JP2020147489A5 - - Google Patents
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- JP2020147489A5 JP2020147489A5 JP2020023498A JP2020023498A JP2020147489A5 JP 2020147489 A5 JP2020147489 A5 JP 2020147489A5 JP 2020023498 A JP2020023498 A JP 2020023498A JP 2020023498 A JP2020023498 A JP 2020023498A JP 2020147489 A5 JP2020147489 A5 JP 2020147489A5
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- JP
- Japan
- Prior art keywords
- frame
- article
- article according
- porosity
- inorganic compound
- Prior art date
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- 229910052751 metal Inorganic materials 0.000 claims 6
- 150000002484 inorganic compounds Chemical class 0.000 claims 4
- 229910010272 inorganic material Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- -1 borides Chemical class 0.000 claims 1
- 150000001805 chlorine compounds Chemical class 0.000 claims 1
- 150000002222 fluorine compounds Chemical class 0.000 claims 1
- 230000004927 fusion Effects 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 150000004767 nitrides Chemical class 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 229910052761 rare earth metal Inorganic materials 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007493 shaping process Methods 0.000 claims 1
- 150000003568 thioethers Chemical class 0.000 claims 1
- 229910001928 zirconium oxide Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/802,791 US11911877B2 (en) | 2019-03-08 | 2020-02-27 | Article including inorganic compound and method of manufacturing article including inorganic compound |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019042824 | 2019-03-08 | ||
| JP2019042824 | 2019-03-08 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020147489A JP2020147489A (ja) | 2020-09-17 |
| JP2020147489A5 true JP2020147489A5 (enExample) | 2023-02-22 |
| JP7575876B2 JP7575876B2 (ja) | 2024-10-30 |
Family
ID=72431678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020023498A Active JP7575876B2 (ja) | 2019-03-08 | 2020-02-14 | 無機化合物からなる物品、および無機化合物からなる物品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7575876B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021066653A (ja) * | 2019-10-23 | 2021-04-30 | キヤノン株式会社 | セラミックス物品の製造方法、金属成分含有液、セラミックス物品製造用キットおよびセラミックス物品 |
| JP7618412B2 (ja) | 2020-09-02 | 2025-01-21 | キヤノン株式会社 | 通信装置、通信方法及びプログラム |
| JP7583261B2 (ja) * | 2021-01-26 | 2024-11-14 | 株式会社不二越 | 吸着プレートおよびその製造方法 |
| JP7583686B2 (ja) * | 2021-07-30 | 2024-11-14 | 京セラ株式会社 | 吸着用部材およびその製造方法 |
| KR102667455B1 (ko) * | 2023-04-14 | 2024-05-20 | 주식회사 에이엠솔루션즈 | 하이브리드 적층생산방법 및 시스템 |
| JP7644321B1 (ja) * | 2024-08-09 | 2025-03-12 | 株式会社松浦機械製作所 | 三次元造形方法、プログラムおよび構造物 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR8707510A (pt) * | 1986-10-17 | 1989-02-21 | Univ Texas | Metodo e aparelhagem para produzir pecas por sinterizacao seletiva |
| JP3830382B2 (ja) * | 2001-03-14 | 2006-10-04 | 日本碍子株式会社 | セラミック焼結体およびその製造方法 |
| JP2005008368A (ja) * | 2003-06-19 | 2005-01-13 | Mikura Bussan Kk | 電子部品のハンドリングユニットおよびその製造方法 |
| JP5279550B2 (ja) * | 2009-02-27 | 2013-09-04 | 太平洋セメント株式会社 | 真空吸着装置及びその製造方法 |
| JP5545803B2 (ja) * | 2009-06-30 | 2014-07-09 | 太平洋セメント株式会社 | セラミックス多孔質焼結体の製造方法 |
| US8500182B2 (en) * | 2010-06-17 | 2013-08-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Vacuum wafer carriers for strengthening thin wafers |
| JP5633766B2 (ja) * | 2013-03-29 | 2014-12-03 | Toto株式会社 | 静電チャック |
| JP2015136753A (ja) * | 2014-01-22 | 2015-07-30 | 日立金属株式会社 | 多孔質焼結板、これを用いた真空吸着パッド、及び多孔質焼結板の製造方法 |
| JP6708460B2 (ja) * | 2016-03-30 | 2020-06-10 | 京セラ株式会社 | 接合体の製造方法 |
-
2020
- 2020-02-14 JP JP2020023498A patent/JP7575876B2/ja active Active
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