JP2020126988A - Component mounting device - Google Patents

Abstract

To provide a component mounting device capable of mounting a component on a to-be-mounted object by adjusting a posture of the to-be-mounted object having a three-dimensional shape while suppressing an increase in a work burden on a user even when there is no information on the three-dimensional shape of the to-be-mounted object.SOLUTION: A component mounting apparatus 100 includes: a holding unit 34 for holding a to-be-mounted object P having a three-dimensional shape on which a component E is mounted; an inclination mechanism unit 32 and a rotation mechanism unit 33, for rotating the holding unit 34 to be inclined to a horizontal plane; a mounting head 41 for mounting the component E on the to-be-mounted object P; a three-dimensional shape measuring unit 9 for measuring the three-dimensional shape of the to-be-mounted object P held by the holding unit 34; and a control device 10 for acquiring information on a plurality of mounting surfaces P1 to P5 on which the component E is mounted based on a measurement result of the to-be-mounted object P by the three-dimensional shape measuring unit 9.SELECTED DRAWING: Figure 2

Description

The present invention relates to a component mounting apparatus, and more particularly to a component mounting apparatus that mounts a component on a mounted object having a three-dimensional shape.

2. Description of the Related Art Conventionally, a component mounting apparatus that mounts a component on an object to be mounted having a three-dimensional shape is known (for example, refer to Patent Document 1).

In the above Patent Document 1, a three-dimensional substrate support that supports a three-dimensional substrate (object to be mounted) having a three-dimensional shape, and a three-dimensional substrate support drive that rotates the three-dimensional substrate support so as to be inclined with respect to a horizontal plane. An electronic circuit component mounting machine (component mounting apparatus) including an apparatus and a mounting head for mounting a component on a three-dimensional substrate is disclosed.

JP2012-119643A

However, in the electronic circuit component mounting machine of the above-mentioned Patent Document 1, information on the three-dimensional shape of the three-dimensional substrate for adjusting the attitude of the three-dimensional substrate by the three-dimensional substrate support driving device so that the mounting surface of the three-dimensional substrate becomes horizontal is previously stored. It seems necessary to enter. That is, the electronic circuit component mounting machine of Patent Document 1 has a disadvantage that it is difficult to adjust the posture of the three-dimensional substrate when there is no information on the three-dimensional shape of the three-dimensional substrate. It is also conceivable that the user manually measures and inputs the three-dimensional shape of the three-dimensional board, or the user manually adjusts the attitude of the three-dimensional board, but in this case, the work load on the user increases. As a result, there is a problem that it is difficult to adjust the posture of the three-dimensional board and mount the components on the three-dimensional board while suppressing an increase in the work load on the user.

The present invention has been made to solve the above problems, and an object of the present invention is to increase the work load of a user even when there is no information on the three-dimensional shape of the mounted object. An object of the present invention is to provide a component mounting apparatus capable of mounting a component on an object to be mounted by adjusting the posture of the object to be mounted having a three-dimensional shape while suppressing the problem.

A component mounting apparatus according to an aspect of the present invention includes a holding unit that holds a mounted object having a three-dimensional shape on which components are mounted, and a rotating mechanism that rotates the holding unit so as to incline with respect to a horizontal plane. Section, a mounting head that mounts a component on the mounted object, a three-dimensional shape measuring unit that measures the three-dimensional shape of the mounted object held by the holding unit, and a measurement result of the mounted object by the three-dimensional shape measuring unit. And a control unit that acquires information about a plurality of mounting surfaces on which components are mounted.

In the component mounting apparatus according to one aspect of the present invention, as described above, the control unit that acquires information about a plurality of mounting surfaces on which components are mounted based on the measurement result of the mounted object by the three-dimensional shape measuring unit is provided. .. This eliminates the need for the user to manually measure and input the three-dimensional shape of the mounted object even when there is no information on the three-dimensional shape of the mounted object, and also requires the user to manually adjust the posture of the mounted object. There is no. Further, the posture of the mounted object can be adjusted so that the component can be mounted based on the information of the mounting surface of the mounted object acquired by the control unit. As a result, even when there is no information on the three-dimensional shape of the mounted object, the posture of the mounted object having the three-dimensional shape is adjusted and the component is mounted on the mounted object while suppressing an increase in the work load on the user. can do.

In the component mounting apparatus according to the above aspect, preferably, the control unit acquires tilt information of the surface of the mounted object from the measurement result of the mounted object by the three-dimensional shape measuring unit, and based on the tilt information of the surface. , The mounting surface of the mounted object is specified. According to this structure, even when there is no information on the three-dimensional shape of the mounted object, by measuring the actual object of the mounted object and acquiring tilt information of the surface of the mounted object, The inclination can be acquired.

In the component mounting apparatus according to the above aspect, preferably, the rotation mechanism portion includes a first rotation mechanism that rotates the holding portion around a horizontal rotation axis line, and a rotation axis line of the first rotation mechanism. A second rotation mechanism that rotates the holding portion about a substantially vertical rotation axis, and the control portion controls the mounted object by both the first rotation mechanism and the second rotation mechanism of the rotation mechanism portion. It is configured to rotate and control so that the three-dimensional shape measuring unit measures the three-dimensional shape of the mounted object from a plurality of directions. According to this structure, since the three-dimensional shape of the mounted object is measured from a plurality of directions, it is possible to suppress the occurrence of blind spots as compared with the case of measuring from one direction. Thereby, the three-dimensional shape of the mounted object can be measured more accurately.

In this case, preferably, the control unit determines, based on the measurement result of the mounted object by the three-dimensional shape measurement unit, whether or not there is a blind spot in the measurement direction. Is configured to control the mounted object so as to be measured. With this configuration, when there is a blind spot, additional measurement is performed from different measurement directions, so the blind spot can be effectively reduced.

In the configuration in which the control unit determines the presence or absence of a blind spot in the measurement direction, preferably, the control unit, when there is a blind spot on the mounting surface of the mounted object, detects the mounted object by the three-dimensional shape measurement unit from an unmeasured direction. It is configured to control to measure. According to this structure, it is possible to reliably prevent the failure to acquire the information on the mounting surface of the mounted object due to the blind spot.

In the component mounting apparatus according to the above aspect, preferably, the control unit is configured to create mounting data for mounting the component on the mounted object based on the acquired information of the plurality of mounting surfaces. There is. According to this structure, the mounting data can be easily created even when there is no information on the three-dimensional shape of the mounted object.

In the component mounting apparatus according to the above aspect, it is preferable that the control unit obtains, from the mounting surface information, angle information for adjusting the posture by the rotating mechanism unit when mounting the component on the mounting surface of the mounted object. Is configured to. According to this structure, when the component is mounted on the mounting object having a three-dimensional shape, the posture of the mounting object can be easily adjusted based on the acquired angle information so that the mounting surface becomes horizontal. ..

In the component mounting apparatus according to the one aspect described above, preferably, the three-dimensional shape measuring unit includes at least one of a laser displacement meter and a stereo camera. According to this structure, the three-dimensional shape of the mounted object can be easily measured by the laser displacement meter or the stereo camera.

In this case, preferably, the three-dimensional shape measurement unit includes a laser displacement meter, and the control unit determines a method of a plane passing through each of the three points based on the position information of the mounted object at the plurality of points by the laser displacement meter. It is configured to compare the line vectors and determine whether the plurality of points of the mounted object are on the same plane. According to this structure, it is possible to easily detect the same plane of the mounted object.

In the component mounting apparatus according to the above aspect, preferably, the control unit is configured to create coordinate data of the component mounting position based on the mounting surface information and the teaching of the mounting position of the component. According to this structure, the component mounting position can be associated with the mounting surface of the mounted object, so that the mounting head can perform the operation of mounting the component on the mounting surface.

In this case, preferably, the control unit is configured to create coordinate data of the component mounting position from the component mounting position taught based on the image of the mounting surface. With this configuration, the user can teach the component mounting position with respect to the image of the mounting surface of the actual mounted object, so that the coordinate data of the component mounting position can be easily created.

In the component mounting apparatus according to the above aspect, preferably, the control unit, based on the information of the mounting surface acquired based on the measurement result of the mounted object by the three-dimensional shape measuring unit, the preset mounting surface information. It is configured to correct. According to this structure, the information of the mounting surface can be corrected by reflecting the measurement result of the actual mounted object, so that the accuracy of the mounting surface information can be improved.

In the component mounting apparatus according to the above aspect, preferably, the control unit is configured to receive an input of approximate dimensions of the mounted object before the solid shape measuring unit measures the mounted object. According to this structure, it is possible to determine in advance whether or not the mounted object will be interfered with other members when being held and moved by the holding section. Further, it is possible to narrow down the measurement range of the mounted object by the three-dimensional shape measuring unit.

In the component mounting apparatus according to the above aspect, preferably, the control unit measures an approximate dimension of the mounted object before holding the mounted object by the holding unit, and measures the approximate dimension of the mounted object. Based on the above, the three-dimensional shape measuring unit is configured to narrow down the measurement range of the mounted object. According to this structure, the measurement range can be set according to the size of the mounted object, so that the measurement time can be shortened as compared with the case where the measurement range is too large.

In the component mounting apparatus according to the above aspect, preferably, the control unit mounts the component on the mounting surface based on the measurement result of the mounted object by the three-dimensional shape measuring unit, and the mounting head and the mounted object. It is configured to determine whether or not the parts interfere with each other. According to this structure, when the component is actually mounted, it is possible to prevent the mounting head from colliding with the mounted object or component.

According to the present invention, as described above, even when there is no information on the three-dimensional shape of the mounted object, it is possible to adjust the posture of the mounted object having the three-dimensional shape while suppressing an increase in the work load of the user. Parts can be mounted on the mounted object.

FIG. 1 is a schematic plan view showing the overall configuration of a component mounting device according to an embodiment of the present invention. FIG. 1 is a schematic front view showing the overall configuration of a component mounting device according to an embodiment of the present invention. FIG. 1 is a schematic side view showing an overall configuration of a component mounting device according to an embodiment of the present invention. It is a perspective view showing a holding unit of a component mounting device by one embodiment of the present invention. FIG. 3 is a perspective view showing an example of an object to be mounted of the component mounting apparatus according to the embodiment of the present invention. FIG. 6 is a side view for explaining measurement of a three-dimensional shape of the mounted object by the laser displacement meter of the component mounting apparatus according to the embodiment of the present invention. FIG. 6 is a plan view for explaining measurement of a three-dimensional shape of a mounted object by a laser displacement meter of the component mounting apparatus according to the embodiment of the present invention. FIG. 6 is a side view for explaining measurement of a three-dimensional shape of a mounted object by a stereo camera of the component mounting apparatus according to the embodiment of the present invention. 6 is a table for explaining a measurement direction of an object to be mounted of the component mounting apparatus according to the embodiment of the present invention. FIG. 3 is a perspective view for explaining a measurement direction of an object to be mounted of the component mounting device according to the embodiment of the present invention. It is a perspective view for explaining measurement from above with respect to a reference position. It is a perspective view for explaining measurement from the back to the reference position. It is a perspective view for explaining measurement from the right side with respect to a reference position. It is a perspective view for explaining measurement from the front with respect to a reference position. It is a perspective view for explaining measurement from the left with respect to a reference position. It is a figure for demonstrating the determination of the plane of the component mounting apparatus by one Embodiment of this invention. It is a figure for demonstrating the determination of the plane in each measurement direction of the component mounting apparatus by one Embodiment of this invention. It is a figure for demonstrating conversion of the measurement result of the component mounting apparatus by one Embodiment of this invention into a reference position. It is a figure for demonstrating composition of the measurement result of the component mounting apparatus by one Embodiment of this invention. It is a figure for explaining a blind spot of a component mounting device by one embodiment of the present invention. 5 is a table for explaining remeasurement when there is a blind spot in the component mounting apparatus according to the embodiment of the present invention. It is a figure for demonstrating determination of the blind spot of the component mounting apparatus by one Embodiment of this invention. It is a figure for demonstrating the attitude|position at the time of the component mounting of the component mounting apparatus by one Embodiment of this invention. FIG. 6 is a diagram for explaining setting of mounting coordinates on the mounting surface of the component mounting apparatus according to the embodiment of the present invention. It is a figure for demonstrating the check of the interference of the component mounting apparatus by one Embodiment of this invention. 6 is a first flowchart for explaining a data creating process of the component mounting apparatus according to the embodiment of the present invention. 8 is a second flowchart for explaining the data creation process of the component mounting apparatus according to the embodiment of the present invention. 6 is a flowchart for explaining a three-dimensional shape measuring process of the component mounting apparatus according to the embodiment of the present invention. 6 is a flowchart for explaining a leveling process by a manual operation of the component mounting apparatus according to the embodiment of the present invention.

Embodiments embodying the present invention will be described below with reference to the drawings.

(Structure of component mounting device)
A configuration of a component mounting apparatus 100 according to an embodiment of the present invention will be described with reference to FIGS.

As shown in FIGS. 1 to 3, the component mounting apparatus 100 is configured to mount a component E (electronic component) such as an IC, a transistor, a capacitor, and a resistor on a mounted object P having a three-dimensional shape. .. The component mounting apparatus 100 is an apparatus that conveys the mounted object P and mounts the component E on the mounted object P.

As shown in FIGS. 1 and 2, the component mounting apparatus 100 includes a base 1, a substrate transport unit 2, a substrate holding unit 3, a head unit 4, a supporting unit 5, a pair of rail units 6, and a pair of rail units 6. A component recognition camera 7, a board recognition camera 8, a three-dimensional shape measurement unit 9, and a control device 10 (see FIG. 2) are provided. The control device 10 is an example of the "control unit" in the claims.

The mounted object P has five mounting surfaces P1, P2, P3, P4, and P5 as shown in FIGS. 5 and 23. The mounting surface P3 is arranged horizontally at the reference position shown in FIG. The mounting surfaces P1, P2, P4 and P5 are arranged at a reference position with a predetermined angle with respect to the horizontal plane.

Position recognition marks (fiducial marks) captured by the board recognition camera 8 are attached to the mounting surfaces P1 to P5, respectively. The mounting surfaces P1 to P5 are flat surfaces on which the component E is mounted by the head unit 4.

As shown in FIG. 1, the Y2 side end of the base 1 is provided with a feeder placement portion 12 for placing a plurality of tape feeders 11.

The tape feeder 11 holds a reel 11a (see FIG. 3) around which a tape holding a plurality of parts E at predetermined intervals is wound. The tape feeder 11 is configured to supply the component E from the tip by rotating the reel 11a and feeding the tape holding the component E.

Each tape feeder 11 is arranged in the feeder arrangement unit 12 in a state of being electrically connected to the control device 10 via a connector (not shown) provided in the feeder arrangement unit 12. Thereby, each tape feeder 11 is configured to feed the tape from the reel 11a and supply the component E based on the control signal from the control device 10. At this time, each tape feeder 11 is configured to supply the component E in accordance with the mounting work of the head unit 4.

The board transport unit 2 is configured to carry in the mounted object P, carry it in the carrying direction (X direction), and carry it out. Further, the board transport unit 2 is configured to transfer the loaded object P to the board holding unit 3. In the component mounting apparatus 100, the substrate transfer section 2 forms a single transfer path.

Here, as shown in FIGS. 1 to 3, the mounted object P is carried by the substrate carrying section 2 while being held by the transfer carrier 91 (jig). Specifically, the plurality of transfer carriers 91 (the mounted objects P) are carried by the board carrying section 2 in a state of being placed on one carrying board 90 (jig). The transport board 90 is a member for transporting the mount target P and has a plate shape. The transfer carrier 91 has a plate shape. The transfer carrier 91 having a plate shape has a slight adhesive layer formed on the upper surface (Z1 side surface). The transfer carrier 91 is configured to detachably hold and mount the mounted object P on the upper surface by adhering the mounted object P to the adhesive layer. A single held portion for holding the substrate holding unit 3 is provided on the lower surface (Z2 side surface) of the transfer carrier 91. The held portion is provided near the center of gravity of the mounted object P held on the upper surface. The held portion is formed so as to protrude downward (Z2 direction) from the lower surface of the transfer carrier 91. The mounted object P is held by the substrate holding unit 3 via the transfer carrier 91.

The substrate transfer section 2 includes an upstream transfer section 21, a central transfer section 22, and a downstream transfer section 23.

The upstream side transport unit 21 is a transport unit provided on the upstream side (X1 side) in the transport direction (X direction). The upstream-side transport unit 21 is configured to carry in the mounted object P before mounting from a transport path (not shown) and also to transport the mounted object P to the central transport unit 22. The upstream side transport unit 21 has a pair of conveyor units 211. The upstream side transport unit 21 supports both ends of the transfer carrier 91 in a direction orthogonal to the transport direction (Y direction) from below by the pair of conveyor units 211, so that the upstream carrier unit 21 is covered from both sides in the direction orthogonal to the transport direction. The mount target P is configured to be transported in the transport direction while supporting the mount target P. In addition, the pair of conveyor units 211 is configured to be able to adjust the interval in the direction orthogonal to the transport direction. Specifically, the Y1 side conveyor unit 211 is configured to be movable in a direction orthogonal to the transport direction, and the Y2 side conveyor unit 211 is fixed. Thus, the width (width in the Y direction) between the pair of conveyor units 211 can be adjusted according to the size of the mounted object P (width in the Y direction).

The central carrying unit 22 is a carrying unit provided between the upstream carrying unit 21 and the downstream carrying unit 23. The central transfer unit 22 is configured to receive the mounted object P before mounting from the upstream transfer unit 21, and transfer the received mounted object P to the downstream transfer unit 23. Further, the central transport unit 22 is configured to move the mounted object P to a delivery position to the substrate holding unit 3.

The central transport unit 22 has a pair of conveyor units 221. The central transport unit 22 supports the both ends of the transfer carrier 91 in the direction (Y direction) orthogonal to the transport direction from below by the pair of conveyor units 221, so that the central transport unit 22 is mounted from both sides in the direction orthogonal to the transport direction. It is configured to convey the mounted object P in the conveying direction while supporting the object P. Further, the pair of conveyor parts 221 are configured to be movable independently of each other in a direction orthogonal to the transport direction by a drive motor (not shown). The central transport unit 22 moves the pair of conveyor units 221 in a direction orthogonal to the transport direction while maintaining the width between the pair of conveyor units 221 (width in the Y direction), and It is configured to move in a direction orthogonal to the transport direction.

In the component mounting apparatus 100, the loaded object P is moved (conveyed) in the conveyance direction (X direction) by the pair of conveyor units 221 of the central conveyance unit 22 and positioned at a predetermined position in the conveyance direction. After that, the mounted object P is moved by the pair of conveyor parts 221 in the direction orthogonal to the transport direction, and thereby is positioned at a predetermined position in the direction orthogonal to the transport direction. As a result, in the component mounting apparatus 100, the mounted object P is moved to the delivery position for delivering the mounted object P to the substrate holding unit 3.

The downstream transport unit 23 is a transport unit provided on the downstream side (X2 side) in the transport direction (X direction). The downstream-side transport unit 23 is configured to receive the mounted object P from the central transport unit 22 and carry out the mounted object P to a transport path (not shown). The downstream transfer unit 23 has a pair of conveyor units 231. The downstream-side transport unit 23 supports both ends of the transfer carrier 91 in the direction (Y direction) orthogonal to the transport direction from below by the pair of conveyor units 231, so that the downstream-side transport unit 23 can be covered from both sides in the direction orthogonal to the transport direction. The mount target P is configured to be transported in the transport direction while supporting the mount target P. In addition, the pair of conveyor units 231 are configured to be able to adjust the interval in the direction orthogonal to the transport direction. Specifically, the Y1 side conveyor unit 231 is configured to be movable in a direction orthogonal to the transport direction, and the Y2 side conveyor unit 231 is fixed. Accordingly, the width (width in the Y direction) between the pair of conveyor units 231 can be adjusted according to the size of the mounted object P (width in the Y direction).

The substrate holding unit 3 is configured to receive the mounted object P from the substrate transfer unit 2 at the transfer position and hold the mounted object P. Specifically, the substrate holding unit 3 is configured to hold the mounted object P via the transfer carrier 91.

Further, the substrate holding unit 3 is configured to move the held mounted object P in the vertical direction (Z direction). Further, the substrate holding unit 3 is configured to incline the held mounted object P (rotate about a horizontal rotation axis). Further, the substrate holding unit 3 is configured to rotate the held mounted object P (rotate about a vertical rotation axis). In other words, the substrate holding unit 3 is configured to be able to adjust the posture of the mounted object P by moving the mounted object P in the vertical direction, inclining, or rotating. Thereby, for example, the posture of the mounted object P can be adjusted so that the mounting surfaces P1 to P5 of the mounted object P are substantially parallel to the horizontal plane (XY plane).

Further, the component mounting apparatus 100 is configured such that the substrate holding unit 3 can be replaced with another unit. Specifically, the component mounting apparatus 100 is configured such that the substrate holding unit 3 can be replaced with a substrate backup unit (not shown) that supports a substantially flat substrate from below.

The component mounting apparatus 100 is a device suitable for mounting the component E on the mounted object P having a three-dimensional shape when the substrate holding unit 3 is attached. Further, the component mounting apparatus 100 is a device suitable for mounting the component E on a substrate having a substantially flat shape when the substrate backup unit is attached.

As shown in FIGS. 1 and 2, the head unit 4 is provided at a position above the base 1 via the support portion 5 and the pair of rail portions 6. Further, the head unit 4 is provided at a position (Z1 direction) above the substrate transport unit 2, the substrate holding unit 3, and the tape feeder 11, and is configured to be movable in the horizontal direction.

When the substrate holding unit 3 is attached, the head unit 4 is configured to perform the mounting work of the component E on the mounted object P held by the substrate holding unit 3. In addition, the head unit 4 is configured to perform the mounting work of the component E on the board supported by the board backup unit when the board backup unit is attached. Specifically, the head unit 4 is configured to suck the component E supplied from the tape feeder 11 and mount the sucked component E on the mount target P.

As shown in FIG. 2, the head unit 4 includes a plurality (six) of mounting heads 41, a plurality (six) of ball screw shafts 42 provided for each mounting head 41, and a plurality of ball screw shafts 42. Further, a plurality (six) of Z-axis motors 43 and a plurality (six) of R-axis motors provided for each mounting head 41 are provided.

The mounting head 41 is configured to mount the component E on the mounted object P. The plurality of mounting heads 41 are linearly arranged along the transport direction (X direction). A nozzle 41a (see FIGS. 2 and 3) is attached to the tip of each mounting head 41. The mounting head 41 is configured to be able to suck and hold the component E supplied from the tape feeder 11 by the negative pressure generated at the tip of the nozzle 41a by a negative pressure generator (not shown).

Each ball screw shaft 42 is formed so as to extend in the vertical direction. Each Z-axis motor 43 is configured to rotate the corresponding ball screw shaft 42. Further, each mounting head 41 is provided with a ball nut 41b (see FIG. 3) that is engaged (screwed) with the corresponding ball screw shaft 42. The mounting head 41 is configured to be vertically movable along the ball screw shaft 42 together with the ball nut 41b that engages (screws) with the ball screw shaft 42 when the ball screw shaft 42 is rotated by the Z-axis motor 43. ing. As a result, the mounting head 41 has a lowered height position at which the component E can be sucked or mounted (mounted) and a raised position at which the mounting head 41 can move in the horizontal direction. It is configured to be movable in the vertical direction between the position and the position. Each R-axis motor is configured to rotate the corresponding mounting head 41 about the central axis of the nozzle 41a (around the rotation axis in the Z direction).

The support portion 5 is configured to move the head unit 4 in the transport direction (X direction). The support portion 5 includes a ball screw shaft 51 extending in the X direction, an X-axis motor 52 rotating the ball screw shaft 51, and a guide rail (not shown) extending in the X direction. Further, the head unit 4 is provided with a ball nut 45 (see FIG. 3) with which the ball screw shaft 51 is engaged (screwed). The head unit 4 moves in the transport direction (X direction) along the support portion 5 together with the ball nut 45 that engages (screws) with the ball screw shaft 51 when the ball screw shaft 51 is rotated by the X axis motor 52. It is configured to be possible.

The pair of rail portions 6 are both formed so as to extend in the Y direction, and are fixed on the base 1 at both ends in the X direction of the base 1. In addition, the pair of rail portions 6 is configured to move the support portion 5 in a direction (Y direction) orthogonal to the transport direction. The pair of rail portions 6 includes a pair of ball screw shafts 61 that both extend in the Y direction, and a plurality (two) of Y-axis motors 62 provided for each ball screw shaft 61. Each Y-axis motor 62 is configured to rotate the corresponding ball screw shaft 61. Further, the support portion 5 is provided with a ball nut (not shown) with which the ball screw shaft 61 is engaged (screwed). The support portion 5 is conveyed along the pair of rail portions 6 together with the ball nuts that engage (screw) with the ball screw shafts 61 when the ball screw shafts 61 are synchronously rotated by the Y-axis motors 62. It is configured to be movable in a direction (Y direction) orthogonal to the direction.

With such a configuration, the head unit 4 is configured to be movable in the horizontal direction (X direction and Y direction) on the base 1. As a result, the head unit 4 can move, for example, above the tape feeder 11 and suck the component E supplied from the tape feeder 11. Further, the head unit 4 can move above the mounted object P held by the substrate holding unit 3 to mount the sucked component E on the mounted object P, for example.

The component recognition camera 7 is fixed on the upper surface of the base 1 near the tape feeder 11, and is configured to capture an image of the component E sucked by the nozzle 41a of the mounting head 41 prior to mounting the component E. ing. The component recognition camera 7 is configured to image the component E sucked by the nozzle 41a of the mounting head 41 from below (Z2 direction). The imaging result is acquired by the control device 10. The control device 10 recognizes the suction state (rotational posture and suction position of the mounting head 41 with respect to the nozzle 41a) of the component E viewed from below, based on the imaging result of the component E sucked by the nozzle 41a of the mounting head 41. Is configured. Further, the control device 10 is configured to correct the rotational posture of the component E and the component mounting position coordinate position (XY coordinate position) at the time of mounting based on the recognition result of the suction state of the component E.

The board recognition camera 8 is configured to capture an image of the position recognition mark attached to the mounted object P prior to mounting the component E. The position recognition mark is a mark for recognizing the position of the mounted object P. The control device 10 acquires the imaging result of the position recognition mark. The control device 10 is configured to recognize the accurate position and posture of the mounted object P held by the substrate holding unit 3 based on the imaging result of the position recognition mark. Further, the control device 10 is configured to correct the component mounting position coordinate position (XY coordinate position) at the time of mounting based on the recognition result of the position and orientation of the mounted object P.

The board recognition camera 8 is attached to the head unit 4. Specifically, the board recognizing camera 8 is attached to the side of the head unit 4 on the Y1 side at the center position of the mounting nozzle array arranged in the X direction. Accordingly, the board recognition camera 8 is configured to be movable in the horizontal direction (X direction and Y direction) on the base 1 together with the head unit 4. The board recognition camera 8 is configured to move in the horizontal direction on the base 1 and image the position recognition mark attached to the mounted object P from above the mounted object P (Z1 direction). ing. Further, the board recognition camera 8 is configured to be able to photograph a holding portion 34 of the board holding unit 3 described later.

The three-dimensional shape measuring unit 9 is configured to measure the three-dimensional shape of the mounted object P held by the holding unit 34. The three-dimensional shape measuring unit 9 includes at least one of a laser displacement meter 9a (see FIG. 6) and a stereo camera 9b (see FIG. 8). As shown in FIGS. 6 and 7, the three-dimensional shape measurement unit 9 (laser displacement meter 9a) irradiates a plurality of measurement points on the mounted object P with laser light, and the mounted object P or the transfer carrier 91. The height of the mounted object P is measured by receiving the reflected light reflected from. The measurement result of the height position is acquired by the control device 10. The control device 10 is configured to acquire the shape of the mounted object P based on the measurement result of the height position. The plurality of measurement points are set in a grid pattern with a predetermined interval. That is, since the height measurement by the laser displacement meter 9a is the measurement at a point, the measurement is performed at a plurality of points while gradually shifting the measurement points in the XY directions. Thereby, the three-dimensional shape (three-dimensional shape) of the mounted object P is measured.

Further, the three-dimensional shape measuring unit 9 (stereo camera 9b) is configured to image the mounted object P from a plurality of different directions, as shown in FIG. The height position at each position of the mounted object P is measured from the parallax of images from a plurality of different directions. The measurement result of the height position is acquired by the control device 10. The control device 10 is configured to acquire the shape of the mounted object P based on the measurement result of the height position.

The solid shape measuring unit 9 measures the solid shape of the mounted object P in order to acquire the information of the solid shape when the solid shape information based on the CAD data of the mounted object P does not exist. Further, the three-dimensional shape measuring unit 9 measures the three-dimensional shape of the mounted object P in order to acquire the position, posture and shape of each mounted object P when the component E is mounted on the mounted object P. ..

The three-dimensional shape measuring unit 9 is attached to the head unit 4. Thereby, the three-dimensional shape measuring unit 9 is configured to be movable in the horizontal direction (X direction and Y direction) on the base 1 together with the head unit 4. Further, the three-dimensional shape measuring unit 9 is configured to move horizontally on the base 1 and measure the three-dimensional shape from above the mounted object P.

The control device 10 includes an information processing unit such as a CPU (Central Processing Unit), a storage unit such as a ROM (Read Only Memory), and a RAM (Random Access Memory). Further, the control device 10 is configured to control the operation of the component mounting apparatus 100. Specifically, the control device 10 includes a board transfer section 2, a board holding unit 3, a head unit 4, a support section 5, a pair of rail sections 6, a component recognition camera 7, a board recognition camera 8, a three-dimensional shape measuring section 9, The tape feeder 11 and the like are controlled according to a prestored program to mount the component E on the mount target P.

(Structure of substrate holding unit)
Next, the configuration of the substrate holding unit 3 will be described with reference to FIG. As shown in FIG. 4, the substrate holding unit 3 includes an elevating mechanism section 31, a tilting mechanism section 32, a rotating mechanism section 33, a holding section 34, and a fixing section 35. The tilt mechanism section 32 is an example of the “rotation mechanism section” and the “first rotation mechanism section” in the claims. The rotation mechanism section 33 is an example of the "rotation mechanism section" and the "second rotation mechanism section" in the claims.

The elevating mechanism section 31 is an up-down axis mechanism section for moving the holding section 34 (object P) in the up-down direction along an axis A1 (indicated by a chain line) extending in the up-down direction. Specifically, the elevating mechanism unit 31 is configured to rotate the ball screw shaft 312 by the drive motor 311 to move the tilting mechanism unit 32, the rotating mechanism unit 33, and the holding unit 34 in the vertical direction.

The tilt mechanism section 32 is configured to rotate the holding section 34 so as to tilt the holding section 34 with respect to the horizontal plane. Specifically, the tilt mechanism section 32 is attached to the lifting mechanism section 31, and is rotated by rotating the rotation mechanism section 33 around the axis A2 (indicated by a one-dot chain line), so that the mounted section held by the holding section 34 is mounted. It is a tilt axis rotation mechanism portion for inclining the object P. The axis A2 is an axis extending in the horizontal direction. That is, the tilting mechanism portion 32 is configured to rotate the holding portion 34 (the mounted object P) around the rotation axis line in the horizontal direction. The axis A2 is a tilt axis extending in a direction substantially parallel to the transport direction, and extends in a direction substantially orthogonal to the mounting direction (Y direction) of the tilting mechanism portion 32 with respect to the elevating mechanism portion 31 and the axis A1. .. The axis A2 is an axis extending in a direction substantially parallel to the arrangement direction (X direction) of the plurality of mounting heads 41. The tilt mechanism portion 32 is configured to rotate the rotation mechanism portion 33 and the holding portion 34 by the drive motor 321. That is, the tilting mechanism part 32 is configured to rotate the holding part 34 and the mounted object P held by the holding part 34 around the axis A2 to tilt the holding part 34 in the YZ plane.

The rotation mechanism unit 33 is a rotation shaft mechanism unit that is attached to the tilt mechanism unit 32 and rotates the mounted object P held by the holding unit 34 around the axis A3 (indicated by a chain line). The axis A3 is an axis extending in a direction substantially orthogonal to the axis A2 (tilt axis). That is, the rotation mechanism portion 33 is configured to rotate the holding portion 34 around a rotation axis line that is substantially perpendicular to the rotation axis line of the tilt mechanism portion 32. The axis A3 is an axis passing through the center of the holding portion 34, and the tilting mechanism portion 32 tilts the rotation mechanism portion 33 and the holding portion 34 at the same time. The rotation mechanism unit 33 is configured to rotate the holding unit 34 by the drive motor 331.

The holding portion 34 is configured to hold the mounted object P having a three-dimensional shape on which the component E is mounted. Specifically, the holding section 34 is attached to the rotation mechanism section 33, and is configured to hold and fix the mounted object P via the transfer carrier 91. The holding portion 34 has a main body portion 341 having a cylindrical shape and a plurality (three) of claw portions 342. The plurality of (three) claw portions 342 are arranged on the upper surface of the main body portion 341 at equal angular intervals (120 degree intervals). Further, each of the plurality of claw portions 342 is configured to be movable in the radial direction of rotation of the holding portion 34.

The fixing portion 35 is a member for attaching and fixing the substrate holding unit 3 to the base 1. As shown in FIGS. 1 to 3, the substrate holding unit 3 is fixed to the base 1 via a fixing portion 35, for example, with a screw or the like.

As shown in FIG. 5, the outer dimension data of the transfer carrier 91 and the mounted object P is acquired in advance. That is, the control device 10 is configured to receive an input of approximate dimensions of the mounted object P before the three-dimensional shape measurement unit 9 measures the mounted object P. The approximate dimensions of the mounted object P are measured and measured by a user with a ruler or the like. In FIG. 5, the transfer carrier 91 has dimensions of B1 in the horizontal direction, B2 in the vertical direction, and B3 in height. The mounted object P has dimensions of C1 in the horizontal direction, C2 in the vertical direction, and C3 in the height. Further, the mounted object P is fixed at a position of horizontal D1 and vertical D2 from the transfer carrier 91. By measuring the approximate dimensions of the mounted object P and the transfer carrier 91 in advance, it is possible to confirm in advance whether or not they are within the device specifications.

Further, the control device 10 measures the approximate dimensions of the mounted object P before holding the mounted object P by the holding section 34, and based on the measured approximate dimensions of the mounted object P, the three-dimensional shape is obtained. It is configured to narrow down the measurement range of the mounted object P measured by the measuring unit 9.

Here, in the present embodiment, the control device 10 acquires the information of the plurality of mounting surfaces P1 to P5 on which the component E is mounted, based on the measurement result of the mounted object P by the three-dimensional shape measuring unit 9. It is configured. Specifically, the control device acquires the tilt information of the surface of the mounted object P from the measurement result of the mounted object P by the three-dimensional shape measuring unit 9, and based on the tilt information of the surface, the mounted object P. The mounting surfaces P1 to P5 are identified.

Further, the control device 10 is configured to create mounting data for mounting the component E on the mount target P based on the acquired information of the plurality of mounting surfaces P1 to P5. Based on the mounting data, the control device 10 controls the posture so that the mounting surfaces P1 to P5 are horizontal, and also controls the mounting of the component E at the set positions on the mounting surfaces P1 to P5.

Further, in the present embodiment, the control device 10 rotates the mounted object P by both the tilting mechanism section 32 and the rotation mechanism section 33, and causes the three-dimensional shape measuring section 9 to rotate the mounted object P three-dimensionally from a plurality of directions. It is configured to control to measure the shape. Specifically, as shown in FIGS. 9 to 15, the control device 10 sets the mounted object P upward, rearward, and rightward with respect to a reference position with the mounted surface P3 facing upward. , Control is performed from five directions, front and left. It should be noted that upward, backward, rightward, forward and leftward mean directions at the reference position, and do not mean actual measuring directions of the three-dimensional shape measuring unit 9.

Specifically, when the mounted object P is measured from above the reference position, the Z axis is set to the position z0, the tilt axis is set to 0 degrees (not tilted), and the R axis is set to 0 degrees. When measuring the mounted object P from the rear at the reference position, the Z axis is set to the position of z1, the tilt axis is set to +90 degrees, and the R axis is set to 0 degree. When measuring the mounted object P from the right side at the reference position, the Z axis is set to the position of z2, the tilt axis is set to +90 degrees, and the R axis is set to +90 degrees. When measuring the mounted object P from the front at the reference position, the Z axis is set to the position of z3, the tilt axis is set to +90 degrees, and the R axis is set to +180 degrees. When measuring the mounted object P from the left side at the reference position, the Z axis is set to the position of z4, the tilt axis is set to +90 degrees, and the R axis is set to −90 degrees. Note that z1, z2, z3, and z4 are automatically adjusted according to the size of the mounted object P and the rotation of the tilt axis and the R axis. Specifically, the vertical direction is adjusted based on the rough dimension data so that the mounted object P fits within the measurement range of the three-dimensional shape measuring unit 9.

When measuring the mounted object P from above at the reference position, the mounting surfaces P3 and P5 of the mounted object P are measured as shown in FIG. When the mounted object P is measured from the rear at the reference position, the mounting surface P5 of the mounted object P is measured as shown in FIG. When the mounted object P is measured from the right side of the reference position, the mounting surface P4 of the mounted object P is measured as shown in FIG. When measuring the mounted object P from the front at the reference position, the mounting surface P1 of the mounted object P is measured as shown in FIG. When measuring the mounted object P from the left side at the reference position, the mounting surface P2 of the mounted object P is measured as shown in FIG.

Further, in the present embodiment, the control device 10 compares the normal vectors of the planes passing through the positions of the three points on the basis of the positional information on the plurality of points of the mounted object P by the laser displacement meter 9a, It is configured to judge whether or not a plurality of points of the mount P are on the same plane. Specifically, as shown in FIG. 16, a triangular plane composed of three adjacent measurement points is obtained based on the coordinates at each measurement point measured by the laser displacement meter 9a. The plane equation is represented by ax+by+cz+d=0. The equation of the plane is calculated by obtaining a, b, c and d from the coordinates of three points. Also, the normal vector (a, b, c) for the plane is acquired. Since the measurement is performed from above, the normal vector is set upward. The control device 10 compares the normal vectors of the triangles and determines that the directions of extension of the surfaces of the triangles whose normal vector is within a predetermined error range are the same. Further, the control device 10 determines whether or not the triangular planes having the same plane orientation are on the same plane based on the plane equation. Thus, the surface forming the surface of the mounted object P is obtained. As shown in FIG. 17, the information on the mounting surfaces P1 to P5 is obtained by the measurement of each of the upper side, the rear side, the right side, the front side, and the left side.

The control device 10 performs coordinate conversion to move the data of the mounting surfaces P1 to P5 obtained in each direction (each posture) to the zero origin posture (reference position). Specifically, as shown in FIG. 18, the coordinates of the Z axis are adjusted. For example, in the case of measurement from the left side, since the Z axis is set to z4, it is converted to z0 according to the reference position. Next, the coordinates are converted based on the rotation of the tilt axis. For example, in the case of measurement from the left, the tilt axis is set to 90 degrees, so the tilt axis is converted (rotated) to 0 degrees in accordance with the reference position. Next, the coordinates are converted based on the rotation of the R axis. For example, in the case of measurement from the left, the R axis is set to −90 degrees, so the R axis is converted (rotated) to 0 degrees in accordance with the reference position. As a result, the coordinate data obtained when the posture is changed and the measurement is performed is converted into the coordinate data at the reference position. Although an example in which the coordinates are converted is shown for the measurement on the left side, the coordinates are similarly converted in other directions (backward, rightward, frontward).

The control device 10 combines the mounting surfaces P1 to P5 acquired in each direction (each posture) at the origin posture (reference position) of the substrate holding unit 3. Specifically, as shown in FIG. 19, the mounting surfaces P1 to P5 acquired from each direction are combined to acquire the three-dimensional shape of the mounted object P. In this case, the surfaces measured from different directions may overlap. For example, the mounting surface P5 is acquired in the case of measuring from above and in the case of measuring from behind. In this case, the overlapping faces will be merged together. For example, the surface measured by any one measurement is selected. Further, for example, the average of a plurality of acquired faces is acquired as a face.

Further, the control device 10 determines the presence or absence of a blind spot in the measurement direction based on the measurement result of the mounted object P by the solid shape measuring unit 9, and if there is a blind spot, the solid shape measuring unit 9 from the unmeasured direction. Is configured to control the mounted object P so as to be measured. In addition, the control device 10 is configured to control the mounted object P to be measured by the three-dimensional shape measuring unit 9 from the unmeasured direction when the mounting surface of the mounted object P has a blind spot. For example, as shown in FIG. 20, a blind spot may occur when measured from five directions (upper, rear, right, front, left). In this case, the control device 10 measures again from another direction. For example, as shown in FIG. 20, the three-dimensional shape of the mounted object P is measured while changing the tilt axis and the R axis with fine increments. Since it is difficult to measure the mounted object P from the transfer carrier 91 side, the transfer carrier 91 side is excluded from the blind spot determination target.

The controller 10 determines the blind spot, as shown in FIG. Specifically, the control device 10 determines whether each surface is in contact with another surface. Then, when there is a side where one side is in contact with another side, it is determined that there is no blind spot near that side. On the other hand, when one surface has a side that is not in contact with another surface, it is determined that there is a blind spot near that side. For example, in the control device 10, with respect to the triangle T1, the triangles T11, T12, and T13 on the same plane are adjacent to each side. In this case, the triangle T1 is determined to be inside this plane. The triangles T3 and T4 belong to different planes. The triangles T3 and T4 are adjacent to each other within a predetermined distance (within a threshold value). In this case, the control device 10 determines that the surfaces to which the triangles T3 and T4 belong are in contact with each other. The triangle T2 is adjacent to the triangles T21 and T22 whose two sides have the same surface. However, one side of the triangle T2 is not adjacent to a triangle on the same plane or another plane within a predetermined distance (within a threshold value). In this case, the control device 10 determines that there is a blind spot near the side of the triangle T2 that is not adjacent to another triangle.

In addition, the control device 10 adjusts the angle by the tilting mechanism portion 32 and the rotation mechanism portion 33 when mounting the component E on the mounting surfaces P1 to P5 of the mounted object P based on the information of the mounting surfaces P1 to P5. It is configured to obtain information. Specifically, the control device 10 calculates the postures of the tilt axis and the R axis that make the mounting surfaces P1 to P5 horizontal based on the orientations (normal vectors) of the mounting surfaces P1 to P5. That is, the control device 10 calculates a posture in which the normal vector of the surface faces upward. As shown in FIG. 23, the mounting surface P1 has an R axis of +180 degrees and a tilt axis of +90 degrees. The mounting surface P2 has an R axis of −90 degrees and a tilt axis of +90 degrees. Further, the mounting surface P3 has an R axis of 0 degrees and a tilt axis of 0 degrees. Further, the mounting surface P4 has an R axis of +90 degrees and a tilt axis of +90 degrees. Further, the mounting surface P5 has an R axis of 0° and a tilt axis of +45°.

In addition, the control device 10 drives the board holding unit 3 based on the postures of the mounting surfaces P1 to P5 to control the mounting surfaces P1 to P5 on which the component E is mounted to be horizontal. Further, the control device 10 drives the substrate holding unit 3 to adjust the height in the vertical direction so that the mounting surfaces P1 to P5 are arranged at appropriate mounting heights based on the information on the mounting surfaces P1 to P5. To do.

Further, the control device 10 is configured to create coordinate data of the component mounting position based on the information on the mounting surfaces P1 to P5 and the teaching of the mounting position of the component E. Specifically, the control device 10 is configured to create coordinate data of the component mounting position from the component mounting position taught based on the images of the mounting surfaces P1 to P5. For example, as shown in FIG. 24, the board recognition camera 8 images the mounting surfaces P1 to P5 and displays an image. The user manually moves the XY axes to adjust so that the fiducial marks on the mounting surfaces P1 to P5 and the mounting position of the component E are imaged in the center of the camera, and the mounting position and the position of the fiducial mark are adjusted. Is taught. Further, at this time, the size of the component E to be mounted and the type of the nozzle 41a to be used are designated.

Further, when mounting the component E on the mounting surfaces P1 to P5 based on the measurement result of the mounted object P by the three-dimensional shape measuring unit 9, the control device 10 and the mounting head 41 and the mounted object P or the component E are mounted. And is configured to determine if and interfere. Specifically, as shown in FIG. 25, the nozzle 41a, the component E, and the component E, based on the measured shape of the mounted object P, the mounting posture, the mounting position of the component E, the component size, and the type of the nozzle 41a. It is determined whether or not the mounted object P and the transfer carrier 91 do not interfere with each other. The control device 10 determines whether or not the nozzles 41a are cylindrical and the parts E, the mounted object P, and the transfer carrier 91 are triangular polygons and whether they intersect with each other by simulation. If they intersect with each other, it is determined that they interfere.

Further, the control device 10 is configured to check the three-dimensional shape when the object P is carried into the component mounting apparatus 100 when the component E of the object P is mounted. Specifically, the control device 10 checks whether or not the loaded object P has a shape corresponding to the production program. The control device 10 is configured to measure the carried-in first mounted object P based on the shape information at the start of the automatic settlement operation, and check whether the shape is different from the shape of the data. Further, it is possible to arbitrarily select whether to check the shape of the first mounted object P or all the mounted objects P.

Further, the control device 10 corrects the information of the preset mounting surfaces P1 to P5 based on the information of the mounting surfaces P1 to P5 acquired based on the measurement result of the mounted object P by the three-dimensional shape measuring unit 9. Is configured.

(Data creation process)
A data creation process for creating data used when mounting the component E on the mount target P will be described with reference to FIGS. The data creation process is performed by the control device 10.

In step S1 of FIG. 26, basic information about the dimensions of the mounted object P and the transfer carrier 91 is input. Specifically, as shown in FIG. 5, the outer size of the transfer carrier 91, the outer size of the mounted object P, and the fixed position of the mounted object P on the transfer carrier 91 are input. In step S<b>2, the transfer board 90 on which a plurality of transfer carriers 91 (the mounted objects P) are placed is transferred by the board transfer section 2, and the transfer board 90 is clamped and fixed on the conveyor section 221.

In step S3, the suction position of each transfer carrier 91 on the transfer board 90 (the position of the transfer carrier 91 on the component mounting apparatus 100) is taught by the user based on the image of the board recognition camera 8. In step S4, the three-dimensional shape measuring unit 9 measures the first mounted object P on the transport board 90 from above. Specifically, the mounted object P on the carrier board 90 is measured by the three-dimensional shape measuring unit 9 and the shape data is acquired. At this time, the surface shape data of the transfer carrier 91 is excluded, and the shape data of only the mounted object P is acquired. Specifically, data on the horizontal shape of the lower surface is excluded. As a result, the outline dimensions of the mounted object P are acquired. Then, the dimension information of the mounted object P is updated from the dimension information of the mounted object P input in step S1 to the acquired shape data information.

In step S5, it is determined whether the measured shape of the mounted object P is within the range of the device specifications. If it is within the device specification range, the process proceeds to step S7. If it is outside the device specification range, the process proceeds to step S6. In step S6, an error is displayed and the process is interrupted.

In step S<b>7, the first mounting target P is sucked by the mounting head 41 and transferred to the substrate holding unit 3. Further, the transfer carrier 91 (mounting target P) is held by the holding portion 34 of the substrate holding unit 3. In step S8, the three-dimensional shape of the mounted object is measured. Specifically, the posture of the mounted object P is changed by the substrate holding unit 3, and the three-dimensional shape of the mounted object P is measured by the three-dimensional shape measuring unit 9 from a plurality of directions.

In step S9 of FIG. 27, it is determined whether or not there is the mounting coordinate data of the component E. For example, it is determined whether or not there is CAD data regarding the mounting position. If there is mounting coordinate data, the process proceeds to step S10. If there is no mounting coordinate data, the process proceeds to step S11. In step S10, the mounting coordinates of the component E are converted from the data, and the process proceeds to step S18.

In step S11, it is determined whether or not the mounting surface is leveled manually. If the manual operation is performed, the process proceeds to step S12. If the manual operation is not performed, the process proceeds to step S13. In step S12, the mounting surface is leveled by a manual operation, and the process proceeds to step S15.

In step S13, the selection of the mounting surface by the user is accepted based on the analysis result of the three-dimensional shape. In step S14, the posture of the holding unit 34 in which the selected mounting surface is horizontal is calculated, and the posture of the holding unit 34 is changed to the calculated posture.

In step S15, the teaching of the mounting coordinates of the component E by the user is accepted. Specifically, the teaching of the mounting coordinates is accepted based on the image of the board recognition camera 8 on the mounting surface. In step S16, it is determined whether or not the teaching of the mounting position on the mounting surface is completed. If completed, the process proceeds to step S17, and if not completed, the process returns to step S15.

In step S17, it is determined whether or not the teaching of the mounting positions on all the mounting surfaces has been completed. If completed, the process proceeds to step S18, and if not completed, the process returns to step S11. In step S18, the user inputs the external dimensions of each component E to be mounted and the nozzles to be used.

In step S19, the mounting interference of the component E is checked. Specifically, the interference between the component E to be mounted and the component E already mounted is checked. Further, the interference between the nozzle 41a that sucks the component E to be mounted and the mounted component E is checked. Further, the interference between the nozzle 41a that sucks the component E to be mounted and the mounted object P is checked. Further, the interference between the nozzle 41a that sucks the component E to be mounted and the transfer carrier 91 is checked. Further, the interference between the mounted object P and the structure of the head unit 4 in the mounting posture is checked. Further, the interference between the transfer carrier 91 and the structure of the head unit 4 in the attitude during mounting is checked. In step S20, the result of checking the component mounting interference is displayed. Then, the data creation process is completed.

(Three-dimensional shape measurement process)
With reference to FIG. 28, the three-dimensional shape measuring process of the mounted object P in step S8 of FIG. 26 will be described.

In step S21 of FIG. 28, the mounted object P is measured by the three-dimensional shape measuring unit 9 from five directions (upper, rear, right, front, left) at the reference position. In step S22, the normal vector of the triangular plane is obtained from the three adjacent measurement coordinates for each measurement value in each direction. The normal vectors of a plurality of triangles are compared with each other to determine whether they are on the same plane to obtain the plane.

In step S23, coordinate conversion is performed on a plane obtained by moving the plane obtained in each direction to the origin (reference position). Also, a plurality of surfaces are combined into one. As a result, information on the three-dimensional shape of the mounted object P is acquired. In step S24, among the three sides of the triangle formed by the three adjacent measurement points, the side that is not in contact with another triangle on the same plane is obtained.

In step S25, a triangle on another surface is searched for in the vicinity of a side that is not in contact with another triangle on the same plane, and it is determined that there is a blind spot if the triangle is not within a predetermined distance. In step S26, when there is a blind spot, it is determined whether remeasurement is necessary. If remeasurement is necessary, the process proceeds to step S27, and if remeasurement is not necessary, the process proceeds to step S28.

In step S27, the three-dimensional shape measuring unit 9 re-measures the mounted object P. In this case, the step widths of the tilt axis and the R axis are input, and the mounted object P is remeasured from each direction. Then, it returns to step S22. In step S28, the analysis result of the surface is displayed. The user confirms whether there is a blind spot based on the analysis result.

In step S29, it is determined whether or not there is a remeasurement instruction from the user. If there is a remeasurement instruction, the process proceeds to step S30. If there is no remeasurement instruction, the three-dimensional shape measurement process ends. In step S30, the three-dimensional shape measuring unit 9 re-measures the mounted object P. In this case, the step widths of the tilt axis and the R axis are input, and the mounted object P is remeasured from each direction. Then, it returns to step S28.

(Manual leveling process)
With reference to FIG. 29, the leveling process by the manual operation in step S12 of FIG. 27 will be described.

In step S31 of FIG. 29, a manual operation by the user that changes the posture of the holding unit 34 so that the mounting surface on which the component E is mounted is approximately horizontal in appearance is accepted. In step S32, the height of the mounting surface which is made substantially horizontal by the manual operation is measured by the laser displacement meter 9a. When the mounting surface is a flat surface, three or more heights are measured, and when the mounting surface is a curved surface, a cross shape is measured.

In step S33, the posture of the holding unit 34 in which the mounting surface is horizontal is calculated from the height measurement result, and the posture of the holding unit 34 is changed to the calculated posture. Then, the leveling process by manual operation is completed.

(Effects of the embodiment)
In this embodiment, the following effects can be obtained.

In the present embodiment, as described above, the control device 10 that acquires information on the plurality of mounting surfaces P1 to P5 on which the component E is mounted based on the measurement result of the mounted object P by the three-dimensional shape measuring unit 9 is provided. .. Thereby, even when there is no information on the three-dimensional shape of the mounted object P, the user does not need to manually measure and input the three-dimensional shape of the mounted object P, and the posture of the mounted object P is manually set by the user. No need to adjust. Further, the posture of the mounted object P can be adjusted so that the component E can be mounted based on the information of the mounting surfaces P1 to P5 of the mounted object P acquired by the control device 10. As a result, even when there is no information on the three-dimensional shape of the mounted object P, the posture of the mounted object P is adjusted and the component E is mounted on the mounted object P while suppressing an increase in the work load on the user. can do.

Further, in the present embodiment, as described above, the control device 10 obtains the tilt information of the surface of the mounted object P from the measurement result of the mounted object P by the three-dimensional shape measuring unit 9, and the tilt information of the surface. Based on the above, the mounting surfaces P1 to P5 of the mounted object P are specified. As a result, even if there is no information on the three-dimensional shape of the mounted object P, the actual surface of the mounted object P is measured and the inclination information of the surface of the mounted object P is acquired, so that the mounting surface P1 of the mounted object P can be obtained. The inclination of ~P5 can be acquired.

Further, in the present embodiment, as described above, the control device 10 causes the mounted object P to be rotated by both the tilting mechanism section 32 and the rotating mechanism section 33 so that the three-dimensional shape measuring section 9 can cover the mounted object P from a plurality of directions. It is configured to control so as to measure the three-dimensional shape of the mounting object P. Thereby, since the three-dimensional shape of the mounted object P is measured from a plurality of directions, it is possible to suppress the occurrence of a blind spot as compared with the case of measuring from one direction. Thereby, the three-dimensional shape of the mounted object P can be measured more accurately.

Further, in the present embodiment, as described above, the control device 10 determines the presence/absence of a blind spot in the measurement direction based on the measurement result of the mounted object P by the three-dimensional shape measuring unit 9, and if there is a blind spot, The three-dimensional shape measuring unit 9 is configured to control the mounted object P to be measured from the unmeasured direction. Accordingly, when there is a blind spot, additional measurement is performed from different measurement directions, so the blind spot can be effectively reduced.

Further, in the present embodiment, as described above, the control device 10 measures the mounted object P from the unmeasured direction by the three-dimensional shape measuring unit 9 when the mounting surface of the mounted object P has a blind spot. It is configured to control. As a result, it is possible to reliably prevent the information about the mounting surfaces P1 to P5 of the mounted object P from being lost due to the blind spot.

Further, in the present embodiment, as described above, the control device 10 creates the mounting data for mounting the component E on the mounted object P based on the acquired information of the plurality of mounting surfaces P1 to P5. To configure. This makes it possible to easily create mounting data even when there is no information on the three-dimensional shape of the mounted object P.

Further, in the present embodiment, as described above, when the control device 10 mounts the component E on the mounting surfaces P1 to P5 of the mounted object P based on the information on the mounting surfaces P1 to P5, the tilting mechanism 32 and the rotation mechanism. The unit 33 is configured to acquire angle information for adjusting the posture. Thus, when the component E is mounted on the mounting object P having a three-dimensional shape, the posture of the mounting object P can be easily adjusted based on the acquired angle information so that the mounting surfaces P1 to P5 are horizontal. You can

Further, in the present embodiment, as described above, the control device 10 controls the normal vector of the surface passing through each of the three points on the basis of the positional information on the plurality of points of the mounted object P by the laser displacement meter 9a. By comparison, it is configured to determine whether or not a plurality of points of the mounted object P are on the same plane. Thereby, the same plane of the mounted object P can be easily detected.

Further, in the present embodiment, as described above, the control device 10 is configured to create the coordinate data of the component mounting position based on the information of the mounting surfaces P1 to P5 and the teaching of the mounting position of the component E. To do. As a result, the component mounting positions can be associated with the mounting surfaces P1 to P5 of the mounted object P, so that the mounting head 41 can perform the operation of mounting the component E on the mounting surfaces P1 to P5.

Further, in the present embodiment, as described above, the control device 10 is configured to generate the coordinate data of the component mounting position from the component mounting position taught based on the images of the mounting surfaces P1 to P5. As a result, the user can teach the component mounting position with respect to the images of the mounting surfaces P1 to P5 of the actual mounted object P, so that the coordinate data of the component mounting position can be easily created.

Further, in the present embodiment, as described above, the control device 10 is preset based on the information of the mounting surfaces P1 to P5 acquired based on the measurement result of the mounted object P by the three-dimensional shape measuring unit 9. It is configured to correct the information on the mounting surfaces P1 to P5. As a result, the information of the mounting surfaces P1 to P5 can be corrected by reflecting the measurement result of the actual mounted object P, so that the accuracy of the information of the mounting surfaces P1 to P5 can be improved.

Further, in the present embodiment, as described above, the control device 10 is configured to receive the input of the approximate dimensions of the mounted object P before the three-dimensional shape measuring unit 9 measures the mounted object P. .. This makes it possible to determine in advance whether or not the mounted object P will interfere with other members when being held and moved by the holding section 34. Moreover, the measurement range of the mounted object P by the three-dimensional shape measuring unit 9 can be narrowed down.

Further, in the present embodiment, as described above, the control device 10 measures the approximate dimensions of the mounted object P before the mounted object P is held by the holding portion 34, and the measured mounted object P is measured. The measurement range of the mounted object P to be measured by the three-dimensional shape measuring unit 9 is narrowed down based on the approximate size of the above. Thereby, the measurement range can be set according to the size of the mounted object P, and thus the measurement time can be shortened as compared with the case where the measurement range is made too large.

Further, in the present embodiment, as described above, when the control device 10 mounts the component E on the mounting surfaces P1 to P5 based on the measurement result of the mounted object P by the three-dimensional shape measuring unit 9, the mounting head is mounted. It is configured to determine whether or not 41 and the mounted object P or the component E interfere with each other. Accordingly, when the component E is actually mounted, it is possible to suppress the mounting head 41 from colliding with the mounted object P or the component E.

(Modification)
It should be considered that the embodiments disclosed this time are exemplifications in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes meaning equivalent to the scope of claims for patent and all modifications (modifications) within the scope.

For example, in the above embodiment, the mounted object has the flat mounting surface, but the present invention is not limited to this. In the present invention, the mounted object may have an uneven mounting surface. Further, the mounted object may have both a flat mounting surface and an uneven mounting surface.

Further, in the above-described embodiment, an example in which the reference surface for inclining the holding portion is a substantially horizontal plane has been shown, but the present invention is not limited to this. In the present invention, the reference plane for inclining the holding portion may be other than the substantially horizontal plane. For example, the reference plane may be the vertical plane.

Further, in the above embodiment, an example of the configuration in which the rotation mechanism section is supported by the tilt mechanism section has been shown, but the present invention is not limited to this. In the present invention, the tilting mechanism section may be supported by the rotating mechanism section. Further, although an example in which the tilting mechanism section and the rotating mechanism section are supported by the lifting mechanism section is shown, the present invention is not limited to this. In the present invention, the elevating mechanism section may be supported by the tilting mechanism section and the rotating mechanism section.

Further, in the above-described embodiment, the mounted object is conveyed by the substrate conveying section via the transfer carrier and is held by the holding section of the substrate holding unit, but the present invention is not limited to this. In the present invention, the mounted object may be directly carried by the board carrying section as long as it can be carried. Further, in the present invention, the mountable object may be directly held by the holding part as long as it can be held.

Further, in the above embodiment, an example in which the holding portion of the substrate holding unit is configured to hold the mounted object by gripping is shown, but the present invention is not limited to this. In the present invention, the holding portion may be configured to hold the mounted object by a method other than the gripping. For example, the holding portion may be configured to hold the mounted object by sucking the mounted object with a negative pressure.

Further, in the above-described embodiment, an example in which the component mounting apparatus is configured such that the board holding unit and the board backup unit can be replaced is shown, but the present invention is not limited to this. In the present invention, the component mounting apparatus may be configured such that the substrate holding unit and the unit other than the substrate backup unit can be replaced.

Further, in the above-described embodiment, the example in which the feeder placement portion is provided and the tape feeder is provided only on the end portion on one side (Y2 side) of the base has been shown, but the present invention is not limited to this. .. In the present invention, the feeder placement portions may be provided at the end portions on both sides (both sides in the Y direction) of the base, and the tape feeders may be placed respectively.

Further, in the above-described embodiment, an example of the configuration in which the board (mounting object) is transported along one lane and the work is performed, but the present invention is not limited to this. In the present invention, the mounted object may be transported along two or more lanes to perform the work.

Further, in the above embodiment, the example in which the three-dimensional shape measuring unit is configured by the laser displacement meter and the stereo camera is shown, but the present invention is not limited to this. In the present invention, the three-dimensional shape measuring unit may be configured by a device other than the laser displacement meter and the stereo camera. For example, the three-dimensional shape measurement unit may be a light section measurement unit that measures by light section measurement or an interference fringe measurement unit that measures by interference fringe measurement. In these cases, a board recognition camera may be used as the camera that performs imaging.

Further, in the above embodiment, an example of the configuration in which the component held by the tape is supplied to the component supply position has been shown, but the present invention is not limited to this. In the present invention, a component placed on a tray or the like may be supplied to the component supply position.

Further, in the above-described embodiment, an example of a configuration in which a so-called in-line head unit in which a plurality of mounting heads are linearly provided in one row or a plurality of rows is provided is shown, but the present invention is not limited to this. In the present invention, a so-called rotary head unit in which a plurality of mounting heads are circumferentially provided may be provided.

Further, in the above embodiment, an example of the configuration in which one head unit is provided is shown, but the present invention is not limited to this. In the present invention, a plurality of head units may be provided.

In the above embodiment, for convenience of description, the processing operation of the control device (control unit) is described using a flow-driven flowchart that sequentially performs processing along the processing flow, but the present invention is not limited to this. In the present invention, the processing operation of the control unit may be performed by an event driven type (event driven type) processing that executes processing on an event-by-event basis. In this case, the event driving may be completely performed, or the event driving and the flow driving may be combined.

9 three-dimensional shape measuring unit 9a laser displacement meter 9b stereo camera 10 control device (control unit)
32 Tilt mechanism section (rotation mechanism section, first rotation mechanism)
33 rotation mechanism section (rotation mechanism section, second rotation mechanism)
34 holding part 41 mounting head 100 component mounting device E component P mounted object P1, P2, P3, P4, P5 mounting surface

Claims (15)

A holding portion that holds a mounted object having a three-dimensional shape on which the component is mounted,
A rotation mechanism section for rotating the holding section so as to be inclined with respect to a horizontal plane,
A mounting head for mounting a component on the mounted object,
A three-dimensional shape measuring unit that measures the three-dimensional shape of the mounted object held by the holding unit,
A component mounting apparatus comprising: a control unit that acquires information on a plurality of mounting surfaces on which components are mounted, based on a measurement result of the mounted object by the three-dimensional shape measuring unit. The control unit acquires tilt information of the surface of the mounted object from the measurement result of the mounted object by the three-dimensional shape measuring unit, and based on the tilt information of the surface, the mounting surface of the mounted object. The component mounting apparatus according to claim 1, wherein the component mounting apparatus is configured to specify. The rotation mechanism portion includes a first rotation mechanism that rotates the holding portion around a horizontal rotation axis line, and the holding mechanism around a rotation axis line that is substantially perpendicular to the rotation axis line of the first rotation mechanism. A second rotating mechanism for rotating the unit,
The control unit rotates the mounted object by both the first rotating mechanism and the second rotating mechanism of the rotating mechanism unit, and the mounted body is mounted by the three-dimensional shape measuring unit from a plurality of directions. The component mounting apparatus according to claim 1, wherein the component mounting apparatus is configured to control so as to measure a three-dimensional shape of an object. The control unit determines, based on the measurement result of the mounted object by the three-dimensional shape measurement unit, whether or not there is a blind spot in the measurement direction. The component mounting apparatus according to claim 3, wherein the component mounting apparatus is configured to control the mounted object so as to be measured. When the mounting surface of the mounted object has a blind spot, the control unit is configured to control the mounted object by the three-dimensional shape measuring unit from an unmeasured direction, Item 4. The component mounting apparatus according to item 4. The control unit is configured to create mounting data for mounting a component on the mounted object based on the acquired information of the plurality of mounting surfaces. The component mounting apparatus according to item 1. The control unit is configured to acquire angle information for adjusting a posture by the rotation mechanism unit when mounting a component on the mounting surface of the mounted object from information of the mounting surface, The component mounting apparatus according to claim 1. The component mounting apparatus according to claim 1, wherein the three-dimensional shape measurement unit includes at least one of a laser displacement meter and a stereo camera. The three-dimensional shape measuring unit includes a laser displacement meter,
The control unit compares the normal vectors of the planes passing through the positions of the three points based on the position information of the plurality of points of the mounted object by the laser displacement meter to determine the plurality of points of the mounted object. The component mounting apparatus according to claim 8, wherein the component mounting apparatus is configured to determine whether or not are on the same plane. The control unit is configured to create coordinate data of a component mounting position based on the information on the mounting surface and a teaching of a mounting position of the component. The component mounting apparatus described. The component mounting apparatus according to claim 10, wherein the control unit is configured to create coordinate data of a component mounting position from a component mounting position taught based on the image of the mounting surface. The control unit is configured to correct preset information on the mounting surface based on information on the mounting surface acquired based on a measurement result of the mounted object by the three-dimensional shape measuring unit. The component mounting apparatus according to any one of claims 1 to 11. 13. The control unit according to claim 1, wherein the control unit is configured to receive an input of approximate dimensions of the mounted object before the solid shape measuring unit measures the mounted object. The component mounting apparatus according to item. The control unit measures an approximate dimension of the mounted object before holding the mounted object by the holding unit, and based on the measured approximate dimension of the mounted object, the three-dimensional shape measurement is performed. The component mounting apparatus according to any one of claims 1 to 13, which is configured to narrow a measurement range of the mounted object measured by a unit. Based on the measurement result of the mounted object by the three-dimensional shape measuring unit, the control unit determines whether the mounting head interferes with the mounted object or the component when mounting the component on the mounting surface. The component mounting apparatus according to claim 1, wherein the component mounting apparatus is configured to determine whether or not it is.

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