JP2020146781A - Monitoring system - Google Patents
Monitoring system Download PDFInfo
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- JP2020146781A JP2020146781A JP2019044723A JP2019044723A JP2020146781A JP 2020146781 A JP2020146781 A JP 2020146781A JP 2019044723 A JP2019044723 A JP 2019044723A JP 2019044723 A JP2019044723 A JP 2019044723A JP 2020146781 A JP2020146781 A JP 2020146781A
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- 238000012544 monitoring process Methods 0.000 title claims abstract description 26
- 235000012431 wafers Nutrition 0.000 description 34
- 238000004140 cleaning Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 7
- 238000012423 maintenance Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 240000004050 Pentaglottis sempervirens Species 0.000 description 3
- 235000004522 Pentaglottis sempervirens Nutrition 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N7/00—Television systems
- H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Quality & Reliability (AREA)
- Theoretical Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Closed-Circuit Television Systems (AREA)
- Burglar Alarm Systems (AREA)
Abstract
Description
本発明は、加工装置の監視システムに関する。 The present invention relates to a monitoring system for processing equipment.
ＩＣ、ＬＳＩ等の複数のデバイスが分割予定ラインによって区画され表面に形成されたウエーハは、研削装置によって裏面が研削され所定の厚みに形成された後、ダイシング装置、レーザー加工装置等によって個々のデバイスチップに分割され、分割された各デバイスチップは携帯電話、パソコン等の電気機器に利用される。 A wafer in which a plurality of devices such as ICs and LSIs are partitioned by a planned division line and formed on the front surface is formed into a predetermined thickness by grinding the back surface by a grinding device, and then individual devices are formed by a dicing device, a laser processing device, or the like. It is divided into chips, and each divided device chip is used for electric devices such as mobile phones and personal computers.
研削装置は、被加工物を保持するチャックテーブルと、チャックテーブルに保持された被加工物を研削する研削手段と、複数の被加工物を収容するカセットが載置されるカセット載置部と、カセット載置部に載置されたカセットから被加工物を搬出する搬出手段と、搬出手段によって搬出された被加工物が仮置きされる仮置き手段と、仮置き手段に仮置きされた被加工物をチャックテーブルまで搬送する搬送手段と、から概ね構成されていてウエーハを所望の厚みに加工することができる（たとえば特許文献１参照）。 The grinding device includes a chuck table for holding a workpiece, a grinding means for grinding the workpiece held on the chuck table, a cassette mounting portion on which a cassette for accommodating a plurality of workpieces is placed, and the like. A unloading means for carrying out the work piece from the cassette placed on the cassette mounting portion, a temporary placement means for temporarily placing the work piece carried out by the carry-out means, and a work piece temporarily placed on the temporary placement means. It is generally composed of a transport means for transporting an object to a chuck table, and a wafer can be processed to a desired thickness (see, for example, Patent Document 1).
しかし、研削装置を修理したり、研削砥石の交換等のメンテナンスを行ったりした際に、作業者が工具を研削装置上に置き忘れてしまう場合があり、工具が研削装置上に置かれたまま研削装置が稼働されると、ウエーハの破損や研削装置の搬送手段等の損傷が生じるという問題がある。上記した問題は、研削装置に限らず、ダイシング装置、レーザー加工装置等を含む様々な加工装置において起こり得る。 However, when the grinding device is repaired or maintenance such as replacement of the grinding wheel is performed, the operator may misplace the tool on the grinding device, and the tool is ground while it is placed on the grinding device. When the apparatus is operated, there is a problem that the wafer is damaged and the transport means of the grinding apparatus is damaged. The above-mentioned problem may occur not only in the grinding device but also in various processing devices including a dicing device, a laser processing device and the like.
上記事実に鑑みてなされた本発明の課題は、加工装置への工具の置き忘れを防止することができる監視システムを提供することである。 An object of the present invention made in view of the above facts is to provide a monitoring system capable of preventing a tool from being misplaced in a processing apparatus.
上記課題を解決するために本発明が提供するのは以下の監視システムである。すなわち、加工装置の監視システムであって、加工装置を撮像するカメラと、該カメラの画像を記憶する第一の画像記憶部および第二の画像記憶部と表示部とを少なくとも備えた制御手段と、を備え、該第一の画像記憶部には正常な状態の加工装置の画像が記憶され該第二の画像記憶部には作業終了時の加工装置の画像が記憶され、該制御手段は、該第一の画像記憶部に記憶された画像と該第二の画像記憶部に記憶された画像とを比較して一致しない場所を該表示部に表示する監視システムである。 The following monitoring system is provided by the present invention in order to solve the above problems. That is, it is a monitoring system of a processing device, and is a control means including at least a camera that images the processing device, a first image storage unit that stores images of the camera, and a second image storage unit and a display unit. The first image storage unit stores an image of a processing device in a normal state, and the second image storage unit stores an image of a processing device at the end of work. This is a monitoring system that compares an image stored in the first image storage unit with an image stored in the second image storage unit and displays a location that does not match on the display unit.
好ましくは、該制御手段は、該第一の画像記憶部に記憶された画像と該第二の画像記憶部に記憶された画像とを比較して一致しない場合、音を発する。 Preferably, the control means emits a sound when the image stored in the first image storage unit and the image stored in the second image storage unit are compared and do not match.
本発明が提供する監視システムは、加工装置を撮像するカメラと、該カメラの画像を記憶する第一の画像記憶部および第二の画像記憶部と表示部とを少なくとも備えた制御手段と、を備え、該第一の画像記憶部には正常な状態の加工装置の画像が記憶され該第二の画像記憶部には作業終了時の加工装置の画像が記憶され、該制御手段は、該第一の画像記憶部に記憶された画像と該第二の画像記憶部に記憶された画像とを比較して一致しない場所を該表示部に表示するので、加工装置を修理したり、部材の交換等のメンテナンスを行ったりした際に作業者が工具を加工装置上に置き忘れても、工具の置き忘れが作業者に報知され、加工装置への工具の置き忘れが防止される。したがって、本発明の監視システムによれば、工具が加工装置上に置かれたまま加工装置が稼働されることによるウエーハの破損や加工装置の損傷が防止される。 The monitoring system provided by the present invention includes a camera that captures an image of the processing apparatus, and a control means that includes at least a first image storage unit and a second image storage unit and a display unit that store images of the camera. The first image storage unit stores an image of the processing device in a normal state, the second image storage unit stores an image of the processing device at the end of work, and the control means is the first. Since the image stored in the first image storage unit is compared with the image stored in the second image storage unit and the inconsistent location is displayed on the display unit, the processing device is repaired or the member is replaced. Even if the operator misplaces the tool on the processing device when performing maintenance such as, the operator is notified of the misplacement of the tool, and the misplacement of the tool on the processing device is prevented. Therefore, according to the monitoring system of the present invention, damage to the wafer and damage to the processing device due to the operation of the processing device while the tool is placed on the processing device can be prevented.
以下、本発明に従って構成された監視システムの好適実施形態について図面を参照しつつ説明する。 Hereinafter, preferred embodiments of the monitoring system configured according to the present invention will be described with reference to the drawings.
図１には、監視システム２と、監視システム２が監視する加工装置の一例としての研削装置４とが示されている。なお、監視システム２が監視する加工装置は、ウエーハ等の被加工物に切削加工を施す切削ブレードを回転可能に備えたダイシング装置や、ウエーハ等の被加工物にレーザー加工を施すレーザー加工装置等であってもよい。 FIG. 1 shows a monitoring system 2 and a grinding device 4 as an example of a processing device monitored by the monitoring system 2. The processing device monitored by the monitoring system 2 includes a dicing device equipped with a rotatably cutting blade for cutting a workpiece such as a wafer, a laser processing device for performing laser processing on a workpiece such as a wafer, and the like. It may be.
監視システム２は、研削装置４を撮像するカメラ６と、カメラ６に電気的に接続された制御手段８とを備える。カメラ６は、研削装置４の上方に配置され、研削装置４の俯瞰画像を撮像するようになっている。また、カメラ６が撮像した画像のデータは制御手段８に送られる。なお、図１には、単一のカメラ６が示されているが、監視システム２は複数のカメラ６を備えていてもよい。 The monitoring system 2 includes a camera 6 that images the grinding device 4, and a control means 8 that is electrically connected to the camera 6. The camera 6 is arranged above the grinding device 4, and is adapted to capture a bird's-eye view image of the grinding device 4. Further, the image data captured by the camera 6 is sent to the control means 8. Although a single camera 6 is shown in FIG. 1, the surveillance system 2 may include a plurality of cameras 6.
制御手段８は、コンピュータから構成される主制御部１０と、主制御部１０に電気的に接続された表示部としてのモニタ１２とを備える。主制御部１０は、制御プログラムに従って演算処理する中央処理装置（ＣＰＵ）と、制御プログラム等を格納するリードオンリメモリ（ＲＯＭ）と、演算結果等を格納する読み書き可能なランダムアクセスメモリ（ＲＡＭ）とを含む（いずれも図示していない。）。 The control means 8 includes a main control unit 10 composed of a computer and a monitor 12 as a display unit electrically connected to the main control unit 10. The main control unit 10 includes a central processing unit (CPU) that performs arithmetic processing according to a control program, a read-only memory (ROM) that stores a control program and the like, and a readable and writable random access memory (RAM) that stores an arithmetic result and the like. (Neither is shown).
主制御部１０のランダムアクセスメモリには、カメラ６が撮像した画像を記憶する第一の画像記憶部１４および第二の画像記憶部１６が設定されている。第一の画像記憶部１４には、研削装置４が稼働するにあたって正常な状態の研削装置４の画像が記憶され、第二の画像記憶部１６には、研削装置４の修理や、部材の交換等のメンテナンスを含む各種作業が終了した時の研削装置４の画像が記憶されるようになっている。また、主制御部１０のリードオンリメモリには、第一の画像記憶部１４に記憶された画像と第二の画像記憶部１６に記憶された画像とを比較する比較部１８が制御プログラムとして格納されている。 A first image storage unit 14 and a second image storage unit 16 for storing an image captured by the camera 6 are set in the random access memory of the main control unit 10. The first image storage unit 14 stores an image of the grinding device 4 in a normal state when the grinding device 4 operates, and the second image storage unit 16 repairs the grinding device 4 or replaces members. The image of the grinding device 4 when various operations including maintenance such as the above are completed is stored. Further, in the read-only memory of the main control unit 10, a comparison unit 18 for comparing an image stored in the first image storage unit 14 and an image stored in the second image storage unit 16 is stored as a control program. Has been done.
そして、制御手段８においては、第一の画像記憶部１４の画像と第二の画像記憶部１６の画像とを比較部１８により比較した結果、一致しない場所をモニタ１２に表示するようになっている。一致しない場所としては、たとえば、メンテナンス等の各種作業において使用された工具が放置されている場所や、研削装置４によって研削加工が施されるウエーハ等の被加工物を収容したカセットが研削装置４のカセット載置部に載置されていない場合におけるカセット載置部が挙げられる。また、第一の画像記憶部１４の画像と第二の画像記憶部１６の画像とが一致しない場合に、音を発するスピーカーや、光を発するライト（いずれも図示していない。）が制御手段８に電気的に接続されていてもよい。 Then, in the control means 8, as a result of comparing the image of the first image storage unit 14 and the image of the second image storage unit 16 by the comparison unit 18, the places where they do not match are displayed on the monitor 12. There is. Examples of places that do not match include places where tools used in various operations such as maintenance are left unattended, and cassettes containing workpieces such as wafers that are ground by the grinding device 4. The cassette mounting portion in the case where the cassette mounting portion is not mounted in the above. Further, when the image of the first image storage unit 14 and the image of the second image storage unit 16 do not match, a speaker that emits sound and a light that emits light (neither is shown) are control means. It may be electrically connected to 8.
次に、監視システム２が監視する加工装置の一例である研削装置４について説明する。図１に示すとおり、研削装置４は直方体状の基台２０を備えており、この基台２０の上面には、研削加工前の複数の円板状のウエーハＷを収容した第一のカセット２２ａが載置される第一のカセット載置部２４ａと、研削加工後の複数のウエーハＷを収容する第二のカセット２２ｂが載置される第二のカセット載置部２４ｂとが互いに間隔をおいて設けられている。 Next, the grinding device 4 which is an example of the processing device monitored by the monitoring system 2 will be described. As shown in FIG. 1, the grinding device 4 includes a rectangular parallelepiped base 20, and a first cassette 22a containing a plurality of disc-shaped wafers W before grinding is placed on the upper surface of the base 20. The first cassette mounting portion 24a on which the wafer is mounted and the second cassette mounting portion 24b on which the second cassette 22b accommodating a plurality of wafers W after grinding is mounted are spaced apart from each other. It is provided.
第一のカセット載置部２４ａと第二のカセット載置部２４ｂとの間には搬出入手段２６が配置されている。搬出入手段２６は、多関節アーム２８と、多関節アーム２８の先端に付設されたＵ字状の吸着片３０とを含む。そして、搬出入手段２６においては、研削加工前のウエーハＷを吸着片３０で吸引保持し第一のカセット２２ａから搬出すると共に、研削加工後のウエーハＷを吸着片３０で吸引保持し第二のカセット２２ｂへ搬入するようになっている。 A loading / unloading means 26 is arranged between the first cassette mounting portion 24a and the second cassette mounting portion 24b. The loading / unloading means 26 includes an articulated arm 28 and a U-shaped suction piece 30 attached to the tip of the articulated arm 28. Then, in the carry-in / out means 26, the wafer W before the grinding process is sucked and held by the suction piece 30 and carried out from the first cassette 22a, and the wafer W after the grinding process is sucked and held by the suction piece 30. It is designed to be carried into the cassette 22b.
基台２０の上面には、搬出入手段２６によって第一のカセット２２ａから搬出された研削加工前のウエーハＷが仮置きされる仮置き手段３２が第一のカセット載置部２４ａに隣接して配置されている。また、基台２０の上面には、研削加工後のウエーハＷに洗浄水を噴射してウエーハＷを洗浄すると共に、洗浄したウエーハＷに乾燥エアーを噴射してウエーハＷを乾燥させる洗浄手段３４が第二のカセット載置部２４ｂに隣接して配置されている。 On the upper surface of the base 20, a temporary storage means 32 for temporarily placing a wafer W before grinding, which is carried out from the first cassette 22a by the loading / unloading means 26, is adjacent to the first cassette mounting portion 24a. Have been placed. Further, on the upper surface of the base 20, a cleaning means 34 for injecting cleaning water onto the ground wafer W to clean the wafer W and injecting dry air onto the cleaned wafer W to dry the wafer W is provided. It is arranged adjacent to the second cassette mounting portion 24b.
さらに、基台２０の上面には、円形のターンテーブル３６が回転自在に設けられており、ターンテーブル３６の上面周縁側には、周方向に等間隔をおいて３個のチャックテーブル３８が回転自在に搭載されている。各チャックテーブル３８は、符号Ａで示す着脱位置と、符号Ｂで示す荒研削位置と、符号Ｃで示す仕上げ研削位置とにターンテーブル３６の回転によって順次位置づけられる。また、各チャックテーブル３８の上端部分には、吸引手段（図示していない。）に接続された多孔質の吸着チャック４０が配置されている。そして、チャックテーブル３８においては、吸引手段で吸着チャック４０の上面に吸引力を生成することにより、吸着チャック４０の上面に載せられたウエーハＷを吸引保持するようになっている。 Further, a circular turntable 36 is rotatably provided on the upper surface of the base 20, and three chuck tables 38 rotate at equal intervals in the circumferential direction on the upper peripheral edge side of the turntable 36. It is installed freely. Each chuck table 38 is sequentially positioned by the rotation of the turntable 36 at the attachment / detachment position indicated by reference numeral A, the rough grinding position indicated by reference numeral B, and the finish grinding position indicated by reference numeral C. Further, a porous suction chuck 40 connected to a suction means (not shown) is arranged at the upper end portion of each chuck table 38. Then, in the chuck table 38, the wafer W mounted on the upper surface of the suction chuck 40 is sucked and held by generating a suction force on the upper surface of the suction chuck 40 by the suction means.
ターンテーブル３６と仮置き手段３２との間には第一の搬送手段４２が配置されており、第一の搬送手段４２は、仮置き手段３２に仮置きされた研削加工前のウエーハＷを、着脱位置Ａに位置づけられたチャックテーブル３８に搬送するようになっている。また、ターンテーブル３６と洗浄手段３４との間には第二の搬送手段４４が配置されており、第二の搬送手段４４は、着脱位置Ａに位置づけられた研削加工後のウエーハＷを洗浄手段３４に搬送するようになっている。 A first conveying means 42 is arranged between the turntable 36 and the temporary placing means 32, and the first conveying means 42 temporarily places the wafer W before grinding on the temporary placing means 32. It is designed to be conveyed to the chuck table 38 positioned at the attachment / detachment position A. Further, a second transport means 44 is arranged between the turntable 36 and the cleaning means 34, and the second transport means 44 cleans the grinding-processed wafer W located at the attachment / detachment position A. It is designed to be transported to 34.
基台２０の端部（図１における奥側端部）には、チャックテーブル３８に保持されたウエーハＷの上面を研削する研削手段４６が配置されている。図示の実施形態の研削手段４６は、荒研削用の研削砥石４８を有する荒研削ユニット５０と、仕上げ研削用の研削砥石５２を有する仕上げ研削ユニット５４とを備える。そして、チャックテーブル３８に保持されたウエーハＷは、ターンテーブル３６の回転によって荒研削位置Ｂに位置づけられた際に荒研削ユニット５０により荒研削加工が施され、次いで、ターンテーブル３６の回転によって仕上げ研削位置Ｃに位置づけられた際に仕上げ研削ユニット５４により仕上げ研削加工が施されるようになっている。 At the end of the base 20 (the back end in FIG. 1), a grinding means 46 for grinding the upper surface of the wafer W held by the chuck table 38 is arranged. The grinding means 46 of the illustrated embodiment includes a rough grinding unit 50 having a grinding wheel 48 for rough grinding and a finishing grinding unit 54 having a grinding wheel 52 for finish grinding. Then, when the wafer W held on the chuck table 38 is positioned at the rough grinding position B by the rotation of the turntable 36, the rough grinding process is performed by the rough grinding unit 50, and then the wafer W is finished by the rotation of the turntable 36. When it is positioned at the grinding position C, the finish grinding process is performed by the finish grinding unit 54.
また、図１に示すとおり、基台２０の上面には、仕上げ研削加工が施された後に着脱位置Ａに位置づけられたウエーハＷの上面（研削面）に向かって洗浄水を噴射する洗浄水ノズル５６が設けられている。 Further, as shown in FIG. 1, a cleaning water nozzle that injects cleaning water toward the upper surface (ground surface) of the wafer W located at the attachment / detachment position A after the upper surface of the base 20 is subjected to finish grinding. 56 is provided.
このような研削装置４を上述の監視システム２によって監視する際は、まず、研削装置４が稼働するにあたって正常な状態をカメラ６によって撮像し、たとえば図２（ａ）に示すような研削装置４の画像を第一の画像記憶部１４に予め記憶させておく。 When monitoring such a grinding device 4 by the above-mentioned monitoring system 2, first, a camera 6 captures an image of a normal state when the grinding device 4 operates, and for example, the grinding device 4 as shown in FIG. 2A. Is stored in advance in the first image storage unit 14.
研削装置４が稼働するにあたって正常な状態とは、研削装置４上に工具が放置されておらず、かつ第一のカセット載置部２４ａおよび第二のカセット載置部２４ｂに第一のカセット２２ａおよび第二のカセット２２ｂが載置されていると共に、搬出入手段２６が初期姿勢（たとえば図１に示す姿勢）になっている等、研削装置４を稼働した際に、ウエーハＷに対して所要の研削加工を問題なく施すことができる状態である。 The normal state for the grinding device 4 to operate is that the tool is not left on the grinding device 4 and the first cassette 22a is placed on the first cassette mounting portion 24a and the second cassette mounting portion 24b. And when the grinding device 4 is operated, such as when the second cassette 22b is placed and the loading / unloading means 26 is in the initial posture (for example, the posture shown in FIG. 1), it is required for the wafer W. It is in a state where the grinding process can be performed without any problem.
より具体的に説明すると、研削装置４が稼働するにあたって正常な状態とは、第一のカセット２２ａからウエーハＷを搬出入手段２６で搬出して仮置き手段３２に仮置きする仮置き工程と、仮置き手段３２に仮置きされたウエーハＷを第一の搬送手段４２で着脱位置Ａのチャックテーブル３８に搬送する第一の搬送工程と、チャックテーブル３８に保持されたウエーハＷの上面に研削手段４６で荒研削加工および仕上げ研削加工を施す研削工程と、研削済みのウエーハＷの上面に洗浄水ノズル５６から洗浄水を噴射する洗浄水噴射工程と、研削済みのウエーハＷを第二の搬送手段４４でチャックテーブル３８から洗浄手段３４に搬送する第二の搬送工程と、研削済みのウエーハＷを洗浄手段３４で洗浄すると共に乾燥させる洗浄・乾燥工程と、洗浄済みのウエーハＷを搬出入手段２６で洗浄手段３４から第二のカセット２２ｂに搬入するカセット搬入工程とを研削装置４において問題なく実施することができる状態である。 More specifically, the normal state for the grinding device 4 to operate includes a temporary placement step in which the wafer W is carried out from the first cassette 22a by the carry-in / out means 26 and temporarily placed in the temporary placement means 32. The first transport step of transporting the wafer W temporarily placed on the temporary placement means 32 to the chuck table 38 at the attachment / detachment position A by the first transport means 42, and the grinding means on the upper surface of the wafer W held by the chuck table 38. A grinding process in which rough grinding and finish grinding are performed in No. 46, a cleaning water injection process in which cleaning water is injected from a cleaning water nozzle 56 onto the upper surface of the ground wafer W, and a second transport means for transporting the ground wafer W. A second transport step of transporting the ground wafer W from the chuck table 38 to the cleaning means 34 at 44, a cleaning / drying step of cleaning and drying the ground wafer W with the cleaning means 34, and a loading / unloading means 26 of the cleaned wafer W. In this state, the grinding device 4 can carry out the cassette carrying-in step of carrying-in from the cleaning means 34 to the second cassette 22b without any problem.
そして、研削装置４を修理したり、研削砥石４８、５２の交換等のメンテナンスを行ったりした際は、作業者の操作に基づいて作業終了時にカメラ６によって研削装置４を撮像し、カメラ６で撮像した作業終了時の研削装置４の画像を第二の画像記憶部１６に記憶させる。 Then, when the grinding device 4 is repaired or maintenance such as replacement of the grinding wheels 48 and 52 is performed, the grinding device 4 is imaged by the camera 6 at the end of the work based on the operation of the operator, and the camera 6 is used. The image of the grinding device 4 at the end of the captured work is stored in the second image storage unit 16.
そうすると、制御手段８の比較部１８は、第一の画像記憶部１４に記憶された画像（正常な状態の研削装置４の画像）と、第二の画像記憶部１６に記憶された画像（作業終了時の研削装置４の画像）とを比較する。両者の画像を比較部１８が比較した結果、一致しない場所がある場合、制御手段８は、一致しない場所をモニタ１２に表示する。 Then, the comparison unit 18 of the control means 8 has an image stored in the first image storage unit 14 (an image of the grinding device 4 in a normal state) and an image stored in the second image storage unit 16 (work). The image of the grinding device 4 at the end) is compared. When the comparison unit 18 compares the two images and there is a non-matching location, the control means 8 displays the non-matching location on the monitor 12.
たとえば、第二の画像記憶部１６の画像が図２（ｂ）に示す画像であった場合には、符号Ｐ１で示す点線で囲んだ場所にスパナＳが放置されていると共に、符号Ｐ２で示す一点鎖線で囲んだ場所にドライバーＤが放置されており、第二の画像記憶部１６の画像においてスパナＳとドライバーＤとが研削装置４上に放置されている点が第一の画像記憶部１４の画像と一致しない。この場合、制御手段８は、図２（ｃ）に示すとおり、スパナＳが放置されている場所Ｐ１と、ドライバーＤが放置されている場所Ｐ２とをモニタ１２に表示する。 For example, when the image of the second image storage unit 16 is the image shown in FIG. 2B, the spanner S is left in the place surrounded by the dotted line indicated by the reference numeral P1 and is indicated by the reference numeral P2. The first image storage unit 14 is that the driver D is left in a place surrounded by the alternate long and short dash line, and the spanner S and the driver D are left on the grinding device 4 in the image of the second image storage unit 16. Does not match the image of. In this case, as shown in FIG. 2C, the control means 8 displays on the monitor 12 the place P1 where the spanner S is left and the place P2 where the driver D is left.
また、第一の画像記憶部１４の画像と第二の画像記憶部１６の画像とが一致しない場合としては、上記のように工具が放置されている場合だけでなく、第一のカセット載置部２４ａおよび第二のカセット載置部２４ｂに第一のカセット２２ａおよび第二のカセット２２ｂが載置されていない場合や、搬出入手段２６が初期姿勢になっていない場合等であってもよい。このような場合に、両者の画像の一致しない場所がモニタ１２に表示されることにより、研削装置４の異常稼働が抑制される。 Further, when the image of the first image storage unit 14 and the image of the second image storage unit 16 do not match, not only when the tool is left as described above, but also when the first cassette is placed. The first cassette 22a and the second cassette 22b may not be mounted on the portion 24a and the second cassette mounting portion 24b, or the loading / unloading means 26 may not be in the initial posture. .. In such a case, the abnormal operation of the grinding device 4 is suppressed by displaying the location where the two images do not match on the monitor 12.
以上のとおりであり、監視システム２においては、研削装置４を修理したり、研削砥石４８、５２の交換等のメンテナンスを行ったりした際に、スパナＳやドライバーＤ等の工具を作業者が研削装置４上に置き忘れても、工具の置き忘れが作業者に報知されるので、研削装置４への工具の置き忘れが防止される。したがって、監視システム２によれば、工具が研削装置４上に置かれたまま研削装置４が稼働されることによるウエーハＷの破損や研削装置４の損傷が防止される。 As described above, in the monitoring system 2, the operator grinds tools such as the spanner S and the driver D when the grinding device 4 is repaired or maintenance such as replacement of the grinding wheels 48 and 52 is performed. Even if the tool is misplaced on the apparatus 4, the operator is notified of the misplacement of the tool, so that the misplacement of the tool on the grinding device 4 is prevented. Therefore, according to the monitoring system 2, damage to the wafer W and damage to the grinding device 4 due to the operation of the grinding device 4 while the tool is placed on the grinding device 4 are prevented.
なお、第一の画像記憶部１４の画像と第二の画像記憶部１６の画像とが一致しない場合に、制御手段８に接続されたスピーカーやライトから音や光を発するようにして、作業者に対して更なる注意喚起を行ってもよい。 When the image of the first image storage unit 14 and the image of the second image storage unit 16 do not match, the operator is made to emit sound or light from the speaker or light connected to the control means 8. You may give further attention to.
２：監視システム
４：研削装置（加工装置）
６：カメラ
８：制御手段
１２：モニタ（表示部）
１４：第一の画像記憶部
１６：第二の画像記憶部
2: Monitoring system 4: Grinding equipment (processing equipment)
6: Camera 8: Control means 12: Monitor (display unit)
14: First image storage unit 16: Second image storage unit
Claims (2)
加工装置を撮像するカメラと、該カメラの画像を記憶する第一の画像記憶部および第二の画像記憶部と表示部とを少なくとも備えた制御手段と、を備え、
該第一の画像記憶部には正常な状態の加工装置の画像が記憶され該第二の画像記憶部には作業終了時の加工装置の画像が記憶され、
該制御手段は、該第一の画像記憶部に記憶された画像と該第二の画像記憶部に記憶された画像とを比較して一致しない場所を該表示部に表示する監視システム。 It is a monitoring system for processing equipment.
A camera that captures an image of the processing apparatus, and a control means that includes at least a first image storage unit and a second image storage unit and a display unit that store images of the camera are provided.
An image of the processing device in a normal state is stored in the first image storage unit, and an image of the processing device at the end of work is stored in the second image storage unit.
The control means is a monitoring system that compares an image stored in the first image storage unit with an image stored in the second image storage unit and displays on the display unit a location that does not match.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008155292A (en) * | 2006-12-21 | 2008-07-10 | Disco Abrasive Syst Ltd | Method and apparatus for machining substrate |
| US20100039513A1 (en) * | 2008-08-08 | 2010-02-18 | Snap-On Incorporated | Image-based inventory control system with automatic calibration and image correction |
| JP2018092386A (en) * | 2016-12-05 | 2018-06-14 | 株式会社日立ビルシステム | Monitor, mislaid-tool search supporting system and mislaid-tool search supporting method |
| JP2018161694A (en) * | 2017-03-24 | 2018-10-18 | 株式会社ディスコ | Tool Detector |
| JP2018192572A (en) * | 2017-05-18 | 2018-12-06 | 株式会社ディスコ | Processing device |
| JP2019016090A (en) * | 2017-07-05 | 2019-01-31 | 日本電設工業株式会社 | Confirmation device and program thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5700180A (en) * | 1993-08-25 | 1997-12-23 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
| JP4464113B2 (en) | 2003-11-27 | 2010-05-19 | 株式会社ディスコ | Wafer processing equipment |
| EP2000869A1 (en) * | 2007-05-25 | 2008-12-10 | General Electric Company | System and method for measuring machining tools with a camera |
| JP2013082055A (en) * | 2011-09-30 | 2013-05-09 | Asahi Glass Co Ltd | Method and system for monitoring glass plate polishing device |
| US9095952B2 (en) * | 2013-01-23 | 2015-08-04 | Applied Materials, Inc. | Reflectivity measurements during polishing using a camera |
| WO2015140841A1 (en) * | 2014-03-20 | 2015-09-24 | 日本電気株式会社 | Anomaly-detecting information processing device and anomaly detection method |
| TWM528819U (en) * | 2016-03-16 | 2016-09-21 | 東台精機股份有限公司 | System for monitoring wear rate of cutting tool |
-
2019
- 2019-03-12 JP JP2019044723A patent/JP7299040B2/en active Active
-
2020
- 2020-02-25 TW TW109106062A patent/TWI814991B/en active
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008155292A (en) * | 2006-12-21 | 2008-07-10 | Disco Abrasive Syst Ltd | Method and apparatus for machining substrate |
| US20100039513A1 (en) * | 2008-08-08 | 2010-02-18 | Snap-On Incorporated | Image-based inventory control system with automatic calibration and image correction |
| JP2018092386A (en) * | 2016-12-05 | 2018-06-14 | 株式会社日立ビルシステム | Monitor, mislaid-tool search supporting system and mislaid-tool search supporting method |
| JP2018161694A (en) * | 2017-03-24 | 2018-10-18 | 株式会社ディスコ | Tool Detector |
| JP2018192572A (en) * | 2017-05-18 | 2018-12-06 | 株式会社ディスコ | Processing device |
| JP2019016090A (en) * | 2017-07-05 | 2019-01-31 | 日本電設工業株式会社 | Confirmation device and program thereof |
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