JP2020119982A5 - - Google Patents

Download PDF

Info

Publication number
JP2020119982A5
JP2020119982A5 JP2019009476A JP2019009476A JP2020119982A5 JP 2020119982 A5 JP2020119982 A5 JP 2020119982A5 JP 2019009476 A JP2019009476 A JP 2019009476A JP 2019009476 A JP2019009476 A JP 2019009476A JP 2020119982 A5 JP2020119982 A5 JP 2020119982A5
Authority
JP
Japan
Prior art keywords
plasma processing
period
power supply
frequency power
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019009476A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020119982A (ja
JP6960421B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2019009476A external-priority patent/JP6960421B2/ja
Priority to JP2019009476A priority Critical patent/JP6960421B2/ja
Priority to KR1020200004218A priority patent/KR102810325B1/ko
Priority to TW109101319A priority patent/TWI849037B/zh
Priority to CN202010041705.3A priority patent/CN111477531A/zh
Priority to US16/743,788 priority patent/US11062882B2/en
Publication of JP2020119982A publication Critical patent/JP2020119982A/ja
Publication of JP2020119982A5 publication Critical patent/JP2020119982A5/ja
Publication of JP6960421B2 publication Critical patent/JP6960421B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2019009476A 2019-01-23 2019-01-23 プラズマ処理装置及びプラズマ処理方法 Active JP6960421B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2019009476A JP6960421B2 (ja) 2019-01-23 2019-01-23 プラズマ処理装置及びプラズマ処理方法
KR1020200004218A KR102810325B1 (ko) 2019-01-23 2020-01-13 플라즈마 처리 장치 및 플라즈마 처리 방법
US16/743,788 US11062882B2 (en) 2019-01-23 2020-01-15 Plasma processing apparatus and plasma processing method
CN202010041705.3A CN111477531A (zh) 2019-01-23 2020-01-15 等离子体处理装置及等离子体处理方法
TW109101319A TWI849037B (zh) 2019-01-23 2020-01-15 電漿處理裝置及電漿處理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019009476A JP6960421B2 (ja) 2019-01-23 2019-01-23 プラズマ処理装置及びプラズマ処理方法

Publications (3)

Publication Number Publication Date
JP2020119982A JP2020119982A (ja) 2020-08-06
JP2020119982A5 true JP2020119982A5 (https=) 2021-10-14
JP6960421B2 JP6960421B2 (ja) 2021-11-05

Family

ID=71608401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019009476A Active JP6960421B2 (ja) 2019-01-23 2019-01-23 プラズマ処理装置及びプラズマ処理方法

Country Status (5)

Country Link
US (1) US11062882B2 (https=)
JP (1) JP6960421B2 (https=)
KR (1) KR102810325B1 (https=)
CN (1) CN111477531A (https=)
TW (1) TWI849037B (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102932766B1 (ko) * 2021-09-08 2026-03-04 삼성전자주식회사 고전압 전원 장치 및 이를 포함하는 플라즈마 식각 장비

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4672456B2 (ja) 2004-06-21 2011-04-20 東京エレクトロン株式会社 プラズマ処理装置
KR101247857B1 (ko) * 2004-06-21 2013-03-26 도쿄엘렉트론가부시키가이샤 플라즈마 처리 장치
JP5466480B2 (ja) * 2009-02-20 2014-04-09 東京エレクトロン株式会社 プラズマエッチング方法、プラズマエッチング装置および記憶媒体
JP2010238881A (ja) * 2009-03-31 2010-10-21 Tokyo Electron Ltd プラズマ処理装置及びプラズマ処理方法
US9287086B2 (en) * 2010-04-26 2016-03-15 Advanced Energy Industries, Inc. System, method and apparatus for controlling ion energy distribution
KR20120022251A (ko) * 2010-09-01 2012-03-12 삼성전자주식회사 플라즈마 식각방법 및 그의 장치
JP5977509B2 (ja) * 2011-12-09 2016-08-24 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
US9922802B2 (en) * 2012-02-20 2018-03-20 Tokyo Electron Limited Power supply system, plasma etching apparatus, and plasma etching method
JP6512962B2 (ja) * 2014-09-17 2019-05-15 東京エレクトロン株式会社 プラズマ処理装置
JP6424120B2 (ja) * 2015-03-23 2018-11-14 東京エレクトロン株式会社 電源システム、プラズマ処理装置及び電源制御方法
JP6392266B2 (ja) * 2016-03-22 2018-09-19 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
US10566177B2 (en) * 2016-08-15 2020-02-18 Applied Materials, Inc. Pulse shape controller for sputter sources
WO2018105700A1 (ja) * 2016-12-08 2018-06-14 東京エレクトロン株式会社 プラズマ溶射装置及び電池用電極の製造方法
KR102730398B1 (ko) * 2017-12-07 2024-11-13 램 리써치 코포레이션 반도체 rf 플라즈마 프로세싱을 위한 펄싱 내 rf 펄싱
US10555412B2 (en) * 2018-05-10 2020-02-04 Applied Materials, Inc. Method of controlling ion energy distribution using a pulse generator with a current-return output stage

Similar Documents

Publication Publication Date Title
CN103890897B (zh) 用于先进等离子体离子能量处理系统的晶圆吸附系统
JP2025075070A5 (https=)
CN103155717B (zh) 控制离子能量分布的系统、方法和装置
CN113228830B (zh) 等离子体处理装置及等离子体处理方法
JP2022020007A5 (https=)
JP5574962B2 (ja) プラズマ処理装置およびプラズマ処理方法
TWI545994B (zh) 用於控制離子能量分佈的方法和裝置
CN104756238B (zh) 控制开关模式离子能量分布系统的方法
CN110473762A (zh) 使用具有电流返回输出级的脉冲发生器来控制离子能量分布的方法
CN116097393A (zh) 用于等离子体处理应用的脉冲电压源
TW200612488A (en) Plasma processing apparatus, method thereof, and computer readable memory medium
JP2009533551A5 (https=)
EP2477207A3 (en) Apparatus for generating high-current electrical discharges
JP2022075506A (ja) プラズマ処理装置及びプラズマ処理方法
KR102919785B1 (ko) 검사 방법, 검사 장치, 및 플라즈마 처리 장치
CN116436286A (zh) 静电卡盘电源和半导体工艺设备
JP2020119982A5 (https=)
JP2020077657A5 (https=)
JP2020077657A (ja) プラズマ処理装置及びプラズマ処理方法
RU2635057C2 (ru) Установка для электроэрозионной обработки
KR101284735B1 (ko) 외부 커패시터를 이용한 대기압 플라즈마 발생장치
JP6960421B2 (ja) プラズマ処理装置及びプラズマ処理方法
Teschke et al. Resonant, high voltage, high power supply for atmospheric pressure plasma sources
CN106851955A (zh) 一种产生大体积大气压均匀放电的装置及方法
KR20030052751A (ko) 아연도금용 고전압 코로나 제어장치 및 방법