙げることができる。好ましくは、３−メチル−１，５−ペンタンジオール及びそのポリエステルジオールを挙げることができる。
成分（ａ）と成分（ａ−１）を併用するとき、成分（ａ）と成分（ａ−１）の総量中の成分（ａ）は通常３〜９５重量％であり、好ましくは５〜５０重量％であり、更に好ましくは８〜２０重量％である。
In the present invention, it is also a preferred embodiment to use a polyol other than the component (a) as the component (a-1). Specific examples of the component (a-1) include hydride polybutadiene polyol, ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, 1,4-butanediol, neopentyl glycol, and the like. 1,6-Hexanediol, 1,8-octanediol, 1,9-nonanediol, 2-methyl-1,8-octanediol, 3-methyl-1,5-pentanediol, 2,4-diethyl-1 , 5-Pentanediol, cyclohexane-1,4-dimethanol, polyethylene glycol, polypropylene glycol, bisphenol A poly (n≈2-20) ethoxydiol, bisphenol A poly (n≈2-20) propoxydiol and other diols ( a-1-1), these diols (a-1-1) and dibasic acids or anhydrides thereof (for example, succinic acid, adipic acid, azelaic acid, dimer acid, isophthalic acid, terephthalic acid, phthalic acid, or these Polyolesterdiol (a-1-2), which is a reaction product with (anhydrous), and the like can be mentioned. Preferably, 3-methyl-1,5-pentanediol and its polyester diol can be mentioned.
When the component (a) and the component (a-1) are used in combination, the component (a) in the total amount of the component (a) and the component (a-1) is usually 3 to 95% by weight, preferably 5 to 50% by weight. It is% by weight, more preferably 8 to 20% by weight.
（ｂ）有機ポリイソシアネートの具体例としては、トリレンジイソシアネート、イソホロンジイソシアネート、１，６−ヘキサメチレンジイソシアネート、トリメチルヘキサメチレンジイソシアネート、キシリレンジイソシアネート、４，４’−ジフェニルメタンジイソシアネート、４、４’−シクロヘキシルメタンジイソシアネート、キシリレンジイソシアネート、１，３−ビス（イソシアナトメチル）シクロヘキサン、トリメチルヘキサメチレンジイソシアネート、ジメリルジイソシアネート、１，５−ナフタレンジイソシアネート、３、３’−ジメチル−４，４’−ジフェニレンジイソシアネート等を挙げることができる。好ましくは、トリレンジイソシアネート、イソホロンジイソシアネート、１，６−ヘキサメチレンジイソシアネート、トリメチルヘキサメチレンジイソシアネートを挙げることができる。 (B) Specific examples of the organic polyisocyanate include tolylene diisocyanate, isophorone diisocyanate, 1,6-hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, xylylene diisocyanate, 4,4'-diphenylmethane diisocyanate, and 4,4'-cyclohexyl. Methylene diisocyanate, xylylene diisocyanate, 1,3-bis (isocyanatomethyl) cyclohexane, trimethylhexamethylene diisocyanate, dimeryl diisocyanate, 1,5-naphthalenedi isocyanate, 3,3'-dimethyl-4,4'-diphenylenediisocyanate And so on. Preferably, tolylene diisocyanate, isophorone diisocyanate, 1,6-hexamethylene diisocyanate and trimethylhexamethylene diisocyanate can be mentioned.
（ｃ）水酸基含有（メタ）アクリレートの具体例としては、２−ヒドロキシエチル（メタ）アクリレート、２−ヒドロキシプロピル（メタ）アクリレート、１，４−ブタンジオール（メタ）アクリレート、ポリエチレングリコールモノ（メタ）アクリレート、ポリプロピレングリコールモノ（メタ）アクリレート、ペンタエリスリトールトリ（メタ）アクリレート、２−ヒドロキシエチル（メタ）アクリレートのε−カプロラクトン付加物、２−ヒドロキシ−３−フェニルオキシプロピル（メタ）アクリレート等を挙げることができる。好ましくは、２−ヒドロキシエチル（メタ）アクリレート、２−ヒドロキシプロピル（メタ）アクリレート、ポリエチレングリコールモノ（メタ）アクリレートを挙げることができる。 (C) Specific examples of the hydroxyl group-containing (meth) acrylate include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 1,4-butanediol (meth) acrylate, and polyethylene glycol mono (meth). Acrylate, polypropylene glycol mono (meth) acrylate, pentaerythritol tri (meth) acrylate, ε-caprolactone adduct of 2-hydroxyethyl (meth) acrylate, 2-hydroxy-3-phenyloxypropyl (meth) acrylate and the like. Can be done. Preferably, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate and polyethylene glycol mono (meth) acrylate can be mentioned.
なお、成分（Ａ）の好ましい含有量は、ディスプレイ用封止剤総量中、通常５〜５０質量％、好ましくは５〜３０質量％、さらに好ましくは１０〜２０質量％である。 The preferable content of the component (A) is usually 5 to 50% by mass, preferably 5 to 30% by mass, and more preferably 10 to 20% by mass in the total amount of the sealant for display.
［（Ｂ）硬化性化合物］
本発明のディスプレイ用封止剤は、成分（Ｂ）として、硬化性化合物（以下、単に「成分（Ｂ）」ともいう。）を含有する。
成分（Ｂ）としては、光や熱等によって硬化する化合物であれば特に限定されないが、成分（Ｂ−１）（メタ）アクリレート（以下、単に成分（Ｂ−１）ともいう。）である場合が好ましく、例えば、（メタ）アクリルエステル、エポキシ（メタ）アクリレート等が挙げられる。
[(B) Curable compound]
The display encapsulant of the present invention contains a curable compound (hereinafter, also simply referred to as “component (B)”) as the component (B).
The component (B) is not particularly limited as long as it is a compound that is cured by light, heat, or the like, but is a component (B-1) (meth) acrylate (hereinafter, also simply referred to as a component (B-1)). Is preferable, and examples thereof include (meth) acrylic ester and epoxy (meth) acrylate.
［（Ｂ−１）（メタ）アクリレート］
（メタ）アクリルエステルの具体例としては、Ｎ−アクリロイルオキシエチルヘキサヒドロフタルイミド、アクリロイルモルホリン、２−ヒドロキシプロピル（メタ）アクリレート、４−ヒドロキシブチル（メタ）アクリレート、シクロヘキサン−１，４−ジメタノールモノ（メタ）アクリレート、テトラヒドロフルフリル（メタ）アクリレート、フェノキシエチル（メタ）アクリレート、フェニルポリエトキシ（メタ）アクリレート、２−ヒドロキシ−３−フェニルオキシプロピル（メタ）アクリレート、ｏ−フェニルフェノールモノエトキシ（メタ）アクリレート、ｏ−フェニルフェノールポリエトキシ（メタ）アクリレート、ｐ−クミルフェノキシエチル（メタ）アクリレート、イソボニル（メタ）アクリレート、トリブロモフェニルオキシエチル（メタ）アクリレート、ジシクロペンタニル（メタ）アクリレート、ジシクロペンテニル（メタ）アクリレート、ジシクロペンテニルオキシエチル（メタ）アクリレート、１，４−ブタンジオールジ（メタ）アクリレート、１，６−ヘキサンジオールジ（メタ）アクリレート、１，９−ノナンジオールジ（メタ）アクリレート、トリシクロデカンジメタノール（メタ）アクリレート、ビスフェノールＡポリエトキシジ（メタ）アクリレート、ビスフェノールＡポリプロポキシジ（メタ）アクリレート、ビスフェノールＦポリエトキシジ（メタ）アクリレート、エチレングリコールジ（メタ）アクリレート、ポリエチレングリコールジ（メタ）アクリレート、トリス（アクリロキシエチル）イソシアヌレート、ペンタエリスリトールテトラ（メタ）アクリレート、ジペンタエリスリトールヘキサ（メタ）アクリレート、ジペンタエリスリトールペンタ（メタ）アクリレート、トリペンタエリスリトールヘキサ（メタ）アクリレート、トリペンタエリスリトールペンタ（メタ）アクリレート、トリメチロールプロパントリ（メタ）アクリレート、トリメチロールプロパンポリエトキシトリ（メタ）アクリレート、ジトリメチロールプロパンテトラ（メタ）アクリレート、ネオペンチルグリコールとヒドロキシピバリン酸のエステルジアクリレートやネオペンチルグリコールとヒドロキシピバリン酸のエステルのε−カプロラクトン付加物のジアクリレート等のモノマー類を挙げることができる。好ましくは、Ｎ−アクリロイルオキシエチルヘキサヒドロフタルイミド、フェノキシエチル（メタ）アクリレート、ジシクロペンテニルオキシエチル（メタ）アクリレートを挙げることができる。
エポキシ（メタ）アクリレートは、エポキシ樹脂と（メタ）アクリル酸との反応により公知の方法で得られる。原料となるエポキシ樹脂としては、特に限定されるものではないが、２官能以上のエポキシ樹脂が好ましく、例えば、レゾルシンジグリシジルエーテル、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＳ型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビスフェノールＡノボラック型エポキシ樹脂、ビスフェノールＦノボラック型エポキシ樹脂、脂環式エポキシ樹脂、脂肪族鎖状エポキシ樹脂、グリシジルエステル型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、ヒダントイン型エポキシ樹脂、イソシアヌレート型エポキシ樹脂、トリフェノールメタン骨格を有するフェノールノボラック型エポキシ樹脂、その他、カテコール、レゾルシノール等の二官能フェノール類のジグリシジルエーテル化物、二官能アルコール類のジグリシジルエーテル化物、およびそれらのハロゲン化物、水素添加物などが挙げられる。これらのうち液晶汚染性の観点から、ビスフェノールＡ型エポキシ樹脂やレゾルシンジグリシジルエーテルが好ましい。また、エポキシ基と（メタ）アクリロイル基との比率は限定されるものではなく、工程適合性の観点から適切に選択される。
なお、エポキシ基の一部をアクリルエステル化する部分エポキシ（メタ）アクリレートが好適に使用される。この場合のアクリル化の割合は、３０〜７０％程度が好ましい。
成分（Ｂ−１）は単独で用いても良いし、２種類以上を混合しても良い。本発明の樹脂組成物において、成分（Ｂ−１）を使用する場合には、樹脂組成物の総量中、通常１０〜８０質量％、好ましくは２０〜７０質量％である。
[(B-1) (meth) acrylate]
Specific examples of the (meth) acrylic ester include N-acryloyloxyethyl hexahydrophthalimide, acryloylmorpholine, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, cyclohexane-1,4-dimethanol mono. (Meta) acrylate, tetrahydrofurfuryl (meth) acrylate, phenoxyethyl (meth) acrylate, phenylpolyethoxy (meth) acrylate, 2-hydroxy-3-phenyloxypropyl (meth) acrylate, o-phenylphenol monoethoxy (meth) ) Acrylate, o-phenylphenol polyethoxy (meth) acrylate, p-cumylphenoxyethyl (meth) acrylate, isobonyl (meth) acrylate, tribromophenyloxyethyl (meth) acrylate, dicyclopentanyl (meth) acrylate, Dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di ( Meta) acrylate, tricyclodecanedimethanol (meth) acrylate, bisphenol A polyethoxydi (meth) acrylate, bisphenol A polypropoxydi (meth) acrylate, bisphenol F polyethoxydi (meth) acrylate, ethylene glycol di (meth) acrylate, polyethylene glycol Di (meth) acrylate, tris (acryloxyethyl) isocyanurate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, tripentaerythritol hexa (meth) acrylate, Tripentaerythritol penta (meth) acrylate, trimethylpropantri (meth) acrylate, trimethylolpropanpolyethoxytri (meth) acrylate, ditrimethylolpropanetetra (meth) acrylate, ester diacrylate of neopentyl glycol and hydroxypivalic acid, Examples thereof include monomers such as diacrylate, which is an ε-caprolactone adduct of an ester of neopentyl glycol and hydroxypivalic acid. Preferred examples include N-acryloyloxyethyl hexahydrophthalimide, phenoxyethyl (meth) acrylate, and dicyclopentenyloxyethyl (meth) acrylate.
Epoxy (meth) acrylate can be obtained by a known method by reacting an epoxy resin with (meth) acrylic acid. The epoxy resin as a raw material is not particularly limited, but a bifunctional or higher functional epoxy resin is preferable, and for example, resorcindiglycidyl ether, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin. , Phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol F novolac type epoxy resin, alicyclic epoxy resin, aliphatic chain epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy Resin, hydant-in type epoxy resin, isocyanurate type epoxy resin, phenol novolac type epoxy resin having a triphenol methane skeleton, diglycidyl ether of bifunctional phenols such as catechol and resorcinol, diglycidyl ether of bifunctional alcohols Examples thereof include compounds, halides thereof, and hydrogenated products. Of these, bisphenol A type epoxy resin and resorcinol diglycidyl ether are preferable from the viewpoint of liquid crystal contamination. Further, the ratio of the epoxy group to the (meth) acryloyl group is not limited, and is appropriately selected from the viewpoint of process compatibility.
Partial epoxy (meth) acrylate in which a part of the epoxy group is acrylic esterified is preferably used. In this case, the ratio of acrylicization is preferably about 30 to 70%.
The component (B-1) may be used alone or in combination of two or more. When the component (B-1) is used in the resin composition of the present invention, it is usually 10 to 80% by mass, preferably 20 to 70% by mass, based on the total amount of the resin composition.
［（Ｂ−２）エポキシ樹脂］
本発明の態様として、上記成分（Ｂ）中に、さらに成分（Ｂ−２）エポキシ樹脂（以下、単に成分（Ｂ−２）ともいう。）が含有される場合がさらに好ましい。
エポキシ樹脂としては特に限定されるものではないが、２官能以上のエポキシ樹脂が好ましく、例えば、レゾルシンジグリシジルエーテル、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＳ型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビスフェノールＡノボラック型エポキシ樹脂、ビスフェノールＦノボラック型エポキシ樹脂、脂環式エポキシ樹脂、脂肪族鎖状エポキシ樹脂、グリシジルエステル型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、ヒダントイン型エポキシ樹脂、イソシアヌレート型エポキシ樹脂、トリフェノールメタン骨格を有するフェノールノボラック型エポキシ樹脂、その他、カテコール、レゾルシノール等の二官能フェノール類のジグリシジルエーテル化物、二官能アルコール類のジグリシジルエーテル化物、およびそれらのハロゲン化物、水素添加物などが挙げられる。これらのうち液晶汚染性の観点から、ビスフェノールＡ型エポキシ樹脂やレゾルシンジグリシジルエーテルが好ましい。
成分（Ｂ−２）は単独で用いても良いし、２種類以上を用いても良い。本発明の樹脂組成物において、成分（Ｂ−２）を使用する場合には、樹脂組成物総量中、通常５〜５０質量％、好ましくは５〜３０質量％である。
[(B-2) Epoxy resin]
As an aspect of the present invention, it is more preferable that the component (B) further contains the component (B-2) epoxy resin (hereinafter, also simply referred to as the component (B-2)).
The epoxy resin is not particularly limited, but a bifunctional or higher functional epoxy resin is preferable, and for example, resorcindiglycidyl ether, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type. Epoxy resin, cresol novolac type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol F novolak type epoxy resin, alicyclic epoxy resin, aliphatic chain epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, hidden type Epoxy resin, isocyanurate type epoxy resin, phenol novolac type epoxy resin having a triphenol methane skeleton, diglycidyl etherified products of bifunctional phenols such as catechol and resorcinol, diglycidyl etherified products of bifunctional alcohols, and them. Examples thereof include halides and hydrogen additives. Of these, bisphenol A type epoxy resin and resorcinol diglycidyl ether are preferable from the viewpoint of liquid crystal contamination.
The component (B-2) may be used alone or in combination of two or more. When the component (B-2) is used in the resin composition of the present invention, it is usually 5 to 50% by mass, preferably 5 to 30% by mass, based on the total amount of the resin composition.
［（Ｃ）有機フィラー］
本発明のディスプレイ用封止剤は、成分（Ｃ）として有機フィラー（以下、単に「成分（Ｃ）」ともいう。）を含有しても良い。上記有機フィラーとしては、例えばウレタン微粒子、アクリル微粒子、スチレン微粒子、スチレンオレフィン微粒子及びシリコーン微粒子が挙げられる。なおシリコーン微粒子としてはＫＭＰ−５９４、ＫＭＰ−５９７、ＫＭＰ−５９８（信越化学工業製）、トレフィルＲＴＭＥ−５５００、９７０１、ＥＰ−２００１（東レダウコーニング社製）が好ましく、ウレタン微粒子としてはＪＢ−８００Ｔ、ＨＢ−８００ＢＫ（根上工業株式会社）、スチレン微粒子としてはラバロンＲＴＭＴ３２０Ｃ、Ｔ３３１Ｃ、ＳＪ４４００、ＳＪ５４００、ＳＪ６４００、ＳＪ４３００Ｃ、ＳＪ５３００Ｃ、ＳＪ６３００Ｃ（三菱化学製）が好ましく、スチレンオレフィン微粒子としてはセプトンＲＴＭＳＥＰＳ２００４、ＳＥＰＳ２０６３が好ましい。
これら有機フィラーは単独で用いても良いし、２種以上を併用しても良い。また２種以上を用いてコアシェル構造としても良い。これらのうち、好ましくは、アクリル微粒子、シリコーン微粒子である。
上記アクリル微粒子を使用する場合、２種類のアクリルゴムからなるコアシェル構造のアクリルゴムである場合が好ましく、特に好ましくはコア層がｎ−ブチルアクリレートであり、シェル層がメチルメタクリレートであるものが好ましい。これはゼフィアックＲＴＭＦ−３５１としてアイカ工業株式会社から販売されている。
また、上記シリコーン微粒子としては、オルガノポリシロキサン架橋物粉体、直鎖のジメチルポリシロキサン架橋物粉体等があげられる。また、複合シリコーンゴムとしては、上記シリコーンゴムの表面にシリコーン樹脂（例えば、ポリオルガノシルセスキオキサン樹脂）を被覆したものがあげられる。これらの微粒子のうち、特に好ましいのは、直鎖のジメチルポリシロキサン架橋粉末のシリコーンゴム又はシリコーン樹脂被覆直鎖ジメチルポリシロキサン架橋粉末の複合シリコーンゴム微粒子である。これらのものは、単独で用いても良いし、２種以上を併用しても良い。また、好ましくは、ゴム粉末の形状は、添加後の粘度の増粘が少ない球状が良い。本発明のディスプレイ用封止剤において、成分（Ｃ）を使用する場合には、ディスプレイ用封止剤の総量中、通常５〜５０質量％、好ましくは５〜４０質量％である。
[(C) Organic filler]
The display encapsulant of the present invention may contain an organic filler (hereinafter, also simply referred to as “component (C)”) as the component (C). Examples of the organic filler include urethane fine particles, acrylic fine particles, styrene fine particles, styrene olefin fine particles, and silicone fine particles. The silicone fine particles are preferably KMP-594, KMP-597, KMP-598 (manufactured by Shin-Etsu Chemical Co., Ltd.), Trefil RTM E-5500, 9701, EP-2001 (manufactured by Toray Dow Corning), and the urethane fine particles are JB- 800T, HB-800BK (Negami Kogyo Co., Ltd.), Lavalon RTM T320C, T331C, SJ4400, SJ5400, SJ6400, SJ4300C, SJ5300C, SJ6300C (manufactured by Mitsubishi Chemical Corporation) are preferable as styrene fine particles, and Septon RTM SEPS2004, as styrene olefin fine particles. SEPS2063 is preferable.
These organic fillers may be used alone or in combination of two or more. Further, a core-shell structure may be formed by using two or more types. Of these, acrylic fine particles and silicone fine particles are preferable.
When the above acrylic fine particles are used, it is preferably an acrylic rubber having a core-shell structure composed of two types of acrylic rubber, and particularly preferably the core layer is n-butyl acrylate and the shell layer is methyl methacrylate. It is sold by Aica Kogyo Co., Ltd. as Zephyac RTM F-351.
Examples of the silicone fine particles include organopolysiloxane crosslinked powder and linear dimethylpolysiloxane crosslinked powder. Further, examples of the composite silicone rubber include those in which the surface of the silicone rubber is coated with a silicone resin (for example, polyorganosylsesquioxane resin). Of these fine particles, particularly preferable are silicone rubber of linear dimethylpolysiloxane crosslinked powder or composite silicone rubber fine particles of silicone resin-coated linear dimethylpolysiloxane crosslinked powder. These may be used alone or in combination of two or more. Further, preferably, the shape of the rubber powder is a spherical shape with less thickening of viscosity after addition. When the component (C) is used in the display encapsulant of the present invention, it is usually 5 to 50% by mass, preferably 5 to 40% by mass, based on the total amount of the display encapsulant.
［（Ｄ）熱硬化剤］
本発明のディスプレイ用封止剤は、成分（Ｄ）として熱硬化剤（以下、単に「成分（Ｄ）」ともいう。）を添加して、反応性の向上を図ることができる。
成分（Ｄ）としては、例えば、分子内に芳香環に結合したカルボキシ基を有する化合物、多価アミン類、多価フェノール類、有機酸ヒドラジド等を挙げることができる。ただしこれらに限定されるものではない。例えば、芳香族ヒドラジドであるテレフタル酸ジヒドラジド、イソフタル酸ジヒドラジド、２，６−ナフトエ酸ジヒドラジド、２，６−ピリジンジヒドラジド、１，２，４−ベンゼントリヒドラジド、１，４，５，８−ナフトエ酸テトラヒドラジド、ピロメリット酸テトラヒドラジド等をあげることが出来る。また、脂肪族ヒドラジドであれば、例えば、ホルムヒドラジド、アセトヒドラジド、プロピオン酸ヒドラジド、シュウ酸ジヒドラジド、マロン酸ジヒドラジド、コハク酸ジヒドラジド、グルタル酸ジヒドラジド、アジピン酸ジヒドラジド、ピメリン酸ジヒドラジド、セバシン酸ジヒドラジド、１，４−シクロヘキサンジヒドラジド、酒石酸ジヒドラジド、リンゴ酸ジヒドラジド、イミノジ酢酸ジヒドラジド、Ｎ，Ｎ’−ヘキサメチレンビスセミカルバジド、クエン酸トリヒドラジド、ニトリロ酢酸トリヒドラジド、シクロヘキサントリカルボン酸トリヒドラジド、１，３−ビス（ヒドラジノカルボノエチル）−５−イソプロピルヒダントイン等のヒダントイン骨格、好ましくはバリンヒダントイン骨格（ヒダントイン環の炭素原子がイソプロピル基で置換された骨格）を有するジヒドラジド、トリス（１−ヒドラジノカルボニルメチル）イソシアヌレート、トリス（２−ヒドラジノカルボニルエチル）イソシアヌレート、トリス（１−ヒドラジノカルボニルエチル）イソシアヌレート、トリス（３−ヒドラジノカルボニルプロピル）イソシアヌレート、ビス（２−ヒドラジノカルボニルエチル）イソシアヌレート等をあげることができる。硬化反応性と潜在性のバランスから好ましくは、イソフタル酸ジヒドラジド、マロン酸ジヒドラジド、アジピン酸ジヒドラジド、トリス（１−ヒドラジノカルボニルメチル）イソシアヌレート、トリス（１−ヒドラジノカルボニルエチル）イソシアヌレート、トリス（２−ヒドラジノカルボニルエチル）イソシアヌレート、トリス（３−ヒドラジノカルボニルプロピル）イソシアヌレートであり、特に好ましくはトリス（２−ヒドラジノカルボニルエチル）イソシアヌレートである。
成分（Ｄ）としては分子内に芳香環に結合したカルボキシ基を有する化合物を使用することが好ましく、例えば、４−ヒドロキシ安息香酸、チオサリチル酸、テレフタル酸、シトラジン酸、４−アミノ安息香酸、４−（アミノメチル）安息香酸、２−メルカプトニコチン酸を挙げることができる。
成分（Ｄ）は単独で用いても良いし、２種類以上を混合しても良い。本発明のディスプレイ用封止剤において、成分（Ｄ）を使用する場合には、ディスプレイ用封止剤総量中、通常０．１〜１０質量％、好ましくは０．１〜５質量％である。
[(D) Thermosetting agent]
In the display encapsulant of the present invention, a thermosetting agent (hereinafter, also simply referred to as “component (D)”) can be added as the component (D) to improve the reactivity.
Examples of the component (D) include compounds having a carboxy group bonded to an aromatic ring in the molecule, polyvalent amines, polyhydric phenols, organic acid hydrazide and the like. However, it is not limited to these. For example, the aromatic hydrazides terephthalic acid dihydrazide, isophthalic acid dihydrazide, 2,6-naphthoic acid dihydrazide, 2,6-pyridinedihydrazide, 1,2,4-benzenetrihydrazide, 1,4,5,8-naphthoic acid. Examples include tetrahydrazide and tetrahydrazide pyromellitic acid. In the case of aliphatic hydrazides, for example, form hydrazide, acetohydrazide, propionic acid hydrazide, oxalic acid dihydrazide, malonic acid dihydrazide, succinic acid dihydrazide, glutarate dihydrazide, adipic acid dihydrazide, pimeric acid dihydrazide, and sebacic acid dihydrazide. , 4-Cyclohexanedihydrazide, tartrate dihydrazide, malic acid dihydrazide, iminodiacetate dihydrazide, N, N'-hexamethylenebis semicarbazide, citrate trihydrazide, nitriloacetate trihydrazide, cyclohexanetricarboxylic acid trihydrazide, 1,3-bis Dihydrazide, tris (1-hydradinocarbonylmethyl) isocyanurate having a hydrandin skeleton such as dinocarbonoethyl) -5-isopropylhydranthin, preferably a valine hydrandin skeleton (a skeleton in which the carbon atom of the hydratoin ring is replaced with an isopropyl group) , Tris (2-hydradinocarbonylethyl) isocyanurate, tris (1-hydradinocarbonylethyl) isocyanurate, tris (3-hydradinocarbonylpropyl) isocyanurate, bis (2-hydradinocarbonylethyl) isocyanurate, etc. I can give it. From the balance of curing reactivity and potential, preferred isiophthalic acid dihydrazide, malonic acid dihydrazide, adipate dihydrazide, tris (1-hydrazinocarbonylmethyl) isocyanurate, tris (1-hydrazinocarbonylethyl) isocyanurate, tris ( 2-Hydradinocarbonylethyl) isocyanurate, tris (3-hydrazinocarbonylpropyl) isocyanurate, and particularly preferably tris (2-hydrazinocarbonylethyl) isocyanurate.
As the component (D), it is preferable to use a compound having a carboxy group bonded to an aromatic ring in the molecule. For example, 4-hydroxybenzoic acid, thiosalicylic acid, terephthalic acid, citradic acid, 4-aminobenzoic acid, 4 − (Aminomethyl) benzoic acid and 2-mercaptonicotinic acid can be mentioned.
The component (D) may be used alone or in combination of two or more. When the component (D) is used in the display encapsulant of the present invention, it is usually 0.1 to 10% by mass, preferably 0.1 to 5% by mass, based on the total amount of the display encapsulant.
本発明のディスプレイ用封止剤は、硬化触媒を添加して、さらに反応性の向上を図ることができる。硬化触媒としては、アミン類やイミダゾール類を挙げることができるが、イミダゾール類が特に好適である。イミダゾール類としては、２−メチルイミダゾール、２−フェニルイミダゾール、２−ウンデシルイミダゾール、２−ヘプタデシルイミダゾール、２−フェニル−４−メチルイミダゾール、１−ベンジル−２−フェニルイミダゾール、１−ベンジル−２−メチルイミダゾール、１−シアノエチル−２−メチルイミダゾール、１−シアノエチル−２−フェニルイミダゾール、１−シアノエチル−２−ウンデシルイミダゾール、２，４−ジアミノ−６（２’−メチルイミダゾール（１’））エチル−ｓ−トリアジン、２，４−ジアミノ−６（２’−ウンデシルイミダゾール（１’））エチル−ｓ−トリアジン、２，４−ジアミノ−６（２’−エチル−４−メチルイミダゾール（１’））エチル−ｓ−トリアジン、２，４−ジアミノ−６（２’−メチルイミダゾール（１’））エチル−ｓ−トリアジン・イソシアヌル酸付加物、２−メチルイミダゾールイソシアヌル酸の２：３付加物、２−フェニルイミダゾールイソシアヌル酸付加物、２−フェニル−３，５−ジヒドロキシメチルイミダゾール、２−フェニル−４−ヒドロキシメチル−５−メチルイミダゾール、１−シアノエチル−２−フェニル−３，５−ジシアノエトキシメチルイミダゾール等が挙げられる。 The display encapsulant of the present invention can further improve the reactivity by adding a curing catalyst. Examples of the curing catalyst include amines and imidazoles, but imidazoles are particularly preferable. Examples of imidazoles include 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-2. -Methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 2,4-diamino-6 (2'-methylimidazole (1')) Ethyl-s-triazine, 2,4-diamino-6 (2'-undecylimidazole (1')) Ethyl-s-triazine, 2,4-diamino-6 (2'-ethyl-4-methylimidazole (1') ')) Ethyl-s-triazine, 2,4-diamino-6 (2'-methylimidazole (1')) ethyl-s-triazine isocyanuric acid adduct, 2-methylimidazole isocyanuric acid 2: 3 adduct , 2-Phenylimidazole isocyanuric acid adduct, 2-phenyl-3,5-dihydroxymethylimidazole, 2-phenyl-4-hydroxymethyl-5-methylimidazole, 1-cyanoethyl-2-phenyl-3,5-dicyanoethoxy Examples thereof include methylimidazole.
［（Ｅ）光ラジカル重合開始剤］
本発明のディスプレイ用封止剤は、成分（Ｅ）として光ラジカル重合開始剤（以下、単に「成分（Ｅ）」ともいう。）を含有しても良い。光ラジカル重合開始剤としては、紫外線や可視光の照射によって、ラジカルや酸を発生し、連鎖重合反応を開始させる化合物であれば特に限定されないが、例えば、ベンジルジメチルケタール、１−ヒドロキシシクロヘキシルフェニルケトン、ジエチルチオキサントン、ベンゾフェノン、２−エチルアンスラキノン、２−ヒドロキシ−２−メチルプロピオフェノン、２−メチル−〔４−（メチルチオ）フェニル〕−２−モルフォリノ−１−プロパン、２，４，６−トリメチルベンゾイルジフェニルホスヒンオキサイド、カンファーキノン、９−フルオレノン、ジフェニルジスルヒド等を挙げることができる。具体的には、ＩＲＧＡＣＵＲＥＲＴＭ６５１、１８４、２９５９、１２７、９０７、３６９、３７９ＥＧ、８１９、７８４、７５４、５００、ＯＸＥ０１、ＯＸＥ０２、ＯＸＥ０３、ＯＸＥ０４、ＤＡＲＯＣＵＲＥＲＴＭ１１７３、ＬＵＣＩＲＩＮＲＴＭＴＰＯ（いずれもＢＡＳＦ社製）、セイクオールＲＴＭＺ、ＢＺ、ＢＥＥ、ＢＩＰ、ＢＢＩ（いずれも精工化学株式会社製）等を挙げることができる。これらの中で、好ましくは、オキシムエステル系開始剤であるＩＲＧＡＣＵＲＥＲＴＭＯＸＥ０１、ＯＸＥ０２、ＯＸＥ０３、ＯＸＥ０４である。
また、液晶汚染性の観点から、分子内に（メタ）アクリル基を有するものを使用する事が好ましく、例えば２−メタクリロイルオキシエチルイソシアネートと１−［４−（２−ヒドロキシエトキシ）−フェニル］−２−ヒドロキシ−２メチル−１−プロパン−１−オンとの反応生成物が好適に用いられる。この化合物は国際公開第２００６／０２７９８２号記載の方法にて製造して得ることができる。
本発明のディスプレイ用封止剤において、成分（Ｅ）を使用する場合には、ディスプレイ用封止剤総量中、通常０．００１〜３質量％、好ましくは０．００２〜２質量％である。
[(E) Photoradical polymerization initiator]
The display encapsulant of the present invention may contain a photoradical polymerization initiator (hereinafter, also simply referred to as “component (E)”) as the component (E). The photoradical polymerization initiator is not particularly limited as long as it is a compound that generates radicals or acids by irradiation with ultraviolet rays or visible light to initiate a chain polymerization reaction, and is, for example, benzyldimethylketal or 1-hydroxycyclohexylphenylketone. , Diethylthioxanthone, benzophenone, 2-ethylanthraquinone, 2-hydroxy-2-methylpropiophenone, 2-methyl- [4- (methylthio) phenyl] -2-morpholino-1-propane, 2,4,6- Examples thereof include trimethylbenzoyldiphenylphosphine oxide, camphorquinone, 9-fluorenone, diphenyldisulfide and the like. Specifically, IRGACURE RTM 651, 184, 2959, 127, 907, 369, 379EG, 819, 784, 754, 500, OXE01, OXE02, OXE03, OXE04, DAROCURE RTM 1173, LUCIRIN RTM TPO (all manufactured by BASF). ), Sequol RTM Z, BZ, BEE, BIP, BBI (all manufactured by Seiko Kagaku Co., Ltd.) and the like. Of these, IRGACURE RTM OXE01, OXE02, OXE03, and OXE04, which are oxime ester-based initiators, are preferable.
Further, from the viewpoint of liquid crystal contamination, it is preferable to use one having a (meth) acrylic group in the molecule, for example, 2-methacryloyloxyethyl isocyanate and 1- [4- (2-hydroxyethoxy) -phenyl]-. The reaction product with 2-hydroxy-2methyl-1-propane-1-one is preferably used. This compound can be produced and obtained by the method described in International Publication No. 2006/027982.
When the component (E) is used in the display encapsulant of the present invention, it is usually 0.001 to 3% by mass, preferably 0.002 to 2% by mass, based on the total amount of the display encapsulant.
［（Ｆ）熱ラジカル重合開始剤］
本発明のディスプレイ用封止剤は、（Ｆ）熱ラジカル重合開始剤（以下、単に「成分（Ｆ）」ともいう。）を含有して、硬化速度、硬化性を向上することができる。
熱ラジカル重合開始剤は、加熱によりラジカルを生じ、連鎖重合反応を開始させる化合物であれば特に限定されないが、有機過酸化物、アゾ化合物、ベンゾイン化合物、ベンゾインエーテル化合物、アセトフェノン化合物、ベンゾピナコール等が挙げられ、ベンゾピナコールが好適に用いられる。例えば、有機過酸化物としては、カヤメックＲＴＭＡ、Ｍ、Ｒ、Ｌ、ＬＨ、ＳＰ−３０Ｃ、パーカドックスＣＨ−５０Ｌ、ＢＣ−ＦＦ、カドックスＢ−４０ＥＳ、パーカドックス１４、トリゴノックスＲＴＭ２２−７０Ｅ、２３−Ｃ７０、１２１、１２１−５０Ｅ、１２１−ＬＳ５０Ｅ、２１−ＬＳ５０Ｅ、４２、４２ＬＳ、カヤエステルＲＴＭＰ−７０、ＴＭＰＯ−７０、ＣＮＤ−Ｃ７０、ＯＯ−５０Ｅ、ＡＮ、カヤブチルＲＴＭＢ、パーカドックス１６、カヤカルボンＲＴＭＢＩＣ−７５、ＡＩＣ−７５（化薬アクゾ株式会社製）、パーメックＲＴＭＮ、Ｈ、Ｓ、Ｆ、Ｄ、Ｇ、パーヘキサＲＴＭＨ、ＨＣ、ＴＭＨ、Ｃ、Ｖ、２２、ＭＣ、パーキュアーＲＴＭＡＨ、ＡＬ、ＨＢ、パーブチルＲＴＭＨ、Ｃ、ＮＤ、Ｌ、パークミルＲＴＭＨ、Ｄ、パーロイルＲＴＭＩＢ、ＩＰＰ、パーオクタＲＴＭＮＤ（日油株式会社製）などが市販品として入手可能である。
[(F) Thermal Radical Polymerization Initiator]
The display encapsulant of the present invention contains (F) a thermal radical polymerization initiator (hereinafter, also simply referred to as “component (F)”), and can improve the curing rate and curability.
The thermal radical polymerization initiator is not particularly limited as long as it is a compound that generates radicals by heating and initiates a chain polymerization reaction, but organic peroxides, azo compounds, benzoin compounds, benzoin ether compounds, acetophenone compounds, benzopinacol and the like can be used. Benzopinacol is preferably used. For example, as organic peroxides, Kayamec RTM A, M, R, L, LH, SP-30C, Parkadox CH-50L, BC-FF, Cadox B-40ES, Parkadox 14, Trigonox RTM 22-70E, 23-C70, 121, 121-50E, 121-LS50E, 21-LS50E, 42, 42LS, Kayaester RTM P-70, TMPO-70, CND-C70, OO-50E, AN, Kayabutyl RTM B, Parkadox 16 , Kaya Carvone RTM BIC-75, AIC-75 (manufactured by Kayaku Akzo Corporation), Permec RTM N, H, S, F, D, G, Perhexa RTM H, HC, TMH, C, V, 22, MC, Percure RTM AH, AL, HB, Perbutyl RTM H, C, ND, L , Percumyl RTM H, D, PEROYL RTM IB, IPP, Perocta RTM ND (manufactured by NOF Corporation) and the like are commercially available.
また、アゾ化合物としては、ＶＡ−０４４、０８６、Ｖ−０７０、ＶＰＥ−０２０１、ＶＳＰ−１００１（和光純薬工業株式会社製）等が市販品として入手可能である。 Further, as the azo compound, VA-044, 086, V-070, VPE-0201, VSP-1001 (manufactured by Wako Pure Chemical Industries, Ltd.) and the like are available as commercial products.
成分（Ｆ）の含有量としては、本発明のディスプレイ用封止剤の総量中、０．０００１〜１０質量％であることが好ましく、さらに好ましくは０．０００５〜５質量％であり、０．００１〜３質量％が特に好ましい。 The content of the component (F) is preferably 0.0001 to 10% by mass, more preferably 0.0005 to 5% by mass, based on the total amount of the display encapsulant of the present invention. 001 to 3% by mass is particularly preferable.
本発明のディスプレイ用封止剤には、さらに必要に応じて、無機フィラー、シランカップリング剤、ラジカル重合防止剤、顔料、レベリング剤、消泡剤、溶剤などの添加剤を配合することができる。 The display encapsulant of the present invention may further contain additives such as an inorganic filler, a silane coupling agent, a radical polymerization inhibitor, a pigment, a leveling agent, a defoaming agent, and a solvent, if necessary. ..
［無機フィラー］
上記無機フィラーとしては、シリカ、シリコンカーバイド、窒化珪素、窒化ホウ素、炭酸カルシウム、炭酸マグネシウム、硫酸バリウム、硫酸カルシウム、マイカ、タルク、クレー、アルミナ、酸化マグネシウム、酸化ジルコニウム、水酸化アルミニウム、水酸化マグネシウム、珪酸カルシウム、珪酸アルミニウム、珪酸リチウムアルミニウム、珪酸ジルコニウム、チタン酸バリウム、硝子繊維、炭素繊維、二硫化モリブデン、アスベスト等が挙げられ、好ましくは溶融シリカ、結晶シリカ、窒化珪素、窒化ホウ素、炭酸カルシウム、硫酸バリウム、硫酸カルシウム、マイカ、タルク、クレー、アルミナ、水酸化アルミニウム、珪酸カルシウム、珪酸アルミニウムが挙げられるが、好ましくはシリカ、アルミナ、タルクである。これら無機フィラーは２種以上を混合して用いても良い。
無機フィラーの平均粒子径は、大きすぎると狭ギャップの液晶表示セル製造時に上下ガラス基板の貼り合わせ時のギャップ形成がうまくできない等の不良要因となるため、２０００ｎｍ以下が適当であり、好ましくは１０００ｎｍ以下、さらに好ましくは３００ｎｍ以下である。また好ましい下限は１０ｎｍ程度であり、さらに好ましくは１００ｎｍ程度である。粒子径はレーザー回折・散乱式粒度分布測定器（乾式）（株式会社セイシン企業製；ＬＭＳ−３０）により測定することができる。
本発明のディスプレイ用封止剤において、無機フィラーを使用する場合には、ディスプレイ用封止剤の総量中、通常５〜５０質量％、好ましくは５〜４０質量％である。無機フィラーの含有量が５質量％より低い場合、ガラス基板に対する接着強度が低下し、また耐湿信頼性も劣るために、吸湿後の接着強度の低下も大きくなる場合がある。又、無機フィラーの含有量が５０質量％より多い場合、フィラー含有量が多すぎるため、つぶれにくく液晶セルのギャップ形成ができなくなってしまう場合がある。
[Inorganic filler]
Examples of the inorganic filler include silica, silicon carbide, silicon nitride, boron nitride, calcium carbonate, magnesium carbonate, barium sulfate, calcium sulfate, mica, talc, clay, alumina, magnesium oxide, zirconium oxide, aluminum hydroxide, and magnesium hydroxide. , Calcium silicate, aluminum silicate, lithium aluminum silicate, zirconium silicate, barium titanate, glass fiber, carbon fiber, molybdenum disulfide, asbestos, etc., preferably molten silica, crystalline silica, silicon nitride, boron nitride, calcium carbonate. , Calcium sulfate, calcium sulfate, mica, talc, clay, alumina, aluminum hydroxide, calcium silicate, aluminum silicate, and preferred are silica, alumina, and talc. Two or more kinds of these inorganic fillers may be mixed and used.
If the average particle size of the inorganic filler is too large, it may cause defects such as poor formation of gaps when the upper and lower glass substrates are bonded when manufacturing a liquid crystal display cell having a narrow gap. Therefore, 2000 nm or less is appropriate, preferably 1000 nm. Below, it is more preferably 300 nm or less. The lower limit is preferably about 10 nm, and more preferably about 100 nm. The particle size can be measured by a laser diffraction / scattering type particle size distribution measuring device (dry type) (manufactured by Seishin Enterprise Co., Ltd .; LMS-30).
When an inorganic filler is used in the display encapsulant of the present invention, it is usually 5 to 50% by mass, preferably 5 to 40% by mass, based on the total amount of the display encapsulant. When the content of the inorganic filler is lower than 5% by mass, the adhesive strength to the glass substrate is lowered, and the moisture resistance reliability is also poor, so that the adhesive strength after moisture absorption may be greatly reduced. Further, when the content of the inorganic filler is more than 50% by mass, the filler content is too large, so that it is difficult to be crushed and the gap of the liquid crystal cell may not be formed.
［シランカップリング剤］
上記シランカップリング剤としては、３−グリシドキシプロピルトリメトキシシラン、３−グリシドキシプロピルメチルジメトキシシラン、３−グリシドキシプロピルメチルジエトキシシラン、２−（３，４−エポキシシクロヘキシル）エチルトリメトキシシラン、Ｎ−フェニル−γ−アミノプロピルトリメトキシシラン、Ｎ−（２−アミノエチル）３−アミノプロピルメチルジメトキシシラン、Ｎ−（２−アミノエチル）３−アミノプロピルメチルトリメトキシシラン、３−アミノプロピルトリエトキシシラン、３−メルカプトプロピルトリメトキシシラン、ビニルトリメトキシシラン、Ｎ−（２−（ビニルベンジルアミノ）エチル）３−アミノプロピルトリメトキシシラン塩酸塩、３−メタクリロキシプロピルトリメトキシシラン、３−クロロプロピルメチルジメトキシシラン、３−クロロプロピルトリメトキシシラン等が挙げられる。これらのシランカップリング剤はＫＢＭシリーズ、ＫＢＥシリーズ等として信越化学工業株式会社等によって販売されている為、市場から容易に入手可能である。本発明のディスプレイ用封止剤において、シランカップリング剤を使用する場合には、ディスプレイ用封止剤総量中、０．０５〜３質量％が好適である。
[Silane coupling agent]
Examples of the silane coupling agent include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 2- (3,4-epoxycyclohexyl) ethyl. Trimethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, N- (2-aminoethyl) 3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) 3-aminopropylmethyltrimethoxysilane, 3 -Aminopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, vinyltrimethoxysilane, N- (2- (vinylbenzylamino) ethyl) 3-aminopropyltrimethoxysilane hydrochloride, 3-methacryloxypropyltrimethoxysilane , 3-Chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane and the like. Since these silane coupling agents are sold by Shin-Etsu Chemical Co., Ltd. as KBM series, KBE series, etc., they are easily available from the market. When a silane coupling agent is used in the display encapsulant of the present invention, 0.05 to 3% by mass is preferable in the total amount of the display encapsulant.
［ラジカル重合防止剤］
上記ラジカル重合防止剤としては、光ラジカル重合開始剤や熱ラジカル重合開始剤等から発生するラジカルと反応して重合を防止する化合物であれば特に限定されるものではなく、キノン系、ピペリジン系、ヒンダードフェノール系、ニトロソ系等を用いることができる。具体的には、ナフトキノン、２−ヒドロキシナフトキノン、２−メチルナフトキノン、２−メトキシナフトキノン、２，２，６，６−テトラメチルピペリジン−１−オキシル、２，２，６，６−テトラメチル−４−ヒドロキシピペリジン−１−オキシル、２，２，６，６−テトラメチル−４−メトキシピペリジン−１−オキシル、２，２，６，６−テトラメチル−４−フェノキシピペリジン−１−オキシル、ハイドロキノン、２−メチルハイドロキノン、２−メトキシハイドロキノン、パラベンゾキノン、ブチル化ヒドロキシアニソール、２，６−ジ−ｔ−ブチル−４−エチルフェノール、２，６−ジ−ｔ−ブチルクレゾール、ステアリルβ−（３，５−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネート、２，２’−メチレンビス（４−エチル−６−ｔ−ブチルフェノール）、４，４’−チオビス（３−メチル−６−ｔ−ブチルフェノール）、４，４’−ブチリデンビス（３−メチル−６−ｔ−ブチルフェノール）、３，９−ビス［１，１−ジメチル−２−［β―（３−ｔ−ブチル−４−ヒドロキシ−５−メチルフェニル）プロピオニルオキシ］エチル］、２，４，８，１０−テトラオキサスピロ［５，５］ウンデカン、テトラキス−［メチレン−３−（３’，５’−ジ−ｔ−ブチル−４’−ヒドロキシフェニルプロピオネート）メタン］、１，３，５−トリス（３’，５’−ジ−ｔ−ブチル−４’−ヒドロキシベンジル）−ｓｅｃ−トリアジン−２，４，６−（１Ｈ，３Ｈ，５Ｈ）トリオン、パラメトキシフェノール、４−メトキシ−１−ナフトール、チオジフェニルアミン、Ｎ−ニトロソフェニルヒドロキシアミンのアルミニウム塩、商品名アデカスタブＬＡ−８１、商品名アデカスタブＬＡ−８２（株式会社アデカ製）等が挙げられるが、これらに限定されるものではない。これらのうちナフトキノン系、ハイドロキノン系、ニトロソ系、ピペラジン系のラジカル重合防止剤が好ましく、ナフトキノン、２−ヒドロキシナフトキノン、ハイドロキノン、２，６−ジ−ｔｅｒｔ−ブチル−Ｐ−クレゾール、ポリストップ７３００Ｐ（伯東株式会社製）が更に好ましく、ポリストップ７３００Ｐ（伯東株式会社製）が最も好ましい。
ラジカル重合防止剤の含有量としては本発明のディスプレイ用封止剤総量中、０．０００１〜１質量％が好ましく、０．００１〜０．５質量％が更に好ましく、０．０１〜０．２質量％が特に好ましい。
[Radical polymerization inhibitor]
The radical polymerization inhibitor is not particularly limited as long as it is a compound that reacts with radicals generated from a photoradical polymerization initiator, a thermal radical polymerization initiator, or the like to prevent polymerization, and is not particularly limited. Hindered phenol type, nitroso type and the like can be used. Specifically, naphthoquinone, 2-hydroxynaphthoquinone, 2-methylnaphthoquinone, 2-methoxynaphthoquinone, 2,2,6,6-tetramethylpiperidin-1-oxyl, 2,2,6,6-tetramethyl-4. -Hydroxypiperidine-1-oxyl, 2,2,6,6-tetramethyl-4-methoxypiperidine-1-oxyl, 2,2,6,6-tetramethyl-4-phenoxypiperidine-1-oxyl, hydroquinone, 2-Methylhydroquinone, 2-methoxyhydroquinone, parabenzoquinone, butylated hydroxyanisol, 2,6-di-t-butyl-4-ethylphenol, 2,6-di-t-butylcresol, stearyl β- (3, 5-di-t-butyl-4-hydroxyphenyl) propionate, 2,2'-methylenebis (4-ethyl-6-t-butylphenol), 4,4'-thiobis (3-methyl-6-t-butylphenol) , 4,4'-Butylidenebis (3-methyl-6-t-butylphenol), 3,9-bis [1,1-dimethyl-2- [β- (3-t-butyl-4-hydroxy-5-methyl) Phenyl) propionyloxy] ethyl], 2,4,8,10-tetraoxaspiro [5,5] undecane, tetrakis- [methylene-3- (3', 5'-di-t-butyl-4'-hydroxy) Phenylpropionate) Methyl], 1,3,5-tris (3', 5'-di-t-butyl-4'-hydroxybenzyl) -sec-triazine-2,4,6- (1H, 3H, 5H) ) Trion, paramethoxyphenol, 4-methoxy-1-naphthol, thiodiphenylamine, aluminum salt of N-nitrosophenylhydroxyamine, trade name Adecastab LA-81, trade name Adecastab LA-82 (manufactured by Adeca Co., Ltd.), etc. However, it is not limited to these. Of these, naphthoquinone-based, hydroquinone-based, nitroso-based, and piperazine-based radical polymerization inhibitors are preferable, and naphthoquinone, 2-hydroxynaphthoquinone, hydroquinone, 2,6-di-tert-butyl-P-cresol, and polystop 7300P (Hakuto). (Manufactured by Hakuto Co., Ltd.) is more preferable, and Polystop 7300P (manufactured by Hakuto Co., Ltd.) is most preferable.
The content of the radical polymerization inhibitor is preferably 0.0001 to 1% by mass, more preferably 0.001 to 0.5% by mass, and 0.01 to 0.2, based on the total amount of the display encapsulant of the present invention. Mass% is particularly preferred.
本発明のディスプレイ用封止剤を得る方法の一例としては、次に示す方法がある。まず、成分（Ａ）、（Ｂ）に、必要に応じて成分（Ｅ）を加熱溶解する。次いで室温まで冷却後、必要に応じて成分（Ｃ）、（Ｄ）、（Ｆ）、無機フィラー、シランカップリング剤、消泡剤、及びレベリング剤、溶剤等を添加し、公知の混合装置、例えば３本ロール、サンドミル、ボールミル等により均一に混合し、金属メッシュにて濾過することにより本発明のディスプレイ用封止剤を製造することができる。 The following method is used as an example of the method for obtaining the display encapsulant of the present invention. First, the component (E) is heat-dissolved in the components (A) and (B), if necessary. Then, after cooling to room temperature, components (C), (D), (F), an inorganic filler, a silane coupling agent, a defoaming agent, a leveling agent, a solvent and the like are added as necessary, and a known mixing device is used. For example, the display encapsulant of the present invention can be produced by uniformly mixing with a three-roll, sand mill, ball mill or the like and filtering with a metal mesh.
また、本発明のディスプレイ用封止剤は、液晶表示セル用接着剤として、特に液晶シール剤として非常に有用である。本発明のディスプレイ用封止剤を液晶シール剤として用いた場合の、液晶表示セルについて、以下に例を示す。 Further, the sealant for a display of the present invention is very useful as an adhesive for a liquid crystal display cell, particularly as a liquid crystal sealant. An example of a liquid crystal display cell when the sealing agent for a display of the present invention is used as a liquid crystal sealant is shown below.
本発明の液晶表示セル用接着剤を用いて製造される液晶表示セルは、基板に所定の電極を形成した一対の基板を所定の間隔に対向配置し、周囲を本発明の液晶シール剤でシールし、その間隙に液晶が封入されたものである。封入される液晶の種類は特に限定されない。ここで、基板とはガラス、石英、プラスチック、シリコン等からなる少なくとも一方に光透過性がある組み合わせの基板から構成される。その製法としては、本発明の液晶シール剤に、グラスファイバー等のスペーサ（間隙制御材）を添加後、該一対の基板の一方にディスペンサー、またはスクリーン印刷装置等を用いて該液晶シール剤を塗布した後、必要に応じて、８０〜１２０℃で仮硬化を行う。その後、該液晶シール剤の堰の内側に液晶を滴下し、真空中にてもう一方のガラス基板を重ね合わせ、ギャップ出しを行う。ギャップ形成後、９０〜１３０℃で３０分〜２時間硬化することにより本発明の液晶表示セルを得ることができる。また光熱併用型として使用する場合は、紫外線照射機により液晶シール剤部に紫外線を照射させて光硬化させる。紫外線照射量は、好ましくは５００〜６０００ｍＪ／ｃｍ２、より好ましくは１０００〜４０００ｍＪ／ｃｍ２（測定波長：３６５ｎｍ）の照射量が好ましい。その後必要に応じて、９０〜１３０℃で３０分〜２時間硬化することにより本発明の液晶表示セルを得ることができる。このようにして得られた本発明の液晶表示セルは、液晶汚染による表示不良が無く、接着性、耐湿信頼性に優れたものである。スペーサとしては、例えばグラスファイバー、シリカビーズ、ポリマービーズ等があげられる。その直径は、目的に応じ異なるが、通常２〜８μｍ、好ましくは４〜７μｍである。その使用量は、本発明の液晶シール剤１００質量部に対し通常０．１〜４質量部、好ましくは０．５〜２質量部、更に、好ましくは０．９〜１．５質量部程度である。 In a liquid crystal display cell manufactured by using the liquid crystal display cell adhesive of the present invention, a pair of substrates having predetermined electrodes formed on the substrates are arranged facing each other at predetermined intervals, and the periphery is sealed with the liquid crystal sealant of the present invention. However, the liquid crystal is enclosed in the gap. The type of liquid crystal to be enclosed is not particularly limited. Here, the substrate is composed of a combination of substrates made of glass, quartz, plastic, silicon, etc., which has light transmission in at least one of them. As a manufacturing method thereof, after adding a spacer (gap control material) such as glass fiber to the liquid crystal sealant of the present invention, the liquid crystal sealant is applied to one of the pair of substrates using a dispenser, a screen printing device or the like. After that, if necessary, temporary curing is performed at 80 to 120 ° C. After that, the liquid crystal is dropped inside the weir of the liquid crystal sealant, and the other glass substrate is superposed in vacuum to create a gap. After forming the gap, the liquid crystal display cell of the present invention can be obtained by curing at 90 to 130 ° C. for 30 minutes to 2 hours. When used as a combined light and heat type, the liquid crystal sealant portion is irradiated with ultraviolet rays by an ultraviolet irradiator to be photocured. The ultraviolet irradiation amount is preferably 500 to 6000 mJ / cm 2 , more preferably 1000 to 4000 mJ / cm 2 (measurement wavelength: 365 nm). Then, if necessary, the liquid crystal display cell of the present invention can be obtained by curing at 90 to 130 ° C. for 30 minutes to 2 hours. The liquid crystal display cell of the present invention thus obtained is free from display defects due to liquid crystal contamination, and has excellent adhesiveness and moisture resistance and reliability. Examples of the spacer include glass fiber, silica beads, polymer beads and the like. Its diameter varies depending on the purpose, but is usually 2 to 8 μm, preferably 4 to 7 μm. The amount used is usually 0.1 to 4 parts by mass, preferably 0.5 to 2 parts by mass, and more preferably 0.9 to 1.5 parts by mass with respect to 100 parts by mass of the liquid crystal sealant of the present invention. is there.
本発明のディスプレイ用封止剤は、硬化性、異なる被着体への接着性、耐湿熱信頼性の要求される分野の接着剤用途の使用に非常に適するものである。例えば液晶シール剤、有機ＥＬ用封止剤、タッチパネル用接着剤である。 The display encapsulant of the present invention is very suitable for use in adhesive applications in fields where curability, adhesion to different adherends, and moisture resistance and heat reliability are required. For example, a liquid crystal sealant, an organic EL sealant, and a touch panel adhesive.
以下、実施例により本発明を更に詳細に説明するが、本発明は実施例に限定されるものではない。尚、特別の記載のない限り、本文中「部」及び「％」とあるのは質量基準である。 Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to the Examples. Unless otherwise specified, "part" and "%" in the text are based on mass.
［合成例１］
温度計、冷却管、攪拌装置を備えたフラスコに、３−メチル−１，５−ペンタンジオールとセバシン酸とのポリエステルポリオール（株式会社クラレ製Ｐ−２０５０、水酸基価５６．８ｍｇＫＯＨ／ｇ）９８７．９ｇと、トリシクロデカンジメタノール（セラニーズ社製ＴＣＤアルコールＤＭ、分子量１９６．３）９８．２ｇ、イソホロンジイソシアネート（エボニック社製ＶＥＳＴＡＮＡＴ ＩＰＤＩ、分子量２２２．３）４４４．６ｇを仕込み、８０℃で反応させた。
このときのイソシアネート含有量は、過剰のアミンを添加し塩酸にて逆滴定することで求め、その値が計算値から求められるイソシアネートの残留量のプラスマイナス２％の範囲であることを確認した。
次いで、メトキノン（重合禁止剤）０．９ｇ、２−ヒドロキシエチルアクリレート（分子量１１６．１）２３９．２ｇ、ジブチル錫ジラウレート（触媒）０．５ｇを添加し、８０℃にて撹拌し、赤外線吸収スペクトルでイソシアネート基の吸収スペクトル（２２８０ｃｍ−１）が消失するまで反応を行い、重量平均分子量６６００のウレタンアクリレートオリゴマーを得た。
[Synthesis Example 1]
In a flask equipped with a thermometer, a cooling tube, and a stirrer, a polyester polyol containing 3-methyl-1,5-pentanediol and sebacic acid (P-2050 manufactured by Kuraray Co., Ltd., hydroxyl value 56.8 mgKOH / g) 987. 9 g, tricyclodecanedimethanol (TCD alcohol DM manufactured by Ceranies, molecular weight 196.3) 98.2 g, and isophorone diisocyanate (VESTANAT IPDI manufactured by Ebonic, molecular weight 222.3) 444.6 g were charged and reacted at 80 ° C. It was.
The isocyanate content at this time was determined by adding excess amine and back titrating with hydrochloric acid, and it was confirmed that the value was in the range of plus or minus 2% of the residual amount of isocyanate obtained from the calculated value.
Next, 0.9 g of methquinone (polymerization inhibitor), 239.2 g of 2-hydroxyethyl acrylate (molecular weight 116.1), and 0.5 g of dibutyltin dilaurate (catalyst) were added, and the mixture was stirred at 80 ° C. to obtain an infrared absorption spectrum. The reaction was carried out until the absorption spectrum of the isocyanate group (2280 cm -1 ) disappeared to obtain a urethane acrylate oligomer having a weight average molecular weight of 6600.
［合成例２］
温度計、冷却管、攪拌装置を備えたフラスコに、ポリカプロラクトンジオール（株式会社ダイセル製プラクセル２２０、水酸基価５６．７ｍｇＫＯＨ／ｇ）１９７９．２ｇと、イソホロンジイソシアネート（エボニック社製ＶＥＳＴＡＮＡＴ ＩＰＤＩ、分子量２２２．３）４００．１ｇを仕込み、８０℃で反応させた。
このときのイソシアネート含有量は、過剰のアミンを添加し塩酸にて逆滴定することで求め、その値が計算値から求められるイソシアネートの残留量のプラスマイナス２％の範囲であることを確認した。
次いで、メトキノン（重合禁止剤）１．３ｇ、２−ヒドロキシエチルアクリレート（分子量１１６．１）１９１．４ｇ、ジブチル錫ジラウレート（触媒）０．８ｇを添加し、８０℃にて撹拌し、赤外線吸収スペクトルでイソシアネート基の吸収スペクトル（２２８０ｃｍ−１）が消失するまで反応を行い、重量平均分子量１１１００のウレタンアクリレートオリゴマーを得た。
[Synthesis Example 2]
In a flask equipped with a thermometer, a cooling tube, and a stirrer, 1979.2 g of polycaprolactone diol (Plaxel 220 manufactured by Daicel Corporation, hydroxyl value 56.7 mgKOH / g) and isophorone diisocyanate (VESTANAT IPDI manufactured by Ebonic), molecular weight 222. 3) 400.1 g was charged and reacted at 80 ° C.
The isocyanate content at this time was determined by adding excess amine and back titrating with hydrochloric acid, and it was confirmed that the value was in the range of plus or minus 2% of the residual amount of isocyanate obtained from the calculated value.
Next, 1.3 g of methquinone (polymerization inhibitor), 191.4 g of 2-hydroxyethyl acrylate (molecular weight 116.1), and 0.8 g of dibutyltin dilaurate (catalyst) were added, and the mixture was stirred at 80 ° C. to obtain an infrared absorption spectrum. The reaction was carried out until the absorption spectrum of the isocyanate group (2280 cm -1 ) disappeared to obtain a urethane acrylate oligomer having a weight average molecular weight of 11100.
［合成例３］
温度計、冷却管、攪拌装置を備えたフラスコに、水素化ポリブタジエンポリオール（日本曹達株式会社製ＧＩ−１０００、水酸基価６７．２ｍｇＫＯＨ／ｇ）８３５．０ｇと、トリシクロデカンジメタノール（セラニーズ社製ＴＣＤアルコールＤＭ、分子量１９６．３）９８．２ｇ、イソホロンジイソシアネート（エボニック社製ＶＥＳＴＡＮＡＴ ＩＰＤＩ、分子量２２２．３）４４４．６ｇを仕込み、８０℃で反応させた。
このときのイソシアネート含有量は、過剰のアミンを添加し塩酸にて逆滴定することで求め、その値が計算値から求められるイソシアネートの残留量のプラスマイナス２％の範囲であることを確認した。
次いで、メトキノン（重合禁止剤）０．８ｇ、２−ヒドロキシエチルアクリレート（分子量１１６．１）２３９．２ｇ、ジブチル錫ジラウレート（触媒）０．５ｇを添加し、８０℃にて撹拌し、赤外線吸収スペクトルでイソシアネート基の吸収スペクトル（２２８０ｃｍ−１）が消失するまで反応を行い、重量平均分子量５７００のウレタンアクリレートオリゴマーを得た。
[Synthesis Example 3]
In a flask equipped with a thermometer, a cooling tube, and a stirrer, 835.0 g of hydrogenated polybutadiene polyol (GI-1000 manufactured by Nippon Soda Co., Ltd., hydroxyl value 67.2 mgKOH / g) and tricyclodecanedimethanol (manufactured by Ceranies) TCD alcohol DM, molecular weight 196.3) 98.2 g, and isophorone diisocyanate (VESTANAT IPDI manufactured by Ebonic, molecular weight 222.3) 444.6 g were charged and reacted at 80 ° C.
The isocyanate content at this time was determined by adding excess amine and back titrating with hydrochloric acid, and it was confirmed that the value was in the range of plus or minus 2% of the residual amount of isocyanate obtained from the calculated value.
Next, 0.8 g of methquinone (polymerization inhibitor), 239.2 g of 2-hydroxyethyl acrylate (molecular weight 116.1), and 0.5 g of dibutyltin dilaurate (catalyst) were added, and the mixture was stirred at 80 ° C. to obtain an infrared absorption spectrum. The reaction was carried out until the absorption spectrum of the isocyanate group (2280 cm -1 ) disappeared to obtain a urethane acrylate oligomer having a weight average molecular weight of 5700.
［合成例４]
市販ベンゾピナコール（東京化成製）１００部（０．２８モル）をジメチルホルムアルデヒド３５０部に溶解させた。これに塩基触媒としてピリジン３２部（０．４モル）、シリル化剤としてＢＳＴＦＡ（信越化学工業製）１５０部（０．５８モル）を加え７０℃まで昇温し、２時間攪拌した。得られた反応液を冷却し、攪拌しながら、水２００部を入れ、生成物を沈殿させると共に未反応シリル化剤を失活させた。沈殿した生成物をろ別分離した後十分に水洗した。次いで得られた生成物をアセトンに溶解し、水を加えて再結晶させ、精製した。目的の１，２−ビス（トリメチルシロキシ）−１，１，２，２−テトラフェニルエタンを１０５．６部（収率８８．３％）得た。
[Synthesis Example 4]
100 parts (0.28 mol) of commercially available benzopinacol (manufactured by Tokyo Kasei) was dissolved in 350 parts of dimethylformaldehyde. To this, 32 parts (0.4 mol) of pyridine as a base catalyst and 150 parts (0.58 mol) of BSTFA (manufactured by Shin-Etsu Chemical Co., Ltd.) as a silylating agent were added, the temperature was raised to 70 ° C., and the mixture was stirred for 2 hours. The obtained reaction solution was cooled, and 200 parts of water was added while stirring to precipitate the product and inactivate the unreacted silylating agent. The precipitated product was separated by filtration and washed thoroughly with water. The resulting product was then dissolved in acetone, recrystallized by adding water and purified. The target 1,2-bis (trimethylsiloxy) -1,1,2,2-tetraphenylethane was obtained in 105.6 parts (yield 88.3%).
［実施例１〜２、比較例１〜２］
下記表１に示す割合で成分（Ａ）、（Ｂ）、（Ｏ）を混合し、成分（Ｆ）を９０℃で加熱溶解させた後、室温まで冷却し、成分（Ｃ）、（Ｄ）、（Ｅ）、（Ｇ）、（Ｏ）を添加し、攪拌した後、３本ロールミルにて分散させ、金属メッシュ（６３５メッシュ）で濾過し、ディスプレイ用封止剤を調製した。
[Examples 1 and 2, Comparative Examples 1 and 2]
The components (A), (B), and (O) are mixed at the ratios shown in Table 1 below, the component (F) is heated and dissolved at 90 ° C., cooled to room temperature, and the components (C) and (D) are cooled. , (E), (G), and (O) were added, stirred, dispersed by a three-roll mill, and filtered through a metal mesh (635 mesh) to prepare a sealant for display.
［評価］
［接着強度］
ガラス基板に配向膜液（日産化学工業株式会社製：ＲＮ２８８０）をスピンコートし、８０℃ホットプレートで３分仮焼きを行い２３０℃オーブンで３０分焼成した。さらに、この配向膜付き基板をＵＶ照射機により５００ｍＪ／ｃｍ２（測定波長：２５４ｎｍ）の紫外線を照射させ、さらに２３０℃オーブンで３０分焼成した。
実施例及び比較例で製造されたディスプレイ用封止剤１００ｇにスペーサとして５μｍのグラスファイバー１ｇを添加して混合撹拌を行う。配向膜を塗布したガラス基板上に、このディスプレイ用封止剤を１ｃｍ×１ｃｍのコーナー部分を再現する形で塗布し、対向の配向膜塗布基板を貼り合わせＵＶ照射機により３０００ｍＪ／ｃｍ２（測定波長：３６５ｎｍ）の紫外線を照射後、オーブンに投入して１３０℃４０分熱硬化させた。その配向膜塗布ガラス基板の引き剥がし接着強度をボンドテスター（西進商事株式会社製：ＳＳ−３０ＷＤ）にて、コーナー部分を押す形で測定した。強度を表１に示す。
また、配向膜を塗布していないガラス基板において測定した接着強度についても表１に結果を示す。
［透湿度］
実施例及び比較例で製造されたディスプレイ用封止剤をポリエチレンテレフタレート（ＰＥＴ）フィルムに挟み、厚み３００μｍの薄膜としたものにＵＶ照射機により３０００ｍＪ／ｃｍ２（測定波長：３６５ｎｍ）の紫外線を照射後、オーブンに投入して１３０℃４０分熱硬化させ、硬化後ＰＥＴフィルムを剥がしてサンプルとした。サンプルの６０℃９０％での透湿度を透湿度測定機（Ｌｅｓｓｙ社製：Ｌ８０−５０００）にて測定した。結果を表１に示す。
［弾性率］
実施例及び比較例で製造されたディスプレイ用封止剤をポリエチレンテレフタレート（ＰＥＴ）フィルムに挟み、厚み１００μｍの薄膜としたものにＵＶ照射機により３０００ｍＪ／ｃｍ２（測定波長：３６５ｎｍ）の紫外線を照射後、オーブンに投入して１３０℃４０分熱硬化させ、硬化後ＰＥＴフィルムを剥がしてサンプルとした。サンプルをテンシロン万能試験機（株式会社エー・アンド・デイ製、ＲＴＧ−１２１０）を用いて、室温（２２℃）下、試験速度５ｍｍ／分で引張試験を行い測定した。結果を表１に示す。
[Evaluation]
[Adhesive strength]
An alignment film solution (manufactured by Nissan Chemical Industries, Ltd .: RN2880) was spin-coated on a glass substrate, calcined on a hot plate at 80 ° C. for 3 minutes, and fired in an oven at 230 ° C. for 30 minutes. Further, the substrate with the alignment film was irradiated with ultraviolet rays of 500 mJ / cm 2 (measurement wavelength: 254 nm) by a UV irradiator, and further fired in an oven at 230 ° C. for 30 minutes.
1 g of 5 μm glass fiber is added as a spacer to 100 g of the display sealant produced in Examples and Comparative Examples, and mixing and stirring are performed. This display encapsulant is applied on a glass substrate coated with an alignment film in a form that reproduces the corners of 1 cm x 1 cm, and the opposite alignment film coated substrates are bonded together and 3000 mJ / cm 2 (measurement) by a UV irradiator. After irradiating with ultraviolet rays (wavelength: 365 nm), the mixture was placed in an oven and thermoset at 130 ° C. for 40 minutes. The peeling adhesive strength of the alignment film-coated glass substrate was measured by pressing a corner portion with a bond tester (manufactured by Seishin Shoji Co., Ltd .: SS-30WD). The intensities are shown in Table 1.
Table 1 also shows the results of the adhesive strength measured on the glass substrate to which the alignment film was not applied.
[Humidity permeability]
The display encapsulant produced in Examples and Comparative Examples was sandwiched between polyethylene terephthalate (PET) films, and a thin film having a thickness of 300 μm was irradiated with ultraviolet rays of 3000 mJ / cm 2 (measurement wavelength: 365 nm) by a UV irradiator. After that, it was put into an oven and heat-cured at 130 ° C. for 40 minutes, and after curing, the PET film was peeled off to prepare a sample. The moisture permeability of the sample at 60 ° C. and 90% was measured with a moisture permeability measuring machine (manufactured by Lessy: L80-5000). The results are shown in Table 1.
[Elastic modulus]
The display encapsulant produced in Examples and Comparative Examples was sandwiched between polyethylene terephthalate (PET) films, and a thin film having a thickness of 100 μm was irradiated with ultraviolet rays of 3000 mJ / cm 2 (measurement wavelength: 365 nm) by a UV irradiator. After that, it was put into an oven and heat-cured at 130 ° C. for 40 minutes, and after curing, the PET film was peeled off to prepare a sample. The sample was measured by performing a tensile test at a test speed of 5 mm / min at room temperature (22 ° C.) using a Tensilon universal testing machine (RTG-1210 manufactured by A & D Co., Ltd.). The results are shown in Table 1.
表１の結果より、本発明のディスプレイ用封止剤は、柔軟性と低透湿を両立し、接着強度にも優れることが確認された。 From the results in Table 1, it was confirmed that the sealant for a display of the present invention has both flexibility and low moisture permeability, and is also excellent in adhesive strength.
本発明のディスプレイ用封止剤は、被着体との接着強度に優れ、柔軟性と低透湿性を両立している為、特に有機膜との接着性が要求されるディスプレイやフレキシブルディスプレイ、湾曲形状のディスプレイ用封止剤として有用である。 The sealant for a display of the present invention has excellent adhesive strength to an adherend and has both flexibility and low moisture permeability. Therefore, a display, a flexible display, or a curve that particularly requires adhesion to an organic film. It is useful as a sealing agent for shape displays.
Claims (12)
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| CN202010164002.XA CN111690355B (en) | 2019-03-15 | 2020-03-10 | Sealant for display and liquid crystal display |
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| JP2016024243A (en) * | 2014-07-17 | 2016-02-08 | 日本化薬株式会社 | Liquid crystal sealant and liquid crystal cell using the same |
| JP2016109997A (en) * | 2014-12-10 | 2016-06-20 | 日本化薬株式会社 | Liquid crystal sealant and liquid crystal cells using the same |
| JP2017057353A (en) * | 2015-09-18 | 2017-03-23 | 日本化薬株式会社 | Polyurethane compound and resin composition containing the same |
| JP2018036469A (en) * | 2016-08-31 | 2018-03-08 | 日本化薬株式会社 | Liquid crystal sealant and liquid crystal display cell using the same |
| JP2018036468A (en) * | 2016-08-31 | 2018-03-08 | 日本化薬株式会社 | Liquid crystal sealant and liquid crystal display cell using the same |
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| JP6288756B2 (en) * | 2013-07-16 | 2018-03-07 | 日本化薬株式会社 | Manufacturing method of liquid crystal display cell and liquid crystal display cell obtained by the method |
| JP6478313B2 (en) | 2014-07-17 | 2019-03-06 | 日本化薬株式会社 | Liquid crystal sealant and liquid crystal display cell using the same |
| JP6899225B2 (en) * | 2017-01-30 | 2021-07-07 | ダイセル・オルネクス株式会社 | Active energy ray-curable composition |
| WO2018225544A1 (en) * | 2017-06-06 | 2018-12-13 | 日本化薬株式会社 | Photocurable composition and electronic component adhesive |
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| JP2016109997A (en) * | 2014-12-10 | 2016-06-20 | 日本化薬株式会社 | Liquid crystal sealant and liquid crystal cells using the same |
| JP2017057353A (en) * | 2015-09-18 | 2017-03-23 | 日本化薬株式会社 | Polyurethane compound and resin composition containing the same |
| JP2018036469A (en) * | 2016-08-31 | 2018-03-08 | 日本化薬株式会社 | Liquid crystal sealant and liquid crystal display cell using the same |
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| KR20200110185A (en) | 2020-09-23 |
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